CN103647006A - 一种led-cob光源及其制备方法 - Google Patents

一种led-cob光源及其制备方法 Download PDF

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CN103647006A
CN103647006A CN201310693538.0A CN201310693538A CN103647006A CN 103647006 A CN103647006 A CN 103647006A CN 201310693538 A CN201310693538 A CN 201310693538A CN 103647006 A CN103647006 A CN 103647006A
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吴懿平
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Zhuhai One Core Semiconductor Technology Co Ltd
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Abstract

本发明公开了一种LED-COB光源，包括片式散热支架，与之一体设置的内封装有至少一颗LED芯片的反光碗或反光槽。其制备方法为：在片式散热支架上冲压出反光碗或反光槽，并镀银，在其内放置LED芯片，用导线串并联后与电极相连；用塑封胶将电极与散热支架电绝缘相连；先用或不用荧光粉胶涂覆在LED芯片上，烘干固化，再在LED芯片上涂覆一个环氧树脂帽或硅胶帽，烘干固化；将电极与片式散热支架连接部分冲裁掉。本发明结构简单、散热良好、使用性能佳，应用于LED灯具，不需再额外设置散热结构，有效降低生产成本、节约资源。

Description

一种LED-COB光源及其制备方法
技术领域
本发明涉及一种光源，具体涉及一种LED-COB光源及其制备方法。
背景技术
LED-COB即chip on board，就是将裸芯片用导电或非导电胶粘附在互连基板上，然后进行引线键合实现其电连接。随着LED封装技术的进步，COB灯珠成为LED光源的主流，直插式的LED灯珠因其热阻大、光衰快、寿命短等缺点逐渐淡出了LED照明与显示的舞台，这使得直插式LED灯珠的生产设备很多都闲置下来，造成资源浪费。
另外，传统的LED-COB光源的灯珠芯片直接封装在铝基板上，芯片的发热量远远超过了铝基板的散热能力，散热效果差，必须再进行外部的散热设计，这就增加了LED灯具的设计成本，制成的LED灯具结构复杂。
发明内容
本发明的任务是提供一种结构简单、散热良好、能有效降低生产成本、节约资源、性能良好的LED-COB光源，及制备该LED-COB光源的方法。
本发明通过下述技术方案来实现：
一种LED-COB光源，包括LED芯片和电极，LED芯片与电极电连接，其特征在于：所述LED-COB光源还包括片式散热支架，设置于片式散热支架上的反光碗或反光槽；反光碗或反光槽与片式散热支架为一体结构；所述LED芯片包括至少一颗，封装于反光碗或反光槽内；所述电极设置于片式散热支架上。
 本发明进一步的改进方案包括：
所述片式散热支架为金属支架；所述反光碗或反光槽为片式散热支架一侧面上直接冲压而成的反光碗或反光槽。
所述反光槽为底部内凹而两侧外张的长条形的开口槽。
所述电极包括正电极和负电极，电极为片式散热支架上直接冲裁出的金属片；电极通过塑封胶与片式散热支架电绝缘相连。
在所述反光碗或反光槽的内表面镀有银层；所述LED芯片之间用导线电连接成LED芯片组，LED芯片组的正极、负极分别与所述正电极、所述负电极连接。
在所述LED芯片上覆盖有环氧树脂帽或硅胶帽。
在所述LED芯片上覆盖有荧光粉胶，荧光粉胶上覆盖有环氧树脂帽或硅胶帽。
所述片式散热支架为铝、铜、铁支架。
一种LED-COB光源的制备方法，其特征在于：包括以下步骤：
a、在片式散热支架上直接冲裁出金属片，该冲裁出的金属片为电极；
b、在片式散热支架的侧面冲压出分离式的反光碗或长条状的反光槽；
c、将电极与片式散热支架电绝缘相连；
 d、在反光碗或反光槽内放置一颗LED芯片，将其正极、负极分别与片式散热支架上的正电极、负电极相连；或在反光碗或反光槽内放置多颗LED芯片，并用导线对多颗LED芯片进行串联和/或并联，形成LED芯片组，再将LED芯片组的正极、负极连至片式散热支架上的正电极、负电极上；
