CN103681229A - 粘合带粘贴方法和粘合带粘贴装置 - Google Patents

粘合带粘贴方法和粘合带粘贴装置 Download PDF

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Publication number
CN103681229A
CN103681229A CN201310388691.2A CN201310388691A CN103681229A CN 103681229 A CN103681229 A CN 103681229A CN 201310388691 A CN201310388691 A CN 201310388691A CN 103681229 A CN103681229 A CN 103681229A
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CN
China
Prior art keywords
adhesive tape
mentioned
tension force
semiconductor crystal
ring frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310388691.2A
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English (en)
Chinese (zh)
Inventor
奥野长平
山本雅之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN103681229A publication Critical patent/CN103681229A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CN201310388691.2A 2012-08-31 2013-08-30 粘合带粘贴方法和粘合带粘贴装置 Pending CN103681229A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012191758A JP6059921B2 (ja) 2012-08-31 2012-08-31 粘着テープ貼付け方法および粘着テープ貼付け装置
JP2012-191758 2012-08-31

Publications (1)

Publication Number Publication Date
CN103681229A true CN103681229A (zh) 2014-03-26

Family

ID=50318444

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310388691.2A Pending CN103681229A (zh) 2012-08-31 2013-08-30 粘合带粘贴方法和粘合带粘贴装置

Country Status (4)

Country Link
JP (1) JP6059921B2 (ja)
KR (1) KR20140029313A (ja)
CN (1) CN103681229A (ja)
TW (1) TW201419443A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106340483A (zh) * 2015-07-06 2017-01-18 株式会社迪思科 卡盘工作台和清洗装置
CN110323157A (zh) * 2018-03-29 2019-10-11 日东电工株式会社 粘合带粘贴方法和粘合带粘贴装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6636696B2 (ja) * 2014-12-25 2020-01-29 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置
JP6706979B2 (ja) * 2016-06-27 2020-06-10 株式会社ディスコ 拡張装置及び拡張方法
KR102499977B1 (ko) 2016-07-13 2023-02-15 삼성전자주식회사 접착 테이프 부착 장치 및 이를 이용한 반도체 패키지의 제조 방법
KR101896384B1 (ko) * 2016-10-04 2018-09-07 주식회사 대성엔지니어링 진공 라미네이터용 챔버장치
JP6848151B2 (ja) * 2017-05-29 2021-03-24 リンテック株式会社 離間装置および離間方法
KR102416073B1 (ko) * 2018-02-28 2022-07-01 미쓰이 가가쿠 토세로 가부시키가이샤 부품 제조 방법, 보지 필름 및 보지구 형성 장치
JP7285133B2 (ja) * 2019-05-17 2023-06-01 日東電工株式会社 シート材貼付け方法およびシート材貼付け装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142156A (ja) * 1988-11-22 1990-05-31 Takatori Haitetsuku:Kk ウエハートレーのテープ貼着装置
US20010017547A1 (en) * 2000-02-29 2001-08-30 Mitsuhiro Furuta Tape-like member transfer system
CN101017767A (zh) * 2006-02-09 2007-08-15 日东电工株式会社 工件粘贴支承方法和使用该方法的工件粘贴支承装置
CN102097294A (zh) * 2009-11-20 2011-06-15 日东电工株式会社 粘合带粘贴装置及粘合带粘贴方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02182656A (ja) * 1989-01-09 1990-07-17 Konica Corp ウェブの張力調整装置
JPH07263524A (ja) * 1994-03-22 1995-10-13 Teikoku Seiki Kk 半導体製造装置におけるテープ展張装置及びこのテープ展張装置を備える半導体製造装置
JP2000019860A (ja) * 1998-06-30 2000-01-21 Ricoh Co Ltd 画像形成装置
JP2002225020A (ja) * 2001-01-30 2002-08-14 Ishikawajima Harima Heavy Ind Co Ltd グリーンセラミックス成型体の成型方法および成型装置
JP4698519B2 (ja) * 2006-07-31 2011-06-08 日東電工株式会社 半導体ウエハマウント装置
JP5542582B2 (ja) * 2010-08-26 2014-07-09 リンテック株式会社 シート貼付装置および貼付方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142156A (ja) * 1988-11-22 1990-05-31 Takatori Haitetsuku:Kk ウエハートレーのテープ貼着装置
US20010017547A1 (en) * 2000-02-29 2001-08-30 Mitsuhiro Furuta Tape-like member transfer system
CN101017767A (zh) * 2006-02-09 2007-08-15 日东电工株式会社 工件粘贴支承方法和使用该方法的工件粘贴支承装置
CN102097294A (zh) * 2009-11-20 2011-06-15 日东电工株式会社 粘合带粘贴装置及粘合带粘贴方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106340483A (zh) * 2015-07-06 2017-01-18 株式会社迪思科 卡盘工作台和清洗装置
CN106340483B (zh) * 2015-07-06 2021-11-19 株式会社迪思科 卡盘工作台和清洗装置
CN110323157A (zh) * 2018-03-29 2019-10-11 日东电工株式会社 粘合带粘贴方法和粘合带粘贴装置

Also Published As

Publication number Publication date
KR20140029313A (ko) 2014-03-10
JP2014049627A (ja) 2014-03-17
JP6059921B2 (ja) 2017-01-11
TW201419443A (zh) 2014-05-16

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Application publication date: 20140326