CN103579366B - Tvs器件及制造方法 - Google Patents
Tvs器件及制造方法 Download PDFInfo
- Publication number
- CN103579366B CN103579366B CN201210276113.5A CN201210276113A CN103579366B CN 103579366 B CN103579366 B CN 103579366B CN 201210276113 A CN201210276113 A CN 201210276113A CN 103579366 B CN103579366 B CN 103579366B
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- buried layer
- heavily doped
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 33
- 229920005591 polysilicon Polymers 0.000 claims abstract description 28
- 238000000605 extraction Methods 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 5
- 238000002955 isolation Methods 0.000 claims description 31
- 238000000407 epitaxy Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims description 10
- 239000011574 phosphorus Substances 0.000 claims description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 238000002513 implantation Methods 0.000 claims description 4
- 238000005468 ion implantation Methods 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 239000002019 doping agent Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 230000001052 transient effect Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- APTZNLHMIGJTEW-UHFFFAOYSA-N pyraflufen-ethyl Chemical compound C1=C(Cl)C(OCC(=O)OCC)=CC(C=2C(=C(OC(F)F)N(C)N=2)Cl)=C1F APTZNLHMIGJTEW-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8611—Planar PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66128—Planar diodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Element Separation (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210276113.5A CN103579366B (zh) | 2012-08-03 | 2012-08-03 | Tvs器件及制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210276113.5A CN103579366B (zh) | 2012-08-03 | 2012-08-03 | Tvs器件及制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103579366A CN103579366A (zh) | 2014-02-12 |
CN103579366B true CN103579366B (zh) | 2016-04-13 |
Family
ID=50050729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210276113.5A Active CN103579366B (zh) | 2012-08-03 | 2012-08-03 | Tvs器件及制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103579366B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105990230B (zh) * | 2015-02-04 | 2019-04-26 | 中芯国际集成电路制造(上海)有限公司 | 制备esd器件的方法、esd器件 |
CN107316863B (zh) * | 2017-07-12 | 2019-05-07 | 新昌县佳良制冷配件厂 | 瞬态电压抑制器及其制作方法 |
CN107527907B (zh) * | 2017-08-31 | 2024-04-09 | 北京燕东微电子有限公司 | 瞬态电压抑制器及其制造方法 |
CN108565259B (zh) * | 2018-04-08 | 2022-03-01 | 南京矽力微电子技术有限公司 | 半导体器件及其制造方法 |
CN109244069B (zh) * | 2018-09-19 | 2020-12-15 | 浙江昌新生物纤维股份有限公司 | 瞬态电压抑制器及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1850396A2 (en) * | 2006-04-28 | 2007-10-31 | Nissan Motor Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN101847663A (zh) * | 2010-04-30 | 2010-09-29 | 上海新进半导体制造有限公司 | 一种瞬间电压抑制器及形成瞬间电压抑制器的方法 |
-
2012
- 2012-08-03 CN CN201210276113.5A patent/CN103579366B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1850396A2 (en) * | 2006-04-28 | 2007-10-31 | Nissan Motor Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN101847663A (zh) * | 2010-04-30 | 2010-09-29 | 上海新进半导体制造有限公司 | 一种瞬间电压抑制器及形成瞬间电压抑制器的方法 |
Also Published As
Publication number | Publication date |
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CN103579366A (zh) | 2014-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140117 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20140117 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |