CN103733518B - 包括电容性传感器的电极配置的印刷电路板 - Google Patents

包括电容性传感器的电极配置的印刷电路板 Download PDF

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Publication number
CN103733518B
CN103733518B CN201280039513.2A CN201280039513A CN103733518B CN 103733518 B CN103733518 B CN 103733518B CN 201280039513 A CN201280039513 A CN 201280039513A CN 103733518 B CN103733518 B CN 103733518B
Authority
CN
China
Prior art keywords
electrode
circuit board
printed circuit
electrodes
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280039513.2A
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English (en)
Chinese (zh)
Other versions
CN103733518A (zh
Inventor
史蒂芬·伯格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neo Ron Co Ltd
Original Assignee
Microchip Technology Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microchip Technology Germany GmbH filed Critical Microchip Technology Germany GmbH
Publication of CN103733518A publication Critical patent/CN103733518A/zh
Application granted granted Critical
Publication of CN103733518B publication Critical patent/CN103733518B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96Touch switches
    • H03K17/962Capacitive touch switches
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96Touch switches
    • H03K2017/9602Touch switches characterised by the type or shape of the sensing electrodes
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K2217/00Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96Touch switches
    • H03K2217/9607Capacitive touch switches
    • H03K2217/960755Constructional details of capacitive touch and proximity switches
    • H03K2217/960765Details of shielding arrangements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K2217/00Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96Touch switches
    • H03K2217/9607Capacitive touch switches
    • H03K2217/960755Constructional details of capacitive touch and proximity switches
    • H03K2217/960775Emitter-receiver or "fringe" type detection, i.e. one or more field emitting electrodes and corresponding one or more receiving electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672Superposed layout, i.e. in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN201280039513.2A 2011-06-24 2012-06-20 包括电容性传感器的电极配置的印刷电路板 Expired - Fee Related CN103733518B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1020110780777 2011-06-24
DE102011078077A DE102011078077A1 (de) 2011-06-24 2011-06-24 Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors
PCT/EP2012/061900 WO2012175580A2 (en) 2011-06-24 2012-06-20 Printed circuit board comprising an electrode configuration of an capacitive sensor

Publications (2)

Publication Number Publication Date
CN103733518A CN103733518A (zh) 2014-04-16
CN103733518B true CN103733518B (zh) 2017-11-17

Family

ID=46420125

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280039513.2A Expired - Fee Related CN103733518B (zh) 2011-06-24 2012-06-20 包括电容性传感器的电极配置的印刷电路板

Country Status (8)

Country Link
US (1) US9702902B2 (enExample)
EP (1) EP2724464B1 (enExample)
JP (1) JP6081996B2 (enExample)
KR (1) KR101911842B1 (enExample)
CN (1) CN103733518B (enExample)
DE (1) DE102011078077A1 (enExample)
TW (1) TWI556693B (enExample)
WO (1) WO2012175580A2 (enExample)

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DE102009057933B3 (de) * 2009-12-11 2011-02-24 Ident Technology Ag Sensoreinrichtung sowie Verfahren zur Annäherungs- und Berührungsdetektion
DE102011078077A1 (de) 2011-06-24 2012-12-27 Ident Technology Ag Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors
DE102012109034A1 (de) * 2012-09-25 2014-03-27 Huf Hülsbeck & Fürst Gmbh & Co. Kg Kraftfahrzeugtürgriff mit Sensorelektronik
JP6198955B2 (ja) 2014-07-30 2017-09-20 日立オートモティブシステムズ株式会社 物理量検出装置
DE102014014050B4 (de) * 2014-09-29 2017-08-03 gomtec GmbH Näherungssensoranordnung
US9810314B2 (en) 2015-02-25 2017-11-07 Kongsberg Driveline Systems I, Inc. Rotary shifter assembly
US10108292B2 (en) * 2015-04-22 2018-10-23 Microchip Technology Incorporated Capacitive sensor system with multiple transmit electrodes
DE102015006607B4 (de) 2015-05-21 2017-05-18 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug
DE102015017199B4 (de) 2015-05-21 2025-05-22 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug und Kraftfahrzeug
JP6511963B2 (ja) * 2015-05-28 2019-05-15 アイシン精機株式会社 静電センサ
CN108352101A (zh) * 2015-11-19 2018-07-31 法国圣戈班玻璃厂 警报玻璃板装置
WO2017085303A1 (de) 2015-11-19 2017-05-26 Saint-Gobain Glass France Alarmscheibenanordnung
CN105649604B (zh) * 2015-12-30 2019-12-06 中国石油天然气集团公司 一种电极电路内置结构
US10089513B2 (en) * 2016-05-30 2018-10-02 Kyocera Corporation Wiring board for fingerprint sensor
EP3494555A1 (de) 2016-08-02 2019-06-12 Saint-Gobain Glass France Alarmscheibenanordnung
BR112018072275A2 (pt) 2016-08-02 2019-02-12 Saint-Gobain Glass France montagem de painel de alarme
US10285275B2 (en) 2017-05-25 2019-05-07 Tt Electronics Plc Sensor device having printed circuit board substrate with built-in media channel
EP3629478B1 (de) * 2018-09-26 2022-04-27 Huf Hülsbeck & Fürst GmbH & Co. KG Sensorvorrichtung zur detektion einer aktivierungshandlung bei einem fahrzeug
DE102019209430A1 (de) 2019-06-28 2020-12-31 Robert Bosch Gmbh Sensoreinrichtung mit kapazitivem Sensor

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US20090161325A1 (en) * 2007-12-20 2009-06-25 Verifone, Inc. Capacitive user-interface switches
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US20090161325A1 (en) * 2007-12-20 2009-06-25 Verifone, Inc. Capacitive user-interface switches
CN101873126A (zh) * 2009-04-22 2010-10-27 胡夫·许尔斯贝克和福斯特有限及两合公司 汽车门把手内的传感器电子器件

Also Published As

Publication number Publication date
KR101911842B1 (ko) 2018-10-25
TW201316855A (zh) 2013-04-16
DE102011078077A1 (de) 2012-12-27
JP2014520401A (ja) 2014-08-21
KR20140040815A (ko) 2014-04-03
EP2724464B1 (en) 2016-09-14
TWI556693B (zh) 2016-11-01
JP6081996B2 (ja) 2017-02-15
US9702902B2 (en) 2017-07-11
WO2012175580A3 (en) 2013-02-21
CN103733518A (zh) 2014-04-16
EP2724464A2 (en) 2014-04-30
WO2012175580A2 (en) 2012-12-27
US20140139240A1 (en) 2014-05-22

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160811

Address after: German Ma Ning Ismail

Applicant after: Microchip technology Germany

Address before: Gil bloom

Applicant before: Ident Technology AG

GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20190415

Address after: Dublin, Ireland

Patentee after: Neo Ron Co., Ltd.

Address before: German Ma Ning Ismail

Patentee before: Microchip technology Germany

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171117

Termination date: 20210620

CF01 Termination of patent right due to non-payment of annual fee