CN103797561A - 用于喷墨头的喷射量校正方法、喷射量校正装置 - Google Patents

用于喷墨头的喷射量校正方法、喷射量校正装置 Download PDF

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Publication number
CN103797561A
CN103797561A CN201280044806.XA CN201280044806A CN103797561A CN 103797561 A CN103797561 A CN 103797561A CN 201280044806 A CN201280044806 A CN 201280044806A CN 103797561 A CN103797561 A CN 103797561A
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CN
China
Prior art keywords
substrate
nozzle
ink gun
ink
ejection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280044806.XA
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English (en)
Chinese (zh)
Inventor
儿玉宪一
大松祯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN103797561A publication Critical patent/CN103797561A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B41J2/12—Ink jet characterised by jet control testing or correcting charge or deflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Electromagnetism (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201280044806.XA 2011-09-15 2012-09-13 用于喷墨头的喷射量校正方法、喷射量校正装置 Pending CN103797561A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-202207 2011-09-15
JP2011202207A JP5727905B2 (ja) 2011-09-15 2011-09-15 インクジェットヘッドの吐出量補正方法、吐出量補正装置、及びナノインプリントシステム
PCT/JP2012/074127 WO2013039259A1 (en) 2011-09-15 2012-09-13 Ejection volume correction method for inkjet head, ejection volume correction apparatus

Publications (1)

Publication Number Publication Date
CN103797561A true CN103797561A (zh) 2014-05-14

Family

ID=47883471

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280044806.XA Pending CN103797561A (zh) 2011-09-15 2012-09-13 用于喷墨头的喷射量校正方法、喷射量校正装置

Country Status (5)

Country Link
US (1) US9724916B2 (https=)
JP (1) JP5727905B2 (https=)
KR (1) KR101625770B1 (https=)
CN (1) CN103797561A (https=)
WO (1) WO2013039259A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107009770A (zh) * 2016-01-28 2017-08-04 海德堡印刷机械股份公司 适配液滴尺寸以实现密度补偿
CN112757796A (zh) * 2020-12-30 2021-05-07 华中科技大学 一种用于显示器件喷印制造全过程质量检测的系统与方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102214828B1 (ko) 2014-05-02 2021-02-15 삼성전자주식회사 임프린트 장치 및 방법
JP6329425B2 (ja) * 2014-05-02 2018-05-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6329437B2 (ja) 2014-06-10 2018-05-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6561469B2 (ja) 2015-01-14 2019-08-21 セイコーエプソン株式会社 印加電圧設定方法、およびプログラム並びにインクジェットプリンター
JP6661334B2 (ja) * 2015-02-03 2020-03-11 キヤノン株式会社 装置、および物品の製造方法
JP6438332B2 (ja) * 2015-03-18 2018-12-12 キヤノン株式会社 インプリントシステム、および物品の製造方法
JP6590667B2 (ja) * 2015-11-30 2019-10-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6552392B2 (ja) * 2015-11-30 2019-07-31 キヤノン株式会社 インプリント装置、計測方法、インプリント方法、および物品の製造方法
KR102078954B1 (ko) * 2015-11-30 2020-02-19 캐논 가부시끼가이샤 임프린팅 장치, 측정 방법, 임프린팅 방법, 및 물품 제조 방법
JP6548560B2 (ja) * 2015-11-30 2019-07-24 キヤノン株式会社 インプリント装置、計測方法、インプリント方法、および物品の製造方法
JP6742177B2 (ja) * 2016-07-15 2020-08-19 キヤノン株式会社 インプリント装置、および物品製造方法
JP7019402B2 (ja) * 2017-12-19 2022-02-15 キヤノン株式会社 吐出装置、および物品の製造装置
JP7060840B2 (ja) * 2018-03-06 2022-04-27 大日本印刷株式会社 インプリントモールド及びインプリント方法
US11927883B2 (en) * 2018-03-30 2024-03-12 Canon Kabushiki Kaisha Method and apparatus to reduce variation of physical attribute of droplets using performance characteristic of dispensers
JP7271352B2 (ja) * 2019-07-17 2023-05-11 キオクシア株式会社 インプリント装置、インプリント方法、および半導体装置の製造方法
US11215921B2 (en) 2019-10-31 2022-01-04 Canon Kabushiki Kaisha Residual layer thickness compensation in nano-fabrication by modified drop pattern
US11262652B2 (en) * 2020-06-25 2022-03-01 Canon Kabushiki Kaisha Nanofabrication method with correction of distortion within an imprint system
KR102619966B1 (ko) * 2021-05-18 2024-01-03 세메스 주식회사 기판 처리 제어 방법, 기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독가능 매체에 저장된 컴퓨터 프로그램
JP7743209B2 (ja) * 2021-06-08 2025-09-24 キヤノン株式会社 成形装置、成形方法及び物品の製造方法
US12523934B2 (en) * 2023-12-06 2026-01-13 Canon Kabushiki Kaisha Apparatus and method for calibrating a fluid dispenser

