CN204268108U - The LED light machine module of nonisulated heat-conducting substrate formula - Google Patents
The LED light machine module of nonisulated heat-conducting substrate formula Download PDFInfo
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- CN204268108U CN204268108U CN201420259014.0U CN201420259014U CN204268108U CN 204268108 U CN204268108 U CN 204268108U CN 201420259014 U CN201420259014 U CN 201420259014U CN 204268108 U CN204268108 U CN 204268108U
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Abstract
The utility model discloses a kind of LED light machine module of nonisulated heat-conducting substrate formula, comprise the light machine template (43) that nonisulated heat-conducting substrate is made, light machine template (43) is fitted with the integrated transparent block of the transparent transition circuit of E type (470), light machine template (43) is also fitted with LED illumination large chip (420); The interface lead end of LED illumination large chip (420) aligns with the integrated transparent block of transparent transition circuit (470) output interface lead end; The one side of described LED illumination large chip (420) microarray strip is also provided with the integrated transparent block of the transparent transition circuit of F type (480); The one side that the one end in the described integrated transparent block of the transparent transition circuit of F type (480) band silver slurry circuit (414) face and LED illumination large chip (420) are with silver to starch circuit (414) carries out butt welding by interface lead, and the other end is with silver to starch the one side of circuit (414) by interface lead butt welding again with the integrated transparent block of the transparent transition circuit of E type (470).
Description
Technical field
The utility model relates to a kind of LED light machine module of nonisulated heat-conducting substrate formula, belongs to technical field of LED illumination.
Background technology
The Chinese patent application such as application number 201310140124.5,201310140138.7,201310140150.8,201310140105.2,201310140134.9,201310140106.7,201310140151.2,201310140136.8 disclose multiple ray machine module technical scheme that can use in LED bulb that is general and that exchange.These technology are set up Lighting Industry framework centered by LED bulb, make LED bulb (lighting source), light fixture, Lighting control become independent production, the basic concept of end product of application lays a good foundation.But above-mentioned patent not yet solves the problem of the built-in driving power of ray machine module.
Existing LED drive power mostly is Switching Power Supply, and volume is too large; Also have the linear power supply that volume is slightly little, but its driving chip coordinates auxiliary element again mainly with DIP dual-in-line or SMD paster encapsulation pattern, its volume is still not enough to little of being placed into ray machine module internal.
LED illumination needs through a series of such as paster to illuminating lamp from chip factory provides LED chip, die bond, welding, encapsulation, color-division, driving design, heat dissipation design, the Production design process that Design of Luminaires etc. are complicated and tediously long, owing to there is chip layout design, many uncertainties such as heat conductive design and power drives design, this industry structure centered by LED chip is difficult under the pattern of replaceable light source, realize light source (bulb) standardization, the LED in terminal market is finally caused to be main body mainly with the overall structure lamp of non-exchange light source, add the industry complexity of illuminating product and reduce the industrial concentration of illuminating product.
Further creation idea advanced person, the built-in driving power of easier standardized LED bulb light machine module and LED illumination chip structure scheme are of far-reaching significance for large-scale promotion LED illumination.
Utility model content
The purpose of this utility model is, provides a kind of LED light machine module of nonisulated heat-conducting substrate formula.The utility model be structurally conducive to LED illumination standardization, promote on a large scale.
The technical solution of the utility model: the LED light machine module of nonisulated heat-conducting substrate formula, be characterized in: comprise the light machine template that nonisulated heat-conducting substrate is made, light machine template is fitted with the integrated transparent block of the transparent transition circuit of E type, the one side of the transparent transition circuit of E type integrated transparent block band silver slurry circuit is back to light machine template; The one side of the transparent transition circuit of E type integrated transparent block band silver slurry circuit is fitted with the one side of LED drive power large chip band interface lead circuit and is welded; Light machine template is also fitted with LED illumination large chip, and LED illumination large chip fits tightly in light machine template without the one side of silver slurry circuit; The interface lead end of LED illumination large chip aligns with transparent transition circuit integrated transparent block output interface lead end; The one side of described LED illumination large chip microarray strip is also provided with the integrated transparent block of the transparent transition circuit of F type; The one side that one end of the described transparent transition circuit of F type integrated transparent block band silver slurry circuit face and LED illumination large chip band silver starch circuit carries out butt welding by interface lead, and the other end one side that integrated transparent block band silver starches circuit with the transparent transition circuit of E type again presses interface lead butt welding.
In the LED light machine module of above-mentioned nonisulated heat-conducting substrate formula, described light machine template and LED illumination large chip binding face are minute surface; For medium and small light machine template, external power source or signal are directly accessed fitting on the LED drive power large chip in light machine template by connector welding; For large-scale light machine template, external power source or signal are linked in the integrated transparent block of the transparent transition circuit of E type by connector connection flexible circuit and import LED drive power large chip again; On described LED drive power large chip or be also provided with transparent cover plate; Described ray machine module is provided with transparent adhesive tape along LED drive power large chip, LED illumination large chip, the integrated transparent block of the transparent transition circuit of E type and the integrated transparent block periphery of the transparent transition circuit of F type.
