CN104334312A - 使一工件中具有延伸深度虚饰的激光切割 - Google Patents
使一工件中具有延伸深度虚饰的激光切割 Download PDFInfo
- Publication number
- CN104334312A CN104334312A CN201380022339.5A CN201380022339A CN104334312A CN 104334312 A CN104334312 A CN 104334312A CN 201380022339 A CN201380022339 A CN 201380022339A CN 104334312 A CN104334312 A CN 104334312A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- laser beam
- lens
- laser
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/422,190 US20120234807A1 (en) | 2009-12-07 | 2012-03-16 | Laser scribing with extended depth affectation into a workplace |
US13/422,190 | 2012-03-16 | ||
PCT/US2013/032781 WO2013138802A1 (en) | 2012-03-16 | 2013-03-18 | Laser scribing with extended depth affectation into a workpiece |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104334312A true CN104334312A (zh) | 2015-02-04 |
Family
ID=49161885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380022339.5A Pending CN104334312A (zh) | 2012-03-16 | 2013-03-18 | 使一工件中具有延伸深度虚饰的激光切割 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2825344A4 (ja) |
JP (1) | JP2015519722A (ja) |
KR (1) | KR20140137437A (ja) |
CN (1) | CN104334312A (ja) |
TW (1) | TW201343296A (ja) |
WO (1) | WO2013138802A1 (ja) |
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CN105102177A (zh) * | 2013-04-04 | 2015-11-25 | Lpkf激光电子股份公司 | 在基板上引入穿孔的方法和装置以及以这种方式制造的基板 |
CN106392334A (zh) * | 2015-07-29 | 2017-02-15 | 大族激光科技产业集团股份有限公司 | 一种透明硬脆材料激光贯穿切割装置以及切割方法 |
CN106925887A (zh) * | 2015-12-24 | 2017-07-07 | 丰田自动车株式会社 | 激光焊接装置 |
CN107945136A (zh) * | 2017-12-04 | 2018-04-20 | 深圳市路畅科技股份有限公司 | 一种鱼眼图像矫正方法、系统、设备及计算机存储介质 |
CN111151895A (zh) * | 2020-01-13 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | 一种利用成丝效应切割透明材料的工艺及系统 |
CN111215768A (zh) * | 2020-01-16 | 2020-06-02 | 吉林大学 | 利用反球差校正进行纵向加工的方法及应用 |
CN111526966A (zh) * | 2017-12-29 | 2020-08-11 | 可利雷斯股份有限公司 | 激光处理装置及方法 |
CN111601676A (zh) * | 2017-11-20 | 2020-08-28 | Ipg光子公司 | 用于处理材料的激光系统和方法 |
CN111699070A (zh) * | 2018-02-15 | 2020-09-22 | 肖特股份有限公司 | 将分离线引入透明脆性破裂材料中的方法和设备及通过该方法生产的具有分离线的元件 |
CN113732511A (zh) * | 2021-08-30 | 2021-12-03 | 中国科学院西安光学精密机械研究所 | 光纤表面包层微纳结构飞秒激光加工方法及装置 |
TWI794589B (zh) * | 2020-02-21 | 2023-03-01 | 海納光電股份有限公司 | 硬脆板材高溫環境加工裝置及方法 |
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WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
US9701564B2 (en) | 2013-01-15 | 2017-07-11 | Corning Incorporated | Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
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US10005152B2 (en) * | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
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- 2013-03-15 TW TW102109207A patent/TW201343296A/zh unknown
- 2013-03-18 KR KR1020147028951A patent/KR20140137437A/ko not_active Application Discontinuation
- 2013-03-18 EP EP13760572.1A patent/EP2825344A4/en not_active Withdrawn
- 2013-03-18 JP JP2015500676A patent/JP2015519722A/ja active Pending
- 2013-03-18 CN CN201380022339.5A patent/CN104334312A/zh active Pending
- 2013-03-18 WO PCT/US2013/032781 patent/WO2013138802A1/en active Application Filing
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US10610971B2 (en) | 2013-04-04 | 2020-04-07 | Lpkf Laser & Electronics Ag | Method for producing recesses in a substrate |
CN106392334A (zh) * | 2015-07-29 | 2017-02-15 | 大族激光科技产业集团股份有限公司 | 一种透明硬脆材料激光贯穿切割装置以及切割方法 |
CN106925887A (zh) * | 2015-12-24 | 2017-07-07 | 丰田自动车株式会社 | 激光焊接装置 |
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CN111526966A (zh) * | 2017-12-29 | 2020-08-11 | 可利雷斯股份有限公司 | 激光处理装置及方法 |
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CN111699070A (zh) * | 2018-02-15 | 2020-09-22 | 肖特股份有限公司 | 将分离线引入透明脆性破裂材料中的方法和设备及通过该方法生产的具有分离线的元件 |
CN111699070B (zh) * | 2018-02-15 | 2022-09-16 | 肖特股份有限公司 | 将分离线引入透明脆性破裂材料中的方法和设备及通过该方法生产的具有分离线的元件 |
CN111151895A (zh) * | 2020-01-13 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | 一种利用成丝效应切割透明材料的工艺及系统 |
CN111215768A (zh) * | 2020-01-16 | 2020-06-02 | 吉林大学 | 利用反球差校正进行纵向加工的方法及应用 |
TWI794589B (zh) * | 2020-02-21 | 2023-03-01 | 海納光電股份有限公司 | 硬脆板材高溫環境加工裝置及方法 |
CN113732511A (zh) * | 2021-08-30 | 2021-12-03 | 中国科学院西安光学精密机械研究所 | 光纤表面包层微纳结构飞秒激光加工方法及装置 |
Also Published As
Publication number | Publication date |
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TW201343296A (zh) | 2013-11-01 |
EP2825344A4 (en) | 2016-02-17 |
EP2825344A1 (en) | 2015-01-21 |
KR20140137437A (ko) | 2014-12-02 |
JP2015519722A (ja) | 2015-07-09 |
WO2013138802A1 (en) | 2013-09-19 |
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