CN103953902B - LED drive power large chip - Google Patents
LED drive power large chip Download PDFInfo
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- CN103953902B CN103953902B CN201410214074.5A CN201410214074A CN103953902B CN 103953902 B CN103953902 B CN 103953902B CN 201410214074 A CN201410214074 A CN 201410214074A CN 103953902 B CN103953902 B CN 103953902B
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Abstract
The invention discloses a kind of LED drive power large chip, the transparency carrier (413) of W is fixed as including width, second transparency carrier (413) is printed with silver paste circuit, and interface lead is formed with silver paste circuit, and interface lead has incoming end and output end；The width of incoming end and the width W of light machine template (43) wire incoming endGIt is identical or have the pad being connected with electric connector；The interface lead for having N+1 bars parallel on the silver paste circuit of output end, spacing W of adjacent two interface leadsJGSubtract interface lead width again divided by N equal to W；Un-encapsulated power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) are first pasted on second transparency carrier (413), then un-encapsulated power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) are welded on the second transparency carrier (413).
Description
Technical field
The present invention relates to a kind of LED drive power large chip, belongs to technical field of LED illumination.
Background technology
Application number 201310140124.5,201310140138.7,201310140150.8,201310140105.2,
201310140134.9, the Chinese patent applications such as 201310140106.7,201310140151.2,201310140136.8 disclose
Multiple ray machine module technical schemes that can be used in LED bulb that is general and exchanging.These technologies are foundation with LED bulb
Centered on Lighting Industry framework, make LED bulb (lighting source), light fixture, Lighting control become independent production, application terminal
The basic concept of product is laid a good foundation.But above-mentioned patent not yet solves the problems, such as the built-in driving power supply of ray machine module.
Existing LED drive power mostly is Switching Power Supply, and volume is too big；Also the linear power supply for having volume slightly smaller, but its drive
Dynamic chip is more to coordinate auxiliary element again with DIP dual-in-lines or SMD pasters encapsulation pattern, is then welded in PCB,
Its volume is still not enough to little to can be placed into ray machine module internal.This thinking is difficult to make LED drive power miniaturization, lightweight
And transparence, it is impossible to it is placed in ray machine module, finally cannot realizes that civil power is directly accessed in LED bulb that is general and exchanging.
The content of the invention
It is an object of the present invention to provide a kind of LED drive power large chip.It may be conveniently used different capacity will
The LED light machine module asked, can volume do it is less so that driving power supply can be put into bulb even ray machine mould
Group is internal, is conducive to the standardization of LED illumination, large-scale popularization.
Technical scheme：LED drive power large chip, is characterized in：The second transparent of W is fixed as including width
Substrate, the second transparency carrier are printed with silver paste circuit, are formed with interface lead on silver paste circuit, and interface lead has incoming end and defeated
Go out end；The width of incoming end and the width W of light machine template (43) wire incoming endGIt is identical or have the weldering being connected with electric connector
Disk；The interface lead for having N+1 bars parallel on the silver paste circuit of output end, spacing W of adjacent two interface leadsJGSubtract equal to W and connect
Mouth wire width is again divided by N (WJG=(W- interface lead width)/N)；Un-encapsulated power drives are pasted on second transparency carrier first
Wafer stage chip and rectifier bridge wafer stage chip, then by un-encapsulated power drives wafer stage chip and rectifier bridge wafer scale
Chip is welded on the second transparency carrier；Rectifier bridge wafer stage chip can be incorporated in power drives wafer stage chip；Second
Transparency carrier has the width at the interface lead end of output end identical with the width W of LED illumination large chip, is highly H2；LED drives
On power supply large chip, the purposes of the interface lead of output end is for connection to the chip array on described LED illumination large chip
's.N is the integer between 3 to 7.
In the LED light machine module that above-mentioned LED drive power large chip is set up, it sets up by the following method：In light
Silver paste circuit is printed in machine template, the silver paste circuit in light machine template is also formed with interface lead, and number and spacing are and LED
The interface lead of driving power supply large chip is identical, and one side of the LED drive power large chip with silver paste circuit is attached to light machine template
One side with silver paste circuit carries out butt welding；The one side of LED illumination large chip microarray strip is attached to into light machine template band silver paste electricity simultaneously
The one side on road carries out butt welding, and both interface leads mutually correspond to welding；So as to by LED illumination large chip and LED drive power
Large chip is connected；Finally the gap around LED illumination large chip and driving power supply large chip is encapsulated with transparent adhesive tape.
In aforesaid LED light machine module, the LED illumination large chip includes that a width is also fixed as the first transparent of W
Substrate, transparent substrates are provided with the parallel interface lead of N+1 bars, and the first transparency carrier is provided with N LEDs chip and constitutes LED core
Piece series connection group, is respectively positioned between two adjacent interface leads per LEDs chip, and the spacing of two adjacent interface leads is WJG
Subtract interface lead width again divided by N (W equal to WJG=(W- interface lead width)/N), and often the both positive and negative polarity of LEDs chip respectively connects
It is connected in two adjacent interface leads；And while multiple LED strip joint groups in parallel so that being formed on the first transparency carrier can be the
The LED chip array of the N row multirows extended on one transparency carrier length direction；N is the integer between 3 to 7；Setting up LED light
During machine module, according to power needs, LED illumination large chip is cut out, is cut into the LED illumination large chip tool of different length
There are different power；It is DC3.2V or the high voltage more than DC10V that described LED chip carries voltage.
