CN103968342A - LED light machine module - Google Patents
LED light machine module Download PDFInfo
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- CN103968342A CN103968342A CN201410213615.2A CN201410213615A CN103968342A CN 103968342 A CN103968342 A CN 103968342A CN 201410213615 A CN201410213615 A CN 201410213615A CN 103968342 A CN103968342 A CN 103968342A
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Abstract
The invention discloses an LED light machine module. The LED light machine module comprises a transparent light machine template (43), wherein a silver paste printing circuit (414) is printed on the light machine template (43); a power drive wafer-level chip (411) and a rectifier bridge wafer-level chip (412) adhere to the light machine template (43), are unpackaged wafer-level devices and are welded to the silver paste printing circuit (414) through flip-chip bonding or forward bonding gold wires (417); an LED chip array adheres to the transparent light machine template (43); the LED chip array is composed of multiple series sections which are connected together in parallel; each series section is formed by connecting three to seven LED chips (41) in series; each LED chip (41) is welded to the silver paste printing circuit (414) through flip-chip bonding or forward bonding gold wires (417).
Description
Technical field
The present invention relates to a kind of LED ray machine module, belong to LED lighting technical field.
Background technology
The Chinese patent application such as application number 201310140124.5,201310140138.7,201310140150.8,201310140105.2,201310140134.9,201310140106.7,201310140151.2,201310140136.8 disclose multiple ray machine module technical schemes that can use on LED bulb general and that exchange.These technology are the Lighting Industry framework of setting up centered by LED bulb, and the basic concept that makes LED bulb (lighting source), light fixture, illumination control become the end product of independent production, application is laid a good foundation.But above-mentioned patent not yet solves the problem of the built-in driving power of ray machine module.
Existing LED driving power mostly is Switching Power Supply, and volume is too large; Also have the linear power supply that volume is slightly little, but it drives chip to coordinate auxiliary element mainly with DIP dual-in-line or SMD paster encapsulation pattern again, its volume is still not enough to little of being placed into ray machine module internal.
LED illumination provides LED chip to start from chip factory need to be through a series of such as paster to illuminating lamp, die bond, welding, encapsulation, color-division, drive design, heat dissipation design, complicated and the tediously long Production design process such as Design of Luminaires, owing to there being chip layout design, many uncertainties such as heat conductive design and power drives design, this industry structure centered by LED chip is difficult to realize light source (bulb) standardization under the pattern of replaceable light source, finally causing the LED lamp in terminal market is main body mainly with the overall structure lamp of non-exchange light source, the industry complexity and the industrial concentration that has reduced illuminating product of illuminating product are increased.
Further creation idea advanced person, the built-in driving power of easier standardized LED bulb ray machine module and LED illumination chip organization plan are of far-reaching significance for large-scale promotion LED illumination.
Summary of the invention
The object of the invention is to, provide a kind of
lEd ray machine module.It is that one is more easily standardized, the LED ray machine module of built-in driving power and LED illumination chip structure, and it is structurally conducive to the standardization of LED illumination, promotes on a large scale.
Technical scheme of the present invention: LED ray machine module, be characterized in: comprise transparent ray machine template, in ray machine template, be printed with silver slurry printed circuit, in ray machine template, be pasted with power drives wafer stage chip and rectifier bridge wafer stage chip, power drives wafer stage chip and rectifier bridge wafer stage chip are the wafer scale device not encapsulating; Power drives wafer stage chip and rectifier bridge wafer stage chip are by face-down bonding or formal dress welding gold thread and the welding of silver slurry printed circuit; In ray machine template, also can be provided with the flexible built-up circuit being welded to each other with silver slurry printed circuit; In described ray machine template, be also bonded with LED chip array; LED chip array is made up of multiple series block that are connected in parallel, and each series block is composed in series by 3～7 (can bear high-tension) LED chips, each LED chip is by face-down bonding or formal dress welding gold thread and the welding of silver slurry printed circuit.
In above-mentioned LED ray machine module, between described power drives wafer stage chip, rectifier bridge wafer stage chip and LED chip, be filled with the transparent sealing for levelling, and then adopt except reserved installation and welding position, pattern and size are added a cover on it and are formed and seal with the identical transparent cover plate of ray machine template; Or directly form one deck by the transparent sealing of power drives wafer stage chip, rectifier bridge wafer stage chip and LED chip sealing at power drives wafer stage chip, rectifier bridge wafer stage chip and LED chip.
