CN103998537B - 硅氧烷溶剂 - Google Patents
硅氧烷溶剂 Download PDFInfo
- Publication number
- CN103998537B CN103998537B CN201280062299.2A CN201280062299A CN103998537B CN 103998537 B CN103998537 B CN 103998537B CN 201280062299 A CN201280062299 A CN 201280062299A CN 103998537 B CN103998537 B CN 103998537B
- Authority
- CN
- China
- Prior art keywords
- fluoride
- silicone
- component
- dissolution agent
- dissolving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000002904 solvent Substances 0.000 title claims abstract description 16
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title claims abstract description 7
- -1 hydrogen ions Chemical class 0.000 claims abstract description 27
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 40
- 239000003795 chemical substances by application Substances 0.000 claims description 25
- FPGGTKZVZWFYPV-UHFFFAOYSA-M tetrabutylammonium fluoride Chemical compound [F-].CCCC[N+](CCCC)(CCCC)CCCC FPGGTKZVZWFYPV-UHFFFAOYSA-M 0.000 claims description 20
- 238000004090 dissolution Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- 150000003839 salts Chemical class 0.000 claims description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 5
- 125000005207 tetraalkylammonium group Chemical group 0.000 claims description 5
- 150000002576 ketones Chemical class 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 150000001983 dialkylethers Chemical class 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 2
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 2
- 150000001346 alkyl aryl ethers Chemical class 0.000 claims description 2
- 229910000473 manganese(VI) oxide Inorganic materials 0.000 claims description 2
- MOVBJUGHBJJKOW-UHFFFAOYSA-N methyl 2-amino-5-methoxybenzoate Chemical compound COC(=O)C1=CC(OC)=CC=C1N MOVBJUGHBJJKOW-UHFFFAOYSA-N 0.000 claims description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N nitrous oxide Inorganic materials [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims description 2
- OUSREJFRRGRLDE-UHFFFAOYSA-M tetra(nonyl)azanium;fluoride Chemical compound [F-].CCCCCCCCC[N+](CCCCCCCCC)(CCCCCCCCC)CCCCCCCCC OUSREJFRRGRLDE-UHFFFAOYSA-M 0.000 claims description 2
- KMUYKILZAMVROR-UHFFFAOYSA-M tetra(propan-2-yl)azanium;fluoride Chemical compound [F-].CC(C)[N+](C(C)C)(C(C)C)C(C)C KMUYKILZAMVROR-UHFFFAOYSA-M 0.000 claims description 2
- SAVMTTISRBULOZ-UHFFFAOYSA-N tetradecan-1-amine;hydrofluoride Chemical compound F.CCCCCCCCCCCCCCN SAVMTTISRBULOZ-UHFFFAOYSA-N 0.000 claims description 2
- QSUJAUYJBJRLKV-UHFFFAOYSA-M tetraethylazanium;fluoride Chemical compound [F-].CC[N+](CC)(CC)CC QSUJAUYJBJRLKV-UHFFFAOYSA-M 0.000 claims description 2