In aforesaid LED light machine module, the formation side of the LED chip array and interface lead on the first transparency carrier
Method is：The slim epitaxial wafer of transition epitaxial layer formation is done using transparent substrate, epitaxial wafer is using ripe chip fabrication techniques point
Layer growth circuit and LED chip, it is then cleaved to form the LED illumination large chip that width is W, wherein the circuit for growing includes
The wire of the connection chip of interface lead and connection LED chip and interface lead, substrate is used as the first transparency carrier；Described core
Two pole of piece can adopt transparency electrode, to increase the light-emitting area of chip due to welding；The ripe manufacture skill of described chip
Art is：Carry out covering silicon, gluing, photoetching, etching, plated film, alloy and abrasive disc using the layering of Metalorganic chemical vapor deposition equipment
Etc. technique；Or LED chip array is mounted on the first transparency carrier for producing silver paste circuit using conventional art, and lead to
Cross face-down bonding or the welding of spun gold formal dress is connected with the silver paste circuit on the first transparency carrier, obtain LED illumination large chip, silver paste
Brush circuit includes the wire of interface lead and connection connection chip.
In aforesaid LED drive power large chip, the LED driving methods on the LED drive power large chip are：Rectification
Civil power AC is converted into Rectified alternating current by the rectifier bridge on bridge wafer stage chip, and the voltage of Rectified alternating current is more than zero, less than etc.
In the specified maximum working voltage V of Rectified alternating currentWR, N section LED loads are set on Rectified alternating current；N is whole between 3 to 7
Number；Each section of LED load is cascaded to form LED load series block group, and multiple LED load series block groups form described LED
Chip array, when the voltage of Rectified alternating current is raised, the hop count of power drives wafer stage chip control LED load series connection is step by step
Increase, when the voltage of Rectified alternating current declines, the hop count for controlling LED load series connection reduces step by step, the hop count of LED load series connection
To be actually connected into the LED load hop count of Rectified alternating current.Civil power AC becomes Rectified alternating current, example after rectifier bridge：AC220V,
After the rectified bridge rectification of 50Hz alternating currents, wavy curve of the voltage for half period (180 degree), cycle pulsating direct current at 0 degree
Voltage is zero, and at 90 degree, pulsating dc voltage reaches maximum VWRFor highest DC311V, during 180 degree, voltage is reduced to zero again, week
And renew.
In aforesaid LED drive power large chip, the hop count of the LED load series connection is controlled by switch, is switched
Control node for voltage segmentation boundary, the number of fragments of the voltage is corresponding with the hop count that LED load is connected；It is described
The control method of the hop count of LED load series connection is, by the negative pole direction of every section of LED load respectively by switching connection pulsating direct current
The negative pole of electricity, then switches on-off to each according to the voltage change of Rectified alternating current and is controlled, using a few sections are opened
The mode on shut-off road realizes the change of the hop count of LED load series connection.LED load can be divided into 3～7 sections, and segmentation is few, and circuit is simple,
But curent change is larger, easily low-order harmonic is produced in electrical network；Segmentation is more, then circuit structure is complicated.Typically take 4～6 sections to be preferred.
In aforesaid LED drive power large chip, pulsating direct current operating voltage V of Rectified alternating current is setWMore than VWmax's
Period, control is all to be switched off, and stops to all LED loads powering, and realizes overvoltage and surge protection to LED；Pass through
The maximum allowable pulsating dc voltage V of adjustment Rectified alternating currentWmaxSize, so as to realize that the luminosity of LED is adjusted.
In aforesaid LED drive power large chip, effective operating current I in circuit is measured by arranging current sensorW,
Work as IWMore than design load KIWRWhen, all switches are closed to realize current protection, switch on and need to reload voltage in next time
After recover, wherein K be regulation coefficient, IWRFor specified effective operating current.
In aforesaid LED drive power large chip, described switch is in pulsating dc voltage ascent stage time delay tmMillisecond
Action, shifts to an earlier date t in the pulsating dc voltage decline stagemMillisecond action, to obtain relatively stable LED operation electric current.
In aforesaid LED drive power large chip, arrange each section of LED load being cascaded be with it is different most
The big LED chip group for carrying magnitude of voltage, obtains can the LED load series block group that worked under switch control rule and be close to ideal sinusoidal
The operating current curve of ripple.
In aforesaid LED drive power large chip, the method for adjustment of the maximum carrying voltage of each section of LED load is：
1. with pulsating dc voltage as ordinate, the pulsating direct current cycle be abscissa mapping；2. a pure resistor load, its power are assumed
The sinusoidal graphics area formed in pulsating direct current half-wave is 1, mapping；3. the load power of LED load series block group is set as pure
The 120% of ohmic load, makees the rectangle echo that an area is 1.2, and the ordinate value as series block group of rectangle shade is total
It is maximum to carry magnitude of voltage；4. in the same manner, it is known that LED load is carried under voltage condition, can be mapped and be drawn the graphics area of LED load,
The area sum of checking LED load is more than the pulsating direct current sine wave area under the control node of switch paragraph by paragraph；5. choose LED to bear
The carrying magnitude of voltage of each section of LED load in series block group is carried, being added the maximum carrying magnitude of voltage total more than or equal to series block group is
Can；Wherein, the higher LED load of magnitude of voltage is carried near positive terminal, carry the relatively low LED load of magnitude of voltage near negative pole end.
In aforesaid LED light machine module, the material of the light machine template is thin slice transparent non-metallic material (such as SiO2,
Al2O3Deng), it is that slim sheet material is warmed to nearly material softening point, stamping forming using pressing equipment using mould.(material
It is brittle and hardness is higher.So can only cutting mode when being processed into light machine template shape, it is relatively costly.)
The method that LED illumination core component is set up using aforesaid LED light machine module：Arrange soft on LED light machine module
Load the inner cover with fluorescent material after property circuit；Inner cover with fluorescent material be by containing fluorescent material injection particulate material with do not contain it is glimmering
The transparent injected-moulded particulate material of light powder is mixed；Mixed proportion is configured as needed, is then obtained final product by injection mo(u)lding；It is wherein described to contain
The injection particulate material of fluorescent material is to mix 20～30% fluorescent powders and 70～80% transparent injected-moulded particulate materials, after hot melt again
Make injection particulate material；Fluorescent material is more than the fluorescent material of 8ms from persistence.
