CN103968287B - LED light machine module with vertically arranged big chips - Google Patents
LED light machine module with vertically arranged big chips Download PDFInfo
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- CN103968287B CN103968287B CN201410213349.3A CN201410213349A CN103968287B CN 103968287 B CN103968287 B CN 103968287B CN 201410213349 A CN201410213349 A CN 201410213349A CN 103968287 B CN103968287 B CN 103968287B
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Abstract
The invention discloses an LED light machine module with vertically arranged big chips. The LED light machine module with the vertically arranged big chips comprises a transparent light machine template (43) printed with a silver slurry circuit, an interface wire of the silver slurry circuit is formed on the light machine template (43), and the width and the spacing of the interface wire are the same as the width W and the spacing WJG of an LED lighting big chip (420) and an LED drive power big chip (410); the LED lighting big chip (420) is connected to the light machine template (43) perpendicular to the light machine template (43) through one or more L-shaped D type transparent transition circuit integration transparent blocks (460); or one or more LED lighting big chips (420) are connected to the light machine template (43) perpendicular to the light machine template (43) through one or more L-shaped C type transparent transition circuit integration transparent blocks (450).
Description
Technical field
The present invention relates to a kind of vertically arranged LED light machine module of large chip, belong to technical field of LED illumination.
Background technology
Application number 201310140124.5,201310140138.7,201310140150.8,201310140105.2,
201310140134.9, the Chinese patent application such as 201310140106.7,201310140151.2,201310140136.8 open
Multiple ray machine module technical schemes that can use in LED bulb that is general and exchanging.These technology are to set up with LED bulb
Centered on Lighting Industry framework, make LED bulb (lighting source), light fixture, Lighting control become independent production, application terminal
The basic concept of product is laid a good foundation.But above-mentioned patent not yet solves the problems, such as the built-in driving power supply of ray machine module.
Existing LED drive power mostly is Switching Power Supply, and volume is too big；Also there is the slightly smaller linear power supply of volume, but its drive
Dynamic chip is many to coordinate auxiliary element again with DIP dual-in-line or SMD paster encapsulation pattern, its volume be still not enough to little to can put
Put ray machine module internal.
LED illumination provides LED chip to start to illuminating lamp to need through a series of such as paster, die bond, weldering from chip factory
Connect, encapsulate, color-division, driving design, heat dissipation design, the complexity such as Design of Luminaires and tediously long production design process, due to depositing
In many uncertainties such as chip layout design, heat conductive design and power drives design, this industry centered on LED chip
Framework is difficult to realize light source (bulb) standardization under the pattern of replaceable light source, and the LED ultimately resulting in terminal market is many
Based on the overall structure lamp of non-exchange light source, increased the industry complexity of illuminating product and reduce illuminating product
Industrial concentration.
Creation idea is advanced, be more easy to the built-in driving power supply of standardized LED bulb light machine module and LED illumination core further
Chip architecture scheme is of far-reaching significance for large-scale promotion LED illumination.
Content of the invention
It is an object of the invention to, a kind of large chip vertically arranged LED light machine module is provided.It is a kind of brightness more
Good, easily standardized, the LED light machine module of built-in driving power supply and LED illumination chip structure, it is conducive to LED in structure
The standardization of illumination, large-scale popularization.
Technical scheme：Large chip vertically arranged LED light machine module, is characterized in：Electric including being printed on silver paste
The transparent light machine template on road, silver paste circuit is formed with interface lead, the width of its interface lead and spacing in light machine template
Width W and spacing W with LED illumination large chip and LED drive power large chipJGIdentical；By 1 and above L-shape D
LED illumination large chip is connected in light machine template by the integrated transparent block of the transparent transition circuit of type perpendicular to light machine template；Or for
Large-scale light machine template, by the integrated transparent block of the transparent transition circuit of Type B by LED drive power large chip and 1 and above in L
1 and above LED illumination large chip are connected to ray machine perpendicular to light machine template by the integrated transparent block of the transparent transition circuit of c-type of shape
In template；Again by LED drive power large chip with silver paste circuit with transparent light machine template with silver paste circuit while by
Interface lead butt welding obtains ray machine module.
Aforesaid large chip is arranged vertically in LED light machine module, for medium and small LED light machine module, external power source or
Signal is directly accessed on the LED drive power large chip being welded on light machine template 43 by connector；For large-scale LED
Ray machine module, light machine template is also welded with flexible circuit 44, and external power source or signal connect flexible circuit by connector and connect
Enter on the LED drive power large chip being welded in light machine template 43；Last big along LED drive power large chip, LED illumination
Chip and the integrated transparent block of the transparent transition circuit of Type B (or the integrated transparent block of the transparent transition circuit of c-type, or the transparent transition circuit of D type
Integrated transparent block) all banding transparent adhesive tapes must encapsulate complete LED light machine module.
Aforesaid large chip is arranged vertically in LED light machine module, and the integrated transparent block of the transparent transition circuit of described D type includes L
The transparency carrier of type, transparency carrier is printed with silver paste circuit, and silver paste circuit is the interface lead of L-type, the width of its interface lead
The width W of degree, quantity and spacing and LED illumination large chip and LED drive power large chip, quantity N+1 and spacing WJGIdentical；Institute
State the transparency carrier that the integrated transparent block of the transparent transition circuit of c-type includes L-type, transparency carrier is printed with silver paste circuit, silver paste electricity
Road is 2 spatially L-shaped group interface wires, the width of every 1 group of interface lead, quantity and spacing and LED illumination large chip
With the width W of LED drive power large chip, quantity N+1 and spacing WJGIdentical；Described LED illumination large chip band silver paste circuit
With the L-shaped integrated transparent block of transparent transition circuit with silver paste circuit while by interface lead butt welding；L-type transparent
The one side with silver paste circuit with silver paste circuit another side and light machine template of the integrated transparent block of transition circuit is by interface lead pair
Weldering；The interface lead of the integrated transparent block of the transparent transition circuit of described Type B has the output end of 1 group of incoming end and more than 1 group, and it connects
The width W of width, quantity and spacing and LED drive power large chip of mouth wire, quantity N+1 and spacing WJGIdentical.
Aforesaid large chip is arranged vertically in LED light machine module, and described LED illumination large chip includes a width and is fixed as
First transparency carrier of W, the first transparency carrier is provided with the parallel interface lead of N+1 bar, and the first transparency carrier is provided with N
LED chip constitutes LED chip series connection group, and every LEDs chip is respectively positioned between two adjacent interface lead, two adjacent connecing
The spacing of mouth wire is WJGSubtract interface lead width equal to W again divided by N (WJG=(W- interface lead width)/N), and every LEDs chip
Both positive and negative polarity be respectively connected in two adjacent interface lead；And multiple LED strip joint group simultaneously in parallel is so that transparency carrier
The LED chip array of the N row multirow that upper formation can extend on transparency carrier length direction；N is the integer between 3 to 7；In group
When building LED light machine module, according to power needs, LED illumination large chip is cut out, is cut into the LED illumination of different length
Large chip has different power；Described LED chip carry voltage be about DC3.2V (suitably being adjusted according to actual conditions) or
High voltage more than DC10V.
