CN103968286B - The LED light machine module that large chip is horizontally disposed - Google Patents
The LED light machine module that large chip is horizontally disposed Download PDFInfo
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- CN103968286B CN103968286B CN201410213295.0A CN201410213295A CN103968286B CN 103968286 B CN103968286 B CN 103968286B CN 201410213295 A CN201410213295 A CN 201410213295A CN 103968286 B CN103968286 B CN 103968286B
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Abstract
The invention discloses the LED light machine module that a kind of large chip is horizontally disposed, including the transparent light machine template (43) being printed on silver slurry circuit (414), silver slurry circuit (414) is formed with interface lead in light machine template (43), the width of its interface lead and spacing and LED illumination large chip (420) and the width W of LED drive power large chip (410) and spacing WJGIdentical；Bigger for power in large-scale ray machine module, or also need to be connected by the light machine template (43) the LED drive power large chip (410) with more than 1 by the integrated transparent block of transition circuit (430)；The one side of one side transparent light machine template (43) band silver slurry circuit (414) again LED drive power large chip (410) and LED illumination large chip (420) band silver being starched circuit (414) obtains LED light machine module by interface lead butt welding.
Description
Technical field
The present invention relates to the LED light machine module that a kind of large chip is horizontally disposed, belong to LED illumination
Technical field.
Background technology
Application number 201310140124.5,201310140138.7,201310140150.8,
201310140105.2、201310140134.9、201310140106.7、
201310140151.2, the Chinese patent application such as 201310140136.8 disclose multiple can be
General and exchange LED bulb on use ray machine module technical scheme.These technology are for building
Vertical Lighting Industry framework centered by LED bulb, makes LED bulb (lighting source), lamp
The basic concept of the end product that tool, Lighting control become independent production, application is laid a good foundation.
But the problem that above-mentioned patent not yet solves ray machine module built-in driving power supply.
Existing LED drive power mostly is Switching Power Supply, and volume is the biggest；Also there is volume slightly smaller
Linear power supply, but its driving chip is many encapsulates pattern with DIP dual-in-line or SMD paster and join
Closing auxiliary element, its volume is still not enough to little to being placed into ray machine module internal.
LED illumination provides LED chip to start to illuminating lamp from chip factory to be needed through a series of all
As paster, die bond, weld, encapsulate, color-division, driving design, heat dissipation design, light fixture
The production design process that design etc. are complicated and tediously long, owing to there is chip layout design, heat conduction sets
Many uncertainties such as meter and power drives design, this industry frame centered by LED chip
Structure is difficult to realize light source (bulb) standardization under the pattern of replaceable light source, ultimately results in end
The many overall structure lamps based on non-exchange light source of LED on end market, add photograph
The industry complexity of bright product and the industrial concentration reducing illuminating product.
Further creation idea is advanced, be more easy to that standardized LED bulb light machine module is built-in to be driven
Galvanic electricity source and LED illumination chip structure scheme are of far-reaching significance for large-scale promotion LED illumination.
Summary of the invention
It is an object of the invention to, it is provided that the LED light machine module that a kind of large chip is horizontally disposed.
It is standardized that it is that one is more easy to, built-in driving power supply and the LED light of LED illumination chip structure
Machine module, it is structurally conducive to the standardization of LED illumination, promotes on a large scale.
Technical scheme: the LED light machine module that large chip is horizontally disposed, is characterized in:
Including being printed on the silver-colored transparent light machine template starching circuit, silver slurry circuit is formed in light machine template
Interface lead, the width of its interface lead and spacing drive electricity with LED illumination large chip and LED
The width W of source large chip and spacing WJGIdentical；It is bigger for power in large-scale ray machine module,
Or also need, by transition circuit integrated transparent block, the LED of light machine template and more than 1 is driven electricity
Source large chip connects；Again LED drive power large chip and LED illumination large chip band silver are starched electricity
The one side of the one side transparent ray machine Form board tape silver slurry circuit on road obtains large chip by interface lead butt welding
Horizontally disposed LED light machine module.
In above-mentioned large chip horizontally disposed LED light machine module, for medium and small LED
Ray machine module, external power source or signal directly pass through connector from the LED being welded on light machine template
Drive and access on power supply large chip；For large-scale LED light machine module, light machine template is also welded
It is connected to flexible circuit, external power source or signal and is linked into welding by connector connection flexible circuit
On LED drive power large chip in light machine template；For merit in large LED ray machine module
Rate is bigger, and light machine template is welded with one and above LED drive power large chip and
Individual and above LED illumination large chip；Also can be along LED drive power large chip, LED illumination
Large chip and or transition circuit integrated transparent block week banding transparent adhesive tape obtain LED light machine module.
In aforesaid large chip horizontally disposed LED light machine module, described transparent transition circuit
Integrated transparent block includes the 3rd transparency carrier, and the 3rd transparency carrier is printed with silver slurry circuit, silver
Slurry circuit has interface lead, interface lead to have 1 group of incoming end and the outfan of more than 1 group；Connect
Enter the width of end and the width W of light machine template wire incoming endGIdentical；The interface lead of outfan
Width and the incoming end width W of LED drive power large chip 410GIdentical；By transition circuit collection
The band silver of the one side and light machine template that become to be printed with in transparent block silver slurry circuit starches the one side of circuit
By interface lead butt welding.The integrated transparent block of transition circuit is for accessing one by external power source or signal
Individual above LED drive power large chip, then exported by LED drive power large chip
On LED illumination large chip.It solve due to the circuit requirement of LED light machine module, outside making
Portion's power supply or signal access LED drive power large chip or LED drive power large chip exports
The circuit of LED illumination large chip need to relate to printed circuit two-sided in light machine template can be real
Existing, owing to held against heat sink is used by the back of generally light machine template, and radiator is big
Being made of metal, the back of light machine template needs insulation, it is impossible to realize circuitron more
Problem.
In aforesaid large chip horizontally disposed LED light machine module, described LED illumination large chip
Be fixed as first transparency carrier of W including a width, the first transparency carrier is provided with N+1 bar
Parallel interface lead, the first transparency carrier is provided with N LEDs chip and constitutes LED chip string
Joint group, every LEDs chip is respectively positioned between two adjacent interface lead, two adjacent connecing
The spacing of mouth wire is WJGInterface lead width is subtracted again divided by N (W equal to WJG=(W-interface lead
Wide)/N), and the both positive and negative polarity of every LEDs chip is connected to two adjacent interfaces respectively and leads
On line；And multiple LED strip joint group the most in parallel so that being formed on transparency carrier can be at transparent base
The LED chip array of the N row multirow extended on plate length direction；N is whole between 3 to 7
Number；When setting up LED light machine module, according to power needs, LED illumination large chip is entered
Row is cut out, and the LED illumination large chip being cut into different length has different power；Described
LED chip carrying voltage is about DC3.2V (suitably adjusting according to practical situation) or more than DC10V
High voltage.
