CN103732001B - 阻焊层和印刷电路板 - Google Patents

阻焊层和印刷电路板 Download PDF

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Publication number
CN103732001B
CN103732001B CN201410045936.6A CN201410045936A CN103732001B CN 103732001 B CN103732001 B CN 103732001B CN 201410045936 A CN201410045936 A CN 201410045936A CN 103732001 B CN103732001 B CN 103732001B
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CN
China
Prior art keywords
resin composition
solder mask
white
methyl
alkali development
Prior art date
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Active
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CN201410045936.6A
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English (en)
Chinese (zh)
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CN103732001A (zh
Inventor
角谷武德
能坂麻美
宇敷滋
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Publication date
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Publication of CN103732001A publication Critical patent/CN103732001A/zh
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Publication of CN103732001B publication Critical patent/CN103732001B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201410045936.6A 2009-08-28 2010-08-27 阻焊层和印刷电路板 Active CN103732001B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009198507A JP5479821B2 (ja) 2009-08-28 2009-08-28 ソルダーレジスト層及びプリント配線板
JP2009-198507 2009-08-28
CN2010102669638A CN102006717A (zh) 2009-08-28 2010-08-27 阻焊层和印刷电路板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2010102669638A Division CN102006717A (zh) 2009-08-28 2010-08-27 阻焊层和印刷电路板

Publications (2)

Publication Number Publication Date
CN103732001A CN103732001A (zh) 2014-04-16
CN103732001B true CN103732001B (zh) 2015-10-28

Family

ID=43813672

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201410045936.6A Active CN103732001B (zh) 2009-08-28 2010-08-27 阻焊层和印刷电路板
CN2010102669638A Pending CN102006717A (zh) 2009-08-28 2010-08-27 阻焊层和印刷电路板

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2010102669638A Pending CN102006717A (zh) 2009-08-28 2010-08-27 阻焊层和印刷电路板

Country Status (4)

Country Link
JP (1) JP5479821B2 (ko)
KR (1) KR101180583B1 (ko)
CN (2) CN103732001B (ko)
TW (1) TWI418938B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5897360B2 (ja) * 2012-03-15 2016-03-30 サンワ化学工業株式会社 Ｌｅｄ用ソルダーレジストを形成するための組成物
JP6130693B2 (ja) 2012-03-30 2017-05-17 太陽インキ製造株式会社 積層構造体、ドライフィルムおよび積層構造体の製造方法
JP5797824B1 (ja) 2014-09-19 2015-10-21 太陽インキ製造株式会社 プリント配線板用硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6637674B2 (ja) 2015-04-30 2020-01-29 信越化学工業株式会社 プリント配線板、プリント配線板の製造方法、及び半導体装置
JP6675111B2 (ja) * 2015-08-03 2020-04-01 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
JP6704189B2 (ja) * 2015-08-03 2020-06-03 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
CN107215113A (zh) * 2017-05-16 2017-09-29 胜宏科技（惠州）股份有限公司 一种用于镭雕条形码文字白油块的制作方法
JP7300619B2 (ja) * 2019-01-11 2023-06-30 太陽ホールディングス株式会社 積層構造体、ドライフィルム、その硬化物および電子部品
KR102398123B1 (ko) 2020-06-10 2022-05-17 한국다이요잉크 주식회사 솔더 레지스트 수지 조성물, 솔더 레지스트 구조체, 드라이 필름 및 인쇄 배선판
KR20220123872A (ko) * 2021-03-02 2022-09-13 삼성전자주식회사 백라이트 유닛, 이를 포함하는 디스플레이 장치, 및 백라이트 유닛의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101105629A (zh) * 2006-07-12 2008-01-16 太阳油墨制造株式会社 光固化性·热固化性的一液型阻焊剂组合物及印刷线路板
CN101445644A (zh) * 2007-11-30 2009-06-03 太阳油墨制造株式会社 白色固化性树脂组合物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2714691B2 (ja) * 1989-06-06 1998-02-16 イビデン株式会社 電子部品搭載用基板の製造方法
JPH05327190A (ja) * 1992-05-26 1993-12-10 Matsushita Electric Works Ltd プリント配線板への印刷方法
JP2908152B2 (ja) * 1992-12-04 1999-06-21 富山日本電気株式会社 液状感光性ソルダーレジスト用現像液
JPH08204316A (ja) * 1995-01-27 1996-08-09 Matsushita Electric Works Ltd プリント配線板、及びその製造方法
JP4155434B2 (ja) * 1999-10-12 2008-09-24 日本サーキット工業株式会社 部分電解メッキ処理されたパッドを有する半導体パッケージ用基板の製造法
JP2002043723A (ja) * 2000-07-25 2002-02-08 Kyocera Corp 配線基板およびこれを用いた電子部品モジュール
JP2002271026A (ja) * 2001-03-14 2002-09-20 Sony Corp 多層型プリント配線基板及び多層型プリント配線基板の製造方法
JP4669703B2 (ja) * 2005-01-19 2011-04-13 イビデン株式会社 プリント配線板及びその製法
JP2007299787A (ja) 2006-04-27 2007-11-15 Toyoda Gosei Co Ltd 発光装置
JP4340272B2 (ja) * 2006-05-30 2009-10-07 太陽インキ製造株式会社 光硬化性・熱硬化性ソルダーレジスト組成物およびそれを用いたプリント配線板
JP4538484B2 (ja) * 2006-10-24 2010-09-08 太陽インキ製造株式会社 光硬化性熱硬化性樹脂組成物およびそれを用いたプリント配線板
US20090141505A1 (en) * 2007-11-30 2009-06-04 Taiyo Ink Mfg., Co,. Ltd. White heat-hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
US20110042124A1 (en) * 2007-12-05 2011-02-24 Mitsubishi Plastics, Inc. Multilayer wiring substrate having cavity portion

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101105629A (zh) * 2006-07-12 2008-01-16 太阳油墨制造株式会社 光固化性·热固化性的一液型阻焊剂组合物及印刷线路板
CN101445644A (zh) * 2007-11-30 2009-06-03 太阳油墨制造株式会社 白色固化性树脂组合物

Also Published As

Publication number Publication date
TW201131298A (en) 2011-09-16
CN102006717A (zh) 2011-04-06
JP2011049476A (ja) 2011-03-10
KR101180583B1 (ko) 2012-09-06
KR20110023798A (ko) 2011-03-08
CN103732001A (zh) 2014-04-16
TWI418938B (zh) 2013-12-11
JP5479821B2 (ja) 2014-04-23

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