CN104137335A - Rfid天线模块和方法 - Google Patents
Rfid天线模块和方法 Download PDFInfo
- Publication number
- CN104137335A CN104137335A CN201380008129.0A CN201380008129A CN104137335A CN 104137335 A CN104137335 A CN 104137335A CN 201380008129 A CN201380008129 A CN 201380008129A CN 104137335 A CN104137335 A CN 104137335A
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- Prior art keywords
- antenna
- chip
- module
- substrate
- card
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- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261595088P | 2012-02-05 | 2012-02-05 | |
| US61/595,088 | 2012-02-05 | ||
| EPPCT/EP2012/066183 | 2012-08-20 | ||
| PCT/EP2012/066183 WO2013034426A1 (en) | 2011-09-11 | 2012-08-20 | Rfid antenna modules and methods of making |
| US201261693262P | 2012-08-25 | 2012-08-25 | |
| US61/693,262 | 2012-08-25 | ||
| US201261704624P | 2012-09-24 | 2012-09-24 | |
| US61/704,624 | 2012-09-24 | ||
| PCT/EP2013/052200 WO2013113945A1 (en) | 2012-02-05 | 2013-02-05 | Rfid antenna modules and methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104137335A true CN104137335A (zh) | 2014-11-05 |
Family
ID=48904432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380008129.0A Pending CN104137335A (zh) | 2012-02-05 | 2013-02-05 | Rfid天线模块和方法 |
Country Status (8)
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104866895A (zh) * | 2015-06-11 | 2015-08-26 | 飞天诚信科技股份有限公司 | 一种智能卡及其制造方法 |
| CN104881701A (zh) * | 2015-06-11 | 2015-09-02 | 飞天诚信科技股份有限公司 | 一种智能卡及其制造方法 |
| CN105808000A (zh) * | 2016-03-10 | 2016-07-27 | 昆山维信诺科技有限公司 | Oled显示装置及制作方法 |
| CN107423802A (zh) * | 2016-04-12 | 2017-12-01 | 英飞凌科技股份有限公司 | 芯片卡和用于制造芯片卡的方法 |
| CN107546181A (zh) * | 2017-08-18 | 2018-01-05 | 华进半导体封装先导技术研发中心有限公司 | 雷达组件封装体 |
| CN109417220A (zh) * | 2016-07-27 | 2019-03-01 | 英特尔公司 | 具有可拆离式天线支持的可穿戴电子设备 |
| US11005180B2 (en) | 2016-03-10 | 2021-05-11 | Suzhou Qingyue Optoelectronics Technology Co., Ltd. | Display device having NFC communication function |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2840530A1 (fr) * | 2013-08-23 | 2015-02-25 | Gemalto SA | Dispositif électronique à mémoire |
| FR3013483B1 (fr) * | 2013-11-15 | 2015-12-25 | Oberthur Technologies | Procede de fabrication d'un dispositif radiofrequence et carte rfid associee |
| KR101892689B1 (ko) * | 2014-10-14 | 2018-08-28 | 삼성전기주식회사 | 칩 전자부품 및 칩 전자부품의 실장 기판 |
| JP2016212778A (ja) * | 2015-05-13 | 2016-12-15 | 凸版印刷株式会社 | デュアルインターフェース通信媒体 |
| JP2018097724A (ja) * | 2016-12-15 | 2018-06-21 | 凸版印刷株式会社 | Ｉｃモジュール、およびｉｃモジュールを搭載した媒体 |
| CN107275304A (zh) * | 2017-06-28 | 2017-10-20 | 山东齐芯微系统科技股份有限公司 | Fcos条带引线键合工艺 |
| US11108156B2 (en) * | 2017-09-27 | 2021-08-31 | Intel Corporation | Differential on-chip loop antenna |
| JP2020136391A (ja) * | 2019-02-15 | 2020-08-31 | 株式会社村田製作所 | 巻線型インダクタ部品 |
| JP6801739B2 (ja) * | 2019-04-18 | 2020-12-16 | 株式会社村田製作所 | アンテナモジュール及び通信装置 |
| WO2024232309A1 (ja) * | 2023-05-11 | 2024-11-14 | Ｔｏｐｐａｎホールディングス株式会社 | Ｉｃモジュール及びｉｃカード |
Citations (5)
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| CN1278936A (zh) * | 1997-11-14 | 2001-01-03 | 凸版印刷株式会社 | 复合ic模块及复合ic卡 |
| US6424301B1 (en) * | 2000-03-01 | 2002-07-23 | Siemens Vdo Automotive Corporation | Combination battery holder and antenna for keyfob |
| US20090315320A1 (en) * | 2006-09-26 | 2009-12-24 | Advanced Microelectronic And Automation Technology Ltd. | Inlays for security documents |
| CN101946254A (zh) * | 2008-02-22 | 2011-01-12 | 凸版印刷株式会社 | 应答器及册子体 |
| WO2011129347A1 (ja) * | 2010-04-13 | 2011-10-20 | 日立金属株式会社 | 三軸アンテナ及びそれに用いるコア組立体 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5084699A (en) | 1989-05-26 | 1992-01-28 | Trovan Limited | Impedance matching coil assembly for an inductively coupled transponder |