In aforesaid LED ray machine module, LED driving method on described LED ray machine module is: civil power AC is converted into Rectified alternating current by the rectifier bridge on rectifier bridge wafer stage chip, the voltage of Rectified alternating current is greater than zero, is less than or equal to the specified maximum working voltage V of Rectified alternating current
wR3～7 sections of LED loads are set on Rectified alternating current, each section of LED load is cascaded and forms LED load series block group, multiple LED load series block form described LED chip array, in the time that the voltage of Rectified alternating current raises, the hop count of power drives wafer stage chip control LED load series connection increases step by step, in the time of the voltage drop of Rectified alternating current, the hop count of controlling LED load series connection reduces step by step, and the hop count of LED load series connection is the actual LED load hop count that is connected into Rectified alternating current.Civil power AC becomes Rectified alternating current after rectifier bridge, example: AC220V, 50Hz alternating current is after rectifier bridge rectification, and voltage is the wavy curve of half period (180 degree), cycle pulsating dc voltage in the time that 0 spends is zero, and in the time that 90 spend, pulsating dc voltage reaches maximum V
wRfor the highest DC311V, 180 when spend, and voltage reduces to again zero, goes round and begins again.
In aforesaid LED ray machine module, the section of described LED load series connection is controlled by switch, the segmentation boundary that the control node of switch is voltage, and the number of fragments of described voltage is corresponding with the hop count of LED load series connection.LED load can be divided into 3～7 sections, and segmentation is few, and circuit is simple, but curent change is larger, easily produces low-order harmonic at electrical network; Segmentation is many, circuit structure complexity.Generally get 4～6 sections for good.The control method of the hop count of described LED load series connection is: the negative pole that the negative pole direction of every section of LED load is connected respectively to Rectified alternating current by switch, then according to the voltage change of Rectified alternating current, the break-make of each switch is controlled, used the mode of a few sections of switches are opened circuit (thereby LED load is also opened circuit) to realize the change of the hop count of LED load series connection.
In aforesaid LED ray machine module, set the pulsating direct current operating voltage V of Rectified alternating current
wbe greater than V
wmaxperiod, control all switches and disconnect, stop to all LED load supplyings, realize the overvoltage protection (comprising the protection of surging) to LED; Allow pulsating dc voltage V by the maximum of adjusting Rectified alternating current
wmaxsize, thereby realize luminosity adjustment to LED.
In aforesaid LED ray machine module, described switch is at pulsating dc voltage ascent stage time delay t
mmillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stage
mmillisecond action, to obtain LED operating current relatively stably.T
mgenerally get 0.1ms.
In aforesaid LED ray machine module, it is the LED chip group with different maximum carrying magnitudes of voltage that each section of LED load being cascaded is set, and can make the LED load series block group of working under switch control obtain the operating current curve that approaches ideal sine wave.
In aforesaid LED ray machine module, the method for adjustment of the maximum of the LED chip group of described each section of LED load carrying voltage is: (key is to calculate the total maximum carrying magnitude of voltage of series block group) 1. taking pulsating dc voltage as ordinate, the pulsating direct current cycle (180 degree) maps for abscissa; 2. suppose a pure resistor load, the sinusoidal graphics area that its power forms at pulsating direct current half-wave is 1, mapping; 3. increase because LED voltage increases electric current, essence is that power damages.The load power of setting LED load series block group is pure resistor load 120%, the rectangle echo that to make an area be 1.2, and the ordinate value of rectangle shade is the total maximum carrying magnitude of voltage of series block group; 4. in like manner, under known LED chip group carrying voltage condition, can map and draw the graphics area of chipset, the area sum of proofing chip group is greater than the sinusoidal wave area of pulsating direct current under the control node of switch piecemeal; 5. choose the carrying magnitude of voltage of chipset in series block group by commodity, be added and be more than or equal to the total maximum carrying magnitude of voltage of series block group; Wherein, the higher LED chip group of carrying magnitude of voltage is near positive terminal (section begins), and the lower LED chip group of carrying magnitude of voltage is near negative pole end (latter end).
In aforesaid LED ray machine module, the material of described ray machine template is that thin slice transparent non-metallic material is (as SiO
2, Al
2o
3deng), it is that slim sheet material is warmed to nearly material softening point, utilizes mould to adopt pressing equipment stamping forming.(because material is easily crisp and hardness is higher, while therefore can only cutting mode being processed into ray machine shape of template, cost is higher.)