Aforesaid large chip is arranged vertically in LED light machine module, and described LED chip array and interface lead are in transparency carrier
On forming method be：Do the slim epitaxial wafer of transition epitaxial layer formation using transparent substrate, epitaxial wafer is using ripe chip
Manufacturing technology multi ANN circuit and LED chip, then cleaved formation width is the LED illumination large chip of W, wherein grows
Circuit include interface lead and connect the wire of the connection chip of LED chip and interface lead, substrate is as the first transparent base
Plate；Described chip two pole, due to not needing to weld, can adopt transparency electrode, to increase the light-emitting area of chip；Described core
Piece maturation manufacturing technology be：Carry out covering silicon, gluing, photoetching, etching, plating using the layering of Metalorganic chemical vapor deposition equipment
The techniques such as film, alloy and abrasive disc；Or using conventional art, LED chip array is mounted on and produces the first saturating of silver paste circuit
On bright substrate, and it is connected with the silver paste circuit on the first transparency carrier by face-down bonding or the welding of spun gold formal dress, obtain LED and shine
Bright large chip, the wire that silver paste brush circuit includes interface lead and connects chip.
Aforesaid large chip is arranged vertically in LED light machine module, and described LED drive power large chip includes width and is fixed as
Second transparency carrier of W, transparency carrier is printed with silver paste circuit, and silver paste circuit has interface lead, and interface lead has incoming end
And output end；The width of incoming end and the width W of light machine template wire incoming endGIdentical or have the pad being connected with connector；
The parallel interface lead of N+1 bar, spacing W of adjacent two interface lead are had on the interface lead of output endJGSubtract interface equal to W to lead
Live width is again divided by N (WJG=(W- interface lead width)/N)；Un-encapsulated power drives wafer is first pasted on the second transparency carrier
Level chip and rectifier bridge wafer stage chip, then by un-encapsulated power drives wafer stage chip and rectifier bridge wafer stage chip
It is welded on the second transparency carrier, the second transparency carrier has the width at interface lead end and the width W phase of LED illumination large chip
With highly for H2；On LED drive power large chip, the purposes of interface lead is for connection on described LED illumination large chip
Chip array.
LED driving method on described LED drive power large chip is：Rectifier bridge on rectifier bridge wafer stage chip is by city
Electric AC is converted into Rectified alternating current, and the voltage of Rectified alternating current is more than zero, less than or equal to Rectified alternating current specified maximum functional electricity
Pressure VWR, N section LED load is arranged on Rectified alternating current；N is the integer between 3 to 7；Each section of LED load is cascaded and is formed
LED load series block group, multiple LED load series block groups form described LED chip array, in the voltage liter of Rectified alternating current
Gao Shi, power drives wafer stage chip controls the hop count of LED load series connection to increase step by step, declines in the voltage of Rectified alternating current
When, control the hop count of LED load series connection to reduce step by step, the hop count of LED load series connection is that the actual LED being connected into Rectified alternating current bears
Carry hop count.Civil power AC becomes Rectified alternating current, example after rectifier bridge：After the rectified bridge rectification of AC220V, 50Hz alternating current, electricity
Press the wavy curve for half period (180 degree), cycle pulsating dc voltage when 0 degree is zero, the Rectified alternating current when 90 degree
Pressure reaches maximum VWRFor highest DC311V, during 180 degree, voltage is reduced to zero again, goes round and begins again.
Aforesaid large chip is arranged vertically in LED light machine module, and the hop count of described LED load series connection is controlled by switch
System, the control node of switch is the segmentation boundary of voltage, and the hop count that the number of fragments of described voltage is connected with LED load is relative
Should；The control method of the hop count of described LED load series connection is to connect the negative pole direction of every section of LED load respectively by switch
The negative pole of Rectified alternating current, then switches on-off to each according to the voltage change of Rectified alternating current and is controlled, using general
The mode of a few sections of switch open circuits realizes the change of the hop count of LED load series connection.LED load can be divided into 3～7 sections, and segmentation is few, electricity
Road is simple, but curent change is larger, easily produces low-order harmonic in electrical network；Segmentation is many, then circuit structure is complicated.Typically take 4～6
Duan Weijia.
Aforesaid large chip is arranged vertically in LED light machine module, sets pulsating direct current operating voltage V of Rectified alternating currentW
More than VWmaxPeriod, control all switches off, stop powering to all LED load, realize to the overvoltage of LED and surge
Protection；By adjusting the maximum allowable pulsating dc voltage V of Rectified alternating currentWmaxSize, thus realizing luminance to LED
Degree adjustment.
Aforesaid large chip is arranged vertically in LED light machine module, records effective work in circuit by arranging current sensor
Make electric current IW, work as IWExceed design load KIWRWhen, close all switches to realize current protection, switching on need to be in weight next time
Recover after new on-load voltage, wherein K is regulation coefficient, IWRFor specified effective operating current.
Aforesaid large chip is arranged vertically in LED light machine module, and described switch prolongs in pulsating dc voltage ascent stage
When tmMillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stagemMillisecond action, to obtain relatively stable LED operation electricity
Stream.
Aforesaid large chip is arranged vertically in LED light machine module, and arranging each section of LED load being cascaded is to have
The different maximum LED chip groups carrying magnitude of voltage, can make the LED load series block group working under switch control rule obtain close
The operating current curve of ideal sine wave.
Aforesaid large chip is arranged vertically in LED light machine module, the adjustment of described each section of LED load maximum carrying voltage
Method is：1. with pulsating dc voltage as ordinate, the pulsating direct current cycle be abscissa mapping；2. suppose that a pure resistance is born
Carry, the sinusoidal graphics area that its power is formed in pulsating direct current half-wave is 1, mapping；3. set the carrying of LED load series block group
Power is the 120% of pure resistor load, makees the rectangle echo that an area is 1.2, and the ordinate value of rectangle shade is connects
The total maximum carrying magnitude of voltage of section group；4. in the same manner it is known that LED load carries under voltage condition, can map and draw the figure of LED load
Shape area, the area sum of checking LED load is more than the pulsating direct current sine wave area under the control node of switch paragraph by paragraph；⑤
Choose the carrying magnitude of voltage of each section of LED load in LED load series block group, be added the maximum carrying total more than or equal to series block group
Magnitude of voltage；Wherein, carry the higher LED load of magnitude of voltage near positive terminal, carry the relatively low LED load of magnitude of voltage close
Negative pole end.
Aforesaid large chip is arranged vertically in LED light machine module, and the material of described light machine template is that thin slice is nonmetallic transparent
Material is (as SiO2, Al2O3Deng), it is that slim sheet material is warmed to nearly material softening point, adopts pressing equipment punching press using mould
Shaping.(material is brittle and hardness is higher.So can only cutting mode when being processed into light machine template shape, cost is relatively
High.)