- YFECTAVBWYHKGE-UHFFFAOYSA-M tetraheptylazanium;fluoride Chemical compound [F-].CCCCCCC[N+](CCCCCCC)(CCCCCCC)CCCCCCC YFECTAVBWYHKGE-UHFFFAOYSA-M 0.000 claims description 2
- AAIWQSJMMIXYGQ-UHFFFAOYSA-M tetrahexylazanium;fluoride Chemical compound [F-].CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC AAIWQSJMMIXYGQ-UHFFFAOYSA-M 0.000 claims description 2
- XNBUJDBFTMTPME-UHFFFAOYSA-M tetrakis(2-methylbutan-2-yl)azanium fluoride Chemical compound [F-].CCC(C)(C)[N+](C(C)(C)CC)(C(C)(C)CC)C(C)(C)CC XNBUJDBFTMTPME-UHFFFAOYSA-M 0.000 claims description 2
- LXWVMXSKHOPXBJ-UHFFFAOYSA-M tetrakis(2-methylpropyl)azanium;fluoride Chemical compound [F-].CC(C)C[N+](CC(C)C)(CC(C)C)CC(C)C LXWVMXSKHOPXBJ-UHFFFAOYSA-M 0.000 claims description 2
- QGAKFUJUPKPDCN-UHFFFAOYSA-M tetraoctylazanium;fluoride Chemical compound [F-].CCCCCCCC[N+](CCCCCCCC)(CCCCCCCC)CCCCCCCC QGAKFUJUPKPDCN-UHFFFAOYSA-M 0.000 claims description 2
- DMUXGOVRWIDZEU-UHFFFAOYSA-M tetrapentylazanium;fluoride Chemical compound [F-].CCCCC[N+](CCCCC)(CCCCC)CCCCC DMUXGOVRWIDZEU-UHFFFAOYSA-M 0.000 claims description 2
- JILOFGXUYHCRMD-UHFFFAOYSA-M tetratert-butylazanium;fluoride Chemical compound [F-].CC(C)(C)[N+](C(C)(C)C)(C(C)(C)C)C(C)(C)C JILOFGXUYHCRMD-UHFFFAOYSA-M 0.000 claims description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 23
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 12
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000002562 thickening agent Substances 0.000 description 5
- IITQJMYAYSNIMI-UHFFFAOYSA-N 3-Methyl-2-cyclohexen-1-one Chemical compound CC1=CC(=O)CCC1 IITQJMYAYSNIMI-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- LFSAPCRASZRSKS-UHFFFAOYSA-N 2-methylcyclohexan-1-one Chemical compound CC1CCCCC1=O LFSAPCRASZRSKS-UHFFFAOYSA-N 0.000 description 3
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 3
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N 3-methyl-2-pentanone Chemical compound CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 238000009210 therapy by ultrasound Methods 0.000 description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LKUDPHPHKOZXCD-UHFFFAOYSA-N 1,3,5-trimethoxybenzene Chemical compound COC1=CC(OC)=CC(OC)=C1 LKUDPHPHKOZXCD-UHFFFAOYSA-N 0.000 description 2
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- HIGGFWFRAWSMBR-UHFFFAOYSA-N 2-Methyl-3-hexanone Chemical compound CCCC(=O)C(C)C HIGGFWFRAWSMBR-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- XJLDYKIEURAVBW-UHFFFAOYSA-N 3-decanone Chemical compound CCCCCCCC(=O)CC XJLDYKIEURAVBW-UHFFFAOYSA-N 0.000 description 2