Use aforesaid LED ray machine module to set up the method for LED illumination core component: on LED ray machine module, flexible circuit to be set, or also on LED ray machine module, to cover after transparent cover plate, pack the inner cover with fluorescent material into; That the injection moulding particulate material containing fluorescent material and the transparent injected-moulded particulate material that does not contain fluorescent material are mixed with the inner cover of fluorescent material; Mixed proportion configures as required, then by injection mo(u)lding and get final product; The wherein said injection moulding particulate material containing fluorescent material is that 20～30% fluorescent powders and 70～80% transparent injected-moulded particulate material are mixed, and again makes injection moulding particulate material after hot melt; Fluorescent material is selected the fluorescent material that is greater than 8ms persistence.
Compared with prior art, ray machine module of the present invention goes for all kinds of bulb patents of inventor's earlier application, original ray machine module in replacement bulb.Ray machine module of the present invention structurally can built-in power and LED illumination chip, and volume is little, is easy to realize standardization.The present invention can change existing industry structure centered by LED chip, LED ray machine module of the present invention can be to realize light source (bulb) standardization under the pattern of replaceable light source, thereby can reduce the industry complexity of illuminating product and reduce the industrial concentration of illuminating product.
In addition, the present invention is converted into Rectified alternating current by rectifier bridge by civil power, voltage in each cycle is divided into multistage by phase place simultaneously, and utilize the different characteristic of voltage in multistage, use switch to regulate being connected in series into the hop count of the LED load of duty, thereby make LED load enter the operational mode of controlization, this operational mode can meet LED chip power supply, and this LED type of drive of the present invention can greatly reduce the complexity of LED driving power, thereby make the built-in driving power of LED ray machine module become possibility, it is significant that this realizes larger versatility and interchangeability for LED bulb.
Brief description of the drawings
Fig. 1 is the ray machine template schematic diagram that the embodiment of the present invention has been printed silver-colored slurry circuit;
Fig. 2 embodiment of the present invention LED chip is the ray machine module figure of formal dress gold thread weldering knot;
Fig. 3 is that embodiment of the present invention LED chip is the ray machine module figure of flip chip bonding knot;
Fig. 4 is the ray machine module figure after embodiment of the present invention encapsulation transparent cover plate;
Fig. 5 is the ray machine module figure after embodiment of the present invention sealing completes;
Fig. 6 is the structural representation of the ray machine core component of the embodiment of the present invention;
Fig. 7 is the LED voltage and current waveform of the embodiment of the present invention;
Fig. 8 is the extra-high pressure operate power oscillogram of the embodiment of the present invention;
The light modulation operate power oscillogram of Fig. 9 embodiment of the present invention;
The circuit connection diagram of Figure 10 embodiment of the present invention;
The driving power chip internal circuit diagram of Figure 11 embodiment of the present invention;
LED voltage and current waveform under 3 sections of loads of Figure 12 embodiment of the present invention;
The LED chip array module power of Figure 13: embodiment of the present invention DC52V series connection loads distribution map;
Figure 14: embodiment of the present invention LED chip array carrying voltage tentative calculation figure;
Figure 15: single DC52V chip bearing power tentative calculation figure of the embodiment of the present invention;
The LED chip array module power of Figure 16: embodiment of the present invention 2*52V+4*35V series connection loads distribution map.
Being labeled as in accompanying drawing: 41-LED chip, 43-ray machine template, 43.1-ray machine template fixing hole, the flexible built-up circuit of 44-, 44.1-solder joint, the transparent sealing of 45-, the inner cover of 61-with fluorescent material, snap ring in 81-, 103-radiator, 112-cable fixed mount, 410-LED driving power large chip, 410.1-transparent cover plate, 411-driving power wafer stage chip, 412-rectifier bridge wafer stage chip, 414-silver slurry circuit, 414.1-pad, 417-welds gold thread.
Mark in accompanying drawing: 41-LED chip, 42-transparent cover plate, 43-ray machine template, 43.1-ray machine module fixing hole, the flexible built-up circuit of 44-, the transparent sealing of 45-, the inner cover of 61-with fluorescent material, 411-LED power drives wafer stage chip, 412-rectifier bridge wafer stage chip, 414-silver slurry printed circuit, 417-welds gold thread.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is further illustrated, but not as the foundation to the present invention's restriction.
Embodiment.LED ray machine module, comprise transparent ray machine template 43 (as shown in Figure 1), in ray machine template 43, be printed with silver slurry printed circuit 414, in ray machine template 43, be pasted with power drives wafer stage chip 411 and rectifier bridge wafer stage chip 412, power drives wafer stage chip 411 and rectifier bridge wafer stage chip 412 are the wafer scale device not encapsulating; Power drives wafer stage chip 411 and rectifier bridge wafer stage chip 412 weld with silver slurry printed circuit 414 by face-down bonding (as shown in Figure 3) or formal dress welding (as shown in Figure 2) gold thread 417; In ray machine template 43, be also provided with the flexible built-up circuit 44 being welded to each other with silver slurry printed circuit 414; In described ray machine template 43, be also bonded with LED chip array; LED chip array is made up of multiple series block that are connected in parallel, and each series block is composed in series by 3～7 (can bear high-tension) LED chips 41, each LED chip 41 welds with silver slurry printed circuit 414 by face-down bonding or formal dress welding gold thread 417.