The method setting up LED illumination core component using aforesaid LED light machine module：LED light machine module is arranged soft
Property circuit, or after being also covered with transparent cover plate, load the inner cover with fluorescent material；Inner cover with fluorescent material is by containing fluorescent material
Injection particulate material mix with the transparent injected-moulded particulate material without fluorescent material；Mixed proportion configures as needed, then passes through note
Molded obtain final product；The wherein said injection particulate material containing fluorescent material is will be transparent injected-moulded with 70～80% for 20～30% fluorescent powders
Particulate material mixes, and again makes injection particulate material after hot melt；The fluorescent material that persistence is more than 8ms selected by fluorescent material.
Compared with prior art, the ray machine module of the present invention go for the present inventor's earlier application all kinds of bulbs special
Profit, original ray machine module in replacement bulb.The ray machine module of the present invention in structure can be with built-in power and LED illumination core
Piece, and small volume, the scheme using LED illumination large chip is disposed vertically, and can achieve 306 degree of luminous effects, by ray machine
After template, setting reflecting layer makes the luminous of LED be fully used, and has higher sending out compared with the LED reflective with traditional one side
The efficiency of light；Compared with the ray machine module patent application technology set up with the transparent light machine template before the present inventor, decrease light
Order of reflection, there is higher brightness.The present invention can promote existing LED industry BPR and optimization, the present invention's
LED light machine module can realize light source (bulb) standardization under the pattern of replaceable light source, such that it is able to reduce illuminating product
Industry complexity and reduce the industrial concentration of illuminating product.
Under the driving of LED power large chip, LED illumination large chip is designed to fixing width W, and length is then according to system
The specification of manufacturing apparatus determining, using when being divided into different length.So LED illumination large chip is not required to for single led
Chip, to cut into grade size, requires reducing the mechanical property to substrate during chip manufacturing, makes the high-purity of similar polycrystalline
Aluminum oxide etc. enters the range of choice of substrate, and the manufacturing cost of LED illumination chip is greatly reduced.
Every LEDs chip the two poles of the earth in LED illumination large chip need not be welded, electrode can do less simultaneously and can be using thoroughly
The scheme of prescribed electrode, can effectively increase the light-emitting area of chip and improve luminous efficiency.
From the beginning of chip factory, LED illumination large chip only need to can be connected on ray machine mould directly against welding equipment in conjunction with power supply large chip
On plate or bulb heat conduction support.LED illumination production procedure is short and simple.Meanwhile, large chip is pressed using power segmentation cutting, if
The factor counting, producing easily determination in product whole process is more, is easy to it is controlled to realize standardized work.
Illumination large chip by being split using power can meet majority of illumination application requirement, such non-cutting, number
The limited illumination large chip of amount easily realizes the industrial concentration of scale, and the manufacturing cost of illuminating product will be greatly reduced.
The present invention changes LED existing encapsulation industrial concept, and illumination large chip is using only needing simplified package big after upside-down mounting
Chip perimeter；Using during formal dress can using cover plate encapsulation etc. technique；Get around external patent barrier.
And because existing LED drive power mostly is Switching Power Supply, volume is too big；Also there is the slightly smaller linear power supply of volume,
But its driving chip is many to coordinate auxiliary element again with DIP dual-in-line or SMD paster encapsulation pattern, is then welded on PCB electricity
On the plate of road, its volume be still not enough to little to ray machine module internal can be placed into.This thinking is difficult to make LED drive power miniature
Change, lightweight and transparence, it is impossible to be placed in ray machine module, finally cannot realize civil power in LED bulb that is general and exchanging
It is directly accessed.
LED illumination application such as driving, light modulation, overvoltage can be met using the power supply large chip of the actuation techniques of the present invention
And the various primary demands of surge protection, overload etc., and can volume do less so that driving power supply can be put into
Bulb or even ray machine module internal.This has very important significance to LED illumination low cost, miniaturization.The present invention pushes away
Move developing towards integrated direction of LED chip, so that the appearance of illumination large chip is become a reality.The two be used in conjunction with entering
One step promotes the fast development of LED illumination industry.
In addition, civil power is converted into Rectified alternating current by rectifier bridge by the present invention, the voltage in each cycle is pressed simultaneously
Phase division is multistage, and using the different characteristic of voltage in multistage, using switch to the LED load concatenating into working condition
Hop count is adjusted, so that LED load enters intelligentized operational mode, this operational mode can meet LED chip and power,
And this LED type of drive of the present invention can greatly reduce the complexity of driving power supply, so that LED light machine module
Built-in driving power supply is possibly realized, and this realizes bigger versatility for LED bulb and interchangeability is significant.
Brief description
Fig. 1 Fig. 1 is the circuit diagram in the small-sized light machine template of the embodiment of the present invention；
Fig. 1 .1 is the small-sized ray machine modular structure schematic diagram of the embodiment of the present invention；
Fig. 2 is the circuit diagram in the medium-sized light machine template of the embodiment of the present invention；
Fig. 2 .1 is the medium-sized ray machine modular structure schematic diagram of the embodiment of the present invention；
Fig. 3 is the circuit diagram in the large-scale light machine template of the embodiment of the present invention；
Fig. 4 is the large-scale ray machine modular structure schematic diagram of the embodiment of the present invention；
Fig. 5 is the Type B transition circuit integrated transparent block structural representation of the embodiment of the present invention；
Fig. 6 is the c-type transition circuit integrated transparent block structural representation of the embodiment of the present invention；
Fig. 7 is the integrated transparent block structural representation of D type transition circuit of the embodiment of the present invention；
Fig. 8 is the structural representation of embodiment of the present invention LED illumination large chip；
Fig. 9 is the structural representation of embodiment of the present invention low-power LED driving power supply large chip；
Figure 21 is the structural representation of embodiment of the present invention high-power LED driving power source large chip；
Figure 10 is the structural representation of the ray machine core component of the embodiment of the present invention；
Figure 22 is the bulb structure schematic diagram of the LED illumination core component establishment of the embodiment of the present invention；
Figure 11 is the LED voltage current waveform figure of the embodiment of the present invention；
Figure 12 is that the extra-high pressure of the embodiment of the present invention runs power waveform figure；
The light modulation of Figure 13 embodiment of the present invention runs power waveform figure；
The circuit connection diagram of Figure 14 embodiment of the present invention；
The driving power supply chip internal circuits figure of Figure 15 embodiment of the present invention；
The LED voltage current waveform figure of 3 sections of loads of Figure 16 embodiment of the present invention；
The LED chip array module power of Figure 17 embodiment of the present invention DC52V series connection loads distribution map；
Figure 18 embodiment of the present invention LED chip array carries voltage tentative calculation figure；
Single DC52V chip bearing power tentative calculation figure of Figure 19 embodiment of the present invention；
The LED chip array module power of Figure 20 embodiment of the present invention 2*52V+4*35V series connection loads distribution map.