Compared with prior art, LED illumination large chip of the invention can meet LED illumination application such as driving, light modulation, mistake
The various primary demands of voltage and surge protection, overload etc., and can volume do it is less so that can be by driving power supply
It is put into bulb even ray machine module internal.This has very important significance to LED illumination low cost, miniaturization.So as to
Developing towards integrated direction for LED chip can be promoted, has made the appearance of illumination large chip become a reality.The two makes jointly
With the fast development for further being promoted LED illumination industry.
The ray machine module of the present invention goes for all kinds of bulb patents of the present inventor's earlier application, replacement bulb Central Plains
Some ray machine modules.The ray machine module of the present invention in structure can be with built-in power and LED illumination chip, and small volume, easily
In realization standardization.The present invention can change the existing industry structure centered on LED chip, the LED light machine of the present invention
Module can be to realize that under the pattern of replaceable light source light source (bulb) is standardized, such that it is able to reduce the industry of illuminating product
Complexity and the industrial concentration for reducing illuminating product.
In addition, civil power is converted into Rectified alternating current by rectifier bridge by the present invention, while the voltage in each cycle is pressed
Phase division is multistage, and using the different characteristic of voltage in multistage, using switch to concatenating the LED load into working condition
Hop count is adjusted, so that LED load enters intelligentized operational mode, the operational mode can meet LED chip and power,
And this LED type of drive of the present invention can greatly reduce the complexity of driving power supply, so that LED light machine module
Built-in driving power supply is possibly realized, for LED bulb, this realizes that bigger versatility and interchangeability are significant.
Description of the drawings
Fig. 1 is high-power LED driving power source large chip front view of the present invention；
Fig. 2 is low-power LED driving power supply large chip front view of the present invention；
Fig. 3 is the high-power LED driving power source large chip front view of resistance of the present invention；
Fig. 4 is the large-scale ray machine module of the present invention；
Fig. 5 is the medium-sized ray machine module of the present invention；
Structural representations of the Fig. 6 for embodiment of the present invention LED illumination large chip；
Structural representations of the Fig. 7 for the ray machine core component of the embodiment of the present invention；
LED voltage current waveform figures of the Fig. 8 for the embodiment of the present invention；
Extra-high pressure operation power waveform figures of the Fig. 9 for the embodiment of the present invention；
The light modulation operation power waveform figure of Figure 10 embodiment of the present invention；
The circuit connection diagram of Figure 11 embodiment of the present invention；
The driving power supply chip internal circuits figure of Figure 12 embodiment of the present invention；
The LED voltage current waveform figure of 3 sections of loads of Figure 13 embodiment of the present invention；
Figure 14：The LED chip array module power loading distribution map of embodiment of the present invention DC52V series connection；
Figure 15：Embodiment of the present invention LED chip array carries voltage tentative calculation figure；
Figure 16：Single DC52V chip bearing power tentative calculation figure of the embodiment of the present invention；
Figure 17：The LED chip array module power loading distribution map of embodiment of the present invention 2*52V+4*35V series connection.
Mark in accompanying drawing for：41-LED chips, 43- light machine templates, 43.1- light machine template fixing holes, 44.1- solder joints,
Inner covers of the 61- with fluorescent material, 410-LED driving power supply large chips, 411-LED power drives wafer stage chips, 412- rectifier bridges
Wafer stage chip, the second transparency carriers of 413-, 414- silver paste circuits, 414.1- pads, 416- resistance, 420-LED illuminate big core
Piece, the first transparency carriers of 421-.
Specific embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples, but be not intended as to the present invention limit according to
According to.
Embodiment.LED drive power large chip：Second transparency carrier 413 of W, the second transparent base are fixed as including width
Plate 413 is printed with silver paste circuit, and interface lead is formed with silver paste circuit, and interface lead has incoming end and output end；Incoming end
Width and 43 wire incoming end of light machine template width WGIt is identical or have the pad being connected with electric connector；The silver of output end
The interface lead for having N+1 bars parallel on slurry circuit, spacing W of adjacent two interface leadsJGEqual to W subtract interface lead width again divided by
N(WJG=(W- interface lead width)/N)；Un-encapsulated power drives wafer stage chip is pasted on second transparency carrier 413 first
411 and rectifier bridge wafer stage chip 412, then by un-encapsulated power drives wafer stage chip 411 and rectifier bridge wafer scale
Chip 412 is welded on the second transparency carrier 413；Rectifier bridge wafer stage chip 412 can be incorporated in power drives wafer scale core
In piece 411；Second transparency carrier 413 has the width at the interface lead end of output end identical with the width W of LED illumination large chip,
Highly it is H2；On LED drive power large chip, the purposes of the interface lead of output end is for connection to the described big core of LED illumination
Chip array on piece.
Its typical sizes be L=12.4mm, h4=5mm (large-scale) or L=12.4mm, h4=97mm (medium and small), total thickness
Degree is less than 1mm, referring to Fig. 1 and Fig. 2.For anti-oxidation and damage wafer stage chip, in wafer stage chip surface local, dispensing is protected
Shield.
LED drive power large chip 410 with LED illumination large chip 420 in be input into road identical width W and interface and lead
Distance between centers of tracks WJG；Width W and interface lead spacing WJGIt is that the LED illumination large chip 420 of different manufacturers is driven with the LED of different manufacturers
General connecting interface between dynamic power supply large chip 410.The width W of output circuit is that LED strip joins length * interface lead spacing WJG
+ conductor width.
As LED drive power large chip 410 can directly adopt mains-supplied, using 410 structure of LED drive power large chip
The characteristics of ray machine module 4 built has small volume, ultra-thin and whole clearing, referring to Fig. 1 and Fig. 2.