- UJBOOUHRTQVGRU-UHFFFAOYSA-N 3-methylcyclohexan-1-one Chemical compound CC1CCCC(=O)C1 UJBOOUHRTQVGRU-UHFFFAOYSA-N 0.000 description 2
- RHLVCLIPMVJYKS-UHFFFAOYSA-N 3-octanone Chemical compound CCCCCC(=O)CC RHLVCLIPMVJYKS-UHFFFAOYSA-N 0.000 description 2
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 2
- IYTXKIXETAELAV-UHFFFAOYSA-N Aethyl-n-hexyl-keton Natural products CCCCCCC(=O)CC IYTXKIXETAELAV-UHFFFAOYSA-N 0.000 description 2
- HYTRYEXINDDXJK-UHFFFAOYSA-N Ethyl isopropyl ketone Chemical compound CCC(=O)C(C)C HYTRYEXINDDXJK-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- RVFBZLFHKFSPRE-UHFFFAOYSA-N N(Cl)(Cl)Cl.[P] Chemical compound N(Cl)(Cl)Cl.[P] RVFBZLFHKFSPRE-UHFFFAOYSA-N 0.000 description 2
- TYBCSQFBSWACAA-UHFFFAOYSA-N Nonan-4-one Chemical compound CCCCCC(=O)CCC TYBCSQFBSWACAA-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000005599 alkyl carboxylate group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 150000001923 cyclic compounds Chemical class 0.000 description 2
- 150000004292 cyclic ethers Chemical class 0.000 description 2
- DBOVMTXPZWVYAQ-UHFFFAOYSA-N cycloheptane-1,3-dione Chemical compound O=C1CCCCC(=O)C1 DBOVMTXPZWVYAQ-UHFFFAOYSA-N 0.000 description 2
- ZAJNGDIORYACQU-UHFFFAOYSA-N decan-2-one Chemical compound CCCCCCCCC(C)=O ZAJNGDIORYACQU-UHFFFAOYSA-N 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- AOGQPLXWSUTHQB-UHFFFAOYSA-N hexyl acetate Chemical compound CCCCCCOC(C)=O AOGQPLXWSUTHQB-UHFFFAOYSA-N 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- VKCYHJWLYTUGCC-UHFFFAOYSA-N nonan-2-one Chemical compound CCCCCCCC(C)=O VKCYHJWLYTUGCC-UHFFFAOYSA-N 0.000 description 2
- GJQIMXVRFNLMTB-UHFFFAOYSA-N nonyl acetate Chemical compound CCCCCCCCCOC(C)=O GJQIMXVRFNLMTB-UHFFFAOYSA-N 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- YLYBTZIQSIBWLI-UHFFFAOYSA-N octyl acetate Chemical compound CCCCCCCCOC(C)=O YLYBTZIQSIBWLI-UHFFFAOYSA-N 0.000 description 2
- 235000011837 pasties Nutrition 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229940090181 propyl acetate Drugs 0.000 description 2
- 239000001488 sodium phosphate Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- 235000019801 trisodium phosphate Nutrition 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 229910019670 (NH4)H2PO4 Inorganic materials 0.000 description 1
- ULPMRIXXHGUZFA-UHFFFAOYSA-N (R)-4-Methyl-3-hexanone Natural products CCC(C)C(=O)CC ULPMRIXXHGUZFA-UHFFFAOYSA-N 0.000 description 1
- NKJOXAZJBOMXID-UHFFFAOYSA-N 1,1'-Oxybisoctane Chemical compound CCCCCCCCOCCCCCCCC NKJOXAZJBOMXID-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VWGNFIQXBYRDCH-UHFFFAOYSA-N 1,4-diethoxybenzene Chemical compound CCOC1=CC=C(OCC)C=C1 VWGNFIQXBYRDCH-UHFFFAOYSA-N 0.000 description 1