In the LED light machine module of aforesaid nonisulated heat-conducting substrate formula, the described integrated transparent block of the transparent transition circuit of E type comprises the 3rd transparency carrier, 3rd transparency carrier is printed with silver slurry circuit, silver slurry circuit forms interface lead, and interface lead has incoming end and output; The width of incoming end interface lead is identical with the width W G1 of flexible circuit incoming end or have the pad be connected with electric connector, width W, the quantity N+1 of the width of the interface lead of output, quantity and spacing and LED illumination large chip are identical with spacing WJG, interface lead or be also connected with the input of LED drive power large chip, its width is WG; The described integrated transparent block of the transparent transition circuit of F type comprises the 4th transparency carrier, 4th transparency carrier is printed with silver slurry circuit, silver slurry circuit is interface lead, and width W, the quantity N+1 of the width of interface lead, quantity and spacing and LED illumination large chip are identical with spacing WJG; N is the integer between 3 to 7.
In the LED light machine module of aforesaid nonisulated heat-conducting substrate formula, described LED illumination large chip comprises the first transparency carrier that a width is fixed as W, first transparency carrier is provided with the parallel interface lead of N+1 bar, first transparency carrier is provided with N LEDs chip and forms LED chip series connection group, every LEDs chip is all between two adjacent interface lead, article two, the spacing of adjacent interface lead is that WJG equals W to subtract interface lead wide again divided by N, and the both positive and negative polarity of every LEDs chip is connected in two adjacent interface lead respectively; And simultaneously multiple LED strip joint group in parallel, make LED chip array transparency carrier being formed the N row multirow that can extend on transparency carrier length direction; N is the integer between 3 to 7.
In the LED light machine module of aforesaid nonisulated heat-conducting substrate formula, described LED drive power large chip comprises the second transparency carrier that width is fixed as W, and transparency carrier is printed with silver slurry circuit, and silver slurry circuit has interface lead, and interface lead has incoming end and output; The width of incoming end is identical with the width W G of the interface lead incoming end in light machine template or have the pad be connected with connector; The interface lead of output has the interface lead that N+1 bar is parallel, the spacing WJG of adjacent two interface lead equals W, and to subtract interface lead wide again divided by N; Second transparency carrier is welded with power drives wafer stage chip and the rectifier bridge wafer stage chip of un-encapsulated.
Compared with prior art, the ray machine module of employing LED drive power large chip of the present utility model and LED illumination large chip structure goes for all kinds of bulb patents of inventor's earlier application of the present utility model, original ray machine module in replacement bulb, wherein light machine template can also adopt the superior metal of heat conductivility to make, and has higher heat dispersion.The heat conduction support simultaneously adopting ray machine module of the present utility model LED drive power large chip and LED illumination large chip directly can also be mounted on bulb have very high heat dispersion and cost performance.Adopt ray machine module of the present utility model structurally can built-in driving power and LED illumination chip, and volume be little, is easy to realize standardization.The utility model can change existing industry structure centered by LED chip, LED light machine module of the present utility model can realize light source (bulb) standardization under the pattern of replaceable light source, thus can reduce the industry complexity of illuminating product and reduce the industrial concentration of illuminating product.
Under the driving of LED drive power large chip, LED illumination large chip is designed to the width W of fixing, and length is then determined according to the specification of manufacturing equipment, is divided into different length during use.Such LED illumination large chip need not cut into grade size for single led chip, mechanical property requirement to substrate will be reduced during chip manufacturing, make the high purity aluminium oxide etc. of similar polycrystalline enter the range of choice of substrate, reduce the manufacturing cost of LED illumination chip significantly.
Every LEDs chip the two poles of the earth in LED illumination large chip without the need to welding, electrode can do less while and the scheme of transparency electrode can be adopted, effectively can increase the light-emitting area of chip and improve luminous efficiency.
From chip factory, LED illumination large chip only directly need can mount in conjunction with power supply large chip and be welded in light machine template or on bulb heat conduction support.LED illumination production procedure is short and simple.Meanwhile, LED illumination large chip, by using power segmentation cutting, designs, to produce the factor easily determined in the whole process of product more, be convenient to realize standardized work to its control.
Can meet majority of illumination application requirement by the illumination large chip using power to split, such non-cutting, a limited number of illumination large chip easily realizes the industrial concentration of scale, will significantly reduce the manufacturing cost of illuminating product.
The utility model changes the existing encapsulation industrial concept of LED, only needs simplified package large chip periphery after the attachment of illumination large chip; Get around external patent barrier.