In aforesaid large chip horizontally disposed LED light machine module, described LED chip array and
Interface lead forming method on the transparent substrate is: use transparent substrate to do transition epitaxial layer
The slim epitaxial wafer formed, epitaxial wafer use ripe chip fabrication techniques multi ANN circuit and
LED chip, the most cleaved formation width is the LED illumination large chip of W, wherein grows
Circuit include interface lead and connect the wire connecting chip of LED chip and interface lead,
Substrate is as the first transparency carrier；Described chip two pole, owing to need not welding, can use
Prescribed electrode, to increase the light-emitting area of chip；Described chip maturation manufacturing technology is: use
The layering of Metalorganic chemical vapor deposition equipment carry out covering silicon, gluing, photoetching, etching, plated film,
The technique such as alloy and abrasive disc；Or use conventional art to be mounted on by LED chip array to produce
On first transparency carrier of silver slurry circuit, and by face-down bonding or spun gold formal dress welding and first
Silver slurry circuit on transparency carrier connects, it is thus achieved that LED illumination large chip, and silver slurry brush circuit includes
Interface lead and the wire of connection chip.
In aforesaid large chip horizontally disposed LED light machine module, described LED drive power is big
Chip includes that width is fixed as second transparency carrier of W, and transparency carrier is printed with silver slurry circuit,
Interface lead, interface lead is had to have incoming end and outfan on silver slurry circuit；The width of incoming end
Width W with light machine template wire incoming endGIdentical or have the pad being connected with connector；Output
The interface lead that N+1 bar is parallel, the spacing of adjacent two interface lead is had in the interface lead of end
WJGInterface lead width is subtracted again divided by N (W equal to WJG=(W-interface lead width)/N)；Second is saturating
Power drives wafer stage chip and the rectifier bridge wafer scale core of un-encapsulated is first pasted on bright substrate
Sheet, then by power drives wafer stage chip and the welding of rectifier bridge wafer stage chip of un-encapsulated
On the second transparency carrier, the second transparency carrier has the width of interface lead end big with LED illumination
The width W of chip is identical, and height is H2；The use of interface lead on LED drive power large chip
The chip array that way is for connection on described LED illumination large chip.
LED driving method on described LED drive power large chip is: rectifier bridge wafer scale core
Civil power AC is converted into Rectified alternating current by the rectifier bridge on sheet, and the voltage of Rectified alternating current is more than
Zero, less than or equal to Rectified alternating current specified maximum working voltage VWR, Rectified alternating current sets
Put N section LED load；N is the integer between 3 to 7；Each section of LED load is cascaded
Forming LED load series block group, multiple LED load series block groups form described LED core
Chip arrays, when the voltage of Rectified alternating current raises, power drives wafer stage chip controls LED
The hop count of load in series increases step by step, when the voltage of Rectified alternating current declines, controls LED and bears
The hop count carrying series connection reduces step by step, and the hop count of LED load series connection is actual to be connected into Rectified alternating current
LED load hop count.Civil power AC becomes Rectified alternating current after rectifier bridge, example: AC220V,
After the rectified bridge rectification of 50Hz alternating current, voltage is the wavy curve of half period (180 degree),
Cycle pulsating dc voltage when 0 degree is zero, and when 90 degree, pulsating dc voltage reaches maximum
Value VWRFor the highest DC311V, when 180 degree, voltage reduces to again zero, goes round and begins again.
In aforesaid large chip horizontally disposed LED light machine module, the series connection of described LED load
Hop count is controlled by switch, the segmentation boundary that control node is voltage of switch, described electricity
The number of fragments of pressure is corresponding with the hop count that LED load is connected；The section of described LED load series connection
The control method of number is, by switch, the negative pole direction of every section of LED load is connected pulsation respectively
Galvanic negative pole, then according to the change in voltage of Rectified alternating current to each switch on-off into
Row controls, and the mode of a few sections of switches open circuit is realized changing of the hop count of LED load series connection by use
Become.LED load can be divided into 3～7 sections, and segmentation is few, and circuit is simple, but curent change is bigger；
Segmentation is many, then circuit structure is complicated.Typically take 4～6 sections to be preferred.
In aforesaid large chip horizontally disposed LED light machine module, set the arteries and veins of Rectified alternating current
Dynamic direct-current working volts VWMore than VWmaxPeriod, control all switching off, stop to institute
LED load is had to power, it is achieved overvoltage and the surge protection to LED；Straight by adjusting pulsation
The maximum allowable pulsating dc voltage V of stream electricityWmaxSize, thus realize luminescence to LED
Brightness adjustment.
In aforesaid large chip horizontally disposed LED light machine module, by arranging current sensor
Record effective operating current I in circuitW, work as IWExceed design load KIWRTime, close all switches
To realize current protection, switch on and need to recover after reloading voltage next time, wherein K
For regulation coefficient, IWRFor specified effective operating current.
In aforesaid large chip horizontally disposed LED light machine module, described switch is straight in pulsation
Stream voltage ascent stage time delay tmMillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stagem
Millisecond action, to obtain LED operation electric current relatively smoothly.
In aforesaid large chip horizontally disposed LED light machine module, it is every that setting is cascaded
One section of LED load is the LED chip group with different maximum carrying magnitudes of voltage, can make opening
Close the LED load series block group acquisition controlling lower work close to the operating current of ideal sine wave
Curve.
In aforesaid large chip horizontally disposed LED light machine module, described each section of LED load
The method of adjustment of maximum carrying voltage is: 1. with pulsating dc voltage as vertical coordinate, pulsating direct current
Cycle is abscissa mapping；2. supposing a pure resistor load, its power is at pulsating direct current half-wave
The sinusoidal graphics area formed is 1, mapping；3. the carrying merit of LED load series block group is set
Rate is the 120% of pure resistor load, makees the rectangle echo that an area is 1.2, rectangle shade
Ordinate value be the maximum carrying magnitude of voltage that series block group is total；The most in like manner, it is known that LED bears
Carry under carrying voltage condition, can map and draw the graphics area of LED load, verify LED piecemeal
The area sum of load is more than the pulsating direct current sine wave area controlled under node of switch；5. select
Take the carrying magnitude of voltage of each section of LED load in LED load series block group, be added more than or equal to string
The maximum carrying magnitude of voltage that connection section group is total；Wherein, the LED load that carrying magnitude of voltage is higher
Near positive terminal, carry the relatively low LED load of magnitude of voltage near negative pole end.
In aforesaid large chip horizontally disposed LED light machine module, the material of described light machine template
For thin slice transparent non-metallic material (such as SiO2, Al2O3Deng), it is to be warmed to by slim sheet material
Nearly material softening point, utilizes mould to use pressing equipment stamping forming.(material is the most brittle and hard
Spend higher.So can only cutting mode when being processed into light machine template shape, relatively costly.)