Between described power drives wafer stage chip 411, rectifier bridge wafer stage chip 412 and LED chip 41, be filled with the transparent sealing 45 for levelling, and then adopt except reserved installation and welding position, pattern and size are added a cover on it and are formed sealing with the identical transparent cover plate 42 of ray machine template 43, as shown in Figure 4; Or directly form at power drives wafer stage chip 411, rectifier bridge wafer stage chip 412 and LED chip 41 the transparent sealing 45 that one deck seals power drives wafer stage chip 411, rectifier bridge wafer stage chip 412 and LED chip 41, as shown in Figure 5.
LED driving method on described LED ray machine module is: civil power AC is converted into Rectified alternating current by the rectifier bridge on rectifier bridge wafer stage chip 412, and the voltage of Rectified alternating current is greater than zero, is less than or equal to the specified maximum working voltage V of Rectified alternating current
wR3～7 sections of LED loads are set on Rectified alternating current, each section of LED load is cascaded and forms LED load series block group, multiple LED load series block form described LED chip array, in the time that the voltage of Rectified alternating current raises, the hop count that power drives wafer stage chip 411 is controlled LED load series connection increases step by step, in the time of the voltage drop of Rectified alternating current, the hop count of controlling LED load series connection reduces step by step, and the hop count of LED load series connection is the actual LED load hop count that is connected into Rectified alternating current.The hop count of described LED load series connection is controlled by switch, the segmentation boundary that the control node of switch is voltage, and the number of fragments of described voltage is corresponding with the hop count of LED load series connection; The control method of the hop count of described LED load series connection is, the negative pole direction of every section of LED load is connected respectively to the negative pole of Rectified alternating current by switch, then according to the voltage change of Rectified alternating current, the break-make of each switch is controlled, used the mode that a few sections of switches are opened circuit to realize the change of the hop count of LED load series connection.Set the pulsating direct current operating voltage V of Rectified alternating current
wbe greater than V
wmaxperiod, control all switches and disconnect, stop to all LED load supplyings, realize overvoltage and surge protection to LED; Allow pulsating dc voltage V by the maximum of adjusting Rectified alternating current
wmaxsize, thereby realize luminosity adjustment to LED.By being set, current sensor records effective operating current I in circuit
w, work as I
wexceed design load KI
wRtime, close all switches to realize current protection, the unlatching of switch need recover after reloading voltage next time, and wherein K is for adjusting coefficient, I
wRfor specified effective operating current.Described switch is at pulsating dc voltage ascent stage time delay t
mmillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stage
mmillisecond action, to obtain LED operating current relatively stably.
Each section of LED load that setting is cascaded is the LED chip group with different maximum carrying magnitudes of voltage, can make the LED load series block group of working under switch control obtain the operating current curve that approaches ideal sine wave.The method of adjustment of the maximum carrying of described each section of LED load voltage is: 1. taking pulsating dc voltage as ordinate, the pulsating direct current cycle (180 degree) maps for abscissa; 2. suppose a pure resistor load, the sinusoidal graphics area that its power forms at pulsating direct current half-wave is 1, mapping (referring to Figure 14); 3. increase because LED voltage increases electric current, essence is that power damages.The load power of setting LED load series block group is pure resistor load 120%, the rectangle echo that to make an area be 1.2, and the ordinate value of rectangle shade is the total maximum carrying magnitude of voltage of series block group; 4. in like manner, under known LED chip group carrying voltage condition, can map and draw the graphics area of chipset, (referring to Figure 15), the area sum of proofing chip group is greater than the sinusoidal wave area of pulsating direct current under the control node of switch piecemeal; 5. choose the carrying magnitude of voltage of chipset in series block group by commodity, be added and be more than or equal to the total maximum carrying magnitude of voltage of series block group; Wherein, the higher LED chip group of carrying magnitude of voltage is near positive terminal (section begins), and the lower LED chip group of carrying magnitude of voltage is near negative pole end (latter end).
The material of described ray machine template (43) is that thin slice transparent non-metallic material is (as SiO
2, Al
2o
3deng), it is that slim sheet material is warmed to nearly material softening point, utilizes mould to adopt pressing equipment stamping forming.(material is easy crisp and hardness is higher.While like this can only cutting mode being processed into ray machine shape of template, cost is higher.)