Accompanying drawing explanation
The LED light machine module schematic diagram of the nonisulated heat-conducting substrate formula of Fig. 1;
Fig. 2 is the large-scale ray machine module finished product structure schematic diagram of the utility model embodiment;
Fig. 3 is the large-scale ray machine modular structure decomposing schematic representation of the utility model embodiment;
Fig. 4 is the bulb structure schematic diagram that the utility model embodiment is substrate with heat conduction support;
Fig. 5 is the small-sized ray machine module finished product structure schematic diagram of the utility model embodiment;
Fig. 6 is the medium-sized ray machine module finished product structure schematic diagram of the utility model embodiment;
Fig. 7 is the integrated transparent block structural representation of E type transition circuit of the utility model embodiment;
Fig. 8 is the integrated transparent block structural representation of F type transition circuit of the utility model embodiment;
Fig. 9 is the structural representation of the utility model embodiment LED illumination large chip;
Figure 10 is the structural representation of the utility model embodiment low-power LED driving power large chip;
Figure 11 is the structural representation of the utility model embodiment high-power LED driving power source large chip;
Figure 12 is the structural representation of the ray machine core component of the utility model embodiment;
Figure 13 is the LED electrical current voltage oscillogram of the utility model embodiment;
Figure 14 is the extra-high pressure operate power oscillogram of the utility model embodiment;
The light modulation operate power oscillogram of Figure 15 the utility model embodiment;
The circuit connection diagram of Figure 16 the utility model embodiment;
The driving power chip internal circuits figure of Figure 17 the utility model embodiment;
The LED electrical current voltage oscillogram of Figure 18 the utility model embodiment 3 sections of loads;
The LED chip array module power of Figure 19: the utility model embodiment DC52V series connection loads distribution map;
Figure 20: the utility model embodiment LED chip array carrying voltage tentative calculation figure;
Figure 21: the utility model embodiment single DC52V chip bearing power tentative calculation figure;
The LED chip array module power of Figure 22: the utility model embodiment 2*52V+4*35V series connection loads distribution map.
Being labeled as in accompanying drawing: 3-heat conduction support, 7-lens, 8-lens snap ring, 10-electrical connector female, 11-electric connector male, snap ring hold-down screw in 12-, 14-snap ring hold-down screw, 43-light machine template, 43.1-light machine template fixing hole, the flexible built-up circuit of 44-, 44.1-solder joint, the transparent sealing of 45-, 61-is with the inner cover of fluorescent material, 62-inner ring cover, snap ring in 81-, 103-radiator, 112-cable fixed mount, 410-LED driving power large chip, 410.1-transparent cover plate, 414-silver slurry circuit, 414.1-pad, 420-LED throws light on large chip, the integrated transparent block of 470-E type transition circuit, 470.1-the 3rd transparency carrier, the integrated transparent block of 480-F type transition circuit, 480.1-the 4th transparency carrier.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is further described, but not as the foundation limited the utility model.
Embodiment.The LED light machine module of nonisulated heat-conducting substrate formula, comprises nonisulated heat-conducting substrate, and the integrated transparent block of the transparent transition circuit of E type 470 fits tightly nonisulated heat-conducting substrate layout back to the one side of silver slurry circuit; The one side of LED drive power large chip 410 with interface lead circuit is fitted in the one side of the integrated transparent block 470 of the transparent transition circuit of E type with silver slurry circuit and carries out butt welding; LED illumination large chip 420 fits tightly nonisulated heat-conducting substrate layout back to the one side of silver slurry circuit, and its interface lead end aligns with the transparent transition circuit of E type integrated transparent block 470 output interface lead end; The one side of described LED illumination large chip 420 microarray strip is also provided with the integrated transparent block 480 of the transparent transition circuit of F type, as shown in figures 1 and 3; The one side that one end and the LED illumination large chip 420 of the described integrated transparent block 480 of the transparent transition circuit of F type with silver slurry circuit face starch circuit with silver carries out butt welding by interface lead, and the other end carries out butt welding with silver-colored one side of starching circuit by interface lead with the integrated transparent block 470 of the transparent transition circuit of E type again and obtains A product.
Nonisulated heat-conducting substrate is that metal or nonmetallic heat conductive material make, and is minute surface with LED illumination large chip 420 binding face; Described nonisulated heat-conducting substrate can adopt the pattern of light machine template 43 for adopting medium and small LED light machine template 43, external power source or signal are directly welded on access on the LED drive power large chip 410 that fits in light machine template 43 by connector 11, as shown in Figure 5 and Figure 6; For adopting large-scale LED light machine module, external power source or signal connect flexible circuit 44 by connector 11 and are linked in the integrated transparent block 470 of transparent transition circuit and import LED drive power large chip 410 again, as shown in Figure 2; Described LED drive power large chip 410 maybe can arrange transparent cover plate 410.1; Described A product complete the nonisulated heat-conducting substrate of large chip along LED drive power large chip 410, LED illumination large chip 420, the integrated transparent block of the transparent transition circuit of E type 470 and the integrated transparent block of the transparent transition circuit of F type 480 weeks banding transparent adhesive tapes 45 and arrange.
