CN103968342B - LED ray machine module - Google Patents
LED ray machine module Download PDFInfo
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- CN103968342B CN103968342B CN201410213615.2A CN201410213615A CN103968342B CN 103968342 B CN103968342 B CN 103968342B CN 201410213615 A CN201410213615 A CN 201410213615A CN 103968342 B CN103968342 B CN 103968342B
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Abstract
The invention discloses a kind of LED ray machine module, comprise transparent ray machine template (43), in ray machine template (43), be printed with silver slurry printed circuit (414), in ray machine template (43), be pasted with power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412), power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) are the wafer scale device not encapsulating; Power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) are by face-down bonding or formal dress welding gold thread (417) and silver slurry printed circuit (414) welding; In described ray machine template (43), be also bonded with LED chip array; LED chip array is made up of multiple series block that are connected in parallel, and each series block is composed in series by 3～7 LEDs chips (41), each LED chip (41) is by face-down bonding or formal dress welding gold thread (417) and silver slurry printed circuit (414) welding.
Description
Technical field
The present invention relates to a kind of LED ray machine module, belong to LED lighting technical field.
Background technology
Application number 201310140124.5,201310140138.7,201310140150.8,201310140105.2、201310140134.9、201310140106.7、201310140151.2, the Chinese patent application such as 201310140136.8 disclose multiple can beThe ray machine module technical scheme using on the general LED bulb with exchanging. These technology are for buildingVertical Lighting Industry framework centered by LED bulb, makes LED bulb (lighting source), lampTool, illumination are controlled the basic concept of the end product that becomes independent production, application and are laid a good foundation.But above-mentioned patent not yet solves the problem of the built-in driving power of ray machine module.
Existing LED driving power mostly is Switching Power Supply, and volume is too large; Also there is volume slightly littleLinear power supply, but it drives chip to join mainly with DIP dual-in-line or SMD paster encapsulation pattern againClose auxiliary element, its volume is still not enough to little of being placed into ray machine module internal.
LED illumination provides LED chip to start from chip factory need to be through a series of all to illuminating lampAs paster, die bond, welding, encapsulation, color-division, driving design, heat dissipation design, light fixtureComplicated and the tediously long Production design process such as design, owing to existing chip layout design, heat conduction to establishMany uncertainties such as meter and power drives design, this industry frame centered by LED chipStructure is difficult to realize light source (bulb) standardization under the pattern of replaceable light source, finally causes endLED lamp on end market is main body mainly with the overall structure lamp of non-exchange light source, has increased photographThe industry complexity of bright product and the industrial concentration that has reduced illuminating product.
Further creation idea advanced person, built-in the driving of easier standardized LED bulb ray machine moduleMoving power supply and LED illumination chip organization plan are of far-reaching significance for large-scale promotion LED illumination.
Summary of the invention
The object of the invention is to, provide a kind ofLED ray machine module. It is the easier standard of oneChange, the LED ray machine module of built-in driving power and LED illumination chip structure, it is in structureOn be conducive to the standardization of LED illumination, promote on a large scale.
Technical scheme of the present invention: LED ray machine module, is characterized in: comprise transparent ray machineTemplate, is printed with silver slurry printed circuit in ray machine template, in ray machine template, be pasted with power drivesWafer stage chip and rectifier bridge wafer stage chip, power drives wafer stage chip and rectifier bridge waferLevel chip is the wafer scale device not encapsulating; Power drives wafer stage chip and rectifier bridge wafer scaleChip is by face-down bonding or formal dress welding gold thread and the welding of silver slurry printed circuit; In ray machine templateAlso can be provided with the flexible built-up circuit being welded to each other with silver slurry printed circuit; In described ray machine templateAlso be bonded with LED chip array; LED chip array is by multiple series block groups that are connected in parallelBecome, and each series block is composed in series by 3～7 (can bear high-tension) LED chips,Each LED chip is by face-down bonding or formal dress welding gold thread and the welding of silver slurry printed circuit.
In above-mentioned LED ray machine module, described power drives wafer stage chip, rectifier bridge waferBetween level chip and LED chip, be filled with the transparent sealing for levelling, and then adopt except pre-Stay outside installation and welding position, pattern and size are added a cover with the identical transparent cover plate of ray machine templateOn it, form sealing; Or directly at power drives wafer stage chip, rectifier bridge wafer stage chipForm one deck by power drives wafer stage chip, rectifier bridge wafer stage chip with LED chip andThe transparent sealing of LED chip sealing.
