CN104117786B - 一种助焊剂 - Google Patents
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- CN104117786B CN104117786B CN201410361489.5A CN201410361489A CN104117786B CN 104117786 B CN104117786 B CN 104117786B CN 201410361489 A CN201410361489 A CN 201410361489A CN 104117786 B CN104117786 B CN 104117786B
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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Abstract
本发明涉及一种助焊剂，按质量百分比包括以下组分：2，3‑吡啶‑二甲酸1.0～3.0％、乳酸0.3～1.5％、苯甲酸0.3～1.1％、水杨酸0.2～0.8％、异佛尔酮4～10％、乳酸正丁酯6～12％、乙二醇5～15％、苯甲醇0.1～2.0％、表面活性剂0.5～2.0％、三乙醇胺0.3～1.5％,余量为乙醇。本发明将2，3‑吡啶二羧酸、乳酸、苯甲酸和水杨酸四种有机酸作为活化剂组合使用，可使活化剂的沸点或分解温度呈一个较大的区间分布，从而保持整个焊接过程中助焊剂都具有较高的活性，此外，助焊剂的活化温度与无铅焊料的熔点相适应，大大提高了无铅焊料的润湿性、防氧化性和焊接性能。
Description
技术领域
本发明涉及焊料技术领域，特别涉及一种助焊剂。
背景技术
在焊接过程中，被焊金属工件表面存在氧化物、灰尘等污垢，阻碍工件基体金属和焊料之间以原子状态相互扩散，因此必须清除氧化物等以使表面清洁露出金属基体，但是被清洁的金属基体表面的原子在大气中又立刻被氧化，在焊接温度下，氧化速度更快。所以在焊接过程中加入助焊剂，用来协助提供没有氧化层的金属表面，并保持这些表面的无氧化物状态，直到焊锡与金属表面完成焊接过程。同时依靠焊剂的化学作用，与被焊金属表面的氧化物化合，在焊接温度下形成液态化台物，使被焊金属部位表面的金属原子与熔融焊料的原子相互扩散，以达到锡焊连接的目的。在焊接过程中助焊剂还能减小液态焊料与被焊材料之间的表面张力，提高液态焊料流动、浸润的性能，使焊料合金能够很好地与被焊接材料结合并形成可靠焊点。
基于环境保护的要求和微电子器件高度集成化发展的需要，高性能无铅焊料的研究和开发成为电子工业界的热点。无铅焊料的应用对助焊剂的性能提出更高的要求，其质量直接影响焊接水平乃至整体产品的质量水平。因此研究开发与无铅焊料相匹配的新型助焊剂对于促进无铅焊料在电子工业领域的应用具有重要意义。
目前，国内开发的助焊剂普遍存在改善无铅焊料润湿性不足、可焊性不强、防止氧化和提高焊接性能效果不理想的缺陷，不能满足现有电子类产品向高性能、多引线、多元化和窄间距化方向发展的需求。
经检索，日本特开平11-077376号公报公布的专利名称为一种助焊剂，其是与焊料粉末混合而生成焊膏的助焊剂，所述助焊剂中包含满足以下条件的量的磷酸酯：焊接时吸附于形成助焊剂残渣的焊接部的表面，形成具有疏水性的覆膜。优选使磷酸酯的添加量为1％～30％。磷酸酯优选为磷酸-2-乙基己酯、磷酸单异癸酯、磷酸单丁酯、磷酸二丁酯、磷酸单月桂酯、磷酸单硬脂酯、磷酸单油醇酯、磷酸二十四烷酯或者双(2-乙基己基)磷酸酯的任意种。该发明在形成有助焊剂残渣的焊接部中，不仅仅依靠焊接部被助焊剂残渣覆盖，而能够可靠地抑制迁移的发生。但该发明不适用于微电子器件，焊接时需要进一步改善焊料润湿性能、提高焊接性能效果。