Use LED ray machine module of the present invention to set up the method for LED illumination core component, as shown in Figure 6: on LED ray machine module, flexible circuit 44 is set, or also on LED ray machine module, covers after transparent cover plate 42, pack the inner cover 61 with fluorescent material into; Inner cover 61 with fluorescent material is that the injection moulding particulate material containing fluorescent material and the transparent injected-moulded particulate material that does not contain fluorescent material are mixed; Mixed proportion configures as required, then by injection mo(u)lding and get final product; The wherein said injection moulding particulate material containing fluorescent material is that 20～30% fluorescent powders and 70～80% transparent injected-moulded particulate material are mixed, and again makes injection moulding particulate material after hot melt; Fluorescent material is selected the fluorescent material that is greater than 8ms persistence.
It is below the operation principle of the present invention as an example of 6 groups of LED loads example.Be that n value is 6.
First, alternating current AC becomes Rectified alternating current after rectifier bridge, example: AC220V, 50Hz alternating current is after rectifier bridge rectification, referring to Fig. 7, voltage is the wavy curve of half period (180 degree), and cycle pulsating dc voltage in the time that 0 spends is zero, and in the time that 90 spend, pulsating dc voltage reaches maximum V
wRfor the highest DC311V, 180 when spend, and voltage reduces to again zero, goes round and begins again.
Job requirement of the present invention, pulsating dc voltage be greater than zero be less than or equal to V
wRbetween, 3～7 sections of loads are set altogether, between each section of load, form series system, raise with voltage, load (being LED load) series connection hop count increases step by step, and load voltage is by switch controlled loading, referring to Fig. 7 and Figure 10, voltage switch node is voltage segmentation boundary.
Power supply management operational mode: the present invention is design current control device not, V is only depended in the keying of switches at different levels
wvariation, referring to Fig. 7, Figure 10 and Figure 11.
Cycle 0～90 is while spending:
The 1st section: work original state, the cycle is from 0 initial, K switch in circuit
1～K
6in opening (ON), electric current is mainly through node J
1pass through K switch
1form path, load is 1V by rated voltage
wRthe LED composition of/6 tandem workings;
The 2nd section: work as V
wbe more than or equal to 1V
wR/ 6 o'clock, K switch 1 was closed (OFF), and electric current mainly forms path through node J2 by K switch 2, and load is 2V by rated voltage
wRthe LED composition of/6 tandem workings;
The 3rd section: work as V
wbe more than or equal to 2V
wR/ 6 o'clock, K switch 1 was in OFF, and K switch 2 is closed (OFF), and electric current mainly forms path through node J3 by K switch 3, and load is 3V by rated voltage
wRthe LED composition of/6 tandem workings;
The 4th section: work as V
wbe more than or equal to 3V
wR/ 6 o'clock, K switch 1～K2 was in OFF, and K switch 3 is closed (OFF), and electric current mainly forms path through node J4 by K switch 4, and load is 4V by rated voltage
wRthe LED composition of/6 tandem workings;
The 5th section: work as V
wbe more than or equal to 4V
wR/ 6 o'clock, K switch 1～K3 was in OFF, and K switch 4 is closed (OFF), and electric current mainly forms path through node J5 by K switch 5, and load is 5V by rated voltage
wRthe LED composition of/6 tandem workings;
The 6th section: work as V
wbe more than or equal to 5V
wR/ 6 o'clock, K switch 1～K4 was in OFF, and K switch 5 is closed (OFF), and electric current forms path through node J6 by K switch 6, and load is 6V by rated voltage
wRthe LED composition of/6 tandem workings;
When K switch 1～K6 closes, the method for closing of time delay 0.1ms can be adopted, electric current relatively stably can be obtained.
