EP2825344A4 - Laser scribing with extended depth affectation into a workpiece - Google Patents

Laser scribing with extended depth affectation into a workpiece

Info

Publication number
EP2825344A4
EP2825344A4 EP13760572.1A EP13760572A EP2825344A4 EP 2825344 A4 EP2825344 A4 EP 2825344A4 EP 13760572 A EP13760572 A EP 13760572A EP 2825344 A4 EP2825344 A4 EP 2825344A4
Authority
EP
European Patent Office
Prior art keywords
workpiece
laser scribing
extended depth
depth affectation
affectation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13760572.1A
Other languages
German (de)
French (fr)
Other versions
EP2825344A1 (en
Inventor
Jeffrey P Sercel
Marco Mendes
Mathew Hannon
Dadelszen Michael Von
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IPG Microsystems LLC
Original Assignee
IPG Microsystems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/422,190 external-priority patent/US20120234807A1/en
Application filed by IPG Microsystems LLC filed Critical IPG Microsystems LLC
Publication of EP2825344A1 publication Critical patent/EP2825344A1/en
Publication of EP2825344A4 publication Critical patent/EP2825344A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222Scoring using a focussed radiation beam, e.g. laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
EP13760572.1A 2012-03-16 2013-03-18 Laser scribing with extended depth affectation into a workpiece Withdrawn EP2825344A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/422,190 US20120234807A1 (en) 2009-12-07 2012-03-16 Laser scribing with extended depth affectation into a workplace
PCT/US2013/032781 WO2013138802A1 (en) 2012-03-16 2013-03-18 Laser scribing with extended depth affectation into a workpiece

Publications (2)

Publication Number Publication Date
EP2825344A1 EP2825344A1 (en) 2015-01-21
EP2825344A4 true EP2825344A4 (en) 2016-02-17

Family

ID=49161885

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13760572.1A Withdrawn EP2825344A4 (en) 2012-03-16 2013-03-18 Laser scribing with extended depth affectation into a workpiece

Country Status (6)