In order to LED power driving chip 411 provides a more stable working power, can be in LED drive power large chip
410 backs are provided with resistance 416, are easy to adjust internal reference voltage, referring to Fig. 3.
The LED light machine module set up using LED drive power large chip, it sets up by the following method：In ray machine mould
Silver paste circuit 414 is printed on plate 43, the silver paste circuit 414 in light machine template 43 is also formed with interface lead, and number and spacing
It is identical with the interface lead of LED drive power large chip 410, by one side of the LED drive power large chip 410 with silver paste circuit
Being attached to one side of the light machine template 43 with silver paste circuit 414 carries out butt welding；Simultaneously by the one side of 420 microarray strip of LED illumination large chip
Being attached to one side of the light machine template 43 with silver paste circuit 414 carries out butt welding, and both interface leads mutually correspond to welding；So as to incite somebody to action
LED illumination large chip 420 is connected with LED drive power large chip 410；Finally with 420 He of transparent adhesive tape encapsulation LED illumination large chip
Gap around driving power supply large chip 410.Referring to Fig. 4 and Fig. 5；Light machine template 43 can adopt transparent template, and LED can be made to light
When light upward LED drive power large chip 410 can be passed through when by reflecting and blocking for light is reduced.
The LED illumination large chip 420, as shown in fig. 6, first transparency carrier of W is also fixed as including a width
421, transparent substrates are provided with the parallel interface lead of N+1 bars, and the first transparency carrier 421 is provided with N LEDs chip 41 and constitutes
LED chip series connection group, is respectively positioned between two adjacent interface leads per LEDs chip 41, two adjacent interface leads
Spacing is WJGSubtract interface lead width again divided by N (W equal to WJG=(W- interface lead width)/N), and per the positive and negative of LEDs chip 41
Pole is respectively connected in two adjacent interface leads；And while multiple LED strip joint groups in parallel so that the first transparency carrier
The LED chip array of the N row multirows that can extend on 421 length direction of the first transparency carrier is formed on 421；N is between 3 to 7
Integer；When LED light machine module is set up, according to power needs, LED illumination large chip 420 is cut out, difference is cut into
The LED illumination large chip 420 of length has different power
The forming method of the LED chip array and interface lead on the first transparency carrier 421 is：Using transparent lining
The slim epitaxial wafer of transition epitaxial layer formation is done at bottom, and epitaxial wafer is using ripe chip fabrication techniques multi ANN circuit and LED core
Piece, it is then cleaved to form the LED illumination large chip that width is W, wherein the circuit for growing includes interface lead and connection LED
The wire of the connection chip of chip and interface lead, substrate is used as the first transparency carrier；Described two pole of chip is not due to needing
Welding, can adopt transparency electrode, to increase the light-emitting area of chip；Described chip maturation manufacturing technology is：Using organic gold
Category chemical vapor depsotition equipment layering carries out covering the techniques such as silicon, gluing, photoetching, etching, plated film, alloy and abrasive disc；Or adopt
LED chip array is mounted on the first transparency carrier 421 for producing silver paste circuit 414 by conventional art, and passes through flip chip bonding
Connect or the welding of spun gold formal dress is connected with the silver paste circuit 414 on the first transparency carrier 421, obtain LED illumination large chip, silver paste brush
Circuit 414 includes the wire of interface lead and connection chip.
LED driving methods on the LED light machine module are：Rectifier bridge on rectifier bridge wafer stage chip 412 is by civil power
AC is converted into Rectified alternating current, and the voltage of Rectified alternating current is more than zero, less than or equal to the specified maximum working voltage of Rectified alternating current
VWR, 3～7 sections of LED loads are set on Rectified alternating current, each section of LED load is cascaded to form LED load series block group,
Multiple LED load series block groups form described LED chip array, and when the voltage of Rectified alternating current is raised, power drives are brilliant
Circle level chip 411 controls the hop count of LED load series connection to be increased step by step, when the voltage of Rectified alternating current declines, controls LED load
The hop count of series connection reduces step by step, and the hop count of LED load series connection is the LED load hop count for being actually connected into Rectified alternating current.
The hop count of the LED load series connection is controlled by switch, and the control node of switch is the segmentation boundary of voltage,
The hop count that the number of fragments of the voltage is connected with LED load is corresponding；The control method of the hop count of the LED load series connection
It is, by the negative pole direction of every section of LED load respectively by switching the negative pole for connecting Rectified alternating current, then according to Rectified alternating current
Voltage change each switched on-off be controlled, realize that LED load is connected using by the modes of a few sections of switch open circuits
Hop count change.
Pulsating direct current operating voltage V of setting Rectified alternating currentWMore than VWmaxPeriod, control it is all switches off, stop
Power to all LED loads, realize the overvoltage and surge protection to LED；By the maximum allowable arteries and veins for adjusting Rectified alternating current
Dynamic DC voltage VWmaxSize, so as to realize that the luminosity of LED is adjusted.
Effective operating current I in circuit is measured by arranging current sensorW, work as IWMore than design load KIWRWhen, close institute
Have switch to realize current protection, switch on and need to recover after voltage is reloaded next time, wherein K be regulation coefficient, IWR
For specified effective operating current.
Described switch is in pulsating dc voltage ascent stage time delay tmMillisecond action, in the pulsating dc voltage decline stage
T in advancemMillisecond action, to obtain relatively stable LED operation electric current.
The each section of LED load that setting is cascaded is the LED chip group with different maximum carrying magnitudes of voltage, can
The LED load series block group worked under switch control rule is made to obtain the operating current curve for being close to ideal sine wave.