The described integrated transparent block 470 of the transparent transition circuit of E type comprises and the 3rd transparency carrier the 470.1, three transparency carrier 470.1 is printed with silver slurry circuit, and silver slurry circuit is interface lead, and interface lead has incoming end and output.The width of incoming end interface lead and the width W of flexible circuit incoming end
g1identical or have the pad 414.1 be connected with electric connector 11, width W, the quantity N+1 and spacing W of the width of the interface lead of output, quantity and spacing and LED illumination large chip 420
jGidentical, interface lead or be also connected with the input of LED drive power large chip 410, its width is W
g, as shown in Figure 7; The described integrated transparent block 480 of the transparent transition circuit of F type comprises the 4th transparency carrier 480.1, on 4th transparency carrier, 480.1 are printed with silver slurry circuit, silver slurry circuit is interface lead, width W, the quantity N+1 and spacing W of the width of interface lead, quantity and spacing and LED illumination large chip 420
jGidentical, as shown in Figure 8.Adopt the integrated transparent block of transparent transition circuit to solve circuit connectivity problem that external power source or signal access LED drive power large chip 410 or LED drive power large chip output to LED illumination large chip 420.The integrated transparent block of transition circuit of the present utility model comprises 2 kinds of integrated transparent block of transition circuit: 1. E type: external power source and signal are linked on LED drive power large chip 410 respectively, and as Fig. 1 and Fig. 7, the width that wherein flexible circuit 44 accesses is W
g1; LED drive power large chip 410 wire access width is W
g, be highly H7; Typical sizes is: width 12.4mm, highly: H7=11.4mm.2. F type: LED drive power large chip 410 outputs on LED illumination large chip 420, see Fig. 8, wherein LED drive power large chip 410 wire exports that width is W, conductor spacing is W
jG, be highly H8; Typical sizes is: width 12.4mm, highly: H8 is by the power decision of LED illumination large chip 420.
Described LED illumination large chip 420, as shown in Figure 9, comprise the first transparency carrier 421 that a width is fixed as W, first transparency carrier is provided with the parallel interface lead of N+1 bar, first transparency carrier 421 is provided with N LEDs chip 41 and forms LED chip series connection group, every LEDs chip 41 is all between two adjacent interface lead, and the spacing of two adjacent interface lead is W
jGequaling W, to subtract interface lead wide again divided by N (W
jG=(W-interface lead is wide)/N), and the both positive and negative polarity of every LEDs chip 41 is connected in two adjacent interface lead respectively; And simultaneously multiple LED strip joint group in parallel, make LED chip array transparency carrier 421 being formed the N row multirow that can extend on transparency carrier 421 length direction; N is the integer between 3 to 7; When setting up LED light machine module, according to power needs, cut out LED illumination large chip 420, the LED illumination large chip 420 being cut into different length has different power.
Described LED chip array and interface lead formation method is on the transparent substrate: adopt transparent substrate to do the slim epitaxial wafer of transition epitaxial layer formation, epitaxial wafer adopts ripe chip fabrication techniques multi ANN circuit and LED chip, then form through cutting the LED illumination large chip that width is W, the circuit wherein grown comprises interface lead and the wire of connection chip being connected LED chip and interface lead, and substrate is as the first transparency carrier; Described chip two pole, owing to not needing welding, can adopt transparency electrode, to increase the light-emitting area of chip; The ripe manufacturing technology of described chip is: adopt the layering of Metalorganic chemical vapor deposition equipment to carry out covering the techniques such as silicon, gluing, photoetching, etching, plated film, alloy and abrasive disc; Or adopt conventional art to be mounted on by LED chip array and produce on the first transparency carrier 421 of silver slurry circuit 414, and starch circuit 414 with the silver on the first transparency carrier 421 be connected by face-down bonding or the welding of spun gold formal dress, obtain LED illumination large chip 420, silver slurry brush circuit 414 comprises interface lead and the wire being connected chip.
Described LED drive power large chip, as shown in figure 11, comprises the second transparency carrier 413 that width is fixed as W, and transparency carrier 413 is printed with silver slurry circuit, and silver slurry circuit 414 has interface lead, and interface lead has incoming end and output; The width W of the interface lead incoming end in the width of incoming end and light machine template 43
gidentical or have the pad 414.1 be connected with connector 11, as shown in Figure 10; The interface lead of output there is the interface lead that N+1 bar is parallel, the spacing W of adjacent two interface lead
jGequaling W, to subtract interface lead wide again divided by N (W
jG=(W-interface lead is wide)/N); Second transparency carrier 413 is first pasted power drives wafer stage chip 411 and the rectifier bridge wafer stage chip 412 of un-encapsulated, then the power drives wafer stage chip 411 of un-encapsulated and rectifier bridge wafer stage chip 412 are welded on the second transparency carrier 413, second transparency carrier 413 has the width of interface lead end identical with the width W of LED illumination large chip, is highly H2; On LED drive power large chip the purposes of interface lead be used to connect described in LED illumination large chip on chip array.
LED driving method on described LED light machine module is: civil power AC is converted into Rectified alternating current by the rectifier bridge on rectifier bridge wafer stage chip 412, and the voltage of Rectified alternating current is greater than zero, is less than or equal to the specified maximum working voltage V of Rectified alternating current
wRrectified alternating current arranges 3 ~ 7 sections of LED load, each section of LED load is cascaded and forms LED load series block group, multiple LED load series block group forms described LED chip array, when the voltage of Rectified alternating current raises, the hop count that power drives wafer stage chip 411 controls LED load series connection increases, step by step when the voltage drop of Rectified alternating current, the hop count controlling LED load series connection reduces step by step, and the hop count of LED load series connection is the actual LED load hop count being connected into Rectified alternating current.
The hop count of described LED load series connection is controlled by switch, and the Controlling vertex of switch is the segmentation boundary of voltage, and the number of fragments of described voltage is corresponding with the hop count that LED load is connected; The control method of the hop count of described LED load series connection is, by the negative electrode side of every section of LED load to the negative pole connecting Rectified alternating current respectively by switch, then control according to the break-make of voltage change to each switch of Rectified alternating current, use the change of the hop count mode of a few sections of switch open circuits being realized LED load series connection.
The pulsating direct current operating voltage V of setting Rectified alternating current
wbe greater than V
wmaxperiod, control all switches disconnect, stop powering to all LED load, realize the overvoltage to LED and surge protection; By adjusting the maximum permission pulsating dc voltage V of Rectified alternating current
wmaxsize, thus realize the luminosity of LED is adjusted.
Effective operating current I in circuit is recorded by arranging current sensor
w, work as I
wexceed design load KI
wRtime, close all switches to realize current protection, the unlatching of switch need recover after reloading voltage next time, and wherein K is regulation coefficient, I
wRfor specified effective operating current.
Described switch is at pulsating dc voltage ascent stage time delay t
mmillisecond action, shifts to an earlier date t in the pulsating dc voltage decline stage
mmillisecond action, to obtain LED operating current relatively stably.
Arranging each section of LED load being cascaded is the LED chip group with different maximum carrying magnitudes of voltage, and the LED load series block group worked under switch control rule can be made to obtain operating current curve close to ideal sine wave.
The method of adjustment of the maximum carrying voltage of described each section of LED load is: be 1. ordinate with pulsating dc voltage, the pulsating direct current cycle maps for abscissa; 2. suppose a pure resistor load, its power is 1 at the sinusoidal graphics area that pulsating direct current half-wave is formed, mapping; 3. the load power setting LED load series block group is 120% of pure resistor load, and make the rectangle echo that an area is 1.2, the ordinate value of rectangle shade is the total maximum carrying magnitude of voltage of series block group; 4. in like manner, under known LED load carrying voltage condition, can map and draw the graphics area of LED load, verify piecemeal the area sum of LED load be greater than the Controlling vertex of switch under the sinusoidal wave area of pulsating direct current; 5. choose the carrying magnitude of voltage of each section of LED load in LED load series block group, be added and be more than or equal to the total maximum carrying magnitude of voltage of series block group; Wherein, carry the higher LED load of magnitude of voltage near positive terminal, carry the lower LED load of magnitude of voltage near negative pole end.
The material of described light machine template 43 is thin slice transparent non-metallic material, as SiO
2, Al
2o
3deng, it slim sheet material is warmed to nearly material softening point, utilizes mould to adopt pressing equipment stamping forming.Because material is easily crisp and hardness is higher, therefore can only cutting mode when carrying out being processed into light machine template shape, cost is higher.
Use aforesaid LED light machine module to set up the method for LED illumination core component, as shown in figure 12, see Fig. 4, LED light machine module arranges the inner cover 61 of the rear tape loaded fluorescent material of flexible circuit 44; Inner cover 61 with fluorescent material is mixed with the transparent injected-moulded particulate material not containing fluorescent material the injection moulding particulate material containing fluorescent material; Mixed proportion configures as required, then by injection mo(u)lding and get final product; The wherein said injection moulding particulate material containing fluorescent material is mixed 20 ~ 30% fluorescent powders and 70 ~ 80% transparent injected-moulded particulate material, again makes injection moulding particulate material after hot melt; Fluorescent material selects be greater than 8ms persistence, is generally less than the fluorescent material of 1000ms.
It is hereafter the operation principle of the present utility model for 6 groups of LED load.Namely n value is 6.
First, alternating current AC becomes Rectified alternating current after rectifier bridge, example: AC220V, 50Hz alternating current is after rectifier bridge rectification, see Figure 13, voltage is the wavy curve of half period (180 degree), and cycle pulsating dc voltage 0 degree time is zero, and 90 degree time, pulsating dc voltage reaches maximum V
wRfor the highest DC311V, when 180 degree, voltage reduces to zero again, goes round and begins again.
Job requirement of the present utility model, pulsating dc voltage be greater than zero be less than or equal to V
wRbetween, 3 ~ 7 sections of loads are set altogether, between each section of load, form series system, raise with voltage, load (i.e. LED load) hop count of connecting increases step by step, and load voltage is loaded by switch control rule, see Figure 13 and Figure 16, voltage switch node is voltage segmentation boundary.