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2007326003A (ja) * 2006-06-06 2007-12-20 Sharp Corp 液滴吐出装置およびその制御方法
US20100098848A1 (en) * 2008-10-22 2010-04-22 Molecular Imprints, Inc. Fluid Dispense Device Calibration
US20110189601A1 (en) * 2010-01-29 2011-08-04 Takeshi Koshiba Method of forming pattern, system for calculating resist coating distribution and program for calculating the same
WO2011108750A1 (en) * 2010-03-03 2011-09-09 Fujifilm Corporation Pattern transfer method and apparatus

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JP4200810B2 (ja) 2002-05-17 2008-12-24 セイコーエプソン株式会社 ディスプレー製造装置、及び、ディスプレー製造方法
EP1768846B1 (en) 2004-06-03 2010-08-11 Molecular Imprints, Inc. Fluid dispensing and drop-on-demand dispensing for nano-scale manufacturing
US8001924B2 (en) 2006-03-31 2011-08-23 Asml Netherlands B.V. Imprint lithography
JP4940884B2 (ja) * 2006-10-17 2012-05-30 大日本印刷株式会社 パターン形成体の製造方法
EP1975704A3 (en) * 2007-03-30 2008-12-10 Fujifilm Corporation Mold structure, imprinting method using the same, magnetic recording medium and production method thereof
JP4908369B2 (ja) 2007-10-02 2012-04-04 株式会社東芝 インプリント方法及びインプリントシステム
JP2011091124A (ja) * 2009-10-21 2011-05-06 Ricoh Co Ltd 光インプリント方法
JP5406777B2 (ja) * 2010-04-02 2014-02-05 東芝機械株式会社 転写装置及び転写方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007326003A (ja) * 2006-06-06 2007-12-20 Sharp Corp 液滴吐出装置およびその制御方法
US20100098848A1 (en) * 2008-10-22 2010-04-22 Molecular Imprints, Inc. Fluid Dispense Device Calibration
US20110189601A1 (en) * 2010-01-29 2011-08-04 Takeshi Koshiba Method of forming pattern, system for calculating resist coating distribution and program for calculating the same
WO2011108750A1 (en) * 2010-03-03 2011-09-09 Fujifilm Corporation Pattern transfer method and apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107009770A (zh) * 2016-01-28 2017-08-04 海德堡印刷机械股份公司 适配液滴尺寸以实现密度补偿
CN107009770B (zh) * 2016-01-28 2019-12-03 海德堡印刷机械股份公司 借助计算机改变基于点的印刷系统中油墨密度值的方法
CN112757796A (zh) * 2020-12-30 2021-05-07 华中科技大学 一种用于显示器件喷印制造全过程质量检测的系统与方法
CN112757796B (zh) * 2020-12-30 2022-04-08 华中科技大学 一种用于显示器件喷印制造全过程质量检测的系统与方法

Also Published As

Publication number Publication date
KR101625770B1 (ko) 2016-05-30
JP5727905B2 (ja) 2015-06-03
US9724916B2 (en) 2017-08-08
WO2013039259A1 (en) 2013-03-21
KR20140068977A (ko) 2014-06-09
JP2013065624A (ja) 2013-04-11
US20140199472A1 (en) 2014-07-17

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Application publication date: 20140514