Being labeled as in accompanying drawing：3- heat conduction support, 7- lens, 8- lens snap ring, 11- electrical connector, 14- snap ring is fixed
Screw, 43- light machine template, 43.1- light machine template fixing hole, 43.2-, 44- flexibility built-up circuit, 44.1- solder joint, 45- is transparent
Sealing, the inner cover with fluorescent material for the 61-, 62- inner ring cover, snap ring in 81-, 103- radiator, 112- cable fixed mount, 410-LED
Driving power supply large chip, 410.1- transparent cover plate, 411- driving power supply wafer stage chip, 412- rectifier bridge wafer stage chip,
413- second transparency carrier, 421- first transparency carrier, 414- silver paste circuit, 414.1- pad, 420-LED illuminates large chip,
The integrated transparent block of 440-B type transition circuit, the integrated transparent block of 450-C type transition circuit.
The present invention is further illustrated with reference to the accompanying drawings and examples, but be not intended as to the present invention limit according to
According to.
Embodiment.Large chip vertically arranged LED light machine module, including the transparent light machine template being printed on silver paste circuit
43, silver paste circuit is formed with interface lead in light machine template 43, the width of its interface lead and spacing and LED illumination large chip
420 and the width W of LED drive power large chip 410 and spacing WJGIdentical；By 1 and the above L-shape transparent mistake of D type
Cross the integrated transparent block of circuit 460 to be connected in light machine template 43 LED illumination large chip 420 perpendicular to light machine template 43；Or it is right
In large-scale light machine template, by the integrated transparent block of the transparent transition circuit of Type B (440) by LED drive power large chip 410 and 1
And the above L-shape integrated transparent block 450 of the transparent transition circuit of c-type by 1 and above LED illumination large chip 420 perpendicular to
Light machine template 43 is connected in light machine template 43；Again by the one side with silver paste circuit for the LED drive power large chip 410 and transparent light
The one side with silver paste circuit for the machine template 43 obtains A product by interface lead butt welding.
For medium and small LED light machine module, as shown in Fig. 1, Fig. 1 .1, Fig. 2 and Fig. 2 .1, external power source or signal are straight
Connected connector 11 to access on the LED drive power large chip 410 being welded on light machine template 43；For large-scale LED
Ray machine module, as shown in Figure 3 and Figure 4, light machine template 43 is also welded with flexible circuit 44, external power source or signal pass through to patch
Part 11 connects flexible circuit 44 and is linked on the LED drive power large chip 410 being welded in light machine template 43；Finally along LED
Driving power supply large chip 410, LED illumination large chip 420 and the integrated transparent block of the transparent transition circuit of Type B 440, the transparent transition of c-type
The integrated transparent block of circuit 450 or 460 weeks banding transparent adhesive tapes 45 of the integrated transparent block of the transparent transition circuit of D type obtain LED light machine module.
The described integrated transparent block 460 of the transparent transition circuit of D type, as shown in fig. 7, comprises the transparency carrier of L-type, transparent base
Silver paste circuit is printed with plate, silver paste circuit is the interface lead of L-type, the width of its interface lead, quantity and spacing and LED shine
The width W of bright large chip 420 and LED drive power large chip 410, quantity N+1 and spacing WJGIdentical；The transparent mistake of described c-type
Cross the integrated transparent block of circuit 450 as shown in fig. 6, including the transparency carrier of L-type, transparency carrier is printed with silver paste circuit, silver paste
Circuit is 2 spatially L-shaped group interface wires, the width of every 1 group of interface lead, quantity and spacing and the big core of LED illumination
The width W of piece 420 and LED drive power large chip 410, quantity N+1 and spacing WJGIdentical；Described LED illumination large chip 420
With silver paste circuit with the L-shaped integrated transparent block of transparent transition circuit with silver paste circuit while by interface lead pair
Weldering；The integrated transparent block of transparent transition circuit of L-type with silver paste circuit another side and light machine template 43 with the one of silver paste circuit
Interface lead butt welding is pressed in face；The integrated transparent block of the transparent transition circuit of described Type B 440 is as shown in figure 5, its interface lead has 1
Organize the output end of incoming end and more than 1 group, the width of its interface lead, quantity and spacing and LED drive power large chip 410
Width W, quantity N+1 and spacing WJGIdentical.Transparency carrier in figure B, C and the integrated transparent block of the transparent transition circuit of D type is also marked
It is designated as 413.
Described LED illumination large chip 420, as shown in figure 8, including the first transparency carrier 421 that a width is fixed as W,
First transparency carrier is provided with the parallel interface lead of N+1 bar, and the first transparency carrier 421 is provided with N LEDs chip 41 and constitutes
LED chip series connection group, every LEDs chip 41 is respectively positioned between two adjacent interface lead, two adjacent interface lead
Spacing is WJGSubtract interface lead width equal to W again divided by N (WJG=(W- interface lead width)/N), and every LEDs chip 41 is positive and negative
Pole is respectively connected in two adjacent interface lead；And multiple LED strip joint group simultaneously in parallel is so that on transparency carrier 421
The LED chip array of the N row multirow that formation can extend on transparency carrier 421 length direction；N is the integer between 3 to 7；?
When setting up LED light machine module, according to power needs, LED illumination large chip 420 is cut out, is cut into the LED of different length
Illumination large chip 420 has different power.
Described LED chip array and interface lead forming method on the transparent substrate is：Done using transparent substrate
Cross the slim epitaxial wafer of epitaxial layer formation, epitaxial wafer adopts ripe chip fabrication techniques multi ANN circuit and LED chip, then
Cleaved formed width be W LED illumination large chip, the circuit wherein growing include interface lead and connect LED chip and
The wire of the connection chip of interface lead, substrate is as the first transparency carrier；Described chip two pole, can due to not needing to weld
Using transparency electrode, to increase the light-emitting area of chip；Described chip maturation manufacturing technology is：Using organometallic chemistry gas
The layering of phase depositing device carries out covering the techniques such as silicon, gluing, photoetching, etching, plated film, alloy and abrasive disc；Or adopt conventional art
LED chip array is mounted on the first transparency carrier 421 producing silver paste circuit 414, and passes through face-down bonding or spun gold
Formal dress welding is connected with the silver paste circuit 414 on the first transparency carrier 421, obtains LED illumination large chip 420, silver paste brush circuit
414 wires including interface lead and connecting chip.
Described LED drive power large chip, as shown in Fig. 9 and Figure 21, is fixed as second transparency carrier of W including width
413, transparency carrier 413 is printed with silver paste circuit, and silver paste circuit 414 has interface lead, and interface lead has incoming end and output
End；The width of incoming end and the width W of light machine template 43 wire incoming endGIdentical or have the pad being connected with connector；Output
There are the parallel interface lead of N+1 bar, spacing W of adjacent two interface lead in the interface lead at endJGSubtract interface lead width equal to W
Again divided by N (WJG=(W- interface lead width)/N)；Un-encapsulated power drives wafer scale is first pasted on the second transparency carrier 413
Chip 411 and rectifier bridge wafer stage chip 412, then will be brilliant to un-encapsulated power drives wafer stage chip 411 and rectifier bridge
Circle level chip 412 is welded on the second transparency carrier 413, and the second transparency carrier 413 has width and the LED illumination at interface lead end
The width W of large chip is identical, highly for H2；On LED drive power large chip the purposes of interface lead be for connection to described
Chip array on LED illumination large chip.