Power supply management operational mode: the utility model is design current control device not, the keying of switch at different levels only depends on V
wchange, see Figure 13, Figure 16 and Figure 17.
During the cycle 0 ~ 90 degree:
1st section: work original state, namely the cycle is initial from 0, and circuit breaker in middle K1 ~ K6 is in opening (ON), and electric current mainly forms path through node J1 by K switch 1, and load is 1V by rated voltage
wRthe LED composition of/6 tandem workings;
2nd section: work as V
wbe more than or equal to 1V
wRwhen/6, K switch 1 is closed (OFF), and electric current mainly forms path through node J2 by K switch 2, and load is 2V by rated voltage
wRthe LED composition of/6 tandem workings;
3rd section: work as V
wbe more than or equal to 2V
wRwhen/6, K switch 1 is in OFF, and K switch 2 is closed (OFF), and electric current mainly forms path through node J3 by K switch 3, and load is 3V by rated voltage
wRthe LED composition of/6 tandem workings;
4th section: work as V
wbe more than or equal to 3V
wRwhen/6, K switch 1 ~ K2 is in OFF, and K switch 3 is closed (OFF), and electric current mainly forms path through node J4 by K switch 4, and load is 4V by rated voltage
wRthe LED composition of/6 tandem workings;
5th section: work as V
wbe more than or equal to 4V
wRwhen/6, K switch 1 ~ K3 is in OFF, and K switch 4 is closed (OFF), and electric current mainly forms path through node J5 by K switch 5, and load is 5V by rated voltage
wRthe LED composition of/6 tandem workings;
6th section: work as V
wbe more than or equal to 5V
wRwhen/6, K switch 1 ~ K4 is in OFF, and K switch 5 is closed (OFF), and electric current forms path through node J6 by K switch 6, and load is 6V by rated voltage
wRthe LED composition of/6 tandem workings;
When K switch 1 ~ K6 closes, the method for closing of time delay 0.1ms can be adopted, electric current relatively stably can be obtained.
During the cycle 90 ~ 180 degree:
6th section: work original state, voltage is reduced downwards by maximum, and circuit breaker in middle K1 ~ K5 is in closed condition (OFF), and K switch 6 is in opening, and electric current forms path through node J6 by K switch 6, and load is 6V by rated voltage
wRthe LED composition of/6 tandem workings;
5th section: work as V
wbe less than or equal to 5V
wRwhen/6, K switch 5 ~ K6 opens (ON), and electric current mainly forms path through node J5 by K switch 5, and load is 5V by rated voltage
wRthe LED composition of/6 tandem workings;
4th section: work as V
wbe less than or equal to 4V
wRwhen/6, K switch 4 ~ K6 opens (ON), and electric current mainly forms path through node J4 by K switch 4, and load is 4V by rated voltage
wRthe LED composition of/6 tandem workings;
3rd section: work as V
wbe less than or equal to 3V
wRwhen/6, K switch 3 ~ K6 opens (ON), and electric current mainly forms path through node J3 by K switch 3, and load is 3V by rated voltage
wRthe LED composition of/6 tandem workings;
2nd section: work as V
wbe less than or equal to 2V
wRwhen/6, K switch 2 ~ K6 opens (ON), and electric current mainly forms path through node J2 by K switch 2, and load is 2V by rated voltage
wRthe LED composition of/6 tandem workings;
1st section: work as V
wbe less than or equal to 1V
wRwhen/6, K switch 1 ~ K6 opens (ON), and electric current mainly forms path through node J1 by K switch 1, and load is 1V by rated voltage
wRthe LED composition of/6 tandem workings.
When K switch 1 ~ K6 opens, the open method of 0.1ms in advance can be adopted, electric current relatively stably can be obtained.
Light modulation operational mode: during the given voltage VT=0 of outer setting one, V
wmaxcorresponding C V
wR, during the given VT=5V of external voltage, V
wmaxcorresponding 0V, arranges 0≤V
wmax≤ CV
wR, C regulation coefficient is the multiple of rated voltage, as C=1.12.V
wbe greater than V
wmaxperiod, the switch of corresponding each section will cut out (OFF), stop powering to the load.It act as a kind of dimming arrangement.See Figure 15, Figure 16 and Figure 17, regulate V
wmaxlower than V
wR, in figure, dash area will increase, and the power being input to load will reduce, thus reach the object of light modulation.Example: be when LED normally works at AC220V civil power, when adjustment alternating current voltage is to the voltage of AC180V, the dash area in figure is V
whigher than the formation power projection figure part of 254V, from the cycle about 55.5 degree to 124.5 degree, because K switch x corresponding in this period is in closedown (OFF), the power consumption of dash area (being equivalent to 57.0% of the loading power of pulsating direct current half-wave under normal civil power) is by disallowable, this part power consumption is not loaded in load, and the brightness of load is reduced.Work as V
wmaxwhen equaling 0, all switches will cut out (OFF), and load supplying amount is zero.Can stepless dimming be accomplished, and energy ezpenditure can not occur.