The method of adjustment that each section of LED load be maximum to carry voltage is：1. with pulsating dc voltage as ordinate, arteries and veins
The dynamic direct current cycle maps for abscissa；2. a pure resistor load, the sinogram that its power is formed in pulsating direct current half-wave are assumed
Shape area is 1, mapping；3. the load power of LED load series block group is set as the 120% of pure resistor load, making an area is
1.2 rectangle echo, the ordinate value of rectangle shade are the total maximum carrying magnitude of voltage of series block group；4. in the same manner, it is known that
LED load is carried under voltage condition, can be mapped and be drawn the graphics area of LED load, the area sum of LED load is verified paragraph by paragraph
More than the pulsating direct current sine wave area under the control node of switch；5. choose each section of LED load in LED load series block group
Magnitude of voltage is carried, the maximum carrying magnitude of voltage total more than or equal to series block group is added；Wherein, carry magnitude of voltage higher
LED load carries the relatively low LED load of magnitude of voltage near negative pole end near positive terminal.
The material of the light machine template 43 be thin slice transparent non-metallic material, such as SiO2, Al2O3Deng it is by slim sheet material
Nearly material softening point is warmed to, it is stamping forming using pressing equipment using mould.As material is brittle and hardness is higher, therefore
Can only cutting mode when being processed into light machine template shape, it is relatively costly.
The method that LED illumination core component is set up using aforesaid LED light machine module, as shown in fig. 7, in LED light machine mould
Load the inner cover 61 with fluorescent material after flexible circuit 44 is set in group；Inner cover 61 with fluorescent material is by the note containing fluorescent material
Modeling particulate material is mixed with the transparent injected-moulded particulate material without fluorescent material；Mixed proportion is configured as needed, then by being molded into
Type is obtained final product；The wherein described injection particulate material containing fluorescent material is by 20～30% fluorescent powders and 70～80% transparent injected-moulded particles
Material is mixed, and injection particulate material is made again after hot melt；Fluorescent material is more than the fluorescent material of 8ms from persistence.
It is hereafter the operation principle of the present invention by taking 6 groups of LED loads as an example.I.e. n values are 6.
First, alternating current AC becomes Rectified alternating current, example after rectifier bridge：The rectified bridge of AC220V, 50Hz alternating current
After rectification, referring to Fig. 8, wavy curve of the voltage for half period (180 degree), cycle pulsating dc voltage at 0 degree is zero,
When 90 degree, pulsating dc voltage reaches maximum VWRFor highest DC311V, during 180 degree, voltage is reduced to zero again, goes round and begins again.
The job requirement of the present invention, in pulsating dc voltage more than zero and less than or equal to VWRBetween, 3～7 sections are arranged altogether bears
Carrying, series system being formed between each section of load, raised with voltage, load (i.e. LED load) series connection hop count increases step by step, load voltage
Loaded by switch control rule, referring to Fig. 8 and Figure 11, voltage switch node is that voltage is segmented boundary.
Power supply management operational mode：Not design current control device of the invention, the keying of switches at different levels are only dependent upon VW's
Change, referring to Fig. 8, Figure 11 and Figure 12.
During 0～90 degree of cycle：
1st section：Work original state, the i.e. cycle is initial from 0, circuit breaker in middle K1～K6In opening (ON), electric current
Main warp knuckle point J1By switching K1Path is formed, it is 1V to load by rated voltageWRThe LED compositions of/6 tandem workings；
2nd section：Work as VWMore than or equal to 1VWRWhen/6, switch K1 closes (OFF), and the main warp knuckle point J2 of electric current is by switching K2
Path is formed, it is 2V to load by rated voltageWRThe LED compositions of/6 tandem workings；
3rd section：Work as VWMore than or equal to 2VWRWhen/6, switch K1 is in OFF, and switch K2 closes (OFF), the main warp knuckle of electric current
Point J3 forms path by switching K3, and it is 3V to load by rated voltageWRThe LED compositions of/6 tandem workings；
4th section：Work as VWMore than or equal to 3VWRWhen/6, switch K1～K2 is in OFF, and switch K3 closes (OFF), and electric current is main
Warp knuckle point J4 forms path by switching K4, and it is 4V to load by rated voltageWRThe LED compositions of/6 tandem workings；
5th section：Work as VWMore than or equal to 4VWRWhen/6, switch K1～K3 is in OFF, and switch K4 closes (OFF), and electric current is main
Warp knuckle point J5 forms path by switching K5, and it is 5V to load by rated voltageWRThe LED compositions of/6 tandem workings；
6th section：Work as VWMore than or equal to 5VWRWhen/6, switch K1～K4 is in OFF, and switch K5 closes (OFF), electric current warp knuckle
Point J6 forms path by switching K6, and it is 6V to load by rated voltageWRThe LED compositions of/6 tandem workings；
The method for closing of time delay 0.1ms when switch K1～K6 is closed, can be adopted, relatively stable electric current can be obtained.
During 90～180 degree of cycle：
6th section：Work original state, voltage are reduced by maximum downwards, and circuit breaker in middle K1～K5 is closed
(OFF), switch K6 and be in opening, electric current warp knuckle point J6 forms path by switching K6, it is 6V to load by rated voltageWR/6
The LED compositions of tandem working；
5th section：Work as VWLess than or equal to 5VWRWhen/6, switch K5～K6 opens (ON), and the main warp knuckle point J5 of electric current is by switch
K5 forms path, and it is 5V to load by rated voltageWRThe LED compositions of/6 tandem workings；
4th section：Work as VWLess than or equal to 4VWRWhen/6, switch K4～K6 opens (ON), and the main warp knuckle point J4 of electric current is by switch
K4 forms path, and it is 4V to load by rated voltageWRThe LED compositions of/6 tandem workings；
3rd section：Work as VWLess than or equal to 3VWRWhen/6, switch K3～K6 opens (ON), and the main warp knuckle point J3 of electric current is by switch
K3 forms path, and it is 3V to load by rated voltageWRThe LED compositions of/6 tandem workings；
2nd section：Work as VWLess than or equal to 2VWRWhen/6, switch K2～K6 opens (ON), and the main warp knuckle point J2 of electric current is by switch
K2 forms path, and it is 2V to load by rated voltageWRThe LED compositions of/6 tandem workings；
1st section：Work as VWLess than or equal to 1VWRWhen/6, switch K1～K6 opens (ON), and the main warp knuckle point J1 of electric current is by switch
K1 forms path, and it is 1V to load by rated voltageWRThe LED compositions of/6 tandem workings.