发明内容
为克服现有技术的缺陷，本发明要解决的技术问题是提供一种助焊剂，以现有助焊剂改善焊料润湿性能不理想、提高焊接性能效果不好的缺陷。
为实现上述技术问题，本发明提供一种助焊剂，按质量百分比包括以下组分：2，3-吡啶-二甲酸1.0～3.0％、乳酸0.3～1.5％、苯甲酸0.3～1.1％、水杨酸0.2～0.8％、异佛尔酮4～10％、乳酸正丁酯6～12％、乙二醇5～15％、苯甲醇0.1～2.0％、表面活性剂0.5～2.0％、三乙醇胺0.3～1.5％,余量为乙醇。
优选的，所述助焊剂按质量百分比包括以下组分：2，3-吡啶-二甲酸1.5～2.5％、乳酸0.5～1.0％、苯甲酸0.5～0.9％、水杨酸0.5～0.7％、异佛尔酮5～8％、乳酸正丁酯8～10％、乙二醇7～11％、苯甲醇0.5～1.5％、表面活性剂0.8～1.2％、三乙醇胺0.5～1.0％,余量为乙醇。
优选的，所述还包括水杨酸钠0.8～1.5％和苯甲酸钠0.4～1.5％。
优选的，所述所述表面活性剂为双(2-乙基己基)琥珀酸酯磺酸钠、吐温、十二烷基苯磺酸钠中的任一种。
与现有技术相比，本发明所具有的有益效果为：把2，3-吡啶二羧酸、乳酸、苯甲酸和水杨酸四种有机酸作为活化剂组合使用，可使活化剂的沸点或分解温度呈一个较大的区间分布，从而保持整个焊接过程中助焊剂都具有较高的活性，此外，助焊剂的活化温度与无铅焊料的熔点相适应，大大提高了无铅焊料的润湿性、防氧化性和焊接性能。
具体实施方式
下面结合具体实施方式对本发明的技术方案作进一步具体说明。
实施例1
一种助焊剂，按质量百分比包括以下组分：2，3-吡啶-二甲酸1.0％、乳酸0.3％、苯甲酸0.3％、水杨酸0.2％、异佛尔酮4％、乳酸正丁酯6％、乙二醇5％、苯甲醇0.3％、表面活性剂0.5％、三乙醇胺0.3％,余量为乙醇。该组分中，2，3-吡啶-二甲酸、乳酸、苯甲酸和水杨酸是活化剂，用于除去引线脚上的氧化物和熔融焊料表面的氧化物,是助焊剂的关键成分之一。其中，2，3-吡啶-二甲酸是一种二元酸，酸性较强，乳酸、水杨酸都是羟基酸，苯甲酸一种芳香酸，具有一般有机羧酸的化学性质，热稳定性好，羟基酸因为分子中含有羟基和羧基两种官能团具有羟基和羧基的一般性质，而且由于羟基酸分子中羟基是吸电基具有吸电子诱导效应，使羧基的离解度增加酸性比相应的羧酸强。因为这些有机酸的沸点或分解温度有一定的差别,把多种有机酸活化剂组合使用,可使活化剂的沸点或分解温度呈一个较大的区间分布,保持整个焊接过程中助焊剂都具有较高的活性,同时助焊剂的活化温度与无铅焊料合金的熔点相适应,改善了无铅焊料润湿性、防止氧化和提高焊接性能的效果。乙醇为溶剂，主要作用是溶解助焊剂中的固体成分,使之形成均匀的溶液,便于待焊元件均匀涂布适量的助焊剂成分,同时它还可以清洗轻的脏物和金属表面的油污。异佛尔酮、乳酸正丁酯和乙二醇为助溶剂，能够阻止活化剂等固体成分从溶液中脱溶的趋势,避免活化剂不良的非均匀分布。苯甲醇为成膜剂，在引线脚焊锡过程中,所涂复的助焊剂沉淀、结晶,形成一层均匀的膜,可使高温分解后的残余物因快速固化、硬化、减小粘性。表面活性剂的主要功能是减小焊料与引线脚金属两者接触时产生的表面张力,增强表面润湿力,增强有机酸活化剂的渗透力,也可起发泡剂的作用。在此，表面活性剂可以选择双(2-乙基己基)琥珀酸酯磺酸钠或吐温，如果选择十二烷基苯磺酸钠则效果更好。三乙醇胺是缓蚀剂，能够减少活化剂等固体成分在高温分解后残留的物质。
实施例2