Use the method that aforesaid LED light machine module sets up LED illumination core component: at LED
Flexible circuit is set on ray machine module, or after being also covered with transparent cover plate, loads band fluorescent material
Inner cover；Inner cover with fluorescent material is by the injection particulate material containing fluorescent material and without fluorescent material
Transparent injected-moulded particulate material mixing；Mixed proportion configures as required, then passes through injection mo(u)lding
Obtain；The wherein said injection particulate material containing fluorescent material be by 20～30% fluorescent powder with
70～80% transparent injected-moulded particulate material mixing, again make injection particulate material after hot melt；Fluorescent material selects
With the persistence of the fluorescent material more than 8ms.
Compared with prior art, the ray machine module of the present invention goes for the present inventor in first Shen
All kinds of bulb patents please, original ray machine module in replacement bulb.The ray machine module of the present invention
Structurally can be with built-in power and LED illumination chip, and volume is little, it is easy to accomplish standard
Change.The present invention can change existing industry structure centered by LED chip, the present invention
LED light machine module can be to realize light source (bulb) standard under the pattern of replaceable light source
Change, such that it is able to reduce the industry complexity of illuminating product and reduce the industry collection of illuminating product
Moderate.
Under the driving of LED power large chip, LED illumination large chip is designed to fixing width
Degree W, length then determines according to the specification of the equipment of manufacture, is divided into different length during use
Degree.So LED illumination large chip is not required to for single led chip to cut into grade size,
The mechanical property requirement to substrate will be reduced during chip manufacturing, make the high purity aluminium oxide of similar polycrystalline
Deng the range of choice of entrance substrate, the manufacturing cost of LED illumination chip is greatly reduced.
Every LEDs chip the two poles of the earth in LED illumination large chip are without welding, and electrode can do relatively
The while of little and the scheme of transparency electrode can be used, can effectively increase the light-emitting area of chip and carry
High-luminous-efficiency.
From the beginning of chip factory, LED illumination large chip only need to can be directly against in conjunction with power supply large chip
Welding equipment is connected in light machine template or bulb heat conduction support.LED illumination production procedure is short and simple.
Meanwhile, large chip by use power segmentation cutting, design, produce product whole during hold
The factor easily determined is more, it is simple to its control is realized standardized work.
Majority of illumination application requirement can be met by the illumination large chip using power to split, this
Illumination large chip sample non-cutting, a limited number of easily realizes the industrial concentration of scale,
The manufacturing cost of illuminating product will be greatly reduced.
The present invention changes LED existing encapsulation industrial concept, after illumination large chip uses upside-down mounting
Only need simplified package large chip periphery；The techniques such as cover plate encapsulation can be used when using formal dress；
Get around external patent barrier.
And owing to existing LED drive power mostly is Switching Power Supply, volume is the biggest；Also there is volume
Slightly smaller linear power supply, but its driving chip is many with DIP dual-in-line or SMD paster encapsulation type
Formula coordinates auxiliary element again, is then welded in PCB, and its volume is still not enough to little
To being placed into ray machine module internal.This thinking is difficult to make LED drive power be miniaturized, gently
Quantify and transparence, it is impossible to be placed in ray machine module, finally cannot be general and exchange
LED bulb realizes civil power and is directly accessed.
The power supply large chip using the actuation techniques of the present invention can meet LED illumination and apply such as
Drive, light modulation, overvoltage and the various primary demands of surge protection, overload etc., and can be
It is less that volume does, to such an extent as to can be put into driving power supply in bulb even ray machine module
Portion.LED illumination low cost, miniaturization are had very important significance by this.The present invention promotes
Developing towards integrated direction of LED chip, makes the appearance of illumination large chip become a reality.
The fast development being used in conjunction with promoting LED illumination industry further of the two.
It addition, civil power is converted into Rectified alternating current by rectifier bridge by the present invention, simultaneously by each
Voltage in cycle is multistage by phase division, and utilizes the different characteristic of voltage in multistage, makes
With switch, the hop count concatenating the LED load into duty is adjusted, so that LED bears
Being loaded into into intelligentized operational mode, this operational mode can meet LED chip and power, and
This LED type of drive of the present invention can greatly reduce the complexity driving power supply, thus
LED light machine module built-in driving power supply is possibly realized, and this realizes bigger for LED bulb
Versatility and interchangeability significant.
Accompanying drawing explanation
Fig. 1 is the circuit diagram in the small-sized light machine template of the embodiment of the present invention；
Fig. 2 is the circuit diagram in the medium-sized light machine template of the embodiment of the present invention；
Fig. 3 is the small-sized ray machine module schematic diagram of the embodiment of the present invention；
Fig. 4 is the medium-sized ray machine module schematic diagram of the embodiment of the present invention；
Fig. 5 is the circuit diagram in the large-scale light machine template of the embodiment of the present invention；
Fig. 6 is the circuit diagram in the powerful large-scale light machine template of the embodiment of the present invention；
Fig. 7 is the large-scale ray machine module schematic diagram of the embodiment of the present invention；
Fig. 8 is the powerful large-scale ray machine module schematic diagram of the embodiment of the present invention；
Fig. 9 is transition circuit of the present invention integrated transparent block structural representation；
Figure 10 is the structural representation of embodiment of the present invention LED illumination large chip；
Figure 11 is the structural representation that embodiment of the present invention low-power LED drives power supply large chip；
Figure 12 is the structural representation of the ray machine core component of the embodiment of the present invention；
Figure 13 is the LED voltage current waveform figure of the embodiment of the present invention；
Figure 14 is that the extra-high pressure of the embodiment of the present invention runs power waveform figure；
The light modulation of Figure 15 embodiment of the present invention runs power waveform figure；
The circuit connection diagram of Figure 16 embodiment of the present invention；
The driving power supply chip internal circuit diagram of Figure 17 embodiment of the present invention；
The LED voltage current waveform figure of Figure 18 embodiment of the present invention 3 sections load；
The LED chip array module power of Figure 19: embodiment of the present invention DC52V series connection loads
Scattergram；
Figure 20: embodiment of the present invention LED chip array carrying voltage tentative calculation figure；
Single DC52V chip bearing power tentative calculation figure of Figure 21: the embodiment of the present invention；
The LED chip array module merit of Figure 22: embodiment of the present invention 2*52V+4*35V series connection
Rate loads scattergram；
Figure 23 is the structural representation of embodiment of the present invention high-power LED driving power source large chip.