Cycle 90～180 is while spending:
The 6th section: work original state, voltage is reduced downwards by maximum, and in circuit, K switch 1～K5 is in closed condition (OFF), and K switch 6 is in opening, and electric current forms path through node J6 by K switch 6, and load is 6V by rated voltage
wRthe LED composition of/6 tandem workings;
The 5th section: work as V
wbe less than or equal to 5V
wR/ 6 o'clock, K switch 5～K6 opened (ON), and electric current mainly forms path through node J5 by K switch 5, and load is 5V by rated voltage
wRthe LED composition of/6 tandem workings;
The 4th section: work as V
wbe less than or equal to 4V
wR/ 6 o'clock, K switch 4～K6 opened (ON), and electric current mainly forms path through node J4 by K switch 4, and load is 4V by rated voltage
wRthe LED composition of/6 tandem workings;
The 3rd section: work as V
wbe less than or equal to 3V
wR/ 6 o'clock, K switch 3～K6 opened (ON), and electric current mainly forms path through node J3 by K switch 3, and load is 3V by rated voltage
wRthe LED composition of/6 tandem workings;
The 2nd section: work as V
wbe less than or equal to 2V
wR/ 6 o'clock, K switch 2～K6 opened (ON), and electric current mainly forms path through node J2 by K switch 2, and load is 2V by rated voltage
wRthe LED composition of/6 tandem workings;
The 1st section: work as V
wbe less than or equal to 1V
wR/ 6 o'clock, K switch 1～K6 opened (ON), and electric current mainly forms path through node J1 by K switch 1, and load is 1V by rated voltage
wRthe LED composition of/6 tandem workings.
When K switch 1～K6 opens, the open method of 0.1ms in advance can be adopted, electric current relatively stably can be obtained.
Light modulation operational mode: when the given voltage VT=0 of outer setting one, V
wmaxcorresponding CV
wR, when the given VT=5V of external voltage, V
wmaxcorresponding 0V, arranges 0≤V
wmax≤ CV
wR, C adjusts coefficient, for the multiple of rated voltage, as C=1.12.V
wbe greater than V
wmaxperiod, the switch of corresponding each section will cut out (OFF), stop powering to the load.It act as a kind of light modulation scheme.Referring to Fig. 9, Figure 10 and Figure 11, regulate V
wmaxlower than V
wR, in figure, dash area will increase, and the power that is input to load will reduce, thereby reach the object of light modulation.Example: when LED in the normal work of AC220V civil power is, while adjusting alternating current voltage to the voltage of AC180V, the dash area in figure is V
whigher than the formation power perspective view part of 254V, from cycles approximately 55.5 degree to 124.5 degree, because corresponding K switch x in this period is in closing (OFF), the power consumption of dash area (be equivalent to pulsating direct current half-wave under normal civil power loading power 57.0%) by disallowable, this part power consumption is not loaded in load, and the brightness of load is reduced.Work as V
wmaxequal at 0 o'clock, all switches will cut out (OFF), and load supplying amount is zero.Can accomplish stepless dimming, and energy consumption can not occur.
Voltage protection operational mode: V is set
wmax=CV
wR.V
wbe greater than V
wmaxperiod, the switch of corresponding each section will cut out (OFF), stop powering to the load.Referring to Fig. 8, Figure 10 and Figure 11, example: in the time that civil power reaches the high voltage of 270V, the dash area in figure is V
whigher than the formation power perspective view part of 348V, from cycles approximately 66 degree to 114 degree, because K1～K6 switch in this period is in cutting out (OFF), the power consumption of dash area (be equivalent to pulsating direct current half-wave under normal civil power loading power 50.2%) by disallowable, this part power consumption is not loaded in load, and load can not burnt because of overvoltage.
Overcurrent protection operational mode: the present invention has overcurrent protection, referring to Figure 11, current sensor records effective operating current I in circuit
wexceed design load KI
wR, K is for adjusting coefficient, example: set I
wR=275mA, K=1.2, logic switch controller will cut out all K switch 1～K6 (OFF), and opening switch (ON) K1～K6 need reload after power supply is pressed and recover in next time.
According to principle same as described above, mode of loading can be divided into 3～7 sections, and segmentation is few, and circuit is simple, but curent change is larger, easily produces low-order harmonic at electrical network, referring to Figure 12; Segmentation is many, circuit structure complexity.Generally get 4～6 sections for good.
Note: V
w-pulsating direct current operating voltage (1.4142* alternating voltage); V
wRthe specified maximum working voltage of-pulsating direct current (1.4142* alternating voltage); V
wmax-maximum the pulsating dc voltage (1.4142* alternating voltage) that allows; I
w-effectively operating current.I
wR-specified effective operating current.
If civil power is AC220, the voltage after rectification is DC311V, and taking every group of LED load as single chips is as example, every chips bears DC52V; As AC110, chip bears DC26V.If the loading power area of pulsating direct current half-wave is 1, referring to Figure 13, it is larger that each LED load in figure (LED module 1 to 6) is loaded power difference, LED module 1 reach pulsating direct current half-wave loading power area 20.68% (for chip nominal output 84.4%); And LED module 6 only have 5.11% (for chip nominal output 19.2%), be about 1/4th power of module 1, through actual measurement checking, the intrinsic brilliance of module 6 is very low; The power being on average loaded of whole chipset is 52.4% of chip nominal output, and the utilization rate of chip is lower; And the nominal output of chipset (dotted line frame area) is the loading power area of pulsating direct current half-wave 159%.Because chip amount of redundancy is excessive, not only chip waste, also causes driving power excessive and waste, and has increased the difficulty that cloth is set up simultaneously.Therefore, under Constant Direct Current state, select the method for chip voltage to have some problems under pulsating direct current state, how to ensure that, under the prerequisite of chip trouble free service, the utilization rate that improves chip becomes a problem to be solved.