In aforesaid LED ray machine module, the LED driving method on described LED ray machine module is:Civil power AC is converted into Rectified alternating current by rectifier bridge on rectifier bridge wafer stage chip, and pulsation is straightFlow electric voltage and be greater than zero, be less than or equal to the specified maximum working voltage V of Rectified alternating currentWR,3～7 sections of LED loads are set, the each section of LED load formation that is cascaded on Rectified alternating currentLED load series block group, multiple LED load series block form described LED chip array,In the time that the voltage of Rectified alternating current raises, power drives wafer stage chip control LED load series connectionHop count increase step by step, in the time of the voltage drop of Rectified alternating current, control LED load series connectionHop count reduces step by step, and the hop count of LED load series connection is that the actual LED that is connected into Rectified alternating current bearsCarry hop count. Civil power AC becomes Rectified alternating current after rectifier bridge, example: AC220V, 50HzAlternating current is after rectifier bridge rectification, and voltage is the wavy curve of half period (180 degree), weekPhase pulsating dc voltage in the time that 0 spends is zero, and in the time that 90 spend, pulsating dc voltage reaches maximumVWRFor the highest DC311V, 180 when spend, and voltage reduces to again zero, goes round and begins again.
In aforesaid LED ray machine module, the section of described LED load series connection is controlled by switchSystem, the segmentation boundary that the control node of switch is voltage, the number of fragments of described voltage and LEDThe hop count of load series connection is corresponding. LED load can be divided into 3～7 sections, and segmentation is few, circuit letterSingle, but curent change is larger, easily produces low-order harmonic at electrical network; Segmentation is many, circuit knotStructure complexity. Generally get 4～6 sections for good. The control method of the hop count of described LED load series connectionBe: the negative pole direction of every section of LED load is connected to the negative of Rectified alternating current by switch respectivelyThe utmost point, then controls the break-make of each switch according to the voltage change of Rectified alternating current, makesRealize LED load string by the mode of a few sections of switches are opened circuit (thereby LED load is also opened circuit)The change of the hop count of connection.
In aforesaid LED ray machine module, set the pulsating direct current operating voltage V of Rectified alternating currentWBe greater than VWmaxPeriod, control all switches and disconnect, stop to all LED load supplyings, realThe now overvoltage protection to LED (comprising the protection of surging); By adjusting Rectified alternating currentThe large pulsating dc voltage V that allowsWmaxSize, thereby realize luminosity adjustment to LED.
In aforesaid LED ray machine module, described switch prolongs at pulsating dc voltage ascent stageTime tmMillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stagemMillisecond action, to obtainLED operating current relatively stably. tmGenerally get 0.1ms.
In aforesaid LED ray machine module, it is tool that each section of LED load being cascaded is setThere is the LED chip group of different maximum carrying magnitude of voltage, can make to work under switch controlLED load series block group obtains the operating current curve that approaches ideal sine wave.
In aforesaid LED ray machine module, the LED chip group of described each section of LED loadThe method of adjustment of large carrying voltage is: (key is to calculate the total maximum carrying of series block groupMagnitude of voltage) 1. taking pulsating dc voltage as ordinate, the pulsating direct current cycle (180 degree) is horizontal strokeCoordinate mapping; 2. suppose a pure resistor load, its power is just forming at pulsating direct current half-waveString graphics area is 1, mapping; 3. increase because LED voltage increases electric current, essence is powerProperty is damaged. The load power of setting LED load series block group is pure resistor load 120%,Make an area and be 1.2 rectangle echo, it is total that the ordinate value of rectangle shade is series block groupMaximum carrying magnitude of voltage; 4. in like manner,, under known LED chip group carrying voltage condition, can doFigure draws the graphics area of chipset, and the area sum of proofing chip group is greater than the control of switch piecemealThe sinusoidal wave area of pulsating direct current under node processed; 5. choose chipset in series block group by commodityCarrying magnitude of voltage, be added and be more than or equal to the total maximum of series block group carrying magnitude of voltage; ItsIn, the higher LED chip group of carrying magnitude of voltage is near positive terminal (section begins), carrying magnitude of voltageLower LED chip group is near negative pole end (latter end).
In aforesaid LED ray machine module, the material of described ray machine template is that thin slice is nonmetal transparentMaterial is (as SiO2，Al2O3Deng), it is that slim sheet material is warmed to nearly material softening point, profitStamping forming with mould employing pressing equipment. (because material is easy crisp and hardness is higher, thereforeWhile can only cutting mode being processed into ray machine shape of template, cost is higher. )
Use aforesaid LED ray machine module to set up the method for LED illumination core component: at LEDOn ray machine module, flexible circuit is set, or also on LED ray machine module, covers after transparent cover plate,Pack the inner cover with fluorescent material into; By the injection moulding particle containing fluorescent material with the inner cover of fluorescent materialMaterial mixes with the transparent injected-moulded particulate material that does not contain fluorescent material; Mixed proportion configures as required, soAfterwards by injection mo(u)lding and get final product; The wherein said injection moulding particulate material containing fluorescent material is by 20～30%Fluorescent powder and 70～80% transparent injected-moulded particulate material mix, and again make injection moulding particle after hot meltMaterial; Fluorescent material is selected the fluorescent material that is greater than 8ms persistence.
