CN103597913B - 等离子体发生装置、以及蒸镀装置和蒸镀方法 - Google Patents
等离子体发生装置、以及蒸镀装置和蒸镀方法 Download PDFInfo
- Publication number
- CN103597913B CN103597913B CN201380001628.7A CN201380001628A CN103597913B CN 103597913 B CN103597913 B CN 103597913B CN 201380001628 A CN201380001628 A CN 201380001628A CN 103597913 B CN103597913 B CN 103597913B
- Authority
- CN
- China
- Prior art keywords
- plasma
- magnetic flux
- coil
- electrode
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/48—Generating plasma using an arc
- H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-088547 | 2012-04-09 | ||
JP2012088547A JP5968666B2 (ja) | 2012-04-09 | 2012-04-09 | プラズマ発生装置および蒸着装置 |
PCT/JP2013/055230 WO2013153864A1 (ja) | 2012-04-09 | 2013-02-27 | プラズマ発生装置並びに蒸着装置および蒸着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103597913A CN103597913A (zh) | 2014-02-19 |
CN103597913B true CN103597913B (zh) | 2016-09-14 |
Family
ID=49327443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380001628.7A Expired - Fee Related CN103597913B (zh) | 2012-04-09 | 2013-02-27 | 等离子体发生装置、以及蒸镀装置和蒸镀方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140158047A1 (de) |
EP (1) | EP2838324A4 (de) |
JP (1) | JP5968666B2 (de) |
KR (1) | KR101953930B1 (de) |
CN (1) | CN103597913B (de) |
TW (1) | TWI604077B (de) |
WO (1) | WO2013153864A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2016282065A1 (en) * | 2015-06-23 | 2018-02-08 | Aurora Labs Limited | Plasma driven particle propagation apparatus and pumping method |
CN113056083A (zh) * | 2019-12-26 | 2021-06-29 | 上海宏澎能源科技有限公司 | 等离子束发生装置 |
CN113365402B (zh) * | 2020-03-06 | 2023-04-07 | 上海宏澎能源科技有限公司 | 限制等离子束的装置 |
CN114442437B (zh) * | 2020-10-30 | 2024-05-17 | 上海宏澎能源科技有限公司 | 光源装置 |
CN114921764B (zh) * | 2022-06-28 | 2023-09-22 | 松山湖材料实验室 | 一种用于高功率脉冲磁控溅射的装置及方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4739170A (en) * | 1985-05-09 | 1988-04-19 | The Commonwealth Of Australia | Plasma generator |
JPH04329637A (ja) * | 1991-05-01 | 1992-11-18 | Fuji Electric Co Ltd | 絶縁膜の製造方法 |
CN1135538A (zh) * | 1994-12-28 | 1996-11-13 | 住友重机械工业株式会社 | 等离子处理方法及其处理装置 |
CN1197848A (zh) * | 1997-02-28 | 1998-11-04 | 住友重机械工业株式会社 | 真空薄膜生长设备 |
CN1263952A (zh) * | 1999-02-01 | 2000-08-23 | 中外炉工业株式会社 | 真空涂层形成装置 |
JP2001295031A (ja) * | 2000-04-14 | 2001-10-26 | Sumitomo Heavy Ind Ltd | 成膜装置及び方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0215166A (ja) * | 1988-07-04 | 1990-01-18 | Kawasaki Steel Corp | イオンプレーティング装置 |
JPH0222464A (ja) * | 1988-07-12 | 1990-01-25 | Raimuzu:Kk | イオンプレーティング装置 |
US5397956A (en) * | 1992-01-13 | 1995-03-14 | Tokyo Electron Limited | Electron beam excited plasma system |
JPH0765170B2 (ja) * | 1992-01-30 | 1995-07-12 | 中外炉工業株式会社 | 薄膜形成装置におけるプラズマ走査装置 |
