CN104364208B - 玻璃基板的切割方法及玻璃基板的制造方法 - Google Patents

玻璃基板的切割方法及玻璃基板的制造方法 Download PDF

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Publication number
CN104364208B
CN104364208B CN201380030915.0A CN201380030915A CN104364208B CN 104364208 B CN104364208 B CN 104364208B CN 201380030915 A CN201380030915 A CN 201380030915A CN 104364208 B CN104364208 B CN 104364208B
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CN
China
Prior art keywords
glass substrate
laser
glass
cutting method
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380030915.0A
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English (en)
Chinese (zh)
Other versions
CN104364208A (zh
Inventor
植松利之
高桥秀幸
增田秀树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN104364208A publication Critical patent/CN104364208A/zh
Application granted granted Critical
Publication of CN104364208B publication Critical patent/CN104364208B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
CN201380030915.0A 2012-06-28 2013-05-31 玻璃基板的切割方法及玻璃基板的制造方法 Expired - Fee Related CN104364208B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012-145991 2012-06-28
JP2012145991 2012-06-28
JP2013004667 2013-01-15
JP2013-004667 2013-01-15
PCT/JP2013/065194 WO2014002685A1 (ja) 2012-06-28 2013-05-31 ガラス基板の切断方法及びガラス基板の製造方法

Publications (2)

Publication Number Publication Date
CN104364208A CN104364208A (zh) 2015-02-18
CN104364208B true CN104364208B (zh) 2017-12-12

Family

ID=49782852

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380030915.0A Expired - Fee Related CN104364208B (zh) 2012-06-28 2013-05-31 玻璃基板的切割方法及玻璃基板的制造方法

Country Status (5)

Country Link
JP (1) JP6206406B2 (ja)
KR (1) KR20150035577A (ja)
CN (1) CN104364208B (ja)
TW (1) TWI603801B (ja)
WO (1) WO2014002685A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6579040B2 (ja) * 2016-05-31 2019-09-25 日本電気硝子株式会社 ガラスロールの製造方法
JP2018024536A (ja) * 2016-08-08 2018-02-15 日本電気硝子株式会社 帯状ガラスフィルムの切断方法
US11459264B2 (en) 2017-02-07 2022-10-04 Nippon Electric Glass Co., Ltd. Method for producing glass film
JP6909403B2 (ja) 2017-07-31 2021-07-28 日本電気硝子株式会社 ガラスフィルムの製造方法
CN113953673A (zh) * 2020-12-21 2022-01-21 宁夏小牛自动化设备有限公司 一种划裂太阳能电池片的方法及其划裂设备
WO2024042887A1 (ja) * 2022-08-25 2024-02-29 日本電気硝子株式会社 ガラス板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57209838A (en) * 1981-04-01 1982-12-23 Kurieiteibu Gurasuwaakusu Inte Laser glass cutting method and product made thereby
WO2006070825A1 (ja) * 2004-12-28 2006-07-06 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の分断方法および基板分断システム
JP2008247038A (ja) * 2008-05-24 2008-10-16 Lemi Ltd 脆性材料のフルカット割断方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000263277A (ja) * 1999-03-16 2000-09-26 Hitachi Cable Ltd 非金属材料の加工方法及びその装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57209838A (en) * 1981-04-01 1982-12-23 Kurieiteibu Gurasuwaakusu Inte Laser glass cutting method and product made thereby
WO2006070825A1 (ja) * 2004-12-28 2006-07-06 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の分断方法および基板分断システム
JP2008247038A (ja) * 2008-05-24 2008-10-16 Lemi Ltd 脆性材料のフルカット割断方法

Also Published As

Publication number Publication date
TW201404516A (zh) 2014-02-01
CN104364208A (zh) 2015-02-18
JPWO2014002685A1 (ja) 2016-05-30
TWI603801B (zh) 2017-11-01
JP6206406B2 (ja) 2017-10-04
WO2014002685A1 (ja) 2014-01-03
KR20150035577A (ko) 2015-04-06

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Address after: Tokyo, Japan

Patentee after: ASAHI GLASS Co.,Ltd.

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Patentee before: ASAHI GLASS Co.,Ltd.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171212

CF01 Termination of patent right due to non-payment of annual fee