Voltage protection operational mode: V is set
wmax=CV
wR.V
wbe greater than V
wmaxperiod, the switch of corresponding each section will cut out (OFF), stop powering to the load.See Figure 14, Figure 16 and Figure 17, example: when civil power reaches the high voltage of 270V, the dash area in figure is V
whigher than the formation power projection figure part of 348V, from the cycle about 66 degree to 114 degree, because K1 ~ K6 switch in this period is in cut out (OFF), the power consumption of dash area (being equivalent to 50.2% of the loading power of pulsating direct current half-wave under normal civil power) is by disallowable, this part power consumption is not loaded in load, and load can not be burnt because of overvoltage.
Overcurrent protection operational mode: the utility model has overcurrent protection, see Figure 17, current sensor records effective operating current I in circuit
wexceed design load KI
wR, K is regulation coefficient, example: setting I
wR=275mA, K=1.2, logic switch controller is by all for cut out K switch 1 ~ K6 (OFF), and opening switch (ON) K1 ~ K6 need recover after reloading power supply pressure next time.
According to principle same as described above, mode of loading can be divided into 3 ~ 7 sections, and segmentation is few, and circuit is simple, but curent change is comparatively large, easily produces low-order harmonic, see Figure 18 at electrical network; Segmentation is many, then circuit structure is complicated.Generally get 4 ~ 6 sections for good.
Note: V
w-pulsating direct current operating voltage (1.4142* alternating voltage); V
wRthe specified maximum working voltage of-pulsating direct current (1.4142* alternating voltage); V
wmax-maximum permission pulsating dc voltage (1.4142* alternating voltage); I
w-effectively operating current.I
wR-specified effective operating current.
If civil power is AC220, the voltage after rectification is DC311V, and often to organize LED load for single chips, then every chips bears DC52V; As AC110, then chip bears DC26V.If the loading power area of pulsating direct current half-wave is 1, see Figure 19, in figure, to be loaded power difference larger for each LED load (LED module 1 to 6), and LED module 1 reaches 20.68% (for 84.4% of chip nominal output) of the loading power area of pulsating direct current half-wave; And LED module 6 only has 5.11% (for 19.2% of chip nominal output), be about 1/4th power of module 1, through actual measurement checking, the intrinsic brilliance of module 6 is very low; The power be on average loaded of whole chipset is 52.4% of chip nominal output, and the utilization rate of chip is lower; And 159% of the loading power area that the nominal output of chipset (dotted line frame area) is pulsating direct current half-wave.Because chip redundancy amount is excessive, not only chip waste, also causes driving power excessive and wastes, adding the difficulty that cloth is set up simultaneously.Therefore, select the method for chip voltage to there is some problems under Constant Direct Current state under pulsating direct current state, how under the prerequisite ensureing chip secure work, the utilization rate improving chip becomes a problem to be solved.
The nominal output setting the LED chip array of 6 series connection loads 1.59 times of power by pulsating direct current half-wave and turns down to 1.2 times (consider that small grids civil power there will be and be not less than 1.2 times of fluctuations), see Figure 20, if when LED chip array chip load power (in figure hatched area) is 1.2 times of pulsating direct current half-wave loading power (pulsating direct current half-wave part area), can extrapolate the carrying voltage of chip array when civil power is AC220V by Figure 20 mapping is DC236V;
See Figure 21, arrange different magnitudes of voltage to LED module 1 respectively to module 6, the chip that can obtain under different bearer magnitude of voltage loads power area (in figure dash area);
Adopt 2*52V+4*35V high voltage chip (model of module 1 and module 2 be VES-AADBHV45, module 3 be ES-AADBHF40 to module 6) to form serial array, then the carrying Voltage Cortrol of chip array is DC244V; Make Figure 22, the chip array of acquisition is loaded power area is pulsating direct current half-wave power area 96.67%, and the power that chip array is loaded is perfect condition close to 1; The power that now LED chip array is loaded is chip array nominal output 77.6%; Experimental verification is close with estimated value.
The module of each voltage section loads power checking: set the loading power area of pulsating direct current half-wave as 1, when voltage is ordinate, easily calculating DC52V chip nominal output by Figure 21 is 26.52%, and in like manner, the nominal output of DC35V chip is 17.89%; Figure 22 is then civil power when being AC220V, the power situation be loaded of each module of LED chip array; Table 1 is power that chip array is loaded when being pulsating direct current half-wave power area 1, line voltage is respectively AC220V, AV246V, each module of AC270V is loaded the situation of power, can find out in table, only module 3 slightly transships at DC311V and DC348V, but has margin of power due to module 1 and module 2, experiment prove module 3 by.
When other line voltage grades, optimal way is carried out with reference to above-mentioned.