LED driving method on described LED light machine module is：Rectifier bridge on rectifier bridge wafer stage chip 412 is by civil power
AC is converted into Rectified alternating current, and the voltage of Rectified alternating current is more than zero, less than or equal to the specified maximum working voltage of Rectified alternating current
VWR, 3～7 sections of LED load are arranged on Rectified alternating current, each section of LED load is cascaded and forms LED load series block group,
Multiple LED load series block groups form described LED chip array, and when the voltage of Rectified alternating current raises, power drives are brilliant
Circle level chip 411 controls the hop count of LED load series connection to increase step by step, when the voltage of Rectified alternating current declines, controls LED load
The hop count of series connection reduces step by step, and the hop count of LED load series connection is the actual LED load hop count being connected into Rectified alternating current.
The hop count of described LED load series connection is controlled by switch, and the control node of switch is the segmentation boundary of voltage,
The hop count that the number of fragments of described voltage is connected with LED load is corresponding；The control method of the hop count of described LED load series connection
It is the negative pole that switch connects Rectified alternating current to be passed through respectively in the negative pole direction of every section of LED load, then according to Rectified alternating current
Voltage change each switched on-off be controlled, realize LED load series connection using by the modes of a few sections of switch open circuits
Hop count change.
Set pulsating direct current operating voltage V of Rectified alternating currentWMore than VWmaxPeriod, control all switches off, stop
Power to all LED load, realize the overvoltage to LED and surge protection；By adjusting the maximum allowable arteries and veins of Rectified alternating current
Dynamic DC voltage VWmaxSize, thus realizing to the adjustment of the luminosity of LED.
Record effective operating current I in circuit by arranging current sensorW, work as IWExceed design load KIWRWhen, close institute
There is switch to realize current protection, switch on and need to recover after reloading voltage next time, wherein K is regulation coefficient, IWR
For specified effective operating current.
Described switch is in pulsating dc voltage ascent stage time delay tmMillisecond action, in the pulsating dc voltage decline stage
T in advancemMillisecond action, to obtain relatively stable LED operation electric current.
Arranging each section of LED load being cascaded is to have the different maximum LED chip groups carrying magnitude of voltage, can
The LED load series block group working under switch control rule is made to obtain the operating current curve close to ideal sine wave.
The method of adjustment that described each section of LED load be maximum to carry voltage is：1. with pulsating dc voltage as ordinate, arteries and veins
The dynamic direct current cycle maps for abscissa；2. a pure resistor load, the sinogram that its power is formed are supposed in pulsating direct current half-wave
Shape area is 1, mapping；3. set the load power of LED load series block group as the 120% of pure resistor load, making an area is
1.2 rectangle echo, the ordinate value of rectangle shade is the total maximum carrying magnitude of voltage of series block group；4. in the same manner it is known that
LED load carries under voltage condition, can map and draw the graphics area of LED load, verify the area sum of LED load paragraph by paragraph
More than the pulsating direct current sine wave area under the control node of switch；5. choose each section of LED load in LED load series block group
Carry magnitude of voltage, be added the maximum carrying magnitude of voltage total more than or equal to series block group；Wherein, carry magnitude of voltage higher
LED load, near positive terminal, carries the relatively low LED load of magnitude of voltage near negative pole end.
The material of described light machine template 43 is thin slice transparent non-metallic material, such as SiO2, Al2O3Deng it is by slim sheet material
It is warmed to nearly material softening point, adopt pressing equipment stamping forming using mould.Because material is brittle and hardness is higher, therefore
Can only cutting mode when being processed into light machine template shape, relatively costly.
The method setting up LED illumination core component using aforesaid LED light machine module, as shown in Figure 10, in LED light machine mould
Loading the inner cover 61 with fluorescent material after setting flexible circuit 44 in group, then be assembled into other assemblies to become bulb；Band
The inner cover 61 of fluorescent material is to mix the injection particulate material containing fluorescent material with the transparent injected-moulded particulate material without fluorescent material；Mixing ratio
Example configures as needed, is then obtained final product by injection mo(u)lding；The wherein said injection particulate material containing fluorescent material is by 20～30%
Fluorescent powder and 70～80% transparent injected-moulded particulate material mix, and again make injection particulate material after hot melt；Twilight sunset selected by fluorescent material
Time is more than the fluorescent material of 8ms.
Figure 22 is the bulb structure schematic diagram that LED illumination core component of the present invention is set up.
It is hereafter the operation principle of the present invention taking 6 groups of LED load as a example.I.e. n value is 6.
First, alternating current AC becomes Rectified alternating current, example after rectifier bridge：The rectified bridge of AC220V, 50Hz alternating current
After rectification, referring to Figure 11, voltage is the wavy curve of half period (180 degree), and cycle pulsating dc voltage when 0 degree is zero,
When 90 degree, pulsating dc voltage reaches maximum VWRFor highest DC311V, during 180 degree, voltage is reduced to zero again, goes round and begins again.
The job requirement of the present invention, is more than zero and less than or equal to V in pulsating dc voltageWRBetween, 3～7 sections of setting altogether is born
Carry, form series system between each section of load, raise with voltage, load (i.e. LED load) series connection hop count increases step by step, load voltage
Loaded by switch control rule, referring to Figure 11 and Figure 14, voltage switch node is voltage segmentation boundary.
Power supply management operational mode：The present invention not design current control device, the keying of switches at different levels is only dependent upon VW's
Change, referring to Figure 11, Figure 14 and Figure 15.
During 0～90 degree of cycle：
1st section：Work original state, that is, the cycle is initial from 0, circuit breaker in middle K1～K6It is in opening (ON), electric current
Mainly through node J1By switching K1Form path, load is 1V by rated voltageWRThe LED composition of/6 tandem workings；
2nd section：Work as VWMore than or equal to 1VWRWhen/6, switch K1 closes (OFF), and electric current mainly passes through to switch K2 through node J2
Form path, load is 2V by rated voltageWRThe LED composition of/6 tandem workings；
3rd section：Work as VWMore than or equal to 2VWRWhen/6, switch K1 is in OFF, and switch K2 closes (OFF), the main warp knuckle of electric current
Point J3 passes through to switch K3 formation path, and load is 3V by rated voltageWRThe LED composition of/6 tandem workings；
4th section：Work as VWMore than or equal to 3VWRWhen/6, switch K1～K2 is in OFF, and switch K3 closes (OFF), and electric current is main
Pass through to switch K4 formation path through node J4, load is 4V by rated voltageWRThe LED composition of/6 tandem workings；
5th section：Work as VWMore than or equal to 4VWRWhen/6, switch K1～K3 is in OFF, and switch K4 closes (OFF), and electric current is main
Pass through to switch K5 formation path through node J5, load is 5V by rated voltageWRThe LED composition of/6 tandem workings；
6th section：Work as VWMore than or equal to 5VWRWhen/6, switch K1～K4 is in OFF, and switch K5 closes (OFF), electric current warp knuckle
Point J6 passes through to switch K6 formation path, and load is 6V by rated voltageWRThe LED composition of/6 tandem workings；
The method for closing of time delay 0.1ms when switch K1～K6 closes, can be adopted, relatively stable electric current can be obtained.