Compared with prior art, ray machine module of the present invention goes for formerly Shen of the inventorAll kinds of bulb patents please, original ray machine module in replacement bulb. Ray machine module of the present inventionStructurally can built-in power and LED illumination chip, and volume is little, is easy to realize standardChange. The present invention can change existing industry structure centered by LED chip, the present inventionLED ray machine module can under the pattern of replaceable light source, realize light source (bulb) standardization,Thereby the industry complexity that can reduce illuminating product is concentrated with the industry that has reduced illuminating productDegree.
In addition, the present invention is converted into Rectified alternating current by rectifier bridge by civil power, simultaneously by eachVoltage in cycle is divided into multistage by phase place, and utilizes the different characteristic of voltage in multistage, makesRegulate being connected in series into the hop count of the LED load of duty with switch, thereby make LED negativeCarry the operational mode that enters controlization, this operational mode can meet LED chip power supply, andThis LED type of drive of the present invention can greatly reduce the complexity of LED driving power,Thereby make the built-in driving power of LED ray machine module become possibility, this realizes for LED bulbLarger versatility and interchangeability are significant.
Brief description of the drawings
Fig. 1 is the ray machine template schematic diagram that the embodiment of the present invention has been printed silver-colored slurry circuit;
Fig. 2 embodiment of the present invention LED chip is the ray machine module figure of formal dress gold thread weldering knot;
Fig. 3 is that embodiment of the present invention LED chip is the ray machine module figure of flip chip bonding knot;
Fig. 4 is the ray machine module figure after embodiment of the present invention encapsulation transparent cover plate;
Fig. 5 is the ray machine module figure after embodiment of the present invention sealing completes;
Fig. 6 is the structural representation of the ray machine core component of the embodiment of the present invention;
Fig. 7 is the LED voltage and current waveform of the embodiment of the present invention;
Fig. 8 is the extra-high pressure operate power oscillogram of the embodiment of the present invention;
The light modulation operate power oscillogram of Fig. 9 embodiment of the present invention;
The circuit connection diagram of Figure 10 embodiment of the present invention;
The driving power chip internal circuit diagram of Figure 11 embodiment of the present invention;
LED voltage and current waveform under 3 sections of loads of Figure 12 embodiment of the present invention;
The LED chip array module power of Figure 13: embodiment of the present invention DC52V series connection loadsDistribution map;
Figure 14: embodiment of the present invention LED chip array carrying voltage tentative calculation figure;
Figure 15: single DC52V chip bearing power tentative calculation figure of the embodiment of the present invention;
The LED chip array module merit of Figure 16: embodiment of the present invention 2*52V+4*35V series connectionRate loads distribution map.
Being labeled as in accompanying drawing: 41-LED chip, 43-ray machine template, 43.1-ray machine templateFixing hole, the flexible built-up circuit of 44-, 44.1-solder joint, the transparent sealing of 45-, 61-is with fluorescent materialInner cover, snap ring in 81-, 103-radiator, 112-cable fixed mount, 410-LED drivesPower supply large chip, 410.1-transparent cover plate, 411-driving power wafer stage chip, 412-rectificationBridge wafer stage chip, 414-silver slurry circuit, 414.1-pad, 417-welds gold thread.
Mark in accompanying drawing: 41-LED chip, 42-transparent cover plate, 43-ray machine template, 43.1-Ray machine module fixing hole, the flexible built-up circuit of 44-, the transparent sealing of 45-, 61-is with fluorescent materialInner cover, 411-LED power drives wafer stage chip, 412-rectifier bridge wafer stage chip, 414-Silver slurry printed circuit, 417-welds gold thread.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is further illustrated, but not as rightThe foundation of the present invention's restriction.
Embodiment. LED ray machine module, comprises transparent ray machine template 43 (as shown in Figure 1),In ray machine template 43, be printed with silver slurry printed circuit 414, in ray machine template 43, be pasted with power supplyDrive wafer stage chip 411 and rectifier bridge wafer stage chip 412, power drives wafer stage chip411 and rectifier bridge wafer stage chip 412 be not encapsulation wafer scale device; Power drives waferLevel chip 411 and rectifier bridge wafer stage chip 412 by face-down bonding (as shown in Figure 3) orFormal dress welding (as shown in Figure 2) gold thread 417 welds with silver slurry printed circuit 414; Ray machine mouldOn plate 43, be also provided with the flexible built-up circuit 44 being welded to each other with silver slurry printed circuit 414; InstituteState and in ray machine template 43, be also bonded with LED chip array; LED chip array is by multiple parallel connectionsSeries block composition together, and each series block is by 3～7 (can bear high-tension) LEDChip 41 is composed in series, and each LED chip 41 is by face-down bonding or formal dress welding gold thread417 weld with silver slurry printed circuit 414.
