CN104159872A - 接合体及半导体模块 - Google Patents

接合体及半导体模块 Download PDF

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Publication number
CN104159872A
CN104159872A CN201280060767.2A CN201280060767A CN104159872A CN 104159872 A CN104159872 A CN 104159872A CN 201280060767 A CN201280060767 A CN 201280060767A CN 104159872 A CN104159872 A CN 104159872A
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China
Prior art keywords
mass
glass
metal
bonding
bonding member
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Pending
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CN201280060767.2A
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English (en)
Chinese (zh)
Inventor
泽井裕一
内藤孝
青柳拓也
藤枝正
森睦宏
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Hitachi Ltd
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Hitachi Ltd
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Publication of CN104159872A publication Critical patent/CN104159872A/zh
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
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    • H10H20/80—Constructional details
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    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
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    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
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    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
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    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
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    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Structural Engineering (AREA)
  • Die Bonding (AREA)
  • Glass Compositions (AREA)
  • Structure Of Printed Boards (AREA)
  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201280060767.2A 2012-01-26 2012-11-21 接合体及半导体模块 Pending CN104159872A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-013663 2012-01-26
JP2012013663A JP5732414B2 (ja) 2012-01-26 2012-01-26 接合体および半導体モジュール
PCT/JP2012/080121 WO2013111434A1 (ja) 2012-01-26 2012-11-21 接合体および半導体モジュール

Publications (1)

Publication Number Publication Date
CN104159872A true CN104159872A (zh) 2014-11-19

Family

ID=48873175

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280060767.2A Pending CN104159872A (zh) 2012-01-26 2012-11-21 接合体及半导体模块

Country Status (7)

Country Link
US (1) US9196563B2 (https=)
JP (1) JP5732414B2 (https=)
KR (1) KR101572774B1 (https=)
CN (1) CN104159872A (https=)
DE (1) DE112012005758B4 (https=)
TW (1) TWI489594B (https=)
WO (1) WO2013111434A1 (https=)

Cited By (3)

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CN106025054A (zh) * 2016-06-29 2016-10-12 海宁市智慧光电有限公司 一种高可靠性超亮片式led光源
CN107683016A (zh) * 2017-11-21 2018-02-09 生益电子股份有限公司 一种快速散热pcb
CN109456076A (zh) * 2017-09-06 2019-03-12 阔斯泰公司 硅玻璃部件、其制造方法及陶瓷与硅玻璃的接合方法

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JP5726698B2 (ja) 2011-07-04 2015-06-03 株式会社日立製作所 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品
JP5844299B2 (ja) 2013-03-25 2016-01-13 株式会社日立製作所 接合材、接合構造体
CN105683111B (zh) * 2013-12-04 2018-09-14 株式会社日立制作所 密封结构体、及密封结构体的制造方法
US9966353B2 (en) * 2013-12-25 2018-05-08 Mitsubishi Materials Corporation Power module substrate, method of producing same, and power module
US10177069B2 (en) 2014-09-19 2019-01-08 Hitachi Ltd. Heat-dissipating structure and semiconductor module using same
EP3236495B1 (en) * 2014-12-16 2019-09-11 Kyocera Corporation Circuit substrate and electronic device
DE102015104518B3 (de) * 2015-03-25 2016-03-10 Infineon Technologies Ag Verfahren zur Herstellung einer Schaltungsträgeranordnung mit einem Träger, der eine durch ein Aluminium-Siliziumkarbid-Metallmatrixkompositmaterial gebildete Oberfläche aufweist
WO2016163377A1 (ja) * 2015-04-09 2016-10-13 ナミックス株式会社 接合体の製造方法
CN108257929B (zh) * 2016-12-29 2020-06-19 比亚迪股份有限公司 一种散热基板及其制备方法和应用以及电子元器件
KR102217222B1 (ko) * 2019-01-30 2021-02-19 엘지전자 주식회사 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체
DE102023108698A1 (de) * 2023-04-05 2024-10-10 Danfoss Silicon Power Gmbh Baugruppe zur Bereitstellung elektronischer Funktionalitäten und Mittel zur Qualitätssicherung einer Fixierschicht davon

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JPH05175254A (ja) * 1991-12-20 1993-07-13 Nippon Electric Glass Co Ltd 低融点接着組成物
JPH08259262A (ja) * 1995-03-20 1996-10-08 Nippon Electric Glass Co Ltd 低融点封着用組成物
CN101164942A (zh) * 2006-10-19 2008-04-23 北京印刷学院 一种无铅碲酸盐低熔封接玻璃
CN101781090A (zh) * 2009-01-16 2010-07-21 日立粉末冶金株式会社 低软化点玻璃组合物、使用该组合物的低温封接材料及电子部件

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JPH08107166A (ja) * 1994-10-06 1996-04-23 Mitsubishi Materials Corp 放熱用フィン
WO2003007370A1 (fr) * 2001-07-12 2003-01-23 Hitachi, Ltd. Substrat de cablage en verre et procede de fabrication associe, pate conductrice et module de semi-conducteurs utilises pour ce substrat de cablage en verre, ainsi que procede de formation d'un substrat de cablage et d'un conducteur
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US20150008573A1 (en) 2015-01-08
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US9196563B2 (en) 2015-11-24
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