| DE69011292T2 (de) | 1989-07-03 | 1995-03-16 | Sokymat S A | Verfahren zur herstellung von elektronischen komponenten mit einer spule aus dünndraht. |
| DE3935364C1 (enrdf_load_stackoverflow) | 1989-10-24 | 1990-08-23 | Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De | |
| WO1991016718A1 (fr) | 1990-04-19 | 1991-10-31 | Ake Gustafson | Procede d'assemblage d'une bobine sur un circuit imprime |
| CA2101850C (fr) | 1991-02-25 | 1999-06-29 | Ake Gustafson | Procede de fixation d'un bobinage a un circuit electronique |
| CH684642A5 (fr) | 1991-02-25 | 1994-11-15 | Ake Gustafson | Pince de maintien d'un corps de bobine dans une machine de bobinage. |
| NL9100347A (nl) | 1991-02-26 | 1992-03-02 | Nedap Nv | Geintegreerde transformator voor een contactloze identificatiekaart. |
| US5249098A (en) | 1991-08-22 | 1993-09-28 | Lsi Logic Corporation | Semiconductor device package with solder bump electrical connections on an external surface of the package |
| DE4311493C2 (de) | 1993-04-07 | 2000-04-06 | Amatech Advanced Micromechanic | IC-Kartenmodul zur Herstellung einer IC-Karte |
| US5381848A (en) | 1993-09-15 | 1995-01-17 | Lsi Logic Corporation | Casting of raised bump contacts on a substrate |
| DE4403753C1 (de) | 1994-02-08 | 1995-07-20 | Angewandte Digital Elektronik | Kombinierte Chipkarte |
| DE4443980C2 (de) | 1994-12-11 | 1997-07-17 | Angewandte Digital Elektronik | Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren |
| US5955723A (en) | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
| DE19534480C2 (de) | 1995-09-18 | 1999-11-11 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul |
| KR100373063B1 (ko) | 1996-02-12 | 2003-05-12 | 만프레트 리츨러 | 와이어도체접속방법및장치 |
| WO1997030418A2 (de) | 1996-02-12 | 1997-08-21 | David Finn | Verfahren und vorrichtung zur kontaktierung eines drahtleiters |
| DE19654902C2 (de) | 1996-03-15 | 2000-02-03 | David Finn | Chipkarte |
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- 2013-02-05 CA CA2860936A patent/CA2860936A1/en not_active Abandoned
- 2013-02-05 JP JP2014555252A patent/JP2015511353A/ja active Pending
- 2013-02-05 KR KR1020147024677A patent/KR20140123562A/ko not_active Withdrawn
- 2013-02-05 CN CN201380008129.0A patent/CN104137335A/zh active Pending
- 2013-02-05 BR BR112014019291A patent/BR112014019291A8/pt not_active IP Right Cessation
- 2013-02-05 AU AU2013214133A patent/AU2013214133A1/en not_active Abandoned
- 2013-02-05 MX MX2014009459A patent/MX2014009459A/es not_active Application Discontinuation
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104866895A (zh) * | 2015-06-11 | 2015-08-26 | 飞天诚信科技股份有限公司 | 一种智能卡及其制造方法 |
| CN104881701A (zh) * | 2015-06-11 | 2015-09-02 | 飞天诚信科技股份有限公司 | 一种智能卡及其制造方法 |
| CN105808000A (zh) * | 2016-03-10 | 2016-07-27 | 昆山维信诺科技有限公司 | Oled显示装置及制作方法 |
| US11005180B2 (en) | 2016-03-10 | 2021-05-11 | Suzhou Qingyue Optoelectronics Technology Co., Ltd. | Display device having NFC communication function |
| CN107423802A (zh) * | 2016-04-12 | 2017-12-01 | 英飞凌科技股份有限公司 | 芯片卡和用于制造芯片卡的方法 |
| CN109417220A (zh) * | 2016-07-27 | 2019-03-01 | 英特尔公司 | 具有可拆离式天线支持的可穿戴电子设备 |
| CN109417220B (zh) * | 2016-07-27 | 2021-03-12 | 英特尔公司 | 具有可拆离式天线支持的可穿戴电子设备 |
| CN107546181A (zh) * | 2017-08-18 | 2018-01-05 | 华进半导体封装先导技术研发中心有限公司 | 雷达组件封装体 |
Also Published As
| Publication number | Publication date |
|---|---|
| MX2014009459A (es) | 2015-06-05 |
| AU2013214133A1 (en) | 2014-07-31 |
| KR20140123562A (ko) | 2014-10-22 |
| CA2860936A1 (en) | 2013-08-08 |
| BR112014019291A2 (enrdf_load_stackoverflow) | 2017-06-20 |
| JP2015511353A (ja) | 2015-04-16 |
| BR112014019291A8 (pt) | 2017-07-11 |
| WO2013113945A1 (en) | 2013-08-08 |
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