- GDXMMBDEMOUTNS-UHFFFAOYSA-N 1-(diethylamino)propan-2-one Chemical compound CCN(CC)CC(C)=O GDXMMBDEMOUTNS-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- PVBMXMKIKMJQRK-UHFFFAOYSA-N 1-chloro-4-(4-chlorobutoxy)butane Chemical compound ClCCCCOCCCCCl PVBMXMKIKMJQRK-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- VNHGETRQQSYUGZ-UHFFFAOYSA-N 1-nitro-2-phenoxybenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1OC1=CC=CC=C1 VNHGETRQQSYUGZ-UHFFFAOYSA-N 0.000 description 1
- AOPDRZXCEAKHHW-UHFFFAOYSA-N 1-pentoxypentane Chemical compound CCCCCOCCCCC AOPDRZXCEAKHHW-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- UIQGEWJEWJMQSL-UHFFFAOYSA-N 2,2,4,4-tetramethylpentan-3-one Chemical compound CC(C)(C)C(=O)C(C)(C)C UIQGEWJEWJMQSL-UHFFFAOYSA-N 0.000 description 1
- UHOPWFKONJYLCF-UHFFFAOYSA-N 2-(2-sulfanylethyl)isoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(CCS)C(=O)C2=C1 UHOPWFKONJYLCF-UHFFFAOYSA-N 0.000 description 1
- KBMDBLCFKPRPOC-UHFFFAOYSA-N 2-bromo-3,3,3-trifluoro-2-(trifluoromethyl)propanenitrile Chemical compound FC(F)(F)C(Br)(C#N)C(F)(F)F KBMDBLCFKPRPOC-UHFFFAOYSA-N 0.000 description 1
- HHBZZTKMMLDNDN-UHFFFAOYSA-N 2-butan-2-yloxybutane Chemical compound CCC(C)OC(C)CC HHBZZTKMMLDNDN-UHFFFAOYSA-N 0.000 description 1
- XYYMFUCZDNNGFS-UHFFFAOYSA-N 2-methylheptan-3-one Chemical compound CCCCC(=O)C(C)C XYYMFUCZDNNGFS-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- AUZFRUHVDNDVJI-UHFFFAOYSA-N 3-acetylpentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)C(C)=O AUZFRUHVDNDVJI-UHFFFAOYSA-N 0.000 description 1
- SUQNVCCJLBQVEI-UHFFFAOYSA-N 3-ethoxycyclopent-2-en-1-one Chemical compound CCOC1=CC(=O)CC1 SUQNVCCJLBQVEI-UHFFFAOYSA-N 0.000 description 1
- NHMJKYVPXYBHSL-UHFFFAOYSA-N 3-hydroxy-2-methylcyclohex-2-en-1-one Chemical compound CC1=C(O)CCCC1=O NHMJKYVPXYBHSL-UHFFFAOYSA-N 0.000 description 1
- PJCCSZUMZMCWSX-UHFFFAOYSA-N 4,4-Dimethoxy-2-butanone Chemical compound COC(OC)CC(C)=O PJCCSZUMZMCWSX-UHFFFAOYSA-N 0.000 description 1
- AZASWMGVGQEVCS-UHFFFAOYSA-N 4,4-dimethylpentan-2-one Chemical compound CC(=O)CC(C)(C)C AZASWMGVGQEVCS-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- DMIIMPQQPXUKOO-UHFFFAOYSA-N 5-methylcyclohexane-1,3-dione Chemical compound CC1CC(=O)CC(=O)C1 DMIIMPQQPXUKOO-UHFFFAOYSA-N 0.000 description 1