Country Link
EP (1) EP2825344A4 (en)
JP (1) JP2015519722A (en)
KR (1) KR20140137437A (en)
CN (1) CN104334312A (en)
TW (1) TW201343296A (en)
WO (1) WO2013138802A1 (en)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
WO2014161534A2 (en) 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Method and device for providing through-openings in a substrate and a substrate produced in said manner
RU2551043C1 (en) * 2013-11-07 2015-05-20 Общество С Ограниченной Ответственностью "Оптосистемы" Method and device for forming precision holes in optically transparent film with ultra-short laser radiation pulse
US10005152B2 (en) * 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
CN106687419A (en) 2014-07-08 2017-05-17 康宁股份有限公司 Methods and apparatuses for laser processing materials
CN107074611A (en) * 2014-07-11 2017-08-18 康宁股份有限公司 System and method that glass-cutting is carried out in glassware are induced to by the way that pulse laser is perforated
US9617180B2 (en) * 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
CN208586209U (en) 2014-07-14 2019-03-08 康宁股份有限公司 A kind of system for forming multiple defects of restriction profile in workpiece
EP3169477B1 (en) 2014-07-14 2020-01-29 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
EP3536440A1 (en) 2014-07-14 2019-09-11 Corning Incorporated Glass article with a defect pattern
JP2016058429A (en) * 2014-09-05 2016-04-21 株式会社ディスコ Wafer processing method
EP3221727B1 (en) * 2014-11-19 2021-03-17 Trumpf Laser- und Systemtechnik GmbH System for asymmetric optical beam shaping
DE102014116958B9 (en) * 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optical system for beam shaping of a laser beam, laser processing system, method for material processing and use of a common elongated focus zone for laser material processing
DE102014116957A1 (en) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optical system for beam shaping
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US20160158890A1 (en) * 2014-12-05 2016-06-09 Solarcity Corporation Systems and methods for scribing photovoltaic structures
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
CN107406293A (en) 2015-01-12 2017-11-28 康宁股份有限公司 The substrate through heat tempering is cut by laser using Multiphoton Absorbtion method
KR102546692B1 (en) 2015-03-24 2023-06-22 코닝 인코포레이티드 Laser Cutting and Processing of Display Glass Compositions
JP2018516215A (en) 2015-03-27 2018-06-21 コーニング インコーポレイテッド Gas permeable window and manufacturing method thereof
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
CN106392334B (en) * 2015-07-29 2020-01-07 大族激光科技产业集团股份有限公司 Laser penetration cutting device and method for transparent hard and brittle material
JP6549014B2 (en) * 2015-10-13 2019-07-24 株式会社ディスコ Optical device wafer processing method
EP3356078B1 (en) * 2015-12-22 2022-05-18 Heraeus Deutschland GmbH & Co. KG Method of producing a metallised ceramic substrate using picolaser ; corresponding metallised ceramic substrate
JP6369454B2 (en) * 2015-12-24 2018-08-08 トヨタ自動車株式会社 Laser welding equipment
CN109311725B (en) 2016-05-06 2022-04-26 康宁股份有限公司 Laser cutting and removing profile shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
KR20190003766A (en) * 2016-06-08 2019-01-09 한스 레이저 테크놀러지 인더스트리 그룹 컴퍼니 리미티드 Sapphire cutting method and apparatus
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
KR102423775B1 (en) 2016-08-30 2022-07-22 코닝 인코포레이티드 Laser processing of transparent materials
KR102078294B1 (en) 2016-09-30 2020-02-17 코닝 인코포레이티드 Apparatus and method for laser machining transparent workpieces using non-axisymmetric beam spots
EP3848333A1 (en) 2016-10-24 2021-07-14 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
CN106425112B (en) * 2016-11-02 2018-11-06 国神光电科技(上海)有限公司 A kind of method and system of laser scribing
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
KR102596305B1 (en) * 2017-11-20 2023-10-30 아이피지 포토닉스 코포레이션 Laser systems and methods for processing materials
CN107945136B (en) * 2017-12-04 2021-09-24 深圳市路畅科技股份有限公司 Fisheye image correction method, fisheye image correction system, fisheye image correction equipment and computer storage medium
WO2019129917A1 (en) 2017-12-29 2019-07-04 Corelase Oy Laser processing apparatus and method
DE102018126381A1 (en) * 2018-02-15 2019-08-22 Schott Ag Method and device for inserting a dividing line into a transparent brittle material, as well as according to the method producible, provided with a dividing line element
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN111151895A (en) * 2020-01-13 2020-05-15 大族激光科技产业集团股份有限公司 Process and system for cutting transparent material by utilizing filamentation effect
CN111215768B (en) * 2020-01-16 2021-03-30 吉林大学 Method for longitudinal processing by utilizing inverse spherical aberration correction and application
TWI794589B (en) * 2020-02-21 2023-03-01 海納光電股份有限公司 Device and method for processing hard and brittle plates in high temperature environment
DE102021100675B4 (en) 2021-01-14 2022-08-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Process for dividing a transparent workpiece
CN113732511B (en) * 2021-08-30 2023-01-06 中国科学院西安光学精密机械研究所 Femtosecond laser processing method and device for fiber surface cladding micro-nano structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050024743A1 (en) * 2003-05-22 2005-02-03 Frederic Camy-Peyret Focusing optic for laser cutting
US20070051706A1 (en) * 2005-09-08 2007-03-08 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
EP1811551A1 (en) * 2004-11-12 2007-07-25 Hamamatsu Photonics K.K. Laser beam machining method and semiconductor chip
EP2186596A1 (en) * 2007-08-03 2010-05-19 Hamamatsu Photonics K.K. Laser working method, laser working apparatus, and its manufacturing method
JP2010158686A (en) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd Optical device for laser processing, laser processing device and laser processing method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967884A (en) * 1974-11-05 1976-07-06 Eastman Kodak Company Three element objective lens
JPH07117647B2 (en) * 1992-05-25 1995-12-18 シーメンス アクチエンゲゼルシヤフト Scanning objective lens
US6133986A (en) * 1996-02-28 2000-10-17 Johnson; Kenneth C. Microlens scanner for microlithography and wide-field confocal microscopy
US8247731B2 (en) * 2002-02-25 2012-08-21 Board Of Regents Of The University Of Nebraska Laser scribing and machining of materials
EP2216128B1 (en) * 2002-03-12 2016-01-27 Hamamatsu Photonics K.K. Method of cutting object to be processed
JP4813985B2 (en) * 2006-06-23 2011-11-09 株式会社ディスコ Wafer processing conditions setting method
EP2105239B1 (en) * 2006-11-30 2016-01-13 Sumitomo Electric Industries, Ltd. Light condensing optical system, laser processing method and apparatus, and method of manufacturing fragile material
JP2010050175A (en) * 2008-08-20 2010-03-04 Disco Abrasive Syst Ltd Laser processing method and laser processing device
JP5241525B2 (en) * 2009-01-09 2013-07-17 浜松ホトニクス株式会社 Laser processing equipment
WO2011071886A1 (en) * 2009-12-07 2011-06-16 J.P. Sercel Associates, Inc. Laser machining and scribing systems and methods
JP5452247B2 (en) * 2010-01-21 2014-03-26 東芝機械株式会社 Laser dicing equipment
JP5614739B2 (en) * 2010-02-18 2014-10-29 国立大学法人埼玉大学 Substrate internal processing apparatus and substrate internal processing method
CN102230983A (en) * 2011-06-17 2011-11-02 山西飞虹激光科技有限公司 Optical element for laser processing and laser processing equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050024743A1 (en) * 2003-05-22 2005-02-03 Frederic Camy-Peyret Focusing optic for laser cutting
EP1811551A1 (en) * 2004-11-12 2007-07-25 Hamamatsu Photonics K.K. Laser beam machining method and semiconductor chip
US20070051706A1 (en) * 2005-09-08 2007-03-08 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
EP2186596A1 (en) * 2007-08-03 2010-05-19 Hamamatsu Photonics K.K. Laser working method, laser working apparatus, and its manufacturing method
JP2010158686A (en) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd Optical device for laser processing, laser processing device and laser processing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013138802A1 *