e、在LED芯片上涂覆一个环氧树脂帽或硅胶帽，烘干固化；或先用荧光粉胶涂覆在LED芯片上，烘干固化，再在荧光粉胶体上涂覆一个环氧树脂帽或硅胶帽，烘干固化；
f、将电极与片式散热支架的连接的金属部分裁掉。
所述步骤b 还包括对反光碗或反光槽进行镀银处理的步骤；所述步骤c中的电极与片式散热支架通过塑封胶电绝缘相连；所述步骤f中电极与片式散热支架的连接的金属部分通过冲脚机冲裁掉。
本发明具有以下优点：结构简单、散热良好、使用性能佳，应用于LED灯具，不需再额外设置散热结构，有效降低生产成本、节约资源，而且可以再将直插式LED灯珠的生产设备利用起来。
附图说明
图1是本发明一种LED-COB光源的剖视图；
图2是本发明中片式散热支架在冲压反光槽前的示意图；
图3是本发明中片式散热支架在冲压反光槽后的示意图；
图4是图1的A处局部放大图
其中：1-电极，2-片式散热支架，3-反光槽，4- LED芯片，5-塑封胶，6-导线，7-环氧树脂帽或硅胶帽，8-荧光粉胶。
具体实施方式
下面结合附图对本发明一种LED-COB光源及其制备方法作进一步描述:
实施例1：
一种LED-COB光源，包括LED芯片4和电极1，LED芯片4与电极1电连接。该 LED-COB光源还包括片式散热支架2，设置于片式散热支架2上的反光碗或反光槽3；反光碗或反光槽3与片式散热支架2为一体结构；LED芯片4包括至少一颗，封装于反光碗或反光槽3内；电极1设置于片式散热支架2上。其中片式散热支架优选为金属支架，更优选其为铝片、铜片、铁片等导热良好的材料。
其中反光碗或反光槽3是在片式散热支架2一侧面上直接冲压而成的（如图3所示），优选该冲压成的反光槽3为底部内凹而两侧外张的长条形的开口槽；片式散热支架2的侧面是指其厚度方向的表面；此种方式的结构设置，使得此种LED-COB光源的散热效果远远优于传统的将LED芯片封装在铝基板正面的光源。
其中电极1包括正电极1和负电极1，其为片式散热支架2上直接冲裁出的金属片；电极1通过塑封胶5与片式散热支架2电绝缘相连。电极的制作流程如下：先在片式散热支架2上冲裁出金属片，该金属片作为电极（如图2所示），再将正电极和负电极通过塑封胶5与片式散热支架2相连，再用冲脚机将电极1与片式散热支架2的连接的金属部分冲裁掉，实现电极1与片式散热支架2之间电绝缘相连。
优选在反光碗或反光槽3的内表面镀有银层，此种结构能够增强导热效果。LED芯片4包括多个，它们之间用导线6电连接成LED芯片组，LED芯片组的正极、负极分别与正电极1、负电极1连接，导线优选为金线、铜线、铝线或合金线。
其中LED芯片的封装可以用或不用荧光粉胶。如不用荧光粉胶，直接在在LED芯片4上涂覆环氧树脂或硅胶，烘干固化，形成环氧树脂帽或硅胶帽7。如果用荧光粉胶，先在LED芯片4上涂覆荧光粉胶8后，烘干固化，再在荧光粉胶上涂覆环氧树脂或硅胶，烘干固化后，形成环氧树脂帽或硅胶帽7。
这种LED-COB光源能应用于各种LED灯具，包括但不限于球泡灯、筒灯、台灯、投光灯、暗槽灯等。
上述LED-COB光源的制备方法如下：
包括以下步骤：
a、在片式散热支架2上直接冲裁出金属片，该冲裁出的金属片为电极；
b、在片式散热支架2的侧面冲压出分离式的反光碗或长条状的反光槽3；
c、将电极1与片式散热支架2电绝缘相连； 
d、在反光碗或反光槽3内放置一颗LED芯片4，将其正极、负极分别与片式散热支架2上的正电极、负电极相连；或在反光碗或反光槽3内放置多颗LED芯片4，并用导线6对多颗LED芯片4进行串联和/或并联，形成LED芯片组，再将LED芯片组的正极、负极连至片式散热支架2上的正电极、负电极上；
e、在LED芯片4上涂覆一个环氧树脂帽或硅胶帽7，烘干固化；或先用荧光粉胶8涂覆在LED芯片4上，烘干固化，再在荧光粉胶体上涂覆一个环氧树脂帽或硅胶帽7，烘干固化；
f、将电极1与片式散热支架2的连接的金属部分裁掉。
优选步骤b 还包括对反光碗或反光槽3进行镀银处理的步骤；步骤c中的电极1与片式散热支架2通过塑封胶5电绝缘相连；步骤f中电极1与片式散热支架2的连接的金属部分通过冲脚机冲裁掉；
其中上述制备LED-COB光源的方法的步骤不限定为唯一先后顺序，可以根据需要进行调整，只要能制成本发明的LED-COB光源均在本发明的保护范围内。
本发明详细介绍了一种实施方式及其附图，但本发明不限于该实施例及其附图，本领域普通技术人员根据本发明，不付出创造性劳动，对其进行修改、等同替换、改进等而得到的其他实施方式及其附图，均在本发明的保护范围内。