Being labeled as in accompanying drawing: 41-LED chip, 43-light machine template, 43.1-light machine template
Fixing hole, 44-flexibility built-up circuit, 44.1-solder joint, the transparent sealing of 45-, 61-band fluorescence
The inner cover of powder, 410-LED drives power supply large chip, 410.1-transparent cover plate, and 411-drives electricity
Source wafer stage chip, 412-rectifier bridge wafer stage chip, 413-the second transparency carrier, 414-
Silver slurry circuit, 414.1-pad, 420-LED illuminates large chip, 421-the first transparency carrier,
The integrated transparent block of 430-A type transition circuit.431-the 3rd transparency carrier.
The present invention is further illustrated with embodiment below in conjunction with the accompanying drawings, but be not intended as right
The foundation that the present invention limits.
Embodiment.The LED light machine module that large chip is horizontally disposed, including being printed on silver slurry circuit
The transparent light machine template 43 of 414, silver slurry circuit 414 is formed in light machine template 43 and connects
Mouth wire, the width of its interface lead and spacing drive with LED illumination large chip 420 and LED
The width W of power supply large chip 410 and spacing WJGIdentical；For power in large-scale ray machine module
Bigger, or also need light machine template 43 and 1 by the integrated transparent block of transition circuit 430
Above LED drive power large chip 410 connects；Again by LED drive power large chip 410
One side transparent light machine template 43 band silver with LED illumination large chip 420 band silver slurry circuit 414
The one side of slurry circuit 414 obtains LED light machine module by interface lead butt welding.
For medium and small LED light machine module (light machine template is respectively as shown in Fig. 2 and Fig. 1),
External power source or signal are directly driven from the LED being welded on light machine template 43 by connector 11
Access on galvanic electricity source large chip 410, as shown in Figure 3 and Figure 4；For large-scale LED light machine
Module, light machine template 43 is as it is shown in figure 5, be also welded with flexible circuit in light machine template 43
44, external power source or signal connect flexible circuit 44 by connector 11 and are linked into and are welded on light
On LED drive power large chip 410 in machine template 43；For large LED ray machine module
Middle power is bigger, and light machine template 43 as shown in Figure 6, light machine template 43 is welded with one
LED drive power large chip 410 more than and and one and above LED illumination large chip
420, as shown in Figure 7 and Figure 8；Tailing edge LED drive power large chip 410, LED illumination
Large chip 420 and or 430 weeks banding transparent adhesive tapes 45 of the integrated transparent block of transition circuit obtain LED light
Machine module.
Shown in described transparent transition circuit integrated transparent block 430 Fig. 9, including the 3rd transparent base
Plate 431, the 3rd transparency carrier 431 is printed with silver slurry circuit 414, and silver slurry circuit 414 has
Interface lead, interface lead has 1 group of incoming end and the outfan of more than 1 group；The width of incoming end
Degree and the width W of light machine template 43 wire incoming endGIdentical；The interface lead of outfan and LED
Drive the incoming end width W of power supply large chip 410GIdentical；By integrated for transition circuit transparent block
The band silver of the one side and light machine template 43 that are printed with silver slurry circuit 414 on 430 starches circuit 414
One side by interface lead butt welding；The integrated transparent block of transition circuit 430 for by external power source or
Signal accesses one and above LED drive power large chip 410, then drives electricity by LED
Source large chip 410 exports on LED illumination large chip 420.Solve due to LED light machine mould
The circuit requirement of group, external power source to be made or signal access LED drive power large chip 410 or
LED drive power large chip exports the circuit of LED illumination large chip 420 need to relate to ray machine
Printed circuit two-sided in template can realize, owing to the back of generally light machine template will
Held against heat sink uses, and radiator is made of metal mostly, and the back of light machine template needs absolutely
Edge, it is impossible to the problem realizing circuitron.The transition circuit integrated transparent block bag of the present invention
Containing a kind of integrated transparent block of transition circuit: A type: external power source and signal are respectively connected to double LED
Driving on power supply large chip 410, see Fig. 9, the width that wherein outer lead accesses is WG；
It is W that LED drive power large chip 410 wire accesses widthG.Its overall width be 2*W+10mm,
It is highly H2；Typical sizes is: width 25.8mm, highly: H2=6mm.
Described LED illumination large chip 420, as shown in Figure 10, is fixed as including a width
First transparency carrier 421 of W, the first transparency carrier is provided with the interface lead that N+1 bar is parallel,
First transparency carrier 421 is provided with N LEDs chip 41 and constitutes LED chip series connection group, often
LEDs chip 41 is respectively positioned between two adjacent interface lead, and two adjacent interfaces are led
The spacing of line is WJGInterface lead width is subtracted again divided by N (W equal to WJG=(W-interface lead width)
/ N), and the both positive and negative polarity of every LEDs chip 41 is connected to two adjacent interface lead respectively
On；And multiple LED strip joint group the most in parallel so that being formed on transparency carrier 421 can be transparent
The LED chip array of the N row multirow extended on substrate 421 length direction；N be 3 to 7 it
Between integer；When setting up LED light machine module, according to power needs, big to LED illumination
Chip 420 is cut out, and the LED illumination large chip 420 being cut into different length has difference
Power.
Described LED chip array and interface lead forming method on the transparent substrate is: use
Transparent substrate does the slim epitaxial wafer that transition epitaxial layer is formed, and epitaxial wafer uses ripe chip system
Making technical point layer growth circuit and LED chip, the most cleaved formation width is that the LED of W shines
Bright large chip, the circuit wherein grown includes that interface lead and connection LED chip and interface are led
The wire connecting chip of line, substrate is as the first transparency carrier；Described chip two pole due to
Need not welding, transparency electrode can be used, to increase the light-emitting area of chip；Described chip
Ripe manufacturing technology is: the Metalorganic chemical vapor deposition equipment layering of employing carry out covering silicon, on
The techniques such as glue, photoetching, etching, plated film, alloy and abrasive disc；Or employing conventional art will
LED chip array is mounted on the first transparency carrier 421 producing silver slurry circuit 414, and
Welded and the silver slurry circuit 414 on the first transparency carrier 421 by face-down bonding or spun gold formal dress
Connecting, it is thus achieved that LED illumination large chip 420, silver slurry brush circuit 414 includes interface lead and company
Connect the wire of chip.
Described LED drive power large chip, as shown in Figure 11 and Figure 23, fixes including width
For second transparency carrier 413 of W, transparency carrier 413 is printed with silver slurry circuit, silver slurry circuit
Having interface lead on 414, interface lead has incoming end and outfan；The width of incoming end and light
The width W of machine template 43 wire incoming endGIdentical or have the pad being connected with connector；Output
The interface lead that N+1 bar is parallel, the spacing of adjacent two interface lead is had in the interface lead of end
WJGInterface lead width is subtracted again divided by N (W equal to WJG=(W-interface lead width)/N)；Second is saturating
Power drives wafer stage chip 411 and the rectifier bridge of first pasting un-encapsulated on bright substrate 413 are brilliant
Circle level chip 412, then by power drives wafer stage chip 411 and the rectifier bridge of un-encapsulated
Wafer stage chip 412 is welded on the second transparency carrier 413, and the second transparency carrier 413 connects
The width of mouth conductor wire end is identical with the width W of LED illumination large chip, and height is H2；LED drives
On the large chip of galvanic electricity source, the purposes of interface lead is for connection to described LED illumination large chip
On chip array.