Also Published As

Publication number Publication date
WO2013138802A1 (en) 2013-09-19
CN104334312A (en) 2015-02-04
JP2015519722A (en) 2015-07-09
KR20140137437A (en) 2014-12-02
TW201343296A (en) 2013-11-01
EP2825344A1 (en) 2015-01-21

Similar Documents

Publication Publication Date Title
EP2825344A4 (en) Laser scribing with extended depth affectation into a workpiece
ZA201202034B (en) Cutting tool
EP2682214A4 (en) Cutting tool
EP2805599A4 (en) Power cutting tool
PL2737791T3 (en) Cutting tool
EP2865468A4 (en) Cutting tool
ZA201304929B (en) A pouch with laser scoring
EP2873479A4 (en) Portable cutting tool
EP2823920A4 (en) Surface coating cutting tool
EP2878405A4 (en) Indexable cutting tool
EP2708621A4 (en) Laser cladding method
SI2540459T1 (en) Cutting tool
EP2825368A4 (en) Hollow tip welding tool
PL2877307T3 (en) Cutting tool and cutting insert with a stopper surface
EP2737967A4 (en) Cutting tool
PL2667993T3 (en) Cutting tool
EP2752263A4 (en) Cutting tool
PL2780172T3 (en) Laser-marked polymer workpiece
EP2939770A4 (en) Cutting tool
EP2926964A4 (en) Formed cutter and formed tool for wood
EP2939806A4 (en) Cutting tool
EP2868408A4 (en) Cutting tool
EP2858788A4 (en) Small diameter cutting tool
EP2703103A4 (en) Cutting tool
EP2676751A4 (en) Cutting tool

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20141009

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160119

RIC1 Information provided on ipc code assigned before grant

Ipc: B23K 26/04 20060101AFI20160113BHEP

Ipc: B23K 26/53 20140101ALI20160113BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20190226

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20190709