CN104093799B - 电路连接材料、连接结构体及其制造方法 - Google Patents

电路连接材料、连接结构体及其制造方法 Download PDF

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Publication number
CN104093799B
CN104093799B CN201380008376.0A CN201380008376A CN104093799B CN 104093799 B CN104093799 B CN 104093799B CN 201380008376 A CN201380008376 A CN 201380008376A CN 104093799 B CN104093799 B CN 104093799B
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China
Prior art keywords
circuit
mercaptan
structural bodies
connection
equal
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CN201380008376.0A
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English (en)
Chinese (zh)
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CN104093799A (zh
Inventor
中泽孝
竹村贤三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lishennoco Co ltd
Original Assignee
Hitachi Chemical Co Ltd
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Publication date
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Publication of CN104093799A publication Critical patent/CN104093799A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
CN201380008376.0A 2012-04-13 2013-04-15 电路连接材料、连接结构体及其制造方法 Active CN104093799B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012092054 2012-04-13
JP2012-092054 2012-04-13
PCT/JP2013/061216 WO2013154203A1 (ja) 2012-04-13 2013-04-15 回路接続材料、接続構造体及びその製造方法

Publications (2)

Publication Number Publication Date
CN104093799A CN104093799A (zh) 2014-10-08
CN104093799B true CN104093799B (zh) 2019-04-26

Family

ID=49327757

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CN201380008376.0A Active CN104093799B (zh) 2012-04-13 2013-04-15 电路连接材料、连接结构体及其制造方法

Country Status (4)

Country Link
JP (1) JP6107816B2 (ja)
KR (1) KR102044574B1 (ja)
CN (1) CN104093799B (ja)
WO (1) WO2013154203A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116635495A (zh) * 2020-09-15 2023-08-22 株式会社力森诺科 电路连接用黏合剂薄膜及其制造方法、以及电路连接结构体的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101138135A (zh) * 2005-03-07 2008-03-05 3M创新有限公司 将柔性印刷电路板连接至另一个电路板的方法
CN101835859A (zh) * 2007-10-29 2010-09-15 日立化成工业株式会社 电路连接材料、连接结构体及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
WO1998044067A1 (en) 1997-03-31 1998-10-08 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
JP4590732B2 (ja) 2000-12-28 2010-12-01 日立化成工業株式会社 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP5111711B2 (ja) * 2002-01-31 2013-01-09 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物及び回路接続方法
JP5221049B2 (ja) * 2006-08-28 2013-06-26 住友電工ファインポリマー株式会社 軸受用成形材料、軸受、及び水中ポンプ
JP5140996B2 (ja) * 2006-08-29 2013-02-13 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP5677727B2 (ja) * 2009-04-20 2015-02-25 株式会社ブリヂストン チオール基含有接着性樹脂組成物
KR20110090758A (ko) * 2010-02-04 2011-08-10 주식회사 이그잭스 회로 접속용 도전 접착제 조성물, 회로 접속재료, 회로 접속구조체 및 회로 접속구조체의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101138135A (zh) * 2005-03-07 2008-03-05 3M创新有限公司 将柔性印刷电路板连接至另一个电路板的方法
CN101835859A (zh) * 2007-10-29 2010-09-15 日立化成工业株式会社 电路连接材料、连接结构体及其制造方法

Also Published As

Publication number Publication date
KR102044574B1 (ko) 2019-11-13
JPWO2013154203A1 (ja) 2015-12-21
KR20140146059A (ko) 2014-12-24
JP6107816B2 (ja) 2017-04-05
WO2013154203A1 (ja) 2013-10-17
CN104093799A (zh) 2014-10-08

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Address after: Tokyo, Japan

Patentee after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: HITACHI CHEMICAL Co.,Ltd.

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