JP6081996B2 - 容量性センサの電極構成を備えている印刷回路基板 - Google Patents

容量性センサの電極構成を備えている印刷回路基板 Download PDF

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Publication number
JP6081996B2
JP6081996B2 JP2014516332A JP2014516332A JP6081996B2 JP 6081996 B2 JP6081996 B2 JP 6081996B2 JP 2014516332 A JP2014516332 A JP 2014516332A JP 2014516332 A JP2014516332 A JP 2014516332A JP 6081996 B2 JP6081996 B2 JP 6081996B2
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Japan
Prior art keywords
electrode
printed circuit
circuit board
electrodes
configuration
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Expired - Fee Related
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JP2014516332A
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English (en)
Japanese (ja)
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JP2014520401A (ja
JP2014520401A5 (enExample
Inventor
シュテファン ブルガー，
シュテファン ブルガー，
Original Assignee
マイクロチップ テクノロジー ジャーマニー ゲーエムベーハー
マイクロチップ テクノロジー ジャーマニー ゲーエムベーハー
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Publication of JP2014520401A publication Critical patent/JP2014520401A/ja
Publication of JP2014520401A5 publication Critical patent/JP2014520401A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H03K2217/960765—Details of shielding arrangements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H03K2217/960775—Emitter-receiver or "fringe" type detection, i.e. one or more field emitting electrodes and corresponding one or more receiving electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2014516332A 2011-06-24 2012-06-20 容量性センサの電極構成を備えている印刷回路基板 Expired - Fee Related JP6081996B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102011078077A DE102011078077A1 (de) 2011-06-24 2011-06-24 Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors
DE102011078077.7 2011-06-24
PCT/EP2012/061900 WO2012175580A2 (en) 2011-06-24 2012-06-20 Printed circuit board comprising an electrode configuration of an capacitive sensor

Publications (3)

Publication Number Publication Date
JP2014520401A JP2014520401A (ja) 2014-08-21
JP2014520401A5 JP2014520401A5 (enExample) 2015-08-06
JP6081996B2 true JP6081996B2 (ja) 2017-02-15

Family

ID=46420125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014516332A Expired - Fee Related JP6081996B2 (ja) 2011-06-24 2012-06-20 容量性センサの電極構成を備えている印刷回路基板

Country Status (8)

Country Link
US (1) US9702902B2 (enExample)
EP (1) EP2724464B1 (enExample)
JP (1) JP6081996B2 (enExample)
KR (1) KR101911842B1 (enExample)
CN (1) CN103733518B (enExample)
DE (1) DE102011078077A1 (enExample)
TW (1) TWI556693B (enExample)
WO (1) WO2012175580A2 (enExample)

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DE102011078077A1 (de) 2011-06-24 2012-12-27 Ident Technology Ag Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors
DE102012109034A1 (de) * 2012-09-25 2014-03-27 Huf Hülsbeck & Fürst Gmbh & Co. Kg Kraftfahrzeugtürgriff mit Sensorelektronik
JP6198955B2 (ja) 2014-07-30 2017-09-20 日立オートモティブシステムズ株式会社 物理量検出装置
DE102014014050B4 (de) * 2014-09-29 2017-08-03 gomtec GmbH Näherungssensoranordnung
US9810314B2 (en) 2015-02-25 2017-11-07 Kongsberg Driveline Systems I, Inc. Rotary shifter assembly
US10108292B2 (en) * 2015-04-22 2018-10-23 Microchip Technology Incorporated Capacitive sensor system with multiple transmit electrodes
DE102015017199B4 (de) 2015-05-21 2025-05-22 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug und Kraftfahrzeug
DE102015006607B4 (de) 2015-05-21 2017-05-18 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug
JP6511963B2 (ja) * 2015-05-28 2019-05-15 アイシン精機株式会社 静電センサ
US10553087B2 (en) 2015-11-19 2020-02-04 Saint-Gobain Glass France Alarm pane arrangement
MX2018006125A (es) * 2015-11-19 2018-08-01 Saint Gobain Arreglo de cristal de alarma.
CN105649604B (zh) * 2015-12-30 2019-12-06 中国石油天然气集团公司 一种电极电路内置结构
US10089513B2 (en) * 2016-05-30 2018-10-02 Kyocera Corporation Wiring board for fingerprint sensor
US10490036B2 (en) 2016-08-02 2019-11-26 Saint-Gobain Glass France Alarm pane assembly
EP3494556A1 (de) 2016-08-02 2019-06-12 Saint-Gobain Glass France Alarmscheibenanordnung
US10285275B2 (en) * 2017-05-25 2019-05-07 Tt Electronics Plc Sensor device having printed circuit board substrate with built-in media channel
EP3629478B1 (de) * 2018-09-26 2022-04-27 Huf Hülsbeck & Fürst GmbH & Co. KG Sensorvorrichtung zur detektion einer aktivierungshandlung bei einem fahrzeug
DE102019209430A1 (de) 2019-06-28 2020-12-31 Robert Bosch Gmbh Sensoreinrichtung mit kapazitivem Sensor

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Also Published As

Publication number Publication date
WO2012175580A2 (en) 2012-12-27
TWI556693B (zh) 2016-11-01
CN103733518A (zh) 2014-04-16
JP2014520401A (ja) 2014-08-21
EP2724464B1 (en) 2016-09-14
TW201316855A (zh) 2013-04-16
US20140139240A1 (en) 2014-05-22
US9702902B2 (en) 2017-07-11
WO2012175580A3 (en) 2013-02-21
KR20140040815A (ko) 2014-04-03
KR101911842B1 (ko) 2018-10-25
EP2724464A2 (en) 2014-04-30
CN103733518B (zh) 2017-11-17
DE102011078077A1 (de) 2012-12-27

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