Described power drives wafer stage chip 411, rectifier bridge wafer stage chip 412 and LED coreBetween sheet 41, be filled with the transparent sealing 45 for levelling, and then adopt install except reserved andOutside welding position, pattern and size are added a cover it with the identical transparent cover plate 42 of ray machine template 43Upper formation sealing, as shown in Figure 4; Or directly at power drives wafer stage chip 411, wholeStream bridge wafer stage chip 412 and LED chip 41 form one deck by power drives wafer stage chip411, the transparent sealing 45 that rectifier bridge wafer stage chip 412 and LED chip 41 seal, asShown in Fig. 5.
LED driving method on described LED ray machine module is: rectifier bridge wafer stage chip 412On rectifier bridge civil power AC is converted into Rectified alternating current, the voltage of Rectified alternating current is greater than zero,Be less than or equal to the specified maximum working voltage V of Rectified alternating currentWR, on Rectified alternating current, arrange 3～7 sections of LED loads, each section of LED load is cascaded and forms LED load series block group, manyIndividual LED load series block forms described LED chip array, at the voltage liter of Rectified alternating currentGao Shi, the hop count that power drives wafer stage chip 411 is controlled LED load series connection increases step by step,In the time of the voltage drop of Rectified alternating current, the hop count of controlling LED load series connection reduces step by step, LEDThe hop count of load series connection is the actual LED load hop count that is connected into Rectified alternating current. Described LED is negativeThe hop count that carries series connection is controlled by switch, point segment limit that the control node of switch is voltageLimit, the number of fragments of described voltage is corresponding with the hop count of LED load series connection; Described LED is negativeThe control method of hop count of carrying series connection is, by the negative pole direction of every section of LED load respectively by openingClose the negative pole that connects Rectified alternating current, then according to the voltage change of Rectified alternating current, each is openedThe break-make of closing is controlled, and uses the mode that a few sections of switches are opened circuit to realize LED load series connectionThe change of hop count. Set the pulsating direct current operating voltage V of Rectified alternating currentWBe greater than VWmax'sPeriod, control all switches and disconnect, stop to all LED load supplyings, realize LED'sOvervoltage and surge protection; Allow pulsating dc voltage by the maximum of adjusting Rectified alternating currentVWmaxSize, thereby realize luminosity adjustment to LED. By current sense is setDevice records effective operating current I in circuitW, work as IWExceed design load KIWRTime, close all openingClose to realize current protection, the unlatching of switch need recover after reloading voltage next time, whereinK is for adjusting coefficient, IWRFor specified effective operating current. Described switch is at pulsating dc voltageAscent stage time delay tmMillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stagemMillisecond is movingDo, to obtain LED operating current relatively stably.
Each section of LED load that setting is cascaded is to have different maximum carrying voltageThe LED chip group of value, can make the LED load series block group acquisition of working under switch control connectThe operating current curve of nearly ideal sine wave. The maximum carrying of described each section of LED load voltageMethod of adjustment is: 1. taking pulsating dc voltage as ordinate, the pulsating direct current cycle (180 degree)For abscissa mapping; 2. suppose a pure resistor load, its power forms at pulsating direct current half-waveSinusoidal graphics area be 1, mapping (referring to Figure 14); 3. because LED voltage increases electric currentIncrease, essence is that power damages. The load power of setting LED load series block group is pure electricity120% of resistance load, the rectangle echo that work one area is 1.2, the ordinate of rectangle shadeValue is the total maximum carrying magnitude of voltage of series block group; 4. in like manner, known LED chip group carryingUnder voltage condition, can map and draw the graphics area of chipset, (referring to Figure 15), tests piecemealThe area sum of card chipset is greater than the sinusoidal wave area of pulsating direct current under the control node of switch;5. choose the carrying magnitude of voltage of chipset in series block group by commodity, be added and be more than or equal to series connectionThe maximum carrying magnitude of voltage that section group is total; Wherein, the higher LED chip group of carrying magnitude of voltageNear positive terminal (begin section), the lower LED chip group of carrying magnitude of voltage is near negative pole end (endSection).