- PSBKJPTZCVYXSD-UHFFFAOYSA-N 5-methylheptan-3-one Chemical compound CCC(C)CC(=O)CC PSBKJPTZCVYXSD-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- YNMZZHPSYMOGCI-UHFFFAOYSA-N Aethyl-octyl-keton Natural products CCCCCCCCC(=O)CC YNMZZHPSYMOGCI-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Chemical class 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
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- 239000004698 Polyethylene Substances 0.000 description 1
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- 229940093499 ethyl acetate Drugs 0.000 description 1
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- 125000000373 fatty alcohol group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
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- 239000000417 fungicide Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- JPXGPRBLTIYFQG-UHFFFAOYSA-N heptan-4-yl acetate Chemical compound CCCC(CCC)OC(C)=O JPXGPRBLTIYFQG-UHFFFAOYSA-N 0.000 description 1
- BGYICJVBGZQOCY-UHFFFAOYSA-N heptyl propanoate Chemical compound CCCCCCCOC(=O)CC BGYICJVBGZQOCY-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- GOKKOFHHJFGZHW-UHFFFAOYSA-N hexyl propanoate Chemical compound CCCCCCOC(=O)CC GOKKOFHHJFGZHW-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
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- 239000004611 light stabiliser Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- MQWCXKGKQLNYQG-UHFFFAOYSA-N methyl cyclohexan-4-ol Natural products CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 1
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- 150000007524 organic acids Chemical class 0.000 description 1
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- 150000007530 organic bases Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWSRVQVEYJNFKQ-UHFFFAOYSA-N pentyl propanoate Chemical compound CCCCCOC(=O)CC TWSRVQVEYJNFKQ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- PJGSXYOJTGTZAV-UHFFFAOYSA-N pinacolone Chemical compound CC(=O)C(C)(C)C PJGSXYOJTGTZAV-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005554 polynitrile Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
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- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000001698 pyrogenic effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- HVZJRWJGKQPSFL-UHFFFAOYSA-N tert-Amyl methyl ether Chemical compound CCC(C)(C)OC HVZJRWJGKQPSFL-UHFFFAOYSA-N 0.000 description 1
- NUMQCACRALPSHD-UHFFFAOYSA-N tert-Butyl ethyl ether Natural products CCOC(C)(C)C NUMQCACRALPSHD-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
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- HTSABYAWKQAHBT-UHFFFAOYSA-N trans 3-methylcyclohexanol Natural products CC1CCCC(O)C1 HTSABYAWKQAHBT-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
