MY172714A - Method and apparatus for mounting electronic or optical components on a substrate - Google Patents

Method and apparatus for mounting electronic or optical components on a substrate

Info

Publication number
MY172714A
MY172714A MYPI2014700432A MYPI2014700432A MY172714A MY 172714 A MY172714 A MY 172714A MY PI2014700432 A MYPI2014700432 A MY PI2014700432A MY PI2014700432 A MYPI2014700432 A MY PI2014700432A MY 172714 A MY172714 A MY 172714A
Authority
MY
Malaysia
Prior art keywords
substrate
suction member
movement axis
component
optical components
Prior art date
Application number
MYPI2014700432A
Other languages
English (en)
Inventor
Hannes Kostner
Andreas Mayr
Harald Meixner
Hugo Pristauz
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of MY172714A publication Critical patent/MY172714A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H01L2224/75823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/7592—Load or pressure adjusting means, e.g. sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
MYPI2014700432A 2013-04-19 2014-02-25 Method and apparatus for mounting electronic or optical components on a substrate MY172714A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00800/13A CH707934B1 (de) 2013-04-19 2013-04-19 Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.

Publications (1)

Publication Number Publication Date
MY172714A true MY172714A (en) 2019-12-11

Family

ID=51709430

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014700432A MY172714A (en) 2013-04-19 2014-02-25 Method and apparatus for mounting electronic or optical components on a substrate

Country Status (8)

Country Link
US (1) US20140311652A1 (enExample)
JP (1) JP6418371B2 (enExample)
KR (1) KR102394745B1 (enExample)
CN (1) CN104112688B (enExample)
CH (1) CH707934B1 (enExample)
MY (1) MY172714A (enExample)
SG (1) SG10201400099TA (enExample)
TW (1) TWI588917B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136243B2 (en) 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
CN107896478A (zh) * 2017-10-11 2018-04-10 广州煌牌自动设备有限公司 一种可模块化的多轴贴片机
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland Ag Bondkopf für die Montage von Bauelementen.
US12046490B2 (en) 2017-11-17 2024-07-23 Besi Switzerland Ag Bonding head for mounting components and die bonder with such a bonding head
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
CN109216390A (zh) * 2018-08-28 2019-01-15 中国电子科技集团公司第十研究所 一种长线列双探测器芯片的倒装互连方法
US11552031B2 (en) * 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
TWI789924B (zh) * 2021-09-27 2023-01-11 友達光電股份有限公司 轉移設備及轉移方法
US12400994B2 (en) * 2021-11-02 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor placing in packaging
US12300660B2 (en) * 2022-01-27 2025-05-13 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a bonded semiconductor structure
CN119786413B (zh) * 2024-12-18 2025-10-17 迈为技术(珠海)有限公司 刺针设备的校正方法、装置、计算机设备和可读存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0376236A (ja) * 1989-08-18 1991-04-02 Fujitsu Ltd ボンディング方法
JP3341855B2 (ja) * 1993-02-08 2002-11-05 東レエンジニアリング株式会社 ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置
JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP2000133995A (ja) * 1998-10-27 2000-05-12 Matsushita Electric Ind Co Ltd 部品装着方法とその装置
JP2002368495A (ja) * 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP4271475B2 (ja) * 2003-03-31 2009-06-03 株式会社ワコー 力検出装置
US7240711B2 (en) * 2004-01-21 2007-07-10 Asm Assembly Automation Ltd. Apparatus and method for alignment of a bonding tool
JP4280169B2 (ja) * 2004-01-23 2009-06-17 芝浦メカトロニクス株式会社 平行調整装置及び平行調整方法、ボンディング装置
JP4128156B2 (ja) * 2004-06-03 2008-07-30 松下電器産業株式会社 部品実装方法及び装置
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
NL1036851C2 (nl) * 2009-04-14 2010-10-18 Assembléon B V Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.
KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법
JP5439068B2 (ja) * 2009-07-08 2014-03-12 株式会社ワコー 力検出装置

Also Published As

Publication number Publication date
SG10201400099TA (en) 2014-11-27
TWI588917B (zh) 2017-06-21
CN104112688A (zh) 2014-10-22
KR102394745B1 (ko) 2022-05-04
CH707934B1 (de) 2017-04-28
JP2014212306A (ja) 2014-11-13
US20140311652A1 (en) 2014-10-23
KR20140125728A (ko) 2014-10-29
CN104112688B (zh) 2018-03-23
CH707934A1 (de) 2014-10-31
TW201442129A (zh) 2014-11-01
JP6418371B2 (ja) 2018-11-07

Similar Documents

Publication Publication Date Title
MY172714A (en) Method and apparatus for mounting electronic or optical components on a substrate
EP4311502A3 (en) Bone positioning and preparing guide systems and methods
MX2011011598A (es) Metodo para corregir medidas de resistividad para efectos de flexion de herramienta.
MY185205A (en) Apparatus and method for positioning an electronic component and/or a carrier relative to a discharging device
MY165050A (en) Fracture determination method, fracture determination apparatus, program, and computer readable recording medium
PH12017500238A1 (en) An assembly and method for handling components
MY190497A (en) Power supply apparatus, electronic device, control method, program, and recording medium
WO2013120839A3 (en) Device for the magnetic-field-compensated positioning of a component
WO2012009379A3 (en) Optical adjustable mounts with absolute position feedback
WO2012051979A3 (de) Vorrichtung zum herstellen, reparieren und/oder austauschen eines bauteils mittels eines durch energiestrahlung verfestigbaren pulvers, sowie ein verfahren und ein gemäss dem verfahren hergestelltes bauteil
MX341159B (es) Metodo y equipo para alinear puertas de caja de un ascensor.
MY160373A (en) Bonding structure and method
WO2012062253A3 (de) Vorrichtung zum herstellen, reparieren und/oder austauschen eines bauteils mittels eines durch energiestrahlung verfestigbaren pulvers, sowie ein verfahren und ein gemäss dem verfahren hergestellten bauteils
EP2492961A3 (en) Method for reducing tilt of transparent window during manufacturing of image sensor
MY183739A (en) Kinematic holding system for a placement head of a placement apparatus
NZ709763A (en) Method for measuring a rotor blade angle
PH12015500483A1 (en) Method of dispensing material based on edge detection
ATE554536T1 (de) Verfahren und vorrichtung zur elektronischen kommunikation zwischen wenigstens zwei kommunikationsgeräten
WO2013025528A3 (en) Method and apparatus for calibrating deep-reading multi-component induction tools with minimal ground effects
HK1209267A2 (en) A system and method for extracting electronic components
WO2016131675A3 (en) Surgical guidance device and method for its preparation
EP3636052A4 (en) ELECTRONIC DEVICE, METHOD AND EQUIPMENT FOR MANUFACTURING AN ELECTRONIC DEVICE AND COMPOSITION THEREFORE
WO2018227072A8 (en) Cutting apparatus
MY162473A (en) A laser apparatus and a method of directing laser to a workpiece surface
WO2016037694A8 (en) Method and device for applying solder paste flux