The open method of 0.1ms in advance when switch K1～K6 is opened, can be adopted, relatively stable electric current can be obtained.
Light modulation operational mode：During outside one given voltage VT=0 of setting, VWmaxCorrespondence CVWR, external voltage gives VT=5V
When, VWmaxCorrespondence 0V, arranges 0≤VWmax≤CVWR, C regulation coefficients are the multiple of rated voltage, such as C=1.12.VWMore than VWmax
Period, correspondence each section switch will close (OFF), stop powering to the load.Which act as a kind of dimming arrangement.Referring to figure
10th, Figure 11 and Figure 12, adjusts VWmaxLess than VWR, in figure, yl moiety will increase, and the power for being input to load will be reduced, so as to reach
To the purpose of light modulation.Example：When LED in AC220V civil power normal works is, when adjusting the voltage of alternating current voltage to AC180V, figure
In dash area be VWFormation power projection figure part higher than 254V, from about 55.5 degree to 124.5 degree of cycle, due to
In this time, in (OFF) is closed, the power consumption of dash area is (equivalent to pulsating direct current under normal civil power half for corresponding switch Kx
Ripple loading power 57.0%) will be disallowable, this part power consumption be not loaded into load on, make the luminance-reduction of load.When
VWmaxDuring equal to 0, all switches will cut out (OFF), and load supplying amount is zero.Stepless dimming can be accomplished, without there is energy
Amount is consumed.
Voltage protection operational mode：V is setWmax=CVWR。VWMore than VWmaxPeriod, correspondence each section switch will close
(OFF), stop powering to the load.Referring to Fig. 9, Figure 11 and Figure 12, example：When civil power reaches the high voltage of 270V, the moon in figure
Shadow part is VWFormation power projection figure part higher than 348V, from about 66 degree to 114 degree of cycle, due in this time
, in (OFF) is closed, the power consumption of dash area is (equivalent to the loading power of pulsating direct current half-wave under normal civil power for K1～K6 switches
50.2%) will be disallowable, this part power consumption be not loaded into load on, load is not burnt because of overvoltage.
Overcurrent protection operational mode：The present invention has overcurrent protection, and referring to Figure 12, current sensor is measured in circuit effectively
Operating current IWMore than design load KIWR, K is regulation coefficient, example：Setting IWR=275mA, K=1.2, logic switch controller will
All switches K1～K6 (OFF) are closed, switch (ON) K1～K6 is opened and need to be recovered after power supply pressure is reloaded next time.
According to principle same as described above, mode of loading can be divided into 3～7 sections, and segmentation is few, and circuit is simple, but curent change
It is larger, easily low-order harmonic is produced in electrical network, referring to Figure 13；Segmentation is more, then circuit structure is complicated.Typically take 4～6 sections to be preferred.
Note：VW- pulsating direct current operating voltage (1.4142* alternating voltages)；VWRThe specified maximum working voltage of-pulsating direct current
(1.4142* alternating voltages)；VWmax- maximum allowable pulsating dc voltage (1.4142* alternating voltages)；IW- effectively work is electric
Stream.IWR- specified effective operating current.
If civil power is AC220, the voltage after rectification is DC311V, so that every group of LED load is as single chip as an example, then per
Chip bears DC52V；Such as AC110, then chip bears DC26V.If the loading power area of pulsating direct current half-wave is 1, referring to figure
14, in figure, each LED load (LED modules 1 to 6) is loaded power difference than larger, and LED modules 1 reach pulsating direct current half-wave
Loading power area 20.68% (for chip nominal output 84.4%)；And LED modules 6 only 5.11% (are chip volume
Make power 19.2%), the about a quarter power of module 1, through actual measurement checking, the intrinsic brilliance of module 6 is very low；Entirely
The power being averagely loaded of chipset for chip nominal output 52.4%, the utilization rate of chip is relatively low；And the volume of chipset
Make power (dotted line frame area) for pulsating direct current half-wave loading power area 159%.Due to chip redundancy amount it is excessive, not only
Chip is wasted, and also results in that driving power supply is excessive and wastes, while increased the difficulty on arranging.Therefore, under Constant Direct Current state
The method of chip voltage is selected to there are some problems under pulsating direct current state, how in the premise for ensureing chip secure work
Under, the utilization rate for improving chip becomes a problem to be solved.
The nominal output of the LED chip array of 6 series connection of setting is turned down by 1.59 times that pulsating direct current half-wave loads power
To 1.2 times (occur in view of small grids civil power and be not less than 1.2 times of fluctuations), referring to Figure 15, if LED chip array chip holds
Load power (hatched area in figure) loads 1.2 times of power (pulsating direct current half-wave part area) for pulsating direct current half-wave
When, the carrying voltage that can extrapolate chip array when civil power is AC220V by Figure 15 mappings is DC236V；
Referring to Figure 16, different magnitudes of voltage are respectively provided with to module 6 to LED modules 1, different bearer magnitude of voltage can be obtained
Under chip loading power area (dash area in figure)；
Using 2*52V+4*35V high voltage chips, (model VES-AADBHV45 of module 1 and module 2, module 3 arrive mould
Group 6 is ES-AADBHF40) composition serial array, then the carrying Voltage Cortrol of chip array is DC244V；Make Figure 17, acquisition
Chip array is loaded 96.67% that power area is pulsating direct current half-wave power area, and the power that chip array is loaded connects
Nearly 1 is perfect condition；The power that now LED chip array is loaded is chip array nominal output 77.6%；Experimental verification with
Estimated value is close.