LED driving method on described LED light machine module is: rectifier bridge wafer stage chip 412
On rectifier bridge civil power AC is converted into Rectified alternating current, the voltage of Rectified alternating current be more than zero,
Less than or equal to Rectified alternating current specified maximum working voltage VWR, Rectified alternating current is arranged 3～
7 sections of LED load, each section of LED load is cascaded and forms LED load series block group, many
Individual LED load series block group forms described LED chip array, at the electricity of Rectified alternating current
When pressure raises, power drives wafer stage chip 411 controls the hop count of LED load series connection and increases step by step
Adding, when the voltage of Rectified alternating current declines, the hop count controlling LED load series connection reduces step by step,
The hop count of LED load series connection is the actual LED load hop count being connected into Rectified alternating current.
The hop count of described LED load series connection is controlled by switch, and the control node of switch is
The segmentation boundary of voltage, the hop count that the number of fragments of described voltage is connected with LED load is relative
Should；The control method of the hop count of described LED load series connection is, by the negative pole of every section of LED load
Direction connects the negative pole of Rectified alternating current respectively by switch, then according to the electricity of Rectified alternating current
Each is switched on-off and is controlled by buckling, uses the mode by the open circuit of a few sections of switches real
The change of the hop count of existing LED load series connection.
Set pulsating direct current running voltage V of Rectified alternating currentWMore than VWmaxPeriod, control
All switch off, stop powering to all LED load, it is achieved overvoltage and the wave to LED
Gush protection；By adjusting the maximum allowable pulsating dc voltage V of Rectified alternating currentWmaxSize,
Thus realize the luminosity to LED and adjust.
Effective operating current I in circuit is recorded by arranging current sensorW, work as IWExceed design
Value KIWRTime, close all switches to realize current protection, switch on need to next time again
Recovering after on-load voltage, wherein K is regulation coefficient, IWRFor specified effective operating current.
Described switch is at pulsating dc voltage ascent stage time delay tmMillisecond action, straight in pulsation
The stream voltage decline stage shifts to an earlier date tmMillisecond action, to obtain LED operation electricity relatively smoothly
Stream.
Arranging each section of LED load being cascaded is to have different maximum carrying voltage
The LED chip group of value, can make the LED load series block group worked under on-off control obtain and connect
The operating current curve of nearly ideal sine wave.
The method of adjustment of described each section of LED load maximum carrying voltage is: 1. with pulsating direct current
Voltage is vertical coordinate, pulsating direct current cycle to be abscissa mapping；2. a pure resistor load is supposed,
Its power is 1 at the sinusoidal graphics area that pulsating direct current half-wave is formed, mapping；3. LED is set
Load power is pure resistor load the 120% of load in series section group, making an area is 1.2
Rectangle echo, the ordinate value of rectangle shade is the maximum carrying voltage that series block group is total
Value；The most in like manner, it is known that under LED load carrying voltage condition, can map and draw LED load
Graphics area, verify area sum the controlling under node more than switch of LED load piecemeal
Pulsating direct current sine wave area；5. holding of each section of LED load in LED load series block group is chosen
Carry magnitude of voltage, be added the maximum carrying magnitude of voltage total more than or equal to series block group；Wherein,
Carry the higher LED load of magnitude of voltage near positive terminal, the LED load that carrying magnitude of voltage is relatively low
Near negative pole end.
The material of described light machine template 43 is thin slice transparent non-metallic material, such as SiO2, Al2O3
Deng, it is that slim sheet material is warmed to nearly material softening point, utilizes mould to use pressing equipment punching
Molded.Owing to material is brittle and hardness is higher, therefore can only be processed into by cutting mode
During light machine template shape, relatively costly.
Use the method that aforesaid LED light machine module sets up LED illumination core component, such as figure
Shown in 12, after LED light machine module arranges flexible circuit 44, load the inner cover of band fluorescent material
61；Inner cover 61 with fluorescent material is by the injection particulate material containing fluorescent material and without fluorescence
The transparent injected-moulded particulate material mixing of powder；Mixed proportion configures as required, then by being molded into
Type and get final product；The wherein said injection particulate material containing fluorescent material be by 20～30% fluorescent powder with
70～80% transparent injected-moulded particulate material mixing, again make injection particulate material after hot melt；Fluorescent material selects
With the persistence of the fluorescent material more than 8ms.
It it is hereafter the operation principle of the present invention as a example by 6 groups of LED load.I.e. n value is 6.
First, alternating current AC becomes Rectified alternating current after rectifier bridge, example: AC220V,
After the rectified bridge rectification of 50Hz alternating current, seeing Figure 13, voltage is half period (180 degree)
Wavy curve, cycle pulsating dc voltage when 0 degree is zero, the pulsating direct current when 90 degree
Voltage reaches maximum VWRFor the highest DC311V, when 180 degree, voltage reduces to again zero, week and
Renew.
The job requirement of the present invention, at pulsating dc voltage more than zero and less than or equal to VWRBetween,
3～7 sections of loads are set altogether, form series system between each section of load, raise with voltage, load
(i.e. LED load) series connection hop count increases step by step, and load voltage is loaded by on-off control, sees
Figure 13 and Figure 16, voltage switch node is voltage segmentation boundary.
Power supply management operational mode: the present invention not design current controls device, opening of switches at different levels
Close and be only dependent upon VWChange, see Figure 13, Figure 16 and Figure 17.
Cycle 0～when 90 degree:
1st section: work original state, i.e. cycle initiate from 0, circuit breaker in middle K1～K6
Being in opening (ON), electric current is mainly through node J1By switch K1Form path, negative
Carrying by rated voltage is 1VWRThe LED composition of/6 tandem workings；
2nd section: work as VWMore than or equal to 1VWRWhen/6, switch K1 closes (OFF), electric current master
Will form path through node J2 by switch K2, load is 2V by rated voltageWR/ 6 strings
The LED composition of connection work；
3rd section: work as VWMore than or equal to 2VWRWhen/6, switch K1 is in OFF, switchs K2
Closing (OFF), electric current mainly forms path through node J3 by switch K3, and load is by specified
Voltage is 3VWRThe LED composition of/6 tandem workings；
4th section: work as VWMore than or equal to 3VWRWhen/6, switch K1～K2 is in OFF, opens
Closing K3 and close (OFF), electric current mainly forms path, load through node J4 by switch K4
It is 4V by rated voltageWRThe LED composition of/6 tandem workings；
5th section: work as VWMore than or equal to 4VWRWhen/6, switch K1～K3 is in OFF, opens
Closing K4 and close (OFF), electric current mainly forms path, load through node J5 by switch K5
It is 5V by rated voltageWRThe LED composition of/6 tandem workings；
6th section: work as VWMore than or equal to 5VWRWhen/6, switch K1～K4 is in OFF, opens
Closing K5 and close (OFF), electric current forms path through node J6 by switch K6, and load is by volume
Determining voltage is 6VWRThe LED composition of/6 tandem workings；
When switch K1～K6 closes, the method for closing of time delay 0.1ms can be used, phase can be obtained
To more stable electric current.