The material of described ray machine template (43) is that thin slice transparent non-metallic material is (as SiO2，Al2O3Deng), it is that slim sheet material is warmed to nearly material softening point, utilizes mould to adopt pressing equipmentStamping forming. (material is easy crisp and hardness is higher. Can only be processed into by cutting mode like thisWhen ray machine shape of template, cost is higher. )
Use LED ray machine module of the present utility model to set up the method for LED illumination core component,As shown in Figure 6: on LED ray machine module, flexible circuit 44 is set, or also at LED ray machine mouldIn group, cover after transparent cover plate 42, pack the inner cover 61 with fluorescent material into; With fluorescent materialInner cover 61 is by the injection moulding particulate material containing fluorescent material and the transparent injected-moulded particulate material that does not contain fluorescent materialMix; Mixed proportion configures as required, then by injection mo(u)lding and get final product; Wherein said containingThe injection moulding particulate material of fluorescent material is by 20～30% fluorescent powders and 70～80% transparent injected-moulded particulate materialMix, after hot melt, again make injection moulding particulate material; Fluorescent material is selected and is greater than 8ms's persistenceFluorescent material.
It is below the operation principle of the present invention as an example of 6 groups of LED loads example. Be that n value is 6.
First, alternating current AC becomes Rectified alternating current after rectifier bridge, example: AC220V,50Hz alternating current is after rectifier bridge rectification, and referring to Fig. 7, voltage is half period (180 degree)Wavy curve, cycle pulsating dc voltage in the time that 0 spends is zero, pulsating direct current in the time that 90 spendVoltage reaches maximum VWRFor the highest DC311V, 180 when spend, and voltage reduces to again zero, week andRenew.
Job requirement of the present invention, pulsating dc voltage be greater than zero be less than or equal to VWRBetween,3～7 sections of loads are set altogether, between each section of load, form series system, raise with voltage, load(being LED load) series connection hop count increases step by step, and load voltage is by switch controlled loading, referring toFig. 7 and Figure 10, voltage switch node is voltage segmentation boundary.
Power supply management operational mode: the present invention is design current control device not, the opening of switches at different levelsClose and only depend on VWVariation, referring to Fig. 7, Figure 10 and Figure 11.
Cycle 0～90 is while spending:
The 1st section: work original state, the cycle is from 0 initial, K switch in circuit1～K6In opening (ON), electric current is mainly through node J1Pass through K switch1Form path, negativeCarrying is 1V by rated voltageWRThe LED composition of/6 tandem workings;
The 2nd section: work as VWBe more than or equal to 1VWR/ 6 o'clock, K switch 1 was closed (OFF), electric current masterForm path by K switch 2 through node J2, load is 2V by rated voltageWR/ 6 stringsThe LED composition of connection work;
The 3rd section: work as VWBe more than or equal to 2VWR/ 6 o'clock, K switch 1 was in OFF, K switch 2Close (OFF), electric current mainly forms path through node J3 by K switch 3, and load is by specifiedVoltage is 3VWRThe LED composition of/6 tandem workings;
The 4th section: work as VWBe more than or equal to 3VWR/ 6 o'clock, K switch 1～K2, in OFF, openedClose K3 and close (OFF), electric current mainly forms path through node J4 by K switch 4, loadBe 4V by rated voltageWRThe LED composition of/6 tandem workings;
The 5th section: work as VWBe more than or equal to 4VWR/ 6 o'clock, K switch 1～K3, in OFF, openedClose K4 and close (OFF), electric current mainly forms path through node J5 by K switch 5, loadBe 5V by rated voltageWRThe LED composition of/6 tandem workings;
The 6th section: work as VWBe more than or equal to 5VWR/ 6 o'clock, K switch 1～K4, in OFF, openedClose K5 and close (OFF), electric current forms path through node J6 by K switch 6, and load is by volumeDetermining voltage is 6VWRThe LED composition of/6 tandem workings;
When K switch 1～K6 closes, the method for closing of time delay 0.1ms can be adopted, phase can be obtainedTo electric current more stably.