The module loading power checking of each voltage section：If the loading power area of pulsating direct current half-wave is 1, voltage is vertical seat
Timestamp, it is 26.52% to calculate DC52V chips nominal output easily by Figure 16, and in the same manner, the nominal output of DC35V chips is
17.89%；Figure 17 be then civil power be AC220V when, the power situation being loaded of each module of LED chip array；Table 1 is chip
When the power that array is loaded is pulsating direct current half-wave power area 1, line voltage is respectively AC220V, AV246V, AC270V
Each module is loaded the situation of power, as can be seen that only module 3 is slightly transshipped in DC311V and DC348V in table, but due to
Module 1 and module 2 have margin of power, and experiment proves that module 3 can pass through.
When civil power is 110V, optimal way is carried out with reference to above-mentioned.
Ideally the checking computations of chip bearing power are as shown in the table：
Claims (12)
1.LED ray machine modules, it is characterised in that it sets up as follows：Silver paste electricity is printed in light machine template (43)
Road (414), the silver paste circuit (414) in light machine template (43) are also formed with interface lead, and number and spacing are driven with LED
The interface lead of power supply large chip (410) is identical, and the one side of (410) with silver paste circuit LED drive power large chip is attached to light
One side of the machine template (43) with silver paste circuit (414) carries out butt welding；Simultaneously by the one side of LED illumination large chip (420) microarray strip
Being attached to one side of the light machine template (43) with silver paste circuit (414) carries out butt welding, and both interface leads mutually correspond to welding；So as to
LED illumination large chip (420) is connected with LED drive power large chip (410)；Finally with the big core of transparent adhesive tape encapsulation LED illumination
Gap around piece (420) and driving power supply large chip (410)；Wherein described LED drive power large chip (410) is including width
Second transparency carrier (413) of W is fixed as, the second transparency carrier (413) is printed with silver paste circuit (414), silver paste circuit (414)
On be formed with interface lead, interface lead has incoming end and output end；The width of incoming end is accessed with light machine template (43) wire
The width W at endGIt is identical or have the pad being connected with electric connector；There are N+1 bars parallel on the silver paste circuit (414) of output end
Interface lead, spacing W of adjacent two interface leadsJGSubtract interface lead width again divided by N equal to W；On second transparency carrier (413)
Un-encapsulated power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) are pasted first, then will be un-encapsulated
Power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) be welded on the second transparency carrier (413)；The
Two transparency carriers (413) have the width at the interface lead end of output end identical with the width W of LED illumination large chip, are highly H2；
On LED drive power large chip, the purposes of the interface lead of output end is for connection to the core on described LED illumination large chip
Chip arrays；N is the integer between 3 to 7.
2. LED light machine module according to claim 1, it is characterised in that：The LED illumination large chip (420) includes one
Individual width is also fixed as first transparency carrier (421) of W, and transparent substrates are provided with the parallel interface lead of N+1 bars, and first is transparent
Substrate (421) be provided with N LEDs chips (41) constitute LED chip series connection group, per LEDs chip (41) be respectively positioned on two it is adjacent
Interface lead between, the spacing of two adjacent interface leads is WJGSubtract interface lead width again divided by N equal to W, and per LEDs
The both positive and negative polarity of chip (41) is respectively connected in two adjacent interface leads；And while multiple LED strip joint groups in parallel so that
The LED chip of the N row multirows that can extend on the first transparency carrier (421) length direction is formed on first transparency carrier (421)
Array；N is the integer between 3 to 7；When LED light machine module is set up, according to power needs, to LED illumination large chip (420)
Be cut out, the LED illumination large chip (420) of different length is cut into different power；Described LED chip carries electricity
Press as DC3.2V or the high voltage more than DC10V.
3. LED light machine module according to claim 2, it is characterised in that：The LED chip array and interface lead are
Forming method on one transparency carrier (421) is：The slim epitaxial wafer of transition epitaxial layer formation, extension are done using transparent substrate
, using ripe chip fabrication techniques multi ANN circuit and LED chip, then cleaved formation width is big for the LED illumination of W for piece
Chip, wherein the circuit for growing includes the wire of the connection chip of interface lead and connection LED chip and interface lead, substrate
As the first transparency carrier；Described two pole of chip can adopt transparency electrode due to welding, to increase the luminous of chip
Area；Described chip maturation manufacturing technology is：Using the layering of Metalorganic chemical vapor deposition equipment carry out covering silicon, gluing,
The techniques such as photoetching, etching, plated film, alloy and abrasive disc；Or LED chip array is mounted on using conventional art and produces silver paste
On first transparency carrier (421) of circuit (414), and pass through face-down bonding or the welding of spun gold formal dress and the first transparency carrier
(421) silver paste circuit (414) connection on, obtains LED illumination large chip, and silver paste brush circuit (414) is including interface lead and company
Connect the wire of chip.
4. LED light machine module according to claim 1, it is characterised in that on the LED drive power large chip (410)
LED driving methods be：Civil power AC is converted into Rectified alternating current by the rectifier bridge on rectifier bridge wafer stage chip (412), pulsation
Galvanic voltage is more than zero, maximum working voltage V specified less than or equal to Rectified alternating currentWR, N sections are set on Rectified alternating current
LED load；N is the integer between 3 to 7；Each section of LED load is cascaded to form LED load series block group, and multiple LED bear
Carry series block group and form described LED chip array, when the voltage of Rectified alternating current is raised, power drives wafer stage chip
(411) hop count for controlling LED load series connection increases step by step, when the voltage of Rectified alternating current declines, controls LED load series connection
Hop count reduces step by step, and the hop count of LED load series connection is the LED load hop count for being actually connected into Rectified alternating current.