Cycle 90～when 180 degree:
6th section: work original state, voltage is reduced downwards by maximum, circuit breaker in middle
K1～K5 is closed (OFF), and switch K6 is in opening, and electric current is through node J6
Forming path by switch K6, load is 6V by rated voltageWRThe LED of/6 tandem workings
Composition；
5th section: work as VWLess than or equal to 5VWRWhen/6, switch K5～K6 opens (ON),
Electric current mainly forms path through node J5 by switch K5, and load is 5V by rated voltageWR/6
The LED composition of tandem working；
4th section: work as VWLess than or equal to 4VWRWhen/6, switch K4～K6 opens (ON),
Electric current mainly forms path through node J4 by switch K4, and load is 4V by rated voltageWR/6
The LED composition of tandem working；
3rd section: work as VWLess than or equal to 3VWRWhen/6, switch K3～K6 opens (ON),
Electric current mainly forms path through node J3 by switch K3, and load is 3V by rated voltageWR/6
The LED composition of tandem working；
2nd section: work as VWLess than or equal to 2VWRWhen/6, switch K2～K6 opens (ON),
Electric current mainly forms path through node J2 by switch K2, and load is 2V by rated voltageWR/6
The LED composition of tandem working；
1st section: work as VWLess than or equal to 1VWRWhen/6, switch K1～K6 opens (ON),
Electric current mainly forms path through node J1 by switch K1, and load is 1V by rated voltageWR/6
The LED composition of tandem working.
When switch K1～K6 opens, the open method of 0.1ms in advance can be used, phase can be obtained
To more stable electric current.
Light modulation operational mode: outside arranges one when giving voltage VT=0, VWmaxCorresponding CVWR,
When external voltage gives VT=5V, VWmaxCorresponding 0V, arranges 0≤VWmax≤CVWR, C adjusts
Coefficient, for the multiple of rated voltage, such as C=1.12.VWMore than VWmaxPeriod, corresponding each
The switch of section will cut out (OFF), stop powering to the load.It act as a kind of dimming arrangement.
See Figure 15, Figure 16 and Figure 17, regulate VWmaxLess than VWR, in figure, yl moiety will increase,
The power being input to load will reduce, thus reach the purpose of light modulation.Example: when LED is at AC220V
Civil power normally works, when adjusting alternating current voltage to the voltage of AC180V, and the shade in figure
Part is VWFormation power projection figure part higher than 254V, from the cycle about 55.5 degree to
Between 124.5 degree, owing to switch Kx corresponding in this period is in closedown (OFF), cloudy
The power consumption of shadow part (be equivalent under normal civil power pulsating direct current half-wave load the 57.0% of power)
By disallowable, this part power consumption is not loaded in load, makes the luminance-reduction of load.When
VWmaxDuring equal to 0, all switches will cut out (OFF), and load supplying amount is zero.Can do
To stepless dimming, without there is energy expenditure.
Voltage protection operational mode: V is setWmax=CVWR。VWMore than VWmaxPeriod, right
Should each section switch will close (OFF), stop powering to the load.See Figure 14, Tu16He
Figure 17, example: when civil power reaches the high voltage of 270V, the dash area in figure is VWIt is higher than
The formation power projection figure part of 348V, from the cycle about 66 degree to 114 degree, due to this
In the section time, K1～K6 switch is in cut out (OFF), and the power consumption of dash area (is just equivalent to
Under normal civil power, pulsating direct current half-wave loads the 50.2% of power) by disallowable, this part power consumption
It is not loaded in load, makes load will not burn because of overvoltage.
Overcurrent protection operational mode: the present invention has overcurrent protection, sees Figure 17, and electric current passes
Sensor records effective operating current I in circuitWExceed design load KIWR, K is regulation coefficient, example:
Set IWR=275mA, K=1.2, logic switch controller is by all for cut out switch K1～K6
(OFF), open switch (ON) K1～K6 to recover after reloading power supply pressure next time.
According to principle same as described above, mode of loading can be divided into 3～7 sections, and segmentation is few, electricity
Road is simple, but curent change is relatively big, easily produces low-order harmonic at electrical network, sees Figure 18；
Segmentation is many, then circuit structure is complicated.Typically take 4～6 sections to be preferred.
Note: VWPulsating direct current running voltage (1.4142* alternating voltage)；VWRPulsation is straight
Flow specified maximum working voltage (1.4142* alternating voltage)；VWmaxMaximum allowable pulsating direct current
Voltage (1.4142* alternating voltage)；IWEffectively operating current.IWRSpecified effective work
Electric current.
If civil power is AC220, the voltage after rectification is DC311V, often to organize LED load as list
As a example by chips, then every chips bears DC52V；Such as AC110, then chip bears DC26V.
If the loading power area of pulsating direct current half-wave is 1, see Figure 19, each LED load in figure
It is bigger that (LED module 1 to 6) is loaded power difference, and it is straight that LED module 1 reaches pulsation
20.68% (for the 84.4% of chip nominal output) loading power area of stream half-wave；And LED
Module 6 only 5.11% (for the 19.2% of chip nominal output), about the four of module 1/
One power, through actual measurement checking, the intrinsic brilliance of module 6 is the lowest；Whole chipset average
The power being loaded is the 52.4% of chip nominal output, and the utilization rate of chip is relatively low；And chip
The nominal output (dotted line frame area) of group is the 159% of the loading power area of pulsating direct current half-wave.
Owing to chip redundancy amount is excessive, not only chip waste, also result in and drive power supply excessive and waste,
Add the difficulty in layout simultaneously.Therefore, the side of chip voltage is selected under Constant Direct Current state
There is some problems in method under pulsating direct current state, how in the premise ensureing chip secure work
Under, the utilization rate improving chip becomes a problem to be solved.