Ideally the checking computations of chip bearing power are as shown in the table:
Claims (5)
1. the LED light machine module of nonisulated heat-conducting substrate formula, it is characterized in that: comprise the light machine template (43) that nonisulated heat-conducting substrate is made, light machine template (43) is fitted with the integrated transparent block of the transparent transition circuit of E type (470), the one side of the integrated transparent block of the transparent transition circuit of E type (470) band silver slurry circuit (414) is back to light machine template (43); The one side of the integrated transparent block of the transparent transition circuit of E type (470) band silver slurry circuit (414) is with the one side of interface lead circuit to fit with LED drive power large chip (410) and is welded; Light machine template (43) is also fitted with LED illumination large chip (420), LED illumination large chip (420) fits tightly in light machine template (43) without the one side of silver slurry circuit (414); The interface lead end of LED illumination large chip (420) aligns with the integrated transparent block of transparent transition circuit (470) output interface lead end; The one side of described LED illumination large chip (420) microarray strip is also provided with the integrated transparent block of the transparent transition circuit of F type (480); The one side that the one end in the described integrated transparent block of the transparent transition circuit of F type (480) band silver slurry circuit (414) face and LED illumination large chip (420) are with silver to starch circuit (414) carries out butt welding by interface lead, and the other end is with silver to starch the one side of circuit (414) by interface lead butt welding again with the integrated transparent block of the transparent transition circuit of E type (470).
2. the LED light machine module of nonisulated heat-conducting substrate formula according to claim 1, is characterized in that: described light machine template (43) and LED illumination large chip (420) binding face are minute surface; For medium and small light machine template, external power source or signal are directly welded on the upper access of the LED drive power large chip (410) fitted in light machine template (43) by connector (11); For large-scale light machine template, external power source or signal are linked on the integrated transparent block of the transparent transition circuit of E type (470) by connector (11) connection flexible circuit (44) and import LED drive power large chip (410) again; Described LED drive power large chip (410) is upper or be also provided with transparent cover plate (410.1); Described ray machine module is provided with transparent adhesive tape (45) along LED drive power large chip (410), LED illumination large chip (420), the integrated transparent block of the transparent transition circuit of E type (470) and the integrated transparent block of the transparent transition circuit of F type (480) periphery.
3. the LED light machine module of nonisulated heat-conducting substrate formula according to claim 1, it is characterized in that: the described integrated transparent block of the transparent transition circuit of E type (470) comprises the 3rd transparency carrier (470.1), 3rd transparency carrier (470.1) is printed with silver slurry circuit (414), silver slurry circuit (414) forms interface lead, and interface lead has incoming end and output; The width of incoming end interface lead and the width W of flexible circuit incoming end
g1identical or have the pad (414.1) be connected with electric connector (11), width W, the quantity N+1 and spacing W of the width of the interface lead of output, quantity and spacing and LED illumination large chip (420)
jGidentical, interface lead or be also connected with the input of LED drive power large chip (410), its width is W
g; The described integrated transparent block of the transparent transition circuit of F type (480) comprises the 4th transparency carrier (480.1), on 4th transparency carrier, (480.1) are printed with silver slurry circuit, silver slurry circuit is interface lead, width W, the quantity N+1 and spacing W of the width of interface lead, quantity and spacing and LED illumination large chip (420)
jGidentical; N is the integer between 3 to 7.
4. the LED light machine module of nonisulated heat-conducting substrate formula according to claim 1, it is characterized in that: described LED illumination large chip (420) comprises the first transparency carrier (421) that a width is fixed as W, first transparency carrier is provided with the parallel interface lead of N+1 bar, first transparency carrier (421) is provided with N LEDs chip (41) and forms LED chip series connection group, every LEDs chip (41) is all between two adjacent interface lead, and the spacing of two adjacent interface lead is W
jGequaling W, to subtract interface lead wide again divided by N, and the both positive and negative polarity of every LEDs chip (41) is connected in two adjacent interface lead respectively; And simultaneously multiple LED strip joint group in parallel, the LED chip array of the N row multirow that the upper formation of transparency carrier (421) can be extended on transparency carrier (421) length direction; N is the integer between 3 to 7.
5. the LED light machine module of nonisulated heat-conducting substrate formula according to claim 1, it is characterized in that: described LED drive power large chip comprises the second transparency carrier (413) that width is fixed as W, transparency carrier (413) is printed with silver slurry circuit (414), silver slurry circuit (414) has interface lead, and interface lead has incoming end and output; The width W of the interface lead incoming end in the width of incoming end and light machine template
gidentical or have the pad (414.1) be connected with connector (11); The interface lead of output there is the interface lead that N+1 bar is parallel, the spacing W of adjacent two interface lead
jGequaling W, to subtract interface lead wide again divided by N; Second transparency carrier (413) is welded with power drives wafer stage chip (411) and the rectifier bridge wafer stage chip (412) of un-encapsulated.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015176626A1 (en) * | 2014-05-20 | 2015-11-26 | 贵州光浦森光电有限公司 | Led large chip and optical machine module group |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015176626A1 (en) * | 2014-05-20 | 2015-11-26 | 贵州光浦森光电有限公司 | Led large chip and optical machine module group |
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