During cycle 90～180 degree：
6th section：Work original state, voltage is reduced downwards by maximum, and circuit breaker in middle K1～K5 is closed
(OFF), switch K6 is in opening, and electric current passes through to switch K6 formation path through node J6, and load is 6V by rated voltageWR/6
The LED composition of tandem working；
5th section：Work as VWLess than or equal to 5VWRWhen/6, switch K5～K6 opens (ON), and electric current mainly passes through switch through node J5
K5 forms path, and load is 5V by rated voltageWRThe LED composition of/6 tandem workings；
4th section：Work as VWLess than or equal to 4VWRWhen/6, switch K4～K6 opens (ON), and electric current mainly passes through switch through node J4
K4 forms path, and load is 4V by rated voltageWRThe LED composition of/6 tandem workings；
3rd section：Work as VWLess than or equal to 3VWRWhen/6, switch K3～K6 opens (ON), and electric current mainly passes through switch through node J3
K3 forms path, and load is 3V by rated voltageWRThe LED composition of/6 tandem workings；
2nd section：Work as VWLess than or equal to 2VWRWhen/6, switch K2～K6 opens (ON), and electric current mainly passes through switch through node J2
K2 forms path, and load is 2V by rated voltageWRThe LED composition of/6 tandem workings；
1st section：Work as VWLess than or equal to 1VWRWhen/6, switch K1～K6 opens (ON), and electric current mainly passes through switch through node J1
K1 forms path, and load is 1V by rated voltageWRThe LED composition of/6 tandem workings.
When switch K1～K6 opens, relatively stable electric current can be obtained using the open method of 0.1ms in advance.
Light modulation operational mode：During outside setting one given voltage VT=0, VWmaxCorresponding CVWR, external voltage gives VT=5V
When, VWmaxCorresponding 0V, arranges 0≤VWmax≤CVWR, C regulation coefficient, is the multiple of rated voltage, such as C=1.12.VWMore than VWmax
Period, corresponding each section of switch will cut out (OFF), stop powering to the load.It act as a kind of dimming arrangement.Referring to figure
13rd, Figure 14 and Figure 15, adjusts VWmaxLess than VWR, in figure yl moiety will increase, and the power being input to load will reduce, thus reaching
Purpose to light modulation.Example：When LED in AC220V civil power normal work is, during the voltage of adjustment alternating current voltage to AC180V, figure
In dash area be VWFormation power projection figure part higher than 254V, from about 55.5 degree to 124.5 degree of cycle, due to
In this time, corresponding switch Kx is in closing (OFF), and the power consumption of dash area (is equivalent to pulsating direct current half under normal civil power
The 57.0% of the loading power of ripple) will be disallowable, this part power consumption is not loaded in load, makes the luminance-reduction of load.When
VWmaxDuring equal to 0, all switches will cut out (OFF), and load supplying amount is zero.Stepless dimming can be accomplished, without there is energy
Amount consumes.
Voltage protection operational mode：Setting VWmax=CVWR.VWMore than VWmaxPeriod, corresponding each section of switch will cut out
(OFF), stop powering to the load.Referring to Figure 12, Figure 14 and Figure 15, example：When civil power reaches the high voltage of 270V, the moon of in figure
Shadow part is VWFormation power projection figure part higher than 348V, from about 66 degree to 114 degree of cycle, due in this time
K1～K6 switch is in cut out (OFF), and the power consumption of dash area (is equivalent to the loading power of pulsating direct current half-wave under normal civil power
50.2%) will be disallowable, this part power consumption is not loaded in load, so that load will not be burnt because of overvoltage.
Overcurrent protection operational mode：The present invention has overcurrent protection, and referring to Figure 15, current sensor records in circuit effectively
Operating current IWExceed design load KIWR, K is regulation coefficient, example：Set IWR=275mA, K=1.2, logic switch controller will
Close all switches K1～K6 (OFF), open switch (ON) K1～K6 and need to recover after reloading power supply pressure next time.
According to principle same as described above, mode of loading can be divided into 3～7 sections, and segmentation is few, and circuit is simple, but curent change
Larger, easily produce low-order harmonic in electrical network, referring to Figure 16；Segmentation is many, then circuit structure is complicated.4～6 sections are typically taken to be preferred.
Note：VWPulsating direct current operating voltage (1.4142* alternating voltage)；VWRThe specified maximum working voltage of pulsating direct current
(1.4142* alternating voltage)；VWmaxMaximum allowable pulsating dc voltage (1.4142* alternating voltage)；IWEffectively work electricity
Stream.IWRSpecified effective operating current.
If civil power is AC220, the voltage after rectification is DC311V, so that every group of LED load is as single chip as a example, then every
Chip bears DC52V；As AC110, then chip bears DC26V.If the loading power area of pulsating direct current half-wave is 1, referring to figure
17, each LED load of in figure (LED module 1 to 6) is loaded that power difference ratio is larger, and LED module 1 reaches pulsating direct current half-wave
Loading power area 20.68% (for the 84.4% of chip nominal output)；And LED module 6 only 5.11% is (for chip volume
Make the 19.2% of power), the about a quarter power of module 1, through actual measurement checking, the intrinsic brilliance of module 6 is very low；Entirely
The power being averagely loaded of chipset is the 52.4% of chip nominal output, and the utilization rate of chip is relatively low；And the volume of chipset
Make the 159% of the loading power area that power (dotted line frame area) is pulsating direct current half-wave.Because chip redundancy amount is excessive, not only
Chip wastes, and it is excessive and waste to also result in driving power supply, increased the difficulty in arrangement simultaneously.Therefore, under Constant Direct Current state
There are some problems under pulsating direct current state, how in the premise ensureing chip secure work in the method selecting chip voltage
Under, the utilization rate improving chip becomes a problem to be solved.