The nominal output of the LED chip array setting 6 series connection is loaded merit by pulsating direct current half-wave
1.59 times of rate are turned down and (be there will be in view of small grids civil power to 1.2 times and be not less than 1.2
Times fluctuation), see Figure 20, if LED chip array chip bearing power (dash area in figure
Area) it is that pulsating direct current half-wave loads power 1.2 times of (pulsating direct current half-wave part area)
Time, can be extrapolated the carrying voltage of chip array when civil power is AC220V by Figure 20 mapping is
DC236V；
See Figure 21, LED module 1 is respectively provided with different magnitudes of voltage to module 6, can
To obtain chip loading power area (dash area in figure) under different bearer magnitude of voltage；
(model of module 1 and module 2 is to use 2*52V+4*35V high voltage chip
VES-AADBHV45, module 3 to module 6 are ES-AADBHF40) composition serial array, then
The carrying Voltage Cortrol of chip array is DC244V；Make Figure 22, it is thus achieved that chip array added
Carrying power area is the 96.67% of pulsating direct current half-wave power area, and chip array is loaded
Power is perfect condition close to 1；The power that now LED chip array is loaded is chip array
Nominal output 77.6%；Experimental verification is close with estimated value.
The module of each voltage section loads power checking: set the loading power area of pulsating direct current half-wave
Being 1, when voltage is vertical coordinate, calculating DC52V chip nominal output easily by Figure 21 is
26.52%, in like manner, the nominal output of DC35V chip is 17.89%；Figure 22 is then that civil power is
During AC220V, the power situation being loaded of each module of LED chip array；Table 1 is chip battle array
When the power that row are loaded is pulsating direct current half-wave power area 1, line voltage is respectively
Each module of AC220V, AV246V, AC270V is loaded the situation of power, can see in table
Going out, only module 3 slightly transships at DC311V and DC348V, but due to module 1 and module 2
Margin of power, experiment is had to prove that module 3 can pass through.
When other line voltage grades, optimal way is carried out with reference to above-mentioned.
Ideally the checking computations of chip bearing power are as shown in the table:
Claims (15)
1. the LED light machine module that large chip is horizontally disposed, it is characterised in that: include being printed on silver
The transparent light machine template (43) of slurry circuit (414), silver slurry circuit (414) is at ray machine mould
Plate is formed with interface lead on (43), and width and the spacing of its interface lead are big with LED illumination
Chip (420) and the width W of LED drive power large chip (410) and spacing WJGIdentical；
Again LED drive power large chip (410) and LED illumination large chip (420) band silver are starched electricity
The one side that the one side on road (414) starches circuit (414) with transparent light machine template (43) band silver is pressed
Interface lead butt welding obtains LED light machine module；Wherein, for power in large-scale ray machine module relatively
Big, or also need by the integrated transparent block of transition circuit (430) by light machine template (43) with
The LED drive power large chip (410) of more than 1 connects.
The LED light machine module that large chip the most according to claim 1 is horizontally disposed, its
It is characterised by: for medium and small LED light machine module, external power source or signal directly pass through
Connector (11) is from the LED drive power large chip (410) being welded on light machine template (43)
Upper access, tailing edge LED drive power large chip (410) and LED illumination large chip (420)
Week banding transparent adhesive tape (45) obtains LED light machine module；For large-scale LED light machine module, light
Flexible circuit (44), external power source or signal also it is welded with by patching in machine template (43)
Part (11) connects flexible circuit (44) and is linked into the LED being welded in light machine template (43)
Drive on power supply large chip (410), tailing edge LED drive power large chip (410) and
LED illumination large chip (420) week banding transparent adhesive tape (45) obtains LED light machine module；For
In large LED ray machine module, power is bigger, and light machine template is welded with more than one on (43)
LED drive power large chip (410) and more than one LED illumination large chip (420),
Tailing edge LED drive power large chip (410), LED illumination large chip (420) and transition
The integrated transparent block of circuit (430) week banding transparent adhesive tape (45) obtains LED light machine module.
The LED light machine module that large chip the most according to claim 1 is horizontally disposed, its
It is characterised by: the integrated transparent block of described transition circuit (430) includes the 3rd transparency carrier
(431), the 3rd transparency carrier (431) is printed with silver slurry circuit (414), silver slurry circuit
(414) having interface lead, interface lead has 1 group of incoming end and the outfan of more than 1 group；
The width of incoming end and the width W of light machine template (43) wire incoming endGIdentical；Outfan
Interface lead width and the incoming end width W of LED drive power large chip (410)GIdentical；
One side and the light of silver slurry circuit (414) will be printed with on integrated for transition circuit transparent block (430)
The one side of band silver slurry circuit (414) of machine template (43) is by interface lead butt welding；Transition electricity
The integrated transparent block in road (430) is driven for external power source or signal are accessed more than one LED
Galvanic electricity source large chip (410), then by LED drive power large chip (410) output to LED
In illumination large chip (420).
The LED light machine module that large chip the most according to claim 1 is horizontally disposed, its
It is characterised by: described LED illumination large chip (420) includes that a width is fixed as the of W
One transparency carrier (421), the first transparency carrier (421) is provided with the interface that N+1 bar is parallel
Wire, the first transparency carrier (421) is provided with N LEDs chip (41) and constitutes LED core
Sheet series connection group, every LEDs chip (41) is respectively positioned between two adjacent interface lead, and two
The spacing of the interface lead that bar is adjacent is WJGInterface lead width is subtracted again divided by N equal to W, and every
The both positive and negative polarity of LED chip (41) is connected in two adjacent interface lead respectively；And with
Shi Binglian multiple LED strip joint group so that the upper formation of the first transparency carrier (421) can be first
The LED chip array of the N row multirow extended on transparency carrier (421) length direction；N is 3
Integer between 7；When setting up LED light machine module, according to power needs, LED is shone
Bright large chip (420) is cut out, and is cut into the LED illumination large chip (420) of different length
There is different power；Described LED chip carrying voltage is DC3.2V or more than DC10V
High voltage.
The LED light machine module that large chip the most according to claim 4 is horizontally disposed, its
It is characterised by: described LED chip array and interface lead are on the first transparency carrier (421)
Forming method be: use transparent substrate do transition epitaxial layer formed slim epitaxial wafer, outward
Prolong sheet and use ripe chip fabrication techniques multi ANN circuit and LED chip, the most cleaved shape
The LED illumination large chip becoming width to be W, the circuit wherein grown includes interface lead and company
Connecing the wire of LED chip and interface lead, substrate is as the first transparency carrier；Described chip
Two poles, owing to need not welding, use transparency electrode, to increase the light-emitting area of chip；Described
Chip maturation manufacturing technology be: use Metalorganic chemical vapor deposition equipment layering cover
Silicon, gluing, photoetching, etching, plated film, alloy and abrasive disc technique；Or employing conventional art
LED chip array is mounted on the first transparency carrier (421) producing silver slurry circuit (414)
On, and by face-down bonding or the welding of spun gold formal dress and the silver on the first transparency carrier (421)
Slurry circuit (414) connects, it is thus achieved that LED illumination large chip (420), silver slurry brush circuit (414)
Including interface lead and the wire of connection LED chip.