The nominal output of setting the LED chip array of 6 series connection loads 1.59 times of power by pulsating direct current half-wave and turns down to 1.2 times (consider small grids civil power there will be not less than 1.2 times of fluctuations), referring to Figure 14, if LED chip array chip load power (rectangle dash area area in figure) is pulsating direct current half-wave while loading power (pulsating direct current half-wave part area) 1.2 times, can be extrapolated civil power and be AC220V by Figure 14 mapping time, the carrying voltage of chip array be DC236V;
Referring to Figure 15, LED module 1 is arranged respectively to different magnitudes of voltage to module 6, the chip that can obtain under different bearer magnitude of voltage loads power area (dash area in figure);
Adopt 2*52V+4*35V high voltage chip (model of module 1 and module 2 is that VES-AADBHV45, module 3 are ES-AADBHF40 to module 6) composition serial array, the carrying voltage of chip array is adjusted into DC244V; Make Figure 16, it is 96.67% of pulsating direct current half-wave power area that the chip array of acquisition is loaded power area, and the power that chip array is loaded approaches 1 for perfect condition; The power that now LED chip array is loaded is chip array nominal output 77.6%; Experimental verification and estimated value are close.
The module of each voltage section loads power checking: the loading power area of establishing pulsating direct current half-wave is 1, and when voltage is ordinate, easily calculating DC52V chip nominal output by Figure 15 is 26.52%, and in like manner, the nominal output of DC35V chip is 17.89%; Figure 16 is civil power while being AC220V, the power situation being loaded of the each module of LED chip array; Table 1 is that power that chip array is loaded is while being pulsating direct current half-wave power area 1, line voltage is respectively AC220V, AV246V, each module of AC270V is loaded the situation of power, in table, can find out, only module 3 slightly transships at DC311V and DC348V, but because module 1 and module 2 have margin of power, experimental results show that module 3 can pass through.
In the time of other line voltage grades, optimal way is with reference to above-mentioned carrying out.
Under perfect condition, the checking computations of chip bearing power are as shown in the table:
Claims (11)
1.LED ray machine module, it is characterized in that: comprise transparent ray machine template (43), in ray machine template (43), be printed with silver slurry printed circuit (414), in ray machine template (43), be pasted with power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412), power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) are the wafer scale device not encapsulating; Power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) are by face-down bonding or formal dress welding gold thread (417) and silver slurry printed circuit (414) welding; In described ray machine template (43), be also bonded with LED chip array; LED chip array is made up of multiple series block that are connected in parallel, and each series block is composed in series by 3～7 LEDs chips (41), each LED chip (41) is by face-down bonding or formal dress welding gold thread (417) and silver slurry printed circuit (414) welding.
2. LED ray machine module according to claim 1, it is characterized in that: between described power drives wafer stage chip (411), rectifier bridge wafer stage chip (412) and LED chip (41), be filled with the transparent sealing (45) for levelling, and then adopt except reserved installation and welding position, pattern and size are added a cover on it and are formed and seal with the identical transparent cover plate (42) of ray machine template (43); Or be directly formed with one deck by the transparent sealing (45) of power drives wafer stage chip (411), rectifier bridge wafer stage chip (412) and LED chip (41) sealing at power drives wafer stage chip (411), rectifier bridge wafer stage chip (412) and LED chip (41).
3. LED ray machine module according to claim 1, it is characterized in that, LED driving method on described LED ray machine module is: civil power AC is converted into Rectified alternating current by the rectifier bridge on rectifier bridge wafer stage chip (412), the voltage of Rectified alternating current is greater than zero, is less than or equal to the specified maximum working voltage V of Rectified alternating current
wR3～7 sections of LED loads are set on Rectified alternating current, each section of LED load is cascaded and forms LED load series block group, multiple LED load series block form described LED chip array, in the time that the voltage of Rectified alternating current raises, the hop count that power drives wafer stage chip (411) is controlled LED load series connection increases step by step, in the time of the voltage drop of Rectified alternating current, the hop count of controlling LED load series connection reduces step by step, and the hop count of LED load series connection is the actual LED load hop count that is connected into Rectified alternating current.