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- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
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- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
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- H01L21/31105—Etching inorganic layers
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
本发明涉及硅氧烷溶剂,包含A)至少一种氟化四烷基铵、B)至少一种能够结合氢离子的无机碱、以及C)至少一种适合于溶解氟化四烷基铵A)以及至少0.001wt%的无机碱B)的溶剂。
Description
本发明涉及用于解聚和去除硅氧烷(硅酮,聚硅氧烷,silicone)残余物的组合物。该组合物称作硅氧烷溶解剂(硅酮消溶剂,siliconedissolver),包含氟化烷基铵、无机碱式盐及溶剂。本发明的组合物特别可用于从敏感的表面和基材去除交联或未交联的、填充或未填充的硅氧烷残余物。取决于应用领域,该硅氧烷溶解剂在各种应用中可以是液态、糊状或凝胶状。
在现有技术中,为了去除或解聚交联或未交联的硅氧烷,已知各种方法和组合物。
●借助有机溶剂或卤化的有机溶剂进行溶胀和去除。
●借助胺例如二异丙胺进行溶胀和去除。
●借助强碱如氢氧化钠或氢氧化钾的碱性溶液使聚二甲基硅氧烷解聚,例如在US 2,710,843中所述。
●借助短链或环状的寡聚二有机基硅氧烷进行解聚,例如在DE69122740 T2中所述。
●通过强酸诸如例如烷基苯磺酸、硫酸、氢氟酸的水溶液进行解聚,例如在JP 8250400 A中所述。
●借助包含卤代磷腈化合物和具有可达7个Si链成员的短链寡聚二甲基硅氧烷的组合物进行解聚,例如在EP 0 884 368 A1中所述。环状或直链的卤代磷腈化合物作为用于制备长链聚二甲基硅氧烷的增链添加剂或缩聚催化剂的相反的用途是早就已知的现有技术,如同催化剂用于使聚二甲基硅氧烷平衡的用途,如在DE 196 07 264 A1中所述。
●US 5,008,229涉及氯代磷腈在有机溶剂中的溶液以及这种组合物用于促进羟基端基的二有机基硅氧烷的缩合和/或平衡的用途。虽然获得改进的结果,但是使用有机溶剂,如乙酸乙酯,以促进氯代磷腈的溶解。DE3725377通过使用磷-氮-氯化物与环状二有机基硅氧烷如八甲基环四硅氧烷的反应产物作为催化剂,省略了有机溶剂的使用。但是经验表明,磷-氮-氯化物与八甲基环四硅氧烷的反应产物通常具有超过几千mPa·s(厘泊)的粘度,这导致该材料不太适合作为用于去除聚二甲基硅氧烷残余物的催化剂。
●US 7,232,770 B1描述了在半导体领域中,将氟化铵连同胺在各种溶剂中用于去除硅氧烷残余物。
所有目前已知的用于溶解硅氧烷的组合物的缺点在于,它们含有腐蚀性物质,诸如例如有机酸或碱,它们在用于从各种不同的基材去除硅氧烷时导致金属的表面腐蚀。
因此,本发明解决的问题是提供一种组合物,该组合物可用于从各种基材或者在基材之间去除交联及未交联的聚硅氧烷残余物,但同时对基材呈惰性,并且在用于去除硅氧烷杂质的处理时间过程中不会损害或腐蚀即使是薄层形式的基材。
该问题出人意料地通过硅氧烷溶解剂解决,该硅氧烷溶解剂包含:
A)至少一种氟化四烷基铵(tetraalkylammonium fluoride),
B)至少一种能够结合氢离子的无机碱,以及
C)至少一种适合于溶解不仅氟化四烷基铵A)而且至少0.001wt%的无机碱B)的溶剂。
出人意料地发现,无机盐特别可用于抑制包含有机氟化四烷基铵和溶剂的溶解硅氧烷的组合物的腐蚀作用。
本发明的硅氧烷溶解剂特别可用于去除在基材上或者在基材之间的聚硅氧烷残余物或聚硅氧烷层。
本发明的硅氧烷溶解剂具有下述优点,其选择性地作用于硅氧烷聚合物和/或聚二甲基硅氧烷基团上。由于反应机理,不会侵蚀其他塑料。对于本发明的硅氧烷溶解剂为惰性的塑料的实例是:聚烯烃、聚苯乙烯、聚氯乙烯、聚乙烯、聚丙烯、聚腈、丙烯腈-丁二烯-苯乙烯共聚物、聚酰亚胺或聚丙烯酸酯。
本发明的硅氧烷溶解剂仅溶解例如加成交联、缩合交联和过氧化物交联的硅橡胶,如RTV-1、RTV-2、LSR和HTV。本发明的硅氧烷溶解剂对于硅橡胶也是有效的,该硅橡胶取决于应用领域包含其他组分,如填料,例如亲水性或疏水性二氧化硅、沉淀二氧化硅(precipitated silicas)、硅氧烷树脂(硅酮树脂)、氧化铝、氧化钛、炭黑、石墨、金属、金属碳酸盐、硅藻土、金属粉尘、纤维,如玻璃纤维或聚合纤维(合成纤维),以及各种添加剂,如杀真菌剂、气味剂、腐蚀抑制剂、氧化抑制剂、光稳定剂、阻燃剂、分散剂、增粘剂、颜料、增塑剂、有机聚合物或热稳定剂。本发明的硅氧烷溶解剂还降解包含聚二有机基硅氧烷单元或硅氧烷树脂的共聚物。
在一个优选的实施方式中,组分A)对应于通式(1):
(CnH2n+1)4N+F- (1)
其中,
n=1至30,优选n=1至18,并且更优选n=1至10。
化合物A)是在现有技术中早就已知的,并且可以商购获得。优选的化合物A)的实例是:氟化四甲基铵、氟化四乙基铵、氟化四丁基铵、氟化四戊基铵、氟化四己基铵、氟化四庚基铵、氟化四辛基铵、氟化四壬基铵、氟化四癸基铵、氟化四异丙基铵、氟化四异丁基铵、氟化四(叔丁基)铵、氟化四(叔戊基)铵。
在一个优选的实施方式中,组分B)选自以下无机盐的组,其中M选自碱金属和碱土金属以及还有单价阳离子诸如例如铵离子的组:
亚磷酸和磷酸的盐MoHpPO3和MoHpPO4,其中o=1至3(经验式示意性地基于单价金属阳离子),并且p=0至2,
亚硫酸和硫酸的盐MqHrSO3、MqHrSO4,其中q=1至2,r=0至1,
