CN104350421B - 感光性组合物及具有其固化层的印刷电路板 - Google Patents

感光性组合物及具有其固化层的印刷电路板 Download PDF

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Publication number
CN104350421B
CN104350421B CN201380028583.2A CN201380028583A CN104350421B CN 104350421 B CN104350421 B CN 104350421B CN 201380028583 A CN201380028583 A CN 201380028583A CN 104350421 B CN104350421 B CN 104350421B
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CN
China
Prior art keywords
photosensitive
carboxyl
photosensitive composite
aforementioned
mass
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CN201380028583.2A
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English (en)
Chinese (zh)
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CN104350421A (zh
Inventor
林亮
山本修一
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Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
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Publication date
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Priority claimed from PCT/JP2013/062951 external-priority patent/WO2013179863A1/ja
Publication of CN104350421A publication Critical patent/CN104350421A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN201380028583.2A 2012-05-29 2013-05-08 感光性组合物及具有其固化层的印刷电路板 Active CN104350421B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012-122325 2012-05-29
JP2012122325 2012-05-29
JP2013-085450 2013-04-16
JP2013085451A JP2014006499A (ja) 2012-05-29 2013-04-16 感光性組成物及びその硬化層を有するプリント配線板
JP2013085450A JP6240399B2 (ja) 2012-05-29 2013-04-16 感光性組成物及びその硬化層を有するプリント配線板
JP2013-085451 2013-04-16
PCT/JP2013/062951 WO2013179863A1 (ja) 2012-05-29 2013-05-08 感光性組成物及びその硬化層を有するプリント配線板

Publications (2)

Publication Number Publication Date
CN104350421A CN104350421A (zh) 2015-02-11
CN104350421B true CN104350421B (zh) 2019-06-04

Family

ID=50104232

Family Applications (1)

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CN201380028583.2A Active CN104350421B (zh) 2012-05-29 2013-05-08 感光性组合物及具有其固化层的印刷电路板

Country Status (4)

Country Link
JP (2) JP2014006499A (ja)
KR (1) KR102050126B1 (ja)
CN (1) CN104350421B (ja)
TW (1) TWI620016B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106916261B (zh) * 2015-12-25 2020-05-19 太阳油墨（苏州）有限公司 孔穴填埋用固化性树脂组合物及其固化物、和印刷电路板
CN106916262B (zh) * 2015-12-25 2020-03-13 太阳油墨（苏州）有限公司 孔穴填埋用固化性树脂组合物及其固化物、和印刷电路板
JP6112691B1 (ja) * 2016-03-16 2017-04-12 互応化学工業株式会社 液状ソルダーレジスト組成物及びプリント配線板
JP5997860B1 (ja) 2016-03-16 2016-09-28 互応化学工業株式会社 液状ソルダーレジスト組成物及びプリント配線板
JP6967508B2 (ja) * 2016-03-31 2021-11-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6154942B1 (ja) * 2016-07-11 2017-06-28 互応化学工業株式会社 液状ソルダーレジスト組成物及びプリント配線板
JP7013666B2 (ja) * 2017-03-29 2022-02-01 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、プリント配線板及びプリント配線板の製造方法
JP6759323B2 (ja) * 2018-03-28 2020-09-23 太陽インキ製造株式会社 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板
CN110317316B (zh) * 2019-07-02 2021-11-30 戚玉侠 一种合成皮革用抗菌耐污聚氨酯的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1434833A (zh) * 2000-02-14 2003-08-06 太阳油墨制造株式会社 形成消光涂膜用的光固化性·热固化性组合物
CN101281367A (zh) * 2007-04-06 2008-10-08 太阳油墨制造株式会社 阻焊剂组合物及其固化物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004294882A (ja) * 2003-03-27 2004-10-21 Nippon Steel Chem Co Ltd 感光性樹脂組成物及び硬化物
JP2004359890A (ja) * 2003-06-06 2004-12-24 Japan U-Pica Co Ltd 光硬化性樹脂組成物及び感光性熱硬化性樹脂組成物並びにその硬化物
JP4449402B2 (ja) 2003-08-25 2010-04-14 日立化成工業株式会社 永久レジスト用感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板
KR100787341B1 (ko) * 2005-09-06 2007-12-18 다이요 잉키 세이조 가부시키가이샤 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는인쇄 배선판
KR100883047B1 (ko) * 2006-07-10 2009-02-11 다이요 잉키 세이조 가부시키가이샤 광 경화성ㆍ열 경화성 수지 조성물, 그의 경화물 및 인쇄배선판
JP4657358B2 (ja) * 2008-12-12 2011-03-23 積水化学工業株式会社 感光性組成物及びソルダーレジスト組成物
JP5338009B2 (ja) * 2009-03-27 2013-11-13 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びその硬化物並びにそれらを用いたプリント配線板
WO2011018907A1 (ja) * 2009-08-10 2011-02-17 積水化学工業株式会社 感光性組成物及びソルダーレジスト組成物
JP5113298B2 (ja) * 2012-01-10 2013-01-09 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1434833A (zh) * 2000-02-14 2003-08-06 太阳油墨制造株式会社 形成消光涂膜用的光固化性·热固化性组合物
CN101281367A (zh) * 2007-04-06 2008-10-08 太阳油墨制造株式会社 阻焊剂组合物及其固化物

Also Published As

Publication number Publication date
KR20150017361A (ko) 2015-02-16
JP2014006498A (ja) 2014-01-16
TW201407281A (zh) 2014-02-16
KR102050126B1 (ko) 2019-11-28
CN104350421A (zh) 2015-02-11
TWI620016B (zh) 2018-04-01
JP6240399B2 (ja) 2017-11-29
JP2014006499A (ja) 2014-01-16

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Effective date of registration: 20230531

Address after: Saitama Prefecture, Japan

Patentee after: TAIYO HOLDINGS Co.,Ltd.

Address before: Saitama Prefecture, Japan

Patentee before: TAIYO INK MFG. Co.,Ltd.