CN104162908B - 具有清洁功能的板材切断装置 - Google Patents
具有清洁功能的板材切断装置 Download PDFInfo
- Publication number
- CN104162908B CN104162908B CN201410203637.0A CN201410203637A CN104162908B CN 104162908 B CN104162908 B CN 104162908B CN 201410203637 A CN201410203637 A CN 201410203637A CN 104162908 B CN104162908 B CN 104162908B
- Authority
- CN
- China
- Prior art keywords
- sheet material
- air
- cut
- quality assurance
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Details Of Cutting Devices (AREA)
- Cleaning In General (AREA)
- Prevention Of Fouling (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013104140A JP5806702B2 (ja) | 2013-05-16 | 2013-05-16 | クリーン機能を備えた板材切断装置 |
JP2013-104140 | 2013-05-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104162908A CN104162908A (zh) | 2014-11-26 |
CN104162908B true CN104162908B (zh) | 2018-03-30 |
Family
ID=51906987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410203637.0A Active CN104162908B (zh) | 2013-05-16 | 2014-05-15 | 具有清洁功能的板材切断装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5806702B2 (ja) |
CN (1) | CN104162908B (ja) |
HK (1) | HK1203893A1 (ja) |
TW (1) | TWI627145B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105060694A (zh) * | 2015-08-31 | 2015-11-18 | 苏州凯锝微电子有限公司 | 一种玻璃切割装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2661117B1 (fr) * | 1990-04-24 | 1994-09-30 | Commissariat Energie Atomique | Procede de protection de surfaces contre la contamination particulaire ambiante a l'aide d'elements soufflants. |
JP2857003B2 (ja) * | 1993-02-10 | 1999-02-10 | シャープ株式会社 | 液晶表示基板の分断方法 |
CA2099711A1 (en) * | 1993-06-29 | 1994-12-30 | Kevin Peter Kowalchuk | Method and apparatus for cleaning optical surfaces |
JPH08116120A (ja) * | 1994-10-13 | 1996-05-07 | Hitachi Cable Ltd | 基板材料の加工方法及びその装置 |
JPH08141764A (ja) * | 1994-11-16 | 1996-06-04 | Hitachi Ltd | レーザ切断方法 |
JPH1111966A (ja) * | 1997-06-20 | 1999-01-19 | Toshiba Corp | スクライブ装置及びスクライブ方法 |
TW526527B (en) * | 2001-01-04 | 2003-04-01 | Applied Materials Inc | Method and apparatus for critical flow particle removal |
JP4296729B2 (ja) * | 2001-07-17 | 2009-07-15 | 富士フイルム株式会社 | ウェブの防塵装置 |
JP2003063643A (ja) * | 2001-08-30 | 2003-03-05 | Nippon Sekkei Kogyo:Kk | 薄板の搬送方法及び装置 |
US6676770B2 (en) * | 2002-03-19 | 2004-01-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for removing particles from wafer pods |
JP3813162B2 (ja) * | 2004-08-05 | 2006-08-23 | 株式会社神戸製鋼所 | 付着物除去装置 |
JP2007331074A (ja) * | 2006-06-16 | 2007-12-27 | Fujifilm Corp | テープ製造方法およびテープ製造装置 |
JP5153296B2 (ja) * | 2007-10-31 | 2013-02-27 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP5256554B2 (ja) * | 2008-07-18 | 2013-08-07 | 株式会社シライテック | 液晶パネルの割断装置 |
JP5550107B2 (ja) * | 2010-03-15 | 2014-07-16 | 株式会社シライテック | Lcdパネルuv硬化前基板のエッジカット加工装置 |
-
2013
- 2013-05-16 JP JP2013104140A patent/JP5806702B2/ja active Active
-
2014
- 2014-04-30 TW TW103115549A patent/TWI627145B/zh active
- 2014-05-15 CN CN201410203637.0A patent/CN104162908B/zh active Active
-
2015
- 2015-05-19 HK HK15104772.9A patent/HK1203893A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014223701A (ja) | 2014-12-04 |
TWI627145B (zh) | 2018-06-21 |
JP5806702B2 (ja) | 2015-11-10 |
TW201505982A (zh) | 2015-02-16 |
HK1203893A1 (en) | 2015-11-06 |
CN104162908A (zh) | 2014-11-26 |
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