The LED light machine module that large chip the most according to claim 1 is horizontally disposed, its
It is characterised by: described LED drive power large chip includes that width is fixed as the second transparent base of W
Plate (413), the second transparency carrier (413) is printed with silver slurry circuit, silver slurry circuit (414)
On have interface lead, interface lead to have incoming end and outfan；The width of incoming end and ray machine mould
The width W of plate (43) wire incoming endGIdentical or have the pad being connected with connector；Outfan
Interface lead on have the parallel interface lead of N+1 bar, the spacing of adjacent two interface lead
WJGInterface lead width is subtracted again divided by N, i.e. W equal to WJG=(W-interface lead width)/N, N are 3
Integer between 7；The power supply first pasting un-encapsulated on second transparency carrier (413) drives
Dynamic wafer stage chip (411) and rectifier bridge wafer stage chip (412), then by un-encapsulated
Power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) be welded on
On two transparency carriers (413), the second transparency carrier (413) have the width of interface lead end with
The width W of LED illumination large chip is identical, and height is H2；Connect on LED drive power large chip
The chip array that the purposes of mouth wire is for connection on described LED illumination large chip.
The LED light machine module that large chip the most according to claim 6 is horizontally disposed, its
Being characterised by, the LED driving method on described LED drive power large chip is: rectifier bridge is brilliant
Civil power AC is converted into Rectified alternating current, pulsating direct current by the rectifier bridge on circle level chip (412)
The voltage of electricity is more than zero, less than or equal to Rectified alternating current specified maximum working voltage VWR, at arteries and veins
On dynamic unidirectional current, N section LED load is set；N is the integer between 3 to 7；Each section of LED bears
Load is cascaded and forms LED load series block group, and multiple LED load series block groups are formed
LED chip array, when the voltage of Rectified alternating current raises, power drives wafer stage chip
(411) hop count controlling LED load series connection increases, step by step under the voltage of Rectified alternating current
During fall, the hop count controlling LED load series connection reduces step by step, and the hop count of LED load series connection is real
Border is connected into the LED load hop count of Rectified alternating current.
The LED light machine module that large chip the most according to claim 7 is horizontally disposed, its
It is characterised by: the hop count of described LED load series connection is controlled by switch, the control of switch
Node is the segmentation boundary of voltage, the hop count that the number of fragments of described voltage is connected with LED load
Corresponding；The control method of the hop count of described LED load series connection is, by every section of LED load
Negative pole direction connects the negative pole of Rectified alternating current respectively by switch, then according to Rectified alternating current
Change in voltage each switched on-off be controlled, use the side of a few sections of switches open circuit
Formula realizes the change of the hop count of LED load series connection.
The LED light machine module that large chip the most according to claim 8 is horizontally disposed, its
It is characterised by: set pulsating direct current running voltage V of Rectified alternating currentWMore than VWmaxPeriod,
Control all switching off, stop powering to all LED load, it is achieved the overvoltage to LED
And surge protection；By adjusting the maximum allowable pulsating dc voltage V of Rectified alternating currentWmax's
Size, thus realize the luminosity to LED and adjust.
The LED light machine module that large chip the most according to claim 8 is horizontally disposed, its
Being characterized by, current sensor is set and records effective operating current I in circuitW, work as IW
Exceed design load KIWRTime, close all switches to realize current protection, switching on need to be
Recovering after reloading voltage next time, wherein K is regulation coefficient, IWRFor specified effective work
Electric current.
The LED light machine module that 11. large chips according to claim 8 are horizontally disposed, its
It is characterised by: described switch is at pulsating dc voltage ascent stage time delay tmMillisecond action,
The pulsating dc voltage decline stage shifts to an earlier date tmMillisecond action, to obtain LED relatively smoothly
Operating current.
The LED light machine module that 12. large chips according to claim 7 are horizontally disposed, its
It is characterised by: arranging each section of LED load being cascaded is to have different maximum carryings
The LED chip group of magnitude of voltage, can make the LED load series block group worked under on-off control obtain
Must be close to the operating current curve of ideal sine wave.
The LED light machine module that 13. large chips according to claim 12 are horizontally disposed,
It is characterized in that, the method for adjustment of described each section of LED load maximum carrying voltage is: 1. with
Pulsating dc voltage is vertical coordinate, pulsating direct current cycle to be abscissa mapping；2. supposition one is pure
Ohmic load, its power is 1 at the sinusoidal graphics area that pulsating direct current half-wave is formed, mapping；
3. the load power of LED load series block group is set as the 120% of pure resistor load, work one side
Amass be 1.2 rectangle echo, the ordinate value of rectangle shade is the maximum that series block group is total
Carrying magnitude of voltage；The most in like manner, it is known that under LED load carrying voltage condition, can map and draw
The graphics area of LED load, verifies the area sum control more than switch of LED load piecemeal
Pulsating direct current sine wave area under node；5. each section of LED in LED load series block group is chosen
The carrying magnitude of voltage of load, is added the maximum carrying magnitude of voltage total more than or equal to series block group i.e.
Can；Wherein, the carrying higher LED load of magnitude of voltage is near positive terminal, and carrying magnitude of voltage is relatively low
LED load near negative pole end.
The LED light machine module that 14. large chips according to claim 1 are horizontally disposed,
It is characterized in that: the material of described light machine template (43) is thin slice transparent non-metallic material, it
It is that slim sheet material is warmed to nearly material softening point, utilizes mould to use pressing equipment punch forming
's.
15. use the LED light machine module group described in claim 1 to 14 any claim
The method building LED illumination core component: flexible circuit (44) is set on LED light machine module,
Or after also lid sets transparent cover plate, load the inner cover (61) of band fluorescent material；With fluorescent material
Inner cover (61) is by the injection particulate material containing fluorescent material and the transparent injected-moulded granule without fluorescent material
Material mixing；Mixed proportion configures as required, then passes through injection mo(u)lding and get final product；Wherein said
Injection particulate material containing fluorescent material is by 20～30% fluorescent powder and 70～80% transparent injected-moulded granule
Material mixing, makes injection particulate material again after hot melt；Fluorescent material selects persistence more than 8ms
Fluorescent material.
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| CN201410213295.0A CN103968286B (en) | 2014-05-20 | 2014-05-20 | The LED light machine module that large chip is horizontally disposed |
| PCT/CN2015/079152 WO2015176626A1 (en) | 2014-05-20 | 2015-05-18 | Led large chip and optical machine module group |
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| CN111068183B (en) * | 2019-12-31 | 2021-07-27 | 青岛温可微电子科技有限公司 | Manufacturing method of welding type heating device |
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