亚硝酸和硝酸的盐MNO2和MNO3(经验式示意性地基于单价金属阳离子)。M优选为钠、钾、镁、钙和铵。特别优选的化合物B)是Na3PO4、Na2HPO4、NaH2PO4、MgHPO4、Mg3(PO4)2、(NH4)H2PO4、(NH4)2HPO4、(NH4)3PO4。
组分C)是能够溶解组分A)和至少0.001wt%的组分B)的溶剂。组分C)的实例是直链、支链和环状的醚,其还可以包含其他杂原子,如氮、磷或卤素原子。用作溶剂的醚的实例包括但不限于二烷基醚:二乙基醚、二正丙基醚、二异丙基醚、二丁基醚、二戊基醚、二己基醚、二辛基醚、2-乙基己基乙烯基醚、4-氯丁基醚、二氯甲基甲基醚、1,2-二甲氧基丙烷、叔戊基甲基醚、叔丁基乙基醚、二仲丁基醚、四乙二醇二甲基醚;环醚:氧杂环戊烷(四氢呋喃)、氧杂环庚烷(四氢吡喃)、1-4-二噁烷;包含芳族基团的醚:甲基苯基醚、2-硝基苯基苯基醚、4-二甲氧基苯、1,3,5-三甲氧基苯、丁基苯基醚、1,4-二乙氧基苯。
完全可用作组分C)的另外的物质种类是酮类,包括直链、支链和环状的化合物,其可以另外地包含其他杂原子,如氮、磷或卤素原子。特别优选为直链和支链的脂族分子。
可用作组分C)的酮的实例包括但不限于:
2-丙酮、2-丁酮、2-戊酮、2-己酮、2-庚酮、2-辛酮、2-壬酮、2-癸酮、3-己酮、3-庚酮、3-辛酮、3-壬酮、3-癸酮、2-甲基-3-丁酮、3,3-二甲基-2-丁酮、2-甲基-3-戊酮、2-甲基-3-己酮、2-甲基-3-庚酮、4-庚酮、4-辛酮、4-壬酮、4-癸酮、2,2-二甲基-3-戊酮、2,4-二甲基-3-戊酮、5-甲基-3-庚酮、4,4-二甲基-2-戊酮、2,2,4,4-四甲基-3-戊酮、3-甲基-2-戊酮、4-甲基-2-戊酮、3,3-二甲氧基-2-丁酮、4,4-二甲氧基-2-丁酮、3-甲基-2-环己酮(3-methyl-2-cyclohanone)、3-甲基-2-环己烯酮、1,3-环庚烷二酮、2-甲基-1,3-环己烷二酮、3-乙氧基-2-环戊烯-1-酮、5-甲基-1,3-环己烷二酮、三乙酰基甲烷、2,2-二甲基环戊酮、2-甲基-环己酮、3-甲基环己酮、4-甲基环己酮、环庚酮、二乙基氨基丙酮。
完全可用作组分C)的另外的物质种类是酯类,包括直链、支链和环状的化合物,其可以另外地包含其他杂原子,如氮、磷或卤素原子。
特别优选为被看作是双极性非质子溶剂的酯。可用作组分C)的酯的实例包括但不限于:
羧酸烷基酯(烷基羧酸酯,alkyl carboxylate esters)、乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸丁酯、乙酸戊酯、乙酸己酯、乙酸庚酯、乙酸辛酯、乙酸壬酯、丙酸甲酯、丙酸乙酯、丙酸丙酯、丙酸丁酯、丙酸戊酯、丙酸己酯、丙酸庚酯、丙酸辛酯。
C)优先选自以下溶剂的组:羧酸烷基酯、二烷基醚、烷基芳基醚、酮。C)特别优先选自以下组:乙酸乙酯、乙酸丙酯、乙酸异丙酯、2-丁酮、2-辛酮、异丙基甲基酮、叔丁基甲基酮。
作为其他可选的成分,本发明的硅氧烷溶解剂可以包含增稠剂D)以便调节粘度并例如产生糊状组合物。增稠剂D)的实例是:沉淀二氧化硅、亲水性或疏水性的胶体二氧化硅(胶二态氧化硅,colloidal silica)、氧化铝、二氧化钛、羧酸的钙盐、炭黑或羧甲基纤维素。可以使用在现有技术中已知的任何增稠剂D),只要其具有低于5000ppm的水含量。水含量应当优选低于2500ppm,并且更优选低于1000ppm。在所述组合物中还必须避免有机脂肪醇基团,因为它们类似于水导致组分A)水解并且硅氧烷溶解剂会丧失其平衡特性。D)优先选自火成二氧化硅(pyrogenous silicas)的组。
本发明的硅氧烷溶解剂通过将A)与B)和C)以及可能的D)理想地混合直至形成澄清的溶液而制备。
每100wt%的硅氧烷溶解剂,优选使用0.1-10wt%的A),并且更优选0.1-5wt%的A)。每100wt%的硅氧烷溶解剂,优选使用0.001至1wt%的B),并且更优选0.01-0.5wt%的B)。C)构成100wt%的硅氧烷溶解剂的剩余部分。
通常通过在室温或提高的温度(可达140℃)下强烈搅拌这些组分0.5至10小时而进行混合。
当使用增稠剂D)时,这么做是为了将本发明的硅氧烷溶解剂的粘度调节到确定的范围。对此,每100wt%的硅氧烷溶解剂,以0.1-30wt%的量使用增稠剂D)。优选添加0.5至10wt%,并且更优选1至5wt%的D)。
本发明进一步提供了本发明的硅氧烷溶解剂用于从表面或基材解聚和去除交联或未交联的硅氧烷残余物的用途。
取决于根据本发明的硅氧烷溶解剂的粘度-液态、糊状或凝胶状,这是以不同的方式实现的,例如通过将本发明的硅氧烷溶解剂喷涂或运送到待清洁的物品/表面/基材上,或者还可以通过将待清洁的物品浸入本发明的硅氧烷溶解剂中。取决于待去除的硅氧烷残余物的层厚度和组成,处理时间可以在10秒与几个小时之间。在一个优选的实施方式中,处理时间在30秒与10分钟之间。在处理时间过程中升高温度促进溶解过程。取决于溶剂C),可以采用在20℃与150℃之间的温度,尽管可以表明20℃至100℃的温度范围是优选的。例如通过泵送、摇动或者超声波处理对根据本发明的硅氧烷溶解剂的任何循环同样具有促进作用。在一个优选的实施方式中,在室温下在超声波处理下,处理时间在10秒与5分钟之间。在另一个优选的实施方式中,在50℃-120℃下在超声波处理下,处理时间在10秒与3分钟之间。
在处理时间段之后,使用不含添加剂的溶剂洗去裂解产物,该溶剂可以但是不必要与在溶解反应中使用的溶剂C)相同。
实施例
以下实施例示出了本发明,没有对其加以限制。除非另有说明,份数是按重量计的。以下实施例是在环境大气压力,即约1,000hPa下,并且除非另有说明,在室温,即约20℃下实施的。在溶解交联的硅氧烷弹性体的应用实施例中,“超声波处理”是通过将玻璃瓶引入超声波浴(Bandelin RM40)中,通过引入超声波探针等进行的。
实施例1:溶解硅氧烷的组合物1
在室温下通过搅拌将2.5克量的氟化四丁基铵和0.05克磷酸三钠在30分钟内溶解在97.45克2-辛酮中。
实施例2:溶解硅氧烷的组合物2