4. LED ray machine module according to claim 3, is characterized in that: the hop count of described LED load series connection is controlled by switch, the segmentation boundary that the control node of switch is voltage, and the number of fragments of described voltage is corresponding with the hop count of LED load series connection; The control method of the hop count of described LED load series connection is, the negative pole direction of every section of LED load is connected respectively to the negative pole of Rectified alternating current by switch, then according to the voltage change of Rectified alternating current, the break-make of each switch is controlled, used the mode that a few sections of switches are opened circuit to realize the change of the hop count of LED load series connection.
5. LED ray machine module according to claim 4, is characterized in that: the pulsating direct current operating voltage V that sets Rectified alternating current
wbe greater than V
wmaxperiod, control all switches and disconnect, stop to all LED load supplyings, realize overvoltage and surge protection to LED; Allow pulsating dc voltage V by the maximum of adjusting Rectified alternating current
wmaxsize, thereby realize luminosity adjustment to LED.
6. LED ray machine module according to claim 4, is characterized in that: record effective operating current I in circuit by current sensor is set
w, work as I
wexceed design load KI
wRtime, close all switches to realize current protection, the unlatching of switch need recover after reloading voltage next time, and wherein K is for adjusting coefficient, I
wRfor specified effective operating current.
7. LED ray machine module according to claim 4, is characterized in that: described switch is at pulsating dc voltage ascent stage time delay t
mmillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stage
mmillisecond action, to obtain LED operating current relatively stably.
8. LED ray machine module according to claim 5, it is characterized in that: it is the LED chip group with different maximum carrying magnitudes of voltage that each section of LED load being cascaded is set, and can make the LED load series block group of working under switch control obtain the operating current curve that approaches ideal sine wave.
9. LED ray machine module according to claim 8, is characterized in that, the method for adjustment of the maximum carrying of described each section of LED load voltage is: 1. taking pulsating dc voltage as ordinate, the pulsating direct current cycle is abscissa mapping; 2. suppose a pure resistor load, the sinusoidal graphics area that its power forms at pulsating direct current half-wave is 1, mapping; 3. the load power of setting LED load series block group is pure resistor load 120%, the rectangle echo that to make an area be 1.2, and the ordinate value of rectangle shade is the total maximum carrying magnitude of voltage of series block group; 4. in like manner, under known LED load-carrying voltage condition, can map and draw the graphics area of LED load,, the area sum of verifying piecemeal LED load is greater than the sinusoidal wave area of pulsating direct current under the control node of switch; 5. choose the carrying magnitude of voltage of each section of LED load in LED load series block group, be added and be more than or equal to the total maximum carrying magnitude of voltage of series block group; Wherein, the higher LED load of carrying magnitude of voltage is near positive terminal, and the lower LED load of carrying magnitude of voltage is near negative pole end.
10. LED ray machine module according to claim 1, it is characterized in that: the material of described ray machine template (43) is thin slice transparent non-metallic material, it is that slim sheet material is warmed to nearly material softening point, utilizes mould to adopt pressing equipment stamping forming.
11. rights to use require the LED ray machine module described in 1 to 10 arbitrary claim to set up the method for LED illumination core component: flexible circuit (44) is set on LED ray machine module, or also on LED ray machine module, cover after transparent cover plate (42), pack the inner cover (61) with fluorescent material into; Inner cover (61) with fluorescent material is that the injection moulding particulate material containing fluorescent material and the transparent injected-moulded particulate material that does not contain fluorescent material are mixed; Mixed proportion configures as required, then by injection mo(u)lding and get final product; The wherein said injection moulding particulate material containing fluorescent material is that 20～30% fluorescent powders and 70～80% transparent injected-moulded particulate material are mixed, and again makes injection moulding particulate material after hot melt; Fluorescent material is selected the fluorescent material that is greater than 8ms persistence.
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| CN201410213615.2A CN103968342B (en) | 2014-05-20 | 2014-05-20 | LED ray machine module |
| PCT/CN2015/079152 WO2015176626A1 (en) | 2014-05-20 | 2015-05-18 | Led large chip and optical machine module group |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410213615.2A CN103968342B (en) | 2014-05-20 | 2014-05-20 | LED ray machine module |
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| CN103968342B CN103968342B (en) | 2016-05-11 |
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|---|---|---|---|---|
| WO2015176626A1 (en) * | 2014-05-20 | 2015-11-26 | 贵州光浦森光电有限公司 | Led large chip and optical machine module group |
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