CN104272443A - 一种薄膜晶体管及其像素单元的制造方法 - Google Patents
一种薄膜晶体管及其像素单元的制造方法 Download PDFInfo
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- CN104272443A CN104272443A CN201380000480.5A CN201380000480A CN104272443A CN 104272443 A CN104272443 A CN 104272443A CN 201380000480 A CN201380000480 A CN 201380000480A CN 104272443 A CN104272443 A CN 104272443A
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- 239000010409 thin film Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 138
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 138
- 239000002184 metal Substances 0.000 claims abstract description 111
- 230000004888 barrier function Effects 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000010410 layer Substances 0.000 claims description 355
- 238000005530 etching Methods 0.000 claims description 100
- 239000012212 insulator Substances 0.000 claims description 91
- 229920002120 photoresistant polymer Polymers 0.000 claims description 48
- 238000002161 passivation Methods 0.000 claims description 41
- 238000001465 metallisation Methods 0.000 claims description 38
- 238000003860 storage Methods 0.000 claims description 29
- 230000015572 biosynthetic process Effects 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 15
- 229910004205 SiNX Inorganic materials 0.000 claims description 11
- 238000009832 plasma treatment Methods 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 7
- 238000005984 hydrogenation reaction Methods 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical class N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 8
- 230000003071 parasitic effect Effects 0.000 abstract description 6
- 230000000717 retained effect Effects 0.000 abstract 1
- 238000001259 photo etching Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910007541 Zn O Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
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- H—ELECTRICITY
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
- H01L21/441—Deposition of conductive or insulating materials for electrodes
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/469—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/4763—Deposition of non-insulating, e.g. conductive -, resistive -, layers on insulating layers; After-treatment of these layers
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
公开了一种薄膜晶体管及其像素单元的制造方法,制造所述薄膜晶体管时经由同一掩膜版(6)刻蚀基板(1)上部分刻蚀阻挡层(5)、栅极金属层(4)和栅极绝缘层(3),保留位于栅极区的金属氧化物层(2)、栅极绝缘层(3)、栅极金属层(4)和刻蚀阻挡层(5)以及位于源极区和漏极区用以形成接触过孔部分的金属氧化物层(2)、栅极绝缘层(3)和栅极金属层(4),如此一次确定栅极(11)、源漏极(12,13)和源漏极接触过孔(9,10)的位置,并使后续通过材料替换形成的源极接触过孔(9)和漏极接触过孔(10)与栅极(11)的间距相等,从而使源漏极(12,13)与栅极(11)自对准和源漏极接触过孔(9,10)与栅极(11)自对准且对称,由此制成的薄膜晶体管不易发生短路、断路,寄生电容小,所制电路运行速度快。另外,本工艺适于薄膜晶体管像素单元制造。
Description
PCT国内申请,说明书已公开。
Claims (12)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2013/071471 WO2014121469A1 (zh) | 2013-02-06 | 2013-02-06 | 一种薄膜晶体管及其像素单元的制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN104272443A true CN104272443A (zh) | 2015-01-07 |
CN104272443B CN104272443B (zh) | 2016-11-30 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020199287A1 (zh) * | 2019-04-04 | 2020-10-08 | 深圳市华星光电技术有限公司 | 顶发光型氧化铟镓锌薄膜晶体管器件制造方法 |
CN111987137A (zh) * | 2020-09-10 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | 柔性面板及其制备方法 |
CN112230798A (zh) * | 2020-10-14 | 2021-01-15 | 京东方科技集团股份有限公司 | 显示面板及制作方法、显示设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6136625A (en) * | 1991-05-08 | 2000-10-24 | Seiko Epson Corporation | Method of manufacturing an active matrix panel |
CN101071816A (zh) * | 2006-05-12 | 2007-11-14 | Lg.菲利浦Lcd株式会社 | 多晶硅薄膜晶体管阵列基板及其制造方法 |
CN102437059A (zh) * | 2011-12-06 | 2012-05-02 | 北京大学 | 一种顶栅自对准氧化锌薄膜晶体管的制备方法 |
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6136625A (en) * | 1991-05-08 | 2000-10-24 | Seiko Epson Corporation | Method of manufacturing an active matrix panel |
CN101071816A (zh) * | 2006-05-12 | 2007-11-14 | Lg.菲利浦Lcd株式会社 | 多晶硅薄膜晶体管阵列基板及其制造方法 |
CN102437059A (zh) * | 2011-12-06 | 2012-05-02 | 北京大学 | 一种顶栅自对准氧化锌薄膜晶体管的制备方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020199287A1 (zh) * | 2019-04-04 | 2020-10-08 | 深圳市华星光电技术有限公司 | 顶发光型氧化铟镓锌薄膜晶体管器件制造方法 |
CN111987137A (zh) * | 2020-09-10 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | 柔性面板及其制备方法 |
CN112230798A (zh) * | 2020-10-14 | 2021-01-15 | 京东方科技集团股份有限公司 | 显示面板及制作方法、显示设备 |
CN112230798B (zh) * | 2020-10-14 | 2024-03-15 | 京东方科技集团股份有限公司 | 显示面板及制作方法、显示设备 |
Also Published As
Publication number | Publication date |
---|---|
US9583519B2 (en) | 2017-02-28 |
US20160126263A1 (en) | 2016-05-05 |
US20150349098A1 (en) | 2015-12-03 |
WO2014121469A1 (zh) | 2014-08-14 |
US9269796B2 (en) | 2016-02-23 |
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Address after: 518057 Guangdong city of Shenzhen province Nanshan District South Road 29, students start building room 2005 Patentee after: Shenzhen Ruoyu Technology Co.,Ltd. Address before: 518057 Guangdong city of Shenzhen province Nanshan District South Road 29, students start building room 2005 Patentee before: SHENZHEN ROYOLE TECHNOLOGIES Co.,Ltd. |