TW201343296A - 使一工件中具有延伸深度虛飾之雷射切割系統及方法 - Google Patents

使一工件中具有延伸深度虛飾之雷射切割系統及方法 Download PDF

Info

Publication number
TW201343296A
TW201343296A TW102109207A TW102109207A TW201343296A TW 201343296 A TW201343296 A TW 201343296A TW 102109207 A TW102109207 A TW 102109207A TW 102109207 A TW102109207 A TW 102109207A TW 201343296 A TW201343296 A TW 201343296A
Authority
TW
Taiwan
Prior art keywords
workpiece
laser beam
lens
laser
range
Prior art date
Application number
TW102109207A
Other languages
English (en)
Chinese (zh)
Inventor
Jeffrey P Sercel
Marco Mendes
Mathew Hannon
Michael Von Dadelszen
Original Assignee
Ipg Microsystems Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/422,190 external-priority patent/US20120234807A1/en
Application filed by Ipg Microsystems Llc filed Critical Ipg Microsystems Llc
Publication of TW201343296A publication Critical patent/TW201343296A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
TW102109207A 2012-03-16 2013-03-15 使一工件中具有延伸深度虛飾之雷射切割系統及方法 TW201343296A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/422,190 US20120234807A1 (en) 2009-12-07 2012-03-16 Laser scribing with extended depth affectation into a workplace

Publications (1)

Publication Number Publication Date
TW201343296A true TW201343296A (zh) 2013-11-01

Family

ID=49161885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102109207A TW201343296A (zh) 2012-03-16 2013-03-15 使一工件中具有延伸深度虛飾之雷射切割系統及方法

Country Status (6)

Country Link
EP (1) EP2825344A4 (ja)
JP (1) JP2015519722A (ja)
KR (1) KR20140137437A (ja)
CN (1) CN104334312A (ja)
TW (1) TW201343296A (ja)
WO (1) WO2013138802A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106425112A (zh) * 2016-11-02 2017-02-22 国神光电科技（上海）有限公司 一种激光划片的方法及系统
TWI575253B (zh) * 2014-11-19 2017-03-21 Trumpf Laser-Und Systemtechnik Gmbh A diffractive optical beam forming element, an optical system for beam shaping of a laser beam, a laser processing apparatus for processing a material that can radically transmit a laser beam, and a laser beam to modify the material The laser beam material is used as a material handling method and a common elongated focusing area application