一种助焊剂，按质量百分比包括以下组分：2，3-吡啶-二甲酸3.0％、乳酸1.5％、苯甲酸1.1％、水杨酸0.8％、水杨酸钠0.8％、异佛尔酮10％、乳酸正丁酯12％、乙二醇15％、苯甲醇1.9％、表面活性剂2.1％、三乙醇胺0.3～1.5％,余量为乙醇。在此，加入的水杨酸钠可以和水杨酸配合，起着助溶剂的作用，能使助焊剂中的固态物质更加快速、充分的溶解。
实施例3
一种助焊剂，按质量百分比包括以下组分：2，3-吡啶-二甲酸2.0％、乳酸0.9％、苯甲酸0.7％、苯甲酸钠0.4、水杨酸0.5％、异佛尔酮7％、乳酸正丁酯9％、乙二醇10％(助溶剂)、苯甲醇1.1％、表面活性剂1.3％、三乙醇胺0.9％(缓蚀剂),余量为乙醇。在此，加入的苯甲酸钠可以和苯甲酸配合，起着助溶剂的作用，能使助焊剂中的固态物质更加快速、充分的溶解。
实施例4
一种助焊剂，按质量百分比包括以下组分：2，3-吡啶-二甲酸1.5％、乳酸0.5％、苯甲酸0.5％、苯甲酸钠0.4％、水杨酸0.5％、水杨酸钠0.8％、异佛尔酮5％、乳酸正丁酯8％、乙二醇7％、苯甲醇0.5％、表面活性剂0.8％、三乙醇胺0.5％,余量为乙醇。
实施例5
一种助焊剂，按质量百分比包括以下组分：2，3-吡啶-二甲酸2.5％、乳酸1.0％、苯甲酸0.9％、苯甲酸钠0.95％、水杨酸0.7％、水杨酸钠1.15％、异佛尔酮8％、乳酸正丁酯8～10％、乙二醇11％、苯甲醇1.5％、表面活性剂1.6％、三乙醇胺1.2％,余量为乙醇。
实施例6
一种助焊剂，按质量百分比包括以下组分：2，3-吡啶-二甲酸2.0％、乳酸0.75％、苯甲酸0.7％、苯甲酸钠1.5％、水杨酸0.6％、异佛尔酮6.5％、乳酸正丁酯9％、乙二醇9％、苯甲醇1.0％、表面活性剂1.2％、三乙醇胺0.85％,余量为乙醇。
实施例7
一种助焊剂，按质量百分比包括以下组分：2，3-吡啶-二甲酸1.5％、乳酸0.5％、苯甲酸0.5％、水杨酸0.5％、水杨酸钠1.5％、异佛尔酮5％、乳酸正丁酯8％、乙二醇7％、苯甲醇0.5％、表面活性剂0.8％、三乙醇胺0.5％,余量为乙醇。
以上各实施例所得到的助焊剂在较大温度范围内具有很高的活性和助焊能力，并且具有极好的防氧化效果，能够显著促进无铅焊料的润湿和铺展，提高焊接的质量，有利于促进无铅焊料在电子工业领域的应用。
最后所应说明的是，以上具体实施方式仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本实用新型进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围，其均应涵盖在本发明的权利要求范围当中。
Claims (4)
1.一种助焊剂，其特征在于，按质量百分比包括以下组分：2，3-吡啶-二甲酸1.0～3.0％、乳酸0.3～1.5％、苯甲酸0.3～1.1％、水杨酸0.2～0.8％、异佛尔酮4～10％、乳酸正丁酯6～12％、乙二醇5～15％、苯甲醇0.3～1.9％、表面活性剂0.6～2.0％、三乙醇胺0.3～1.5％,余量为乙醇。
2.根据权利要求1所述的助焊剂，其特征在于，按质量百分比包括以下组分：2，3-吡啶-二甲酸1.5～2.5％、乳酸0.5～1.0％、苯甲酸0.5～0.9％、水杨酸0.5～0.7％、异佛尔酮5～8％、乳酸正丁酯8～10％、乙二醇7～11％、苯甲醇0.5～1.5％、表面活性剂0.8～1.6％、三乙醇胺0.5～1.2％,余量为乙醇。
3.根据权利要求1所述的助焊剂，其特征在于：还包括水杨酸钠0.8～1.5％、苯甲酸钠0.4～1.5％的任一种或两种。
4.根据权利要求1或2所述的助焊剂，其特征在于：所述表面活性剂为双(2-乙基己基)琥珀酸酯磺酸钠、吐温或十二烷基苯磺酸钠中的任一种。
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