Cycle 90～180 is while spending:
The 6th section: work original state, voltage is reduced downwards by maximum, switch in circuitK1～K5 is in closed condition (OFF), and K switch 6 is in opening, and electric current is through node J6Form path by K switch 6, load is 6V by rated voltageWRThe LED of/6 tandem workingsComposition;
The 5th section: work as VWBe less than or equal to 5VWR/ 6 o'clock, K switch 5～K6 opened (ON),Electric current mainly forms path through node J5 by K switch 5, and load is 5V by rated voltageWR/6The LED composition of tandem working;
The 4th section: work as VWBe less than or equal to 4VWR/ 6 o'clock, K switch 4～K6 opened (ON),Electric current mainly forms path through node J4 by K switch 4, and load is 4V by rated voltageWR/6The LED composition of tandem working;
The 3rd section: work as VWBe less than or equal to 3VWR/ 6 o'clock, K switch 3～K6 opened (ON),Electric current mainly forms path through node J3 by K switch 3, and load is 3V by rated voltageWR/6The LED composition of tandem working;
The 2nd section: work as VWBe less than or equal to 2VWR/ 6 o'clock, K switch 2～K6 opened (ON),Electric current mainly forms path through node J2 by K switch 2, and load is 2V by rated voltageWR/6The LED composition of tandem working;
The 1st section: work as VWBe less than or equal to 1VWR/ 6 o'clock, K switch 1～K6 opened (ON),Electric current mainly forms path through node J1 by K switch 1, and load is 1V by rated voltageWR/6The LED composition of tandem working.
When K switch 1～K6 opens, the open method of 0.1ms in advance can be adopted, phase can be obtainedTo electric current more stably.
Light modulation operational mode: when the given voltage VT=0 of outer setting one, VWmaxCorresponding CVWR，When the given VT=5V of external voltage, VWmaxCorresponding 0V, arranges 0≤VWmax≤CVWR, C adjustsCoefficient, for the multiple of rated voltage, as C=1.12. VWBe greater than VWmaxPeriod, corresponding eachThe switch of section will cut out (OFF), stop powering to the load. It act as a kind of light modulation scheme.Referring to Fig. 9, Figure 10 and Figure 11, regulate VWmaxLower than VWR, in figure, dash area will increase,The power that is input to load will reduce, thereby reach the object of light modulation. Example: when LED is at AC220VThe normal work of civil power is, while adjusting alternating current voltage to the voltage of AC180V, and the shade in figurePart is VWHigher than the formation power perspective view part of 254V, from cycles approximately 55.5 degree toBetween 124.5 degree, because corresponding K switch x in this period is in closing (OFF), the moonThe power consumption of shadow part (be equivalent to pulsating direct current half-wave under normal civil power loading power 57.0%)By disallowable, this part power consumption is not loaded in load, and the brightness of load is reduced. WhenVWmaxEqual at 0 o'clock, all switches will cut out (OFF), and load supplying amount is zero. Can doTo stepless dimming, and can there is not energy consumption.
Voltage protection operational mode: V is setWmax＝CVWR。VWBe greater than VWmaxPeriod, rightSwitch that should each section will cut out (OFF), stop powering to the load. Referring to Fig. 8, Tu10HeFigure 11, example: in the time that civil power reaches the high voltage of 270V, the dash area in figure is VWHigher thanThe formation power perspective view part of 348V, from cycles approximately 66 degree to 114 degree, due to thisIn the section time, K1～K6 switch is in cutting out (OFF), and the power consumption of dash area (is just equivalent toUnder normal civil power 50.2% of the loading power of pulsating direct current half-wave) by disallowable, this part power consumptionBe not loaded in load, load can not burnt because of overvoltage.
Overcurrent protection operational mode: the present invention has overcurrent protection, referring to Figure 11, electric current passesSensor records effective operating current I in circuitWExceed design load KIWR, K is for adjusting coefficient, example:Set IWR=275mA, K=1.2, logic switch controller will cut out all K switch 1～K6(OFF), opening switch (ON) K1～K6 need reload after power supply is pressed and recover in next time.
According to principle same as described above, mode of loading can be divided into 3～7 sections, and segmentation is few, electricityRoad is simple, but curent change is larger, easily produces low-order harmonic at electrical network, referring to Figure 12;Segmentation is many, circuit structure complexity. Generally get 4～6 sections for good.
Note: VW-pulsating direct current operating voltage (1.4142* alternating voltage); VWR-pulsation is straightFlow specified maximum working voltage (1.4142* alternating voltage); VWmax-maximum permission pulsating direct currentVoltage (1.4142* alternating voltage); IW-effectively operating current. IWR-specified effective workElectric current.
If civil power is AC220, the voltage after rectification is DC311V, taking every group of LED load as singleChips is example, and every chips bears DC52V; As AC110, chip bears DC26V.If the loading power area of pulsating direct current half-wave is 1, referring to Figure 13, each LED load in figureIt is larger that (LED module 1 to 6) is loaded power difference, and it is straight that LED module 1 reaches pulsation20.68% (be chip nominal output 84.4%) of the loading power area of stream half-wave; And LEDModule 6 only have 5.11% (for chip nominal output 19.2%), be about four of module 1/One power, through actual measurement checking, the intrinsic brilliance of module 6 is very low; Whole chipset averageThe power being loaded is 52.4% of chip nominal output, and the utilization rate of chip is lower; And chip159% of the loading power area that the nominal output (dotted line frame area) of group is pulsating direct current half-wave.Because chip amount of redundancy is excessive, not only chip waste, also causes driving power excessive and waste,Increased the difficulty that cloth is set up simultaneously. Therefore, under Constant Direct Current state, select the side of chip voltageThere is some problems in method, how in the prerequisite that ensures chip trouble free service under pulsating direct current stateUnder, the utilization rate that improves chip becomes a problem to be solved.