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
WO2014161534A2 (de) * 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Verfahren und vorrichtung zum einbringen von durchbrechungen in ein substrat sowie ein derart hergestelltes substrat
RU2551043C1 (ru) * 2013-11-07 2015-05-20 Общество С Ограниченной Ответственностью "Оптосистемы" Способ и устройство формирования прецизионных отверстий в оптически прозрачной пленке сверхкоротким импульсом лазерного излучения
US10005152B2 (en) * 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
MX2017000440A (es) * 2014-07-11 2017-08-16 Corning Inc Sistemas y metodos para cortado de vidrio al inducir perforaciones por láser pulsado en artículos de vidrio.
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
EP3169476A1 (en) 2014-07-14 2017-05-24 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
KR20170028943A (ko) 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
US9617180B2 (en) * 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
EP3221727B1 (de) 2014-11-19 2021-03-17 Trumpf Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
US20160158890A1 (en) * 2014-12-05 2016-06-09 Solarcity Corporation Systems and methods for scribing photovoltaic structures
KR20170105562A (ko) * 2015-01-12 2017-09-19 코닝 인코포레이티드 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
CN107922237B (zh) 2015-03-24 2022-04-01 康宁股份有限公司 显示器玻璃组合物的激光切割和加工
CN107666983B (zh) 2015-03-27 2020-10-02 康宁股份有限公司 可透气窗及其制造方法
EP3319911B1 (en) 2015-07-10 2023-04-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
CN106392334B (zh) * 2015-07-29 2020-01-07 大族激光科技产业集团股份有限公司 一种透明硬脆材料激光贯穿切割装置以及切割方法
JP6549014B2 (ja) * 2015-10-13 2019-07-24 株式会社ディスコ 光デバイスウエーハの加工方法
US20190009362A1 (en) * 2015-12-22 2019-01-10 Heraeus Deutschland GmbH & Co. KG Method for producing a metal-ceramic substrate with picolaser
JP6369454B2 (ja) * 2015-12-24 2018-08-08 トヨタ自動車株式会社 レーザー溶接装置
WO2017192835A1 (en) 2016-05-06 2017-11-09 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
CN106102986B (zh) 2016-06-08 2018-06-12 大族激光科技产业集团股份有限公司 用于切割蓝宝石的方法及其装置
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
EP3490945B1 (en) 2016-07-29 2020-10-14 Corning Incorporated Methods for laser processing
CN110121398B (zh) 2016-08-30 2022-02-08 康宁股份有限公司 透明材料的激光加工
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
EP3697564B1 (en) * 2017-11-20 2023-10-18 IPG Photonics Corporation System and method laser for processing of materials
CN107945136B (zh) * 2017-12-04 2021-09-24 深圳市路畅科技股份有限公司 一种鱼眼图像矫正方法、系统、设备及计算机存储介质
FI3731991T3 (fi) 2017-12-29 2023-05-11 Corelase Oy Laserprosessointilaite ja -menetelmä
DE102018126381A1 (de) * 2018-02-15 2019-08-22 Schott Ag Verfahren und Vorrichtung zum Einfügen einer Trennlinie in ein transparentes sprödbrüchiges Material, sowie verfahrensgemäß herstellbares, mit einer Trennlinie versehenes Element
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN111151895A (zh) * 2020-01-13 2020-05-15 大族激光科技产业集团股份有限公司 一种利用成丝效应切割透明材料的工艺及系统
CN111215768B (zh) * 2020-01-16 2021-03-30 吉林大学 利用反球差校正进行纵向加工的方法及应用
TWI794589B (zh) * 2020-02-21 2023-03-01 海納光電股份有限公司 硬脆板材高溫環境加工裝置及方法
DE102021100675B4 (de) 2021-01-14 2022-08-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zum Zerteilen eines transparenten Werkstücks
CN113732511B (zh) * 2021-08-30 2023-01-06 中国科学院西安光学精密机械研究所 光纤表面包层微纳结构飞秒激光加工方法及装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967884A (en) * 1974-11-05 1976-07-06 Eastman Kodak Company Three element objective lens
JPH07117647B2 (ja) * 1992-05-25 1995-12-18 シーメンス アクチエンゲゼルシヤフト 走査対物レンズ
AU1975197A (en) * 1996-02-28 1997-10-01 Kenneth C. Johnson Microlens scanner for microlithography and wide-field confocal microscopy
US8247731B2 (en) * 2002-02-25 2012-08-21 Board Of Regents Of The University Of Nebraska Laser scribing and machining of materials
DE60335538D1 (de) * 2002-03-12 2011-02-10 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
FR2855084A1 (fr) * 2003-05-22 2004-11-26 Air Liquide Optique de focalisation pour le coupage laser
JP4917257B2 (ja) * 2004-11-12 2012-04-18 浜松ホトニクス株式会社 レーザ加工方法
DE102006042280A1 (de) * 2005-09-08 2007-06-06 IMRA America, Inc., Ann Arbor Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
JP4813985B2 (ja) * 2006-06-23 2011-11-09 株式会社ディスコ ウエーハの加工条件設定方法
EP2105239B1 (en) * 2006-11-30 2016-01-13 Sumitomo Electric Industries, Ltd. Light condensing optical system, laser processing method and apparatus, and method of manufacturing fragile material
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
JP2010050175A (ja) * 2008-08-20 2010-03-04 Disco Abrasive Syst Ltd レーザー加工方法及びレーザー加工装置
JP2010158686A (ja) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法
JP5241525B2 (ja) * 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置
WO2011071886A1 (en) * 2009-12-07 2011-06-16 J.P. Sercel Associates, Inc. Laser machining and scribing systems and methods
JP5452247B2 (ja) * 2010-01-21 2014-03-26 東芝機械株式会社 レーザダイシング装置
JP5614739B2 (ja) * 2010-02-18 2014-10-29 国立大学法人埼玉大学 基板内部加工装置および基板内部加工方法
CN102230983A (zh) * 2011-06-17 2011-11-02 山西飞虹激光科技有限公司 用于激光加工的光学元件及激光加工设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI575253B (zh) * 2014-11-19 2017-03-21 Trumpf Laser-Und Systemtechnik Gmbh A diffractive optical beam forming element, an optical system for beam shaping of a laser beam, a laser processing apparatus for processing a material that can radically transmit a laser beam, and a laser beam to modify the material The laser beam material is used as a material handling method and a common elongated focusing area application
CN106425112A (zh) * 2016-11-02 2017-02-22 国神光电科技（上海）有限公司 一种激光划片的方法及系统
CN106425112B (zh) * 2016-11-02 2018-11-06 国神光电科技（上海）有限公司 一种激光划片的方法及系统

Also Published As

Publication number Publication date
EP2825344A1 (en) 2015-01-21
WO2013138802A1 (en) 2013-09-19
CN104334312A (zh) 2015-02-04
KR20140137437A (ko) 2014-12-02
JP2015519722A (ja) 2015-07-09
EP2825344A4 (en) 2016-02-17

Similar Documents

Publication Publication Date Title
TW201343296A (zh) 使一工件中具有延伸深度虛飾之雷射切割系統及方法
US20120234807A1 (en) Laser scribing with extended depth affectation into a workplace
TWI655986B (zh) 雷射加工方法
US20110132885A1 (en) Laser machining and scribing systems and methods
TWI652129B (zh) 多區段聚焦透鏡元件以及供切割或裁切晶圓之雷射加工系統之操作方法
TWI659793B (zh) 用於使用可調整雷射束焦線來處理透明材料的系統及方法
US8969220B2 (en) Methods and systems for laser processing of coated substrates
US20130256286A1 (en) Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
TWI647187B (zh) 自載體分離玻璃片的方法
Bovatsek et al. Highest-speed dicing of thin silicon wafers with nanosecond-pulse 355nm q-switched laser source using line-focus fluence optimization technique
KR20150112870A (ko) 레이저 가공 강화 유리
CN113601027A (zh) 一种双激光复合隐形切割方法及加工系统
JP6744624B2 (ja) 管状脆性部材の分断方法並びに分断装置
KR101271104B1 (ko) 다중 빔 사이에서 발생되는 ｖ-형상의 미세-크랙을 이용한 레이저 스크라이빙 장치 및 레이저 스크라이빙 방법
TW201446378A (zh) 使用散光加長型光束點以及使用超短脈波及／或較長波長的雷射處理方法
JP2020021968A (ja) 半導体加工対象物のスクライブ方法
KR20150127844A (ko) 기판 절단 장치 및 방법
JP6787617B2 (ja) 管状脆性部材の分断方法並びに分断装置
Bovatsek et al. Ultrashort pulse micromachining with the 10-μJ FCPA fiber laser
KR20130112111A (ko) 레이저 가공방법