5. LED light machine module according to claim 4, it is characterised in that：The hop count of the LED load series connection is by switch
It is controlled, the segmentation boundary of the control node of switch for voltage, the hop count that the number of fragments of the voltage is connected with LED load
It is corresponding；The control method of the hop count of the LED load series connection is, by the negative pole direction of every section of LED load respectively by switch
The negative pole of connection Rectified alternating current, then switches on-off to each according to the voltage change of Rectified alternating current and is controlled, make
With the change of the hop count that the mode of a few sections of switch open circuits is realized LED load series connection.
6. LED light machine module according to claim 5, it is characterised in that：The pulsating direct current work of setting Rectified alternating current
Voltage VWMore than VWmaxPeriod, control it is all switches off, stop to all LED loads powering, realize overvoltage to LED
And surge protection；By the maximum allowable pulsating dc voltage V for adjusting Rectified alternating currentWmaxSize, so as to realize to LED's
Luminosity is adjusted.
7. LED light machine module according to claim 5, it is characterised in that：Measured in circuit by arranging current sensor
Effectively operating current IW, work as IWMore than design load KIWRWhen, all switches are closed realizing current protection, switching on need to be
Reload next time, wherein K is regulation coefficient, IWRFor specified effective operating current.
8. LED light machine module according to claim 5, it is characterised in that：Described switch rises in pulsating dc voltage
Stage time delay tmMillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stagemMillisecond action, to obtain relatively stable LED
Operating current.
9. LED light machine module according to claim 4, it is characterised in that：The each section of LED load that setting is cascaded
It is, with the different maximum LED chip groups for carrying magnitude of voltage, to obtain can the LED load series block group that worked under switch control rule
The operating current curve of ideal sine wave must be close to.
10. LED light machine module according to claim 9, it is characterised in that each section of LED load is maximum to carry electricity
The method of adjustment of pressure is：1. with pulsating dc voltage as ordinate, the pulsating direct current cycle be abscissa mapping；2. hypothesis one is pure
Ohmic load, its power are 1 in the sinusoidal graphics area that pulsating direct current half-wave is formed, mapping；3. set LED load series block group
Load power be the 120% of pure resistor load, make the rectangle echo that an area is 1.2, the ordinate value of rectangle shade is
For the total maximum carrying magnitude of voltage of series block group；4. in the same manner, it is known that LED load is carried under voltage condition, can map and show that LED bears
The graphics area of load, the area sum of checking LED load is more than the pulsating direct current sine corrugated under the control node of switch paragraph by paragraph
Product；5. the carrying magnitude of voltage of each section of LED load in LED load series block group is chosen, is added total most more than or equal to series block group
It is big to carry magnitude of voltage；Wherein, the higher LED load of magnitude of voltage is carried near positive terminal, carry the relatively low LED of magnitude of voltage and bear
Carry near negative pole end.
11. LED light machine modules according to claim 2, it is characterised in that：The material of the light machine template (43) is thin slice
Transparent non-metallic material, it is that slim sheet material is warmed to nearly material softening point, adopts pressing equipment punch forming using mould
's.
12. usage rights require that the LED light machine module described in 1 to 3 any claim sets up the side of LED illumination core component
Method：Arrange on LED light machine module flexible excessive circuit (44) and or transparent cover plate (42) load the inner cover with fluorescent material afterwards
(61)；Inner cover with fluorescent material (61) is by the injection particulate material containing fluorescent material and the transparent injected-moulded particle without fluorescent material
Material is mixed；Mixed proportion is configured as needed, is then obtained final product by injection mo(u)lding；The wherein described injection particulate material containing fluorescent material
It is that 20～30% fluorescent powders and 70～80% transparent injected-moulded particulate materials are mixed, after hot melt, makes again injection particulate material；It is glimmering
Light powder is more than the fluorescent material of 8ms from persistence.
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| CN201410214074.5A CN103953902B (en) | 2014-05-20 | 2014-05-20 | LED drive power large chip |
| PCT/CN2015/079152 WO2015176626A1 (en) | 2014-05-20 | 2015-05-18 | Led large chip and optical machine module group |
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| CN201410214074.5A CN103953902B (en) | 2014-05-20 | 2014-05-20 | LED drive power large chip |
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| WO2015176626A1 (en) * | 2014-05-20 | 2015-11-26 | 贵州光浦森光电有限公司 | Led large chip and optical machine module group |
| CN105627125A (en) * | 2016-03-11 | 2016-06-01 | 贵州光浦森光电有限公司 | Large-chip LED lamp filament and large-chip LED lamp filament bulb |
| CN105627131B (en) * | 2016-03-11 | 2019-05-03 | 贵州光浦森光电有限公司 | A kind of LED filament light bulb of band cylinder heat slinger |
| CN105605449A (en) * | 2016-03-11 | 2016-05-25 | 贵州光浦森光电有限公司 | Blocky large-chip LED lamp filament assembly and blocky large-chip LED lamp filament bulb |
| CN105627124B (en) * | 2016-03-11 | 2019-07-30 | 贵州光浦森光电有限公司 | A kind of LED filament component, the method and LED filament light bulb for setting up LED filament light bulb |
| CN105627130B (en) * | 2016-03-11 | 2019-05-03 | 贵州光浦森光电有限公司 | A kind of LED filament light bulb with heat radiation bracket |
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| WO2012101519A2 (en) * | 2011-01-28 | 2012-08-02 | Seoul Semiconductor Co., Ltd. | Led luminescence apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2012101519A2 (en) * | 2011-01-28 | 2012-08-02 | Seoul Semiconductor Co., Ltd. | Led luminescence apparatus |
| CN103340017A (en) * | 2011-01-28 | 2013-10-02 | 首尔半导体株式会社 | Led driving circuit package |
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