在室温下通过搅拌将2.5克量的氟化四丁基铵和0.05克磷酸氢二钠在30分钟内溶解在97.45克2-辛酮中。
实施例3:溶解硅氧烷的组合物3
在室温下通过搅拌将2.5克量的氟化四丁基铵和0.05克氢氧化钙在30分钟内溶解在97.45克乙酸正丙酯中。
实施例4:溶解硅氧烷的组合物4
在室温下通过搅拌将2.5克量的氟化四丁基铵和0.05克磷酸三钠在30分钟内溶解在97.45克乙酸正丙酯中。
实施例5:溶解硅氧烷的组合物5
在室温下通过搅拌将2.5克量的氟化四丁基铵和0.05克磷酸氢二钠在30分钟内溶解在97.45克乙酸正丙酯中。
实施例6:溶解硅氧烷的组合物6
在室温下通过搅拌将2.5克量的氟化四丁基铵和0.05克氢氧化钙在30分钟内溶解在97.45克2-辛酮中。
实施例7:溶解硅氧烷的组合物7(非根据本发明)
在室温下通过搅拌将2.5克量的氟化四丁基铵在30分钟内溶解在97.5克2-辛酮中。
实施例8:溶解硅氧烷的组合物8(非根据本发明)
在室温下通过搅拌将2.5克量的氟化四丁基铵在30分钟内溶解在97.5克乙酸正丙酯中。
实施例9:溶解聚二甲基硅氧烷组合物
在室温下用5ml来自实施例1至8的各个溶液涂覆在每种情况下为1平方厘米的交联的硅氧烷组合物(LR3003/40,购自WackerChemie AG,慕尼黑)的100μm薄层。对于各自和每种组合物,完全溶解膜的时间为10-20秒。
实施例10:铝腐蚀
为了评估腐蚀,将1平方厘米的商购铝箔放入各种溶液中,并在任何一个系列中在指定的时间从中移开。根据扫描电子显微镜照片评估腐蚀,在表1中划分为“负”=“-”(在SEM中没有可见的腐蚀)和“正”=“+”(SEM显示出可见的腐蚀,即点状腐蚀,局部溶解铝)。
表1
根据表1表明,出人意料地发现,根据本发明的硅氧烷溶解剂特别用于在铝的腐蚀明显减少的情况下去除硅氧烷残余物。在室温下,几分钟的处理时间通常是足够的。
Claims (4)
1.用于从表面或基材解聚和去除交联或未交联的硅氧烷残余物的硅氧烷溶解剂的用途,其特征在于,所述硅氧烷溶解剂是包含下述的硅氧烷溶解剂:
A)至少一种氟化四烷基铵,
B)至少一种能够结合氢离子的无机碱,其中组分B)选自以下无机盐的组:
亚磷酸和磷酸的盐MoHpPO3和MoHpPO4、亚硫酸和硫酸的盐MqHrSO3、MqHrSO4、亚硝酸和硝酸的盐MNO2和MNO3,其中M选自碱金属和碱土金属的组,并且o=1至3,p=0至2,q=1至2,以及r=0至1,以及
C)至少一种不仅适合于溶解氟化四烷基铵A)而且适合于溶解至少0.001wt%的无机碱B)的溶剂,
其中,基于100wt%的硅氧烷溶解剂,所述硅氧烷溶解剂包含:
0.1-10wt%的组分A),
0.001-1wt%的组分B),以及
剩余部分的组分C),
其中,组分C)选自以下溶剂的组:羧酸烷基酯、二烷基醚、烷基芳基醚、酮。
2.根据权利要求1所述的硅氧烷溶解剂的用途,其中,组分A)选自以下四烷基铵化合物的组:
氟化四甲基铵、氟化四乙基铵、氟化四丁基铵、氟化四戊基铵、氟化四己基铵、氟化四庚基铵、氟化四辛基铵、氟化四壬基铵、氟化四癸基铵、氟化四异丙基铵。
3.根据权利要求1所述的硅氧烷溶解剂的用途,其中,组分A)选自氟化四异丁基铵、氟化四(叔丁基)铵。
4.根据权利要求1所述的硅氧烷溶解剂的用途,其中,组分A)选自氟化四(叔戊基)铵。
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JP7299564B2 (ja) * | 2019-11-20 | 2023-06-28 | 日産化学株式会社 | 洗浄剤組成物の洗浄能の向上方法、洗浄剤組成物の製造方法及び洗浄剤組成物 |
JP7530035B2 (ja) | 2020-03-23 | 2024-08-07 | 日産化学株式会社 | バンプ付き半導体基板の洗浄方法 |
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2011
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- 2012-12-06 JP JP2014546428A patent/JP5951796B2/ja not_active Expired - Fee Related
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- 2012-12-06 US US14/362,783 patent/US9309488B2/en not_active Expired - Fee Related
- 2012-12-06 EP EP12795474.1A patent/EP2791259A1/de not_active Withdrawn
- 2012-12-06 KR KR1020147015999A patent/KR101636390B1/ko active IP Right Grant
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TW201326385A (zh) | 2013-07-01 |
DE102011088885A1 (de) | 2013-06-20 |
KR101636390B1 (ko) | 2016-07-05 |
US9309488B2 (en) | 2016-04-12 |
CN103998537A (zh) | 2014-08-20 |
EP2791259A1 (de) | 2014-10-22 |
KR20140096362A (ko) | 2014-08-05 |
US20140336093A1 (en) | 2014-11-13 |
WO2013087510A1 (de) | 2013-06-20 |
JP5951796B2 (ja) | 2016-07-13 |
JP2015505886A (ja) | 2015-02-26 |
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