CN103945640A - 防静电线路板及其制作方法 - Google Patents
防静电线路板及其制作方法 Download PDFInfo
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- CN103945640A CN103945640A CN201410200100.9A CN201410200100A CN103945640A CN 103945640 A CN103945640 A CN 103945640A CN 201410200100 A CN201410200100 A CN 201410200100A CN 103945640 A CN103945640 A CN 103945640A
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- antistatic
- wiring board
- prepreg
- circuit board
- temperature
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000009413 insulation Methods 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 17
- 239000011889 copper foil Substances 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 238000007731 hot pressing Methods 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 claims abstract description 4
- 238000010023 transfer printing Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 31
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 27
- 238000011161 development Methods 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000000047 product Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 13
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 10
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000428 dust Substances 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000006227 byproduct Substances 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 7
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 7
- 239000000347 magnesium hydroxide Substances 0.000 claims description 7
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- 238000005470 impregnation Methods 0.000 claims description 6
- 239000012046 mixed solvent Substances 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000004090 dissolution Methods 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000009966 trimming Methods 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 238000011017 operating method Methods 0.000 claims description 2
- 230000003068 static effect Effects 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 230000018109 developmental process Effects 0.000 description 17
- 230000006378 damage Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000013064 chemical raw material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410200100.9A CN103945640B (zh) | 2014-05-13 | 2014-05-13 | 防静电线路板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410200100.9A CN103945640B (zh) | 2014-05-13 | 2014-05-13 | 防静电线路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN103945640A true CN103945640A (zh) | 2014-07-23 |
CN103945640B CN103945640B (zh) | 2017-01-11 |
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Family Applications (1)
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CN201410200100.9A Expired - Fee Related CN103945640B (zh) | 2014-05-13 | 2014-05-13 | 防静电线路板及其制作方法 |
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CN (1) | CN103945640B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105867073A (zh) * | 2016-06-04 | 2016-08-17 | 深圳市柯士达光电有限公司 | 一种防静电曝光机系统及其制造方法 |
CN106028629A (zh) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | 印刷电路板和电子装置 |
CN108601208A (zh) * | 2018-06-22 | 2018-09-28 | 东莞市腾跃气动工具有限公司 | 防静电和浪涌的线路板 |
CN108617111A (zh) * | 2018-05-03 | 2018-10-02 | 深圳崇达多层线路板有限公司 | 一种超厚铜线路板的制作工艺 |
CN110446360A (zh) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | 一种高精度铝基板和柔性板碱性蚀刻加工工艺 |
US10760548B2 (en) | 2015-06-30 | 2020-09-01 | Vestas Wind Systems A/S | Extreme load control |
CN114204273A (zh) * | 2021-12-15 | 2022-03-18 | 吉林大学 | 一种超薄柔性保形超材料吸波器及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1220284A (zh) * | 1998-11-13 | 1999-06-23 | 湖北省化学研究所 | 用于防静电的环氧树脂化合物及其制备 |
DE69942430D1 (de) * | 1998-12-09 | 2010-07-08 | Kureha Corp | Kunstharzzusammensetzung |
CN102612257A (zh) * | 2011-01-19 | 2012-07-25 | 肖克科技有限公司 | 含有电压可切换介电材料的衬底 |
CN203884072U (zh) * | 2014-05-13 | 2014-10-15 | 张伯平 | 防静电线路板 |
-
2014
- 2014-05-13 CN CN201410200100.9A patent/CN103945640B/zh not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10760548B2 (en) | 2015-06-30 | 2020-09-01 | Vestas Wind Systems A/S | Extreme load control |
CN105867073A (zh) * | 2016-06-04 | 2016-08-17 | 深圳市柯士达光电有限公司 | 一种防静电曝光机系统及其制造方法 |
CN106028629A (zh) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | 印刷电路板和电子装置 |
CN108617111A (zh) * | 2018-05-03 | 2018-10-02 | 深圳崇达多层线路板有限公司 | 一种超厚铜线路板的制作工艺 |
CN108601208A (zh) * | 2018-06-22 | 2018-09-28 | 东莞市腾跃气动工具有限公司 | 防静电和浪涌的线路板 |
CN110446360A (zh) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | 一种高精度铝基板和柔性板碱性蚀刻加工工艺 |
CN114204273A (zh) * | 2021-12-15 | 2022-03-18 | 吉林大学 | 一种超薄柔性保形超材料吸波器及其制备方法 |
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Publication number | Publication date |
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CN103945640B (zh) | 2017-01-11 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: XINGTAI HAINA ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHANG BOPING Effective date: 20150127 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 054000 XINGTAI, HEBEI PROVINCE TO: 054700 XINGTAI, HEBEI PROVINCE |
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TA01 | Transfer of patent application right |
Effective date of registration: 20150127 Address after: 054700 Weixian County Economic Development Zone, Hebei Province, open road, No. 3, No. Applicant after: Xingtai Haina Electronics Technology Co., Ltd Address before: 054000 Weixian County Hebei Xingtai Open Road No. 1 Haina electronics company Applicant before: Zhang Boping |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170111 Termination date: 20170513 |
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CF01 | Termination of patent right due to non-payment of annual fee |