JP3409874B2 (ja) * | 1993-03-12 | 2003-05-26 | 株式会社アルバック | イオンプレーティング装置 |
JPH0776770A (ja) | 1993-09-10 | 1995-03-20 | A G Technol Kk | 蒸着装置 |
JPH07254315A (ja) * | 1994-03-14 | 1995-10-03 | Nippon Sheet Glass Co Ltd | 被膜の形成方法 |
US7300559B2 (en) * | 2000-04-10 | 2007-11-27 | G & H Technologies Llc | Filtered cathodic arc deposition method and apparatus |
JP4627365B2 (ja) * | 2000-11-17 | 2011-02-09 | 中外炉工業株式会社 | 圧力勾配型プラズマ発生装置の始動方法 |
JP2003008197A (ja) * | 2001-06-20 | 2003-01-10 | Fujitsu Ten Ltd | 基板加熱装置 |
JP3744467B2 (ja) * | 2002-06-04 | 2006-02-08 | 日新電機株式会社 | 真空アーク蒸着方法及びその装置 |
US7033462B2 (en) * | 2001-11-30 | 2006-04-25 | Nissin Electric Co., Ltd. | Vacuum arc vapor deposition process and apparatus |
JP4003448B2 (ja) * | 2001-11-30 | 2007-11-07 | 日新電機株式会社 | 真空アーク蒸着方法及びその装置 |
JP2004010920A (ja) * | 2002-06-04 | 2004-01-15 | Nissin Electric Co Ltd | 真空アーク蒸着装置 |
KR100606451B1 (ko) * | 2004-06-16 | 2006-08-01 | 송석균 | 상압 플라즈마 발생장치 |
JP3793816B2 (ja) * | 2003-10-03 | 2006-07-05 | 国立大学法人東北大学 | プラズマ制御方法、及びプラズマ制御装置 |
JP2008038197A (ja) | 2006-08-04 | 2008-02-21 | Shin Meiwa Ind Co Ltd | プラズマ成膜装置 |
-
2012
- 2012-04-09 JP JP2012088547A patent/JP5968666B2/ja not_active Expired - Fee Related
-
2013
- 2013-02-27 CN CN201380001628.7A patent/CN103597913B/zh not_active Expired - Fee Related
- 2013-02-27 KR KR1020137031520A patent/KR101953930B1/ko active IP Right Grant
- 2013-02-27 EP EP13776393.4A patent/EP2838324A4/de not_active Withdrawn
- 2013-02-27 US US14/117,346 patent/US20140158047A1/en not_active Abandoned
- 2013-02-27 WO PCT/JP2013/055230 patent/WO2013153864A1/ja active Application Filing
- 2013-04-01 TW TW102111668A patent/TWI604077B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4739170A (en) * | 1985-05-09 | 1988-04-19 | The Commonwealth Of Australia | Plasma generator |
JPH04329637A (ja) * | 1991-05-01 | 1992-11-18 | Fuji Electric Co Ltd | 絶縁膜の製造方法 |
CN1135538A (zh) * | 1994-12-28 | 1996-11-13 | 住友重机械工业株式会社 | 等离子处理方法及其处理装置 |
CN1197848A (zh) * | 1997-02-28 | 1998-11-04 | 住友重机械工业株式会社 | 真空薄膜生长设备 |
CN1263952A (zh) * | 1999-02-01 | 2000-08-23 | 中外炉工业株式会社 | 真空涂层形成装置 |
JP2001295031A (ja) * | 2000-04-14 | 2001-10-26 | Sumitomo Heavy Ind Ltd | 成膜装置及び方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5968666B2 (ja) | 2016-08-10 |
TW201348480A (zh) | 2013-12-01 |
US20140158047A1 (en) | 2014-06-12 |
EP2838324A1 (de) | 2015-02-18 |
KR20140143072A (ko) | 2014-12-15 |
WO2013153864A1 (ja) | 2013-10-17 |
JP2013218881A (ja) | 2013-10-24 |
EP2838324A4 (de) | 2015-09-23 |
CN103597913A (zh) | 2014-02-19 |
KR101953930B1 (ko) | 2019-03-04 |
TWI604077B (zh) | 2017-11-01 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160914 Termination date: 20210227 |