CN103730355B - 一种超结结构的制造方法 - Google Patents
一种超结结构的制造方法 Download PDFInfo
- Publication number
- CN103730355B CN103730355B CN201310734654.2A CN201310734654A CN103730355B CN 103730355 B CN103730355 B CN 103730355B CN 201310734654 A CN201310734654 A CN 201310734654A CN 103730355 B CN103730355 B CN 103730355B
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- epitaxial layer
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- groove
- drift region
- type epitaxial
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 8
- 238000002513 implantation Methods 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 230000001413 cellular effect Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000407 epitaxy Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/063—Reduced surface field [RESURF] pn-junction structures
- H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310734654.2A CN103730355B (zh) | 2013-12-27 | 2013-12-27 | 一种超结结构的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310734654.2A CN103730355B (zh) | 2013-12-27 | 2013-12-27 | 一种超结结构的制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN103730355A CN103730355A (zh) | 2014-04-16 |
CN103730355B true CN103730355B (zh) | 2016-05-11 |
Family
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Family Applications (1)
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CN201310734654.2A Active CN103730355B (zh) | 2013-12-27 | 2013-12-27 | 一种超结结构的制造方法 |
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CN (1) | CN103730355B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108022924B (zh) * | 2017-11-30 | 2020-08-07 | 上海华虹宏力半导体制造有限公司 | 沟槽型超级结及其制造方法 |
CN108400093A (zh) * | 2018-02-05 | 2018-08-14 | 上海华虹宏力半导体制造有限公司 | 超级结器件工艺方法 |
CN112447505B (zh) * | 2019-09-03 | 2022-11-22 | 华润微电子(重庆)有限公司 | 自平衡超结结构及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102623350A (zh) * | 2012-04-11 | 2012-08-01 | 无锡新洁能功率半导体有限公司 | 具有超结结构的半导体器件的制造方法 |
CN103022087A (zh) * | 2011-09-26 | 2013-04-03 | 朱江 | 一种半导体晶片及其制造方法 |
CN103022086A (zh) * | 2011-09-26 | 2013-04-03 | 朱江 | 一种半导体晶片及其制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146429A (ja) * | 2010-01-12 | 2011-07-28 | Renesas Electronics Corp | パワー系半導体装置 |
JP5556335B2 (ja) * | 2010-04-27 | 2014-07-23 | 富士電機株式会社 | 超接合半導体装置の製造方法 |
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2013
- 2013-12-27 CN CN201310734654.2A patent/CN103730355B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103022087A (zh) * | 2011-09-26 | 2013-04-03 | 朱江 | 一种半导体晶片及其制造方法 |
CN103022086A (zh) * | 2011-09-26 | 2013-04-03 | 朱江 | 一种半导体晶片及其制备方法 |
CN102623350A (zh) * | 2012-04-11 | 2012-08-01 | 无锡新洁能功率半导体有限公司 | 具有超结结构的半导体器件的制造方法 |
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CN103730355A (zh) | 2014-04-16 |
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Address after: 710021 export processing zone, No. twelve, 1 road, Fengcheng, Shaanxi, Xi'an Patentee after: Longteng Semiconductor Co.,Ltd. Address before: 710021 export processing zone, No. twelve, 1 road, Fengcheng, Shaanxi, Xi'an Patentee before: LONTEN SEMICONDUCTOR Co.,Ltd. Address after: 710021 export processing zone, No. twelve, 1 road, Fengcheng, Shaanxi, Xi'an Patentee after: LONTEN SEMICONDUCTOR Co.,Ltd. Address before: 710021 export processing zone, No. twelve, 1 road, Fengcheng, Shaanxi, Xi'an Patentee before: Xi'an Lonten Renewable Energy Technology Inc. |
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Effective date of registration: 20220324 Address after: 710000 export processing zone, No. 1, Fengcheng 12th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee after: Longteng Semiconductor Co.,Ltd. Patentee after: Xi'an Longxiang Semiconductor Co.,Ltd. Address before: 710021 export processing zone, No.1, Fengcheng 12th Road, Xi'an City, Shaanxi Province Patentee before: Longteng Semiconductor Co.,Ltd. |
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