CN104112688B - 用于将电子或光学部件安装在基板上的方法和设备 - Google Patents

用于将电子或光学部件安装在基板上的方法和设备 Download PDF

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Publication number
CN104112688B
CN104112688B CN201410154273.1A CN201410154273A CN104112688B CN 104112688 B CN104112688 B CN 104112688B CN 201410154273 A CN201410154273 A CN 201410154273A CN 104112688 B CN104112688 B CN 104112688B
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CN
China
Prior art keywords
suction member
substrate
movement
correction value
force
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CN201410154273.1A
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English (en)
Chinese (zh)
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CN104112688A (zh
Inventor
翰尼斯·科斯特纳
安德鲁斯·迈尔
哈拉尔德·迈克斯纳
雨果·普里斯陶茨
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Besi Switzerland AG
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Besi Switzerland AG
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Publication of CN104112688A publication Critical patent/CN104112688A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H01L2224/75823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/7592—Load or pressure adjusting means, e.g. sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201410154273.1A 2013-04-19 2014-04-17 用于将电子或光学部件安装在基板上的方法和设备 Active CN104112688B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00800/13A CH707934B1 (de) 2013-04-19 2013-04-19 Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
CH00800/13 2013-04-19

Publications (2)

Publication Number Publication Date
CN104112688A CN104112688A (zh) 2014-10-22
CN104112688B true CN104112688B (zh) 2018-03-23

Family

ID=51709430

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410154273.1A Active CN104112688B (zh) 2013-04-19 2014-04-17 用于将电子或光学部件安装在基板上的方法和设备

Country Status (8)

Country Link
US (1) US20140311652A1 (enExample)
JP (1) JP6418371B2 (enExample)
KR (1) KR102394745B1 (enExample)
CN (1) CN104112688B (enExample)
CH (1) CH707934B1 (enExample)
MY (1) MY172714A (enExample)
SG (1) SG10201400099TA (enExample)
TW (1) TWI588917B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136243B2 (en) 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
CN107896478A (zh) * 2017-10-11 2018-04-10 广州煌牌自动设备有限公司 一种可模块化的多轴贴片机
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland Ag Bondkopf für die Montage von Bauelementen.
US12046490B2 (en) 2017-11-17 2024-07-23 Besi Switzerland Ag Bonding head for mounting components and die bonder with such a bonding head
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
CN109216390A (zh) * 2018-08-28 2019-01-15 中国电子科技集团公司第十研究所 一种长线列双探测器芯片的倒装互连方法
US11552031B2 (en) * 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
TWI789924B (zh) * 2021-09-27 2023-01-11 友達光電股份有限公司 轉移設備及轉移方法
US12400994B2 (en) * 2021-11-02 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor placing in packaging
US12300660B2 (en) * 2022-01-27 2025-05-13 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a bonded semiconductor structure
CN119786413B (zh) * 2024-12-18 2025-10-17 迈为技术(珠海)有限公司 刺针设备的校正方法、装置、计算机设备和可读存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335222A (zh) * 2007-06-27 2008-12-31 新光电气工业株式会社 电子元件安装装置及制造电子器件的方法
CN101868140A (zh) * 2009-04-14 2010-10-20 阿森姆布里昂有限公司 适合于将构件放置在衬底上的装置及其方法

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Publication number Priority date Publication date Assignee Title
JPH0376236A (ja) * 1989-08-18 1991-04-02 Fujitsu Ltd ボンディング方法
JP3341855B2 (ja) * 1993-02-08 2002-11-05 東レエンジニアリング株式会社 ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置
JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP2000133995A (ja) * 1998-10-27 2000-05-12 Matsushita Electric Ind Co Ltd 部品装着方法とその装置
JP2002368495A (ja) * 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP4271475B2 (ja) * 2003-03-31 2009-06-03 株式会社ワコー 力検出装置
US7240711B2 (en) * 2004-01-21 2007-07-10 Asm Assembly Automation Ltd. Apparatus and method for alignment of a bonding tool
JP4280169B2 (ja) * 2004-01-23 2009-06-17 芝浦メカトロニクス株式会社 平行調整装置及び平行調整方法、ボンディング装置
JP4128156B2 (ja) * 2004-06-03 2008-07-30 松下電器産業株式会社 部品実装方法及び装置
KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법
JP5439068B2 (ja) * 2009-07-08 2014-03-12 株式会社ワコー 力検出装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335222A (zh) * 2007-06-27 2008-12-31 新光电气工业株式会社 电子元件安装装置及制造电子器件的方法
CN101868140A (zh) * 2009-04-14 2010-10-20 阿森姆布里昂有限公司 适合于将构件放置在衬底上的装置及其方法

Also Published As

Publication number Publication date
SG10201400099TA (en) 2014-11-27
TWI588917B (zh) 2017-06-21
CN104112688A (zh) 2014-10-22
KR102394745B1 (ko) 2022-05-04
CH707934B1 (de) 2017-04-28
JP2014212306A (ja) 2014-11-13
MY172714A (en) 2019-12-11
US20140311652A1 (en) 2014-10-23
KR20140125728A (ko) 2014-10-29
CH707934A1 (de) 2014-10-31
TW201442129A (zh) 2014-11-01
JP6418371B2 (ja) 2018-11-07

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