The nominal output of setting the LED chip array of 6 series connection loads merit by pulsating direct current half-wave1.59 times of rate turn down to 1.2 times that (considering that small grids civil power there will be is not less than 1.2Doubly fluctuation), referring to Figure 14, establish LED chip array chip load power (rectangle shade in figurePart area) load power (pulsating direct current half-wave part area) for pulsating direct current half-wave1.2 times time, the carrying of chip array can extrapolate civil power and be AC220V by Figure 14 mapping timeVoltage is DC236V;
Referring to Figure 15, LED module 1 is arranged respectively to different magnitudes of voltage to module 6, canLoad power area (dash area in figure) with the chip obtaining under different bearer magnitude of voltage;
(model of module 1 and module 2 is to adopt 2*52V+4*35V high voltage chipVES-AADBHV45, module 3 are ES-AADBHF40 to module 6) composition serial array,The carrying voltage of chip array is adjusted into DC244V; Make Figure 16, the chip array of acquisition is addedCarrying power area is 96.67% of pulsating direct current half-wave power area, and chip array is loadedPower approaches 1 for perfect condition; The power that now LED chip array is loaded is chip arrayNominal output 77.6%; Experimental verification and estimated value are close.
The module of each voltage section loads power checking: the loading power area of establishing pulsating direct current half-waveBe 1, when voltage is ordinate, easily calculates DC52V chip nominal output by Figure 15 and be26.52%, in like manner, the nominal output of DC35V chip is 17.89%; Figure 16 is that civil power isWhen AC220V, the power situation being loaded of the each module of LED chip array; Table 1 is chip battle arrayWhen the power that row are loaded is pulsating direct current half-wave power area 1, line voltage is respectivelyAC220V, AV246V, each module of AC270V is loaded the situation of power, in table, can seeGo out, only module 3 slightly transships at DC311V and DC348V, but due to module 1 and module 2There is margin of power, experimental results show that module 3 can pass through.
In the time of other line voltage grades, optimal way is with reference to above-mentioned carrying out.
Under perfect condition, the checking computations of chip bearing power are as shown in the table:
Claims (11)
1.LED ray machine module, is characterized in that: comprise transparent ray machine template (43), lightIn machine template (43), be printed with silver slurry printed circuit (414), ray machine template (43) is upper pastesHave power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412), power supply drivesMoving wafer stage chip (411) and rectifier bridge wafer stage chip (412) are the wafer scale not encapsulatingDevice; Power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) pass throughFace-down bonding or formal dress welding gold thread (417) and silver slurry printed circuit (414) welding; DescribedRay machine template is also bonded with LED chip array on (43); LED chip array is by multiple parallel connectionsSeries block composition together, and each series block is by 3～7 LEDs chip (41) series connection groupsBecome, each LED chip (41) by face-down bonding or formal dress welding gold thread (417) withSilver slurry printed circuit (414) welding.
2. LED ray machine module according to claim 1, is characterized in that: described electricitySource drives wafer stage chip (411), rectifier bridge wafer stage chip (412) and LED chip (41)Between be filled with the transparent sealing (45) for levelling, and then adopt except reserved and install and welderingConnect outside position, pattern and size add with the identical transparent cover plate (42) of ray machine template (43)Cover on it and form and seal; Or directly at power drives wafer stage chip (411), rectifier bridge crystalline substanceCircle level chip (412) and LED chip (41) are formed with one deck by power drives wafer scale coreIt is transparent that sheet (411), rectifier bridge wafer stage chip (412) and LED chip (41) sealSealing (45).
3. LED ray machine module according to claim 1, is characterized in that described LEDLED driving method on ray machine module is: the rectification on rectifier bridge wafer stage chip (412)Civil power AC is converted into Rectified alternating current by bridge, and the voltage of Rectified alternating current is greater than zero, is less than etc.In the specified maximum working voltage VWR of Rectified alternating current, on Rectified alternating current, arrange 3～7 sectionsLED load, each section of LED load is cascaded and forms LED load series block group, multiple LEDLoad series block forms described LED chip array, in the time that the voltage of Rectified alternating current raises,The hop count that power drives wafer stage chip (411) is controlled LED load series connection increases step by step,When the voltage drop of Rectified alternating current, the hop count of controlling LED load series connection reduces step by step, LEDThe hop count of load series connection is the actual LED load hop count that is connected into Rectified alternating current.