The nominal output setting the LED chip array of 6 series connection is turned down by 1.59 times that pulsating direct current half-wave loads power
(occur in view of small grids civil power and be not less than 1.2 times of fluctuations) to 1.2 times, referring to Figure 18, if LED chip array chip holds
Carry 1.2 times that power (in figure hatched area) loads power (pulsating direct current half-wave part area) for pulsating direct current half-wave
When, can extrapolate, by Figure 18 mapping, the carrying voltage that civil power is chip array during AC220V is DC236V；
Referring to Figure 19, to module 6, different magnitudes of voltage are respectively provided with to LED module 1, different bearer magnitude of voltage can be obtained
Under chip load power area (in figure dash area)；
Using 2*52V+4*35V high voltage chip, (model VES-AADBHV45 of module 1 and module 2, module 3 arrive mould
Group 6 is ES-AADBHF40) composition serial array, then the carrying Voltage Cortrol of chip array is DC244V；Make Figure 20, acquisition
Chip array is loaded 96.67% that power area is pulsating direct current half-wave power area, and the power that chip array is loaded connects
Nearly 1 is perfect condition；The power that now LED chip array is loaded is chip array nominal output 77.6%；Experimental verification with
Estimated value is close.
The module of each voltage section loads power checking：If the loading power area of pulsating direct current half-wave is 1, voltage is vertical seat
Timestamp, calculating DC52V chip nominal output easily by Figure 19 is 26.52%, and in the same manner, the nominal output of DC35V chip is
17.89%；Figure 20 is then civil power when being AC220V, the power situation being loaded of each module of LED chip array；Table 1 is chip
When the power that array is loaded is pulsating direct current half-wave power area 1, line voltage is respectively AC220V, AV246V, AC270V
Each module is loaded the situation of power, as can be seen that only module 3 slightly transships in DC311V and DC348V in table, but due to
Module 1 and module 2 have margin of power, and experiment proves that module 3 can pass through.
In other line voltage grades, optimal way is carried out with reference to above-mentioned.
Ideally the checking computations of chip bearing power are as shown in the table：
Claims (15)
1. large chip vertically arranged LED light machine module it is characterised in that：Including the transparent light machine template being printed on silver paste circuit
(43), silver paste circuit is formed with interface lead in light machine template (43), and the width of its interface lead and spacing are big with LED illumination
The width W of chip (420) and LED drive power large chip (410) and spacing WJGIdentical；Wherein, for medium and small LED light
Machine module, by the L-shape integrated transparent block of the transparent transition circuit of D type (460) of more than 1 by LED illumination large chip (420)
It is connected in light machine template (43) perpendicular to light machine template (43), then by LED drive power large chip (410) with silver paste circuit
With transparent light machine template (43) with silver paste circuit while obtain ray machine module by interface lead butt welding；And for large-scale ray machine
Template, by the integrated transparent block of the transparent transition circuit of Type B (440) by LED drive power large chip (410) with more than 1 in L
After the integrated transparent block of the transparent transition circuit of c-type (450) of shape connects, then by more than 1 LED illumination large chip (420) perpendicular to
Light machine template (43) is connected in light machine template (43), then by LED drive power large chip (410) one side with silver paste circuit with
The transparent one side with silver paste circuit for the light machine template (43) obtains ray machine module by interface lead butt welding.
2. the vertically arranged LED light machine module of large chip according to claim 1 it is characterised in that：For medium and small
LED light machine module, external power source or signal directly pass through connector (11) and drive electricity from the LED being welded on light machine template (43)
Source large chip (410) is upper to be accessed, finally transparent along LED drive power large chip (410), LED illumination large chip (420) and D type
The integrated transparent block of transition circuit (460) week banding transparent adhesive tape (45) must encapsulate complete LED light machine module；For large-scale LED
Ray machine module, light machine template (43) is also welded with flexible circuit (44), and external power source or signal pass through connector (11) and connect
Flexible circuit (44) is linked on the LED drive power large chip (410) being welded in light machine template (43), finally drives along LED
Dynamic power supply large chip (410), LED illumination large chip (420), the integrated transparent block of the transparent transition circuit of Type B (440) and c-type are transparent
The integrated transparent block of transition circuit (450) week banding transparent adhesive tape (45) must encapsulate complete LED light machine module.
3. the vertically arranged LED light machine module of large chip according to claim 1 it is characterised in that：The transparent mistake of described D type
Cross the transparency carrier that the integrated transparent block of circuit (460) includes L-type, transparency carrier is printed with silver paste circuit, silver paste circuit is L-type
Interface lead, the width of its interface lead, quantity and spacing and LED illumination large chip (420) and LED drive power large chip
(410) width W, quantity N+1 and spacing WJGIdentical；The integrated transparent block (450) of the transparent transition circuit of described c-type includes L-type
Transparency carrier, transparency carrier is printed with silver paste circuit, and silver paste circuit is 2 spatially L-shaped group interface wires, every 1 group
The width W of the width of interface lead, quantity and spacing and LED illumination large chip (420) and LED drive power large chip (410),
Quantity N+1 and spacing WJGIdentical；Described LED illumination large chip (420) one side with silver paste circuit transparent transition circuit with D type
Integrated transparent block (460) or the transparent transition circuit of c-type integrated transparent block (450) one side with silver paste circuit are by interface lead pair
Weldering；The band silver paste circuit of the integrated transparent block of the transparent transition circuit of D type (460) or the integrated transparent block of the transparent transition circuit of c-type (450)
The one side with silver paste circuit of another side and light machine template (43) is by interface lead butt welding；The transparent transition circuit of described Type B is integrated
The interface lead of transparent block (440) has the output end of 1 group of incoming end and more than 1 group, the width of its interface lead, quantity and spacing
With the width W of LED drive power large chip (410), quantity N+1 and spacing WJGIdentical；N is the integer between 3 to 7.
4. the vertically arranged LED light machine module of large chip according to claim 1 it is characterised in that：Described LED illumination is big
Chip (420) includes the transparency carrier (421) that a width is fixed as W, and transparency carrier (421) is provided with parallel the connecing of N+1 bar
Mouth wire, transparency carrier (421) is provided with N LEDs chip (41) and constitutes LED chip series connection group, every LEDs chip (41) all positions
Between two adjacent interface lead, the spacing of two adjacent interface lead is WJGEqual to W subtract interface lead width again divided by
N, and the both positive and negative polarity of every LEDs chip (41) is respectively connected in two adjacent interface lead；And multiple LED simultaneously in parallel
Series connection group is so that the LED core of the N row multirow that formation can extend on transparency carrier (421) length direction gone up by transparency carrier (421)
Chip arrays；N is the integer between 3 to 7；When setting up LED light machine module, according to power needs, to LED illumination large chip
(420) it is cut out, the LED illumination large chip (420) being cut into different length has different power；Described LED chip
Carrying voltage is DC3.2V or the high voltage more than DC10V.
5. the vertically arranged LED light machine module of large chip according to claim 4 it is characterised in that：Described LED chip battle array
Row and interface lead forming method on the transparent substrate are：Do the slim extension of transition epitaxial layer formation using transparent substrate
Piece, using ripe chip fabrication techniques multi ANN circuit and LED chip, then cleaved formation width is the LED of W to epitaxial wafer
Illumination large chip, the wire that the circuit wherein growing includes interface lead and connects LED chip and interface lead, transparency carrier
As substrate；Described chip two pole due to do not need weld, using transparency electrode, to increase the light-emitting area of chip；Described
Chip maturation manufacturing technology be：Using the layering of Metalorganic chemical vapor deposition equipment carry out covering silicon, gluing, photoetching, etching,
Plated film, alloy and abrasive disc technique；Or using conventional art, LED chip array is mounted on and produces silver paste circuit (414)
On transparency carrier (421), and by the silver paste circuit (414) on face-down bonding or the welding of spun gold formal dress and transparency carrier (421)
Connection, acquisition LED illumination large chip, silver paste brush circuit (414) inclusion interface lead and connection LED chip are led with interface lead
Line.