Claims (10)

1.一种LED-COB光源，包括LED芯片（4）和电极（1），LED芯片（4）与电极（1）电连接，其特征在于：所述LED-COB光源还包括片式散热支架（2），设置于片式散热支架（2）上的反光碗或反光槽（3）；反光碗或反光槽（3）与片式散热支架（2）为一体结构；所述LED芯片（4）包括至少一颗，封装于反光碗或反光槽（3）内；所述电极（1）设置于片式散热支架（2）上。
2.根据权利要求1所述的一种LED-COB光源，其特征在于：所述片式散热支架（2）为金属支架；所述反光碗或反光槽（3）为片式散热支架（2）一侧面上直接冲压而成的反光碗或反光槽（3）。
3.根据权利要求2所述的一种LED-COB光源，其特征在于：所述反光槽（3）为底部内凹而两侧外张的长条形的开口槽。
4.根据权利要求1至3中任一权利要求所述的一种LED-COB光源，其特征在于：所述电极（1）包括正电极和负电极，电极（1）为片式散热支架（2）上直接冲裁出的金属片；电极（1）通过塑封胶（5）与片式散热支架（2）电绝缘相连。
5.根据权利要求4所述的一种LED-COB光源，其特征在于：在所述反光碗或反光槽（3）的内表面镀有银层；所述LED芯片（4）之间用导线（6）电连接成LED芯片组，LED芯片组的正极、负极分别与所述正电极、所述负电极连接。
6.根据权利要求5所述的一种LED-COB光源，其特征在于：在所述LED芯片（4）上覆盖有环氧树脂帽或硅胶帽（7）。
7.根据权利要求5所述的一种LED-COB光源，其特征在于：在所述LED芯片（4）上覆盖有荧光粉胶（8），荧光粉胶上覆盖有环氧树脂帽或硅胶帽（7）。
8.根据权利要求1所述的一种LED-COB光源，其特征在于：所述片式散热支架（2）为铝、铜、铁支架。
9.一种LED-COB光源的制备方法，其特征在于：包括以下步骤：
a、在片式散热支架（2）上直接冲裁出金属片，该冲裁出的金属片为电极；
b、在片式散热支架（2）的侧面冲压出分离式的反光碗或长条状的反光槽（3）；
c、将电极（1）与片式散热支架（2）电绝缘相连；
d、在反光碗或反光槽（3）内放置一颗LED芯片（4），将其正极、负极分别与片式散热支架（2）上的正电极、负电极相连；或在反光碗或反光槽（3）内放置多颗LED芯片（4），并用导线（6）对多颗LED芯片（4）进行串联和/或并联，形成LED芯片组，再将LED芯片组的正极、负极连至片式散热支架（2）上的正电极、负电极上；
e、在LED芯片（4）上涂覆一个环氧树脂帽或硅胶帽（7），烘干固化；或先用荧光粉胶（8）涂覆在LED芯片（4）上，烘干固化，再在荧光粉胶体上涂覆一个环氧树脂帽或硅胶帽（7），烘干固化；
f、将电极（1）与片式散热支架（2）的连接的金属部分裁掉。
10.根据权利要求9所述的一种LED-COB光源的制备方法，其特征在于：所述步骤b 还包括对反光碗或反光槽（3）进行镀银处理的步骤；所述步骤c中的电极（1）与片式散热支架（2）通过塑封胶（5）电绝缘相连；所述步骤f中电极（1）与片式散热支架（2）的连接的金属部分通过冲脚机冲裁掉。
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