4. LED ray machine module according to claim 3, is characterized in that: described LEDThe hop count of load series connection is controlled by switch, point segment limit that the control node of switch is voltageLimit, the number of fragments of described voltage is corresponding with the hop count of LED load series connection; Described LED is negativeThe control method of hop count of carrying series connection is, by the negative pole direction of every section of LED load respectively by openingClose the negative pole that connects Rectified alternating current, then according to the voltage change of Rectified alternating current, each is openedThe break-make of closing is controlled, and uses the mode that a few sections of switches are opened circuit to realize LED load series connectionThe change of hop count.
5. LED ray machine module according to claim 4, is characterized in that: set arteries and veinsMoving galvanic pulsating direct current operating voltage VWBe greater than VWmaxPeriod, control all switches disconnectedOpen, stop to all LED load supplyings, realize overvoltage and surge protection to LED; LogicalCross the maximum permission pulsating dc voltage V that adjusts Rectified alternating currentWmaxSize, thereby realizeTo the luminosity adjustment of LED.
6. LED ray machine module according to claim 4, is characterized in that: by establishingPut current sensor and record effective operating current I in circuitW, work as IWExceed design load KIWRTime,Close all switches to realize current protection, the unlatching of switch need be reloaded after voltage in next timeRecover, wherein K is for adjusting coefficient, IWRFor specified effective operating current.
7. LED ray machine module according to claim 4, is characterized in that: describedSwitch is at pulsating dc voltage ascent stage time delay tmMillisecond action, in Rectified alternating current dropsStage shifts to an earlier date tmMillisecond action, to obtain LED operating current relatively stably.
8. LED ray machine module according to claim 5, is characterized in that: string is setEach being linked togather section LED load is the LED chip with different maximum carrying magnitudes of voltageGroup, can make the LED load series block group acquisition of working under switch control approach ideal sine waveOperating current curve.
9. LED ray machine module according to claim 8, is characterized in that, described everyThe method of adjustment of the one section of maximum carrying of LED load voltage is: 1. sit as vertical taking pulsating dc voltageMark, pulsating direct current cycle are abscissa mapping; 2. suppose a pure resistor load, its power existsThe sinusoidal graphics area that pulsating direct current half-wave forms is 1, mapping; 3. set LED load series connectionThe load power of section group is pure resistor load 120%, the rectangle shade that to make an area be 1.2Figure, the ordinate value of rectangle shade is the total maximum carrying magnitude of voltage of series block group; 4. in like manner,Under known LED load-carrying voltage condition, can map and draw the graphics area of LED load, byThe area sum of section checking LED load is greater than the pulsating direct current sine under the control node of switchCorrugated is long-pending; 5. choose the carrying magnitude of voltage of each section of LED load in LED load series block group, phaseAdd and be more than or equal to the total maximum carrying magnitude of voltage of series block group; Wherein, carrying magnitude of voltageHigh LED load is near positive terminal, and the lower LED load of carrying magnitude of voltage is near negative pole end.
10. LED ray machine module according to claim 1, is characterized in that: described lightThe material of machine template (43) is thin slice transparent non-metallic material, and it is that slim sheet material is warmed toNearly material softening point, utilizes mould to adopt pressing equipment stamping forming.
11. rights to use require the LED ray machine module group described in 1 to 10 arbitrary claimBuild the method for LED illumination core component: flexible circuit (44) is set on LED ray machine module,Or also on LED ray machine module, cover after transparent cover plate (42), pack the inner cover with fluorescent material into(61); Inner cover (61) with fluorescent material be by containing the injection moulding particulate material of fluorescent material with notTransparent injected-moulded particulate material containing fluorescent material mixes; Mixed proportion configures as required, then passes throughInjection mo(u)lding and get final product; The wherein said injection moulding particulate material containing fluorescent material is to be by mass percent20～30% fluorescent powders and mass percent are that 70～80% transparent injected-moulded particulate material mix, hot meltAfter again make injection moulding particulate material; Fluorescent material is selected the fluorescent material that is greater than 8ms persistence.
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| PCT/CN2015/079152 WO2015176626A1 (en) | 2014-05-20 | 2015-05-18 | Led large chip and optical machine module group |
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| CN1678158A (en) * | 2005-03-21 | 2005-10-05 | 上海纳晶科技有限公司 | Highly efficient energy-saving semiconductor plane integrated light-source module |
| CN103340017A (en) * | 2011-01-28 | 2013-10-02 | 首尔半导体株式会社 | Led driving circuit package |
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