6. the vertically arranged LED light machine module of large chip according to claim 1 it is characterised in that：Described LED drives electricity
Source large chip includes the second transparency carrier (413) that width is fixed as W, and the second transparency carrier (413) is printed with silver paste circuit, silver
There is interface lead, interface lead has incoming end and output end on slurry circuit (414)；The width of incoming end is led with light machine template (43)
The width W of line incoming endGIdentical or have the pad being connected with connector；Parallel the connecing of N+1 bar is had on the interface lead of output end
Mouth wire, spacing W of adjacent two interface leadJGSubtract interface lead width equal to W again divided by N；Second transparency carrier (413) is upper first
Paste un-encapsulated power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412), then will be un-encapsulated
Power drives wafer stage chip (411) and rectifier bridge wafer stage chip (412) are welded on the second transparency carrier (413), and second
Transparency carrier (413) has the width at interface lead end identical with the width W of LED illumination large chip, highly for H2；LED drives electricity
On the large chip of source, the purposes of interface lead is for connection to the chip array on described LED illumination large chip；N be 3 to 7 it
Between integer.
7. the vertically arranged LED light machine module of large chip according to claim 6 is it is characterised in that described LED drives electricity
LED driving method on the large chip of source is：It is straight that civil power AC is converted into pulsation by the rectifier bridge on rectifier bridge wafer stage chip (412)
Stream electricity, the voltage of Rectified alternating current is more than zero, less than or equal to Rectified alternating current specified maximum working voltage VWR, in pulsating direct current
N section LED load is arranged on electricity；N is the integer between 3 to 7；Each section of LED load is cascaded and forms LED load series block
Group, multiple LED load series block groups form LED chip array, when the voltage of Rectified alternating current raises, power drives wafer scale
Chip (411) controls the hop count of LED load series connection to increase step by step, when the voltage of Rectified alternating current declines, controls LED load string
The hop count of connection reduces step by step, and the hop count of LED load series connection is the actual LED load hop count being connected into Rectified alternating current.
8. the vertically arranged LED light machine module of large chip according to claim 7 it is characterised in that：Described LED load string
The hop count of connection is controlled by switch, and the control node of switch is the segmentation boundary of voltage, the number of fragments of described voltage and
The hop count of LED load series connection is corresponding；The control method of the hop count of described LED load series connection is, by the negative pole of every section of LED load
The negative pole that switch connects Rectified alternating current is passed through respectively in direction, then according to the voltage change of Rectified alternating current, each is switched
Break-make is controlled, using the change of the hop count that the mode of a few sections of switch open circuits is realized LED load series connection.
9. the vertically arranged LED light machine module of large chip according to claim 8 it is characterised in that：Set pulsating direct current
Pulsating direct current operating voltage V of electricityWMore than VWmaxPeriod, control all switches off, stop powering to all LED load, real
The now overvoltage to LED and surge protection；By adjusting the maximum allowable pulsating dc voltage V of Rectified alternating currentWmaxSize,
Thus realizing the luminosity adjustment to LED.
10. the vertically arranged LED light machine module of large chip according to claim 8 it is characterised in that：By arranging electric current
Sensor records effective operating current I in circuitW, work as IWExceed design load KIWRWhen, close all switches to realize electric current guarantor
Shield, switches on and need to recover after reloading voltage next time, and wherein K is regulation coefficient, IWRFor specified effective operating current.
The vertically arranged LED light machine module of 11. large chips according to claim 8 it is characterised in that：Described switch exists
Pulsating dc voltage ascent stage time delay tmMillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stagemMillisecond action, to obtain
Relatively stable LED operation electric current.
The vertically arranged LED light machine module of 12. large chips according to claim 7 it is characterised in that：Setting is connected on one
The each section of LED load rising is to have the different maximum LED chip groups carrying magnitudes of voltage, can make to work under switch control rule
LED load series block group obtains the operating current curve close to ideal sine wave.
The vertically arranged LED light machine module of 13. large chips according to claim 12 is it is characterised in that described each section
The method of adjustment that LED load is maximum to carry voltage is：1. with pulsating dc voltage as ordinate, the pulsating direct current cycle is as abscissa
Mapping；2. suppose a pure resistor load, the sinusoidal graphics area that its power is formed in pulsating direct current half-wave is 1, mapping；3. set
The load power determining LED load series block group is the 120% of pure resistor load, makees the rectangle echo that an area is 1.2, rectangle
The ordinate value of shade is the total maximum carrying magnitude of voltage of series block group；4. in the same manner it is known that LED load carries voltage condition
Under, can map and draw the graphics area of LED load, the area sum of checking LED load is more than under the control node of switch paragraph by paragraph
Pulsating direct current sine wave area；5. choose the carrying magnitude of voltage of each section of LED load in LED load series block group, addition is more than
The maximum carrying magnitude of voltage total equal to series block group；Wherein, carry the higher LED load of magnitude of voltage near positive terminal, hold
Carry the relatively low LED load of magnitude of voltage near negative pole end.
The vertically arranged LED light machine module of 14. large chips according to claim 1 it is characterised in that：Described light machine template
(43) material is thin slice transparent non-metallic material, and it is that slim sheet material is warmed to nearly material softening point, is adopted using mould
Pressing equipment is stamping forming.
15. usage rights require the LED light machine module described in 1 to 14 any claim to set up the side of LED illumination core component
Method：On LED light machine module, setting flexible circuit (44) loads the inner cover with fluorescent material (61) afterwards；Inner cover with fluorescent material
(61) it is that the injection particulate material containing fluorescent material is mixed with the transparent injected-moulded particulate material without fluorescent material；Mixed proportion is as needed
Configuration, is then obtained final product by injection mo(u)lding；The wherein said injection particulate material containing fluorescent material be by 20～30% fluorescent powders with
70～80% transparent injected-moulded particulate material mix, and again make injection particulate material after hot melt；Fluorescent material selects persistence to be more than 8ms
Fluorescent material.
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| CN102334202A (en) * | 2009-02-27 | 2012-01-25 | 东芝照明技术株式会社 | Light-emitting module and illumination apparatus |
| CN201673928U (en) * | 2010-05-07 | 2010-12-15 | 深圳市晶鼎源光电科技有限公司 | High power LED |
| CN203810157U (en) * | 2014-05-20 | 2014-09-03 | 贵州光浦森光电有限公司 | LED-light machine module with perpendicularly arranged large chips |
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