CN103521953A - 一种预成型焊片助焊剂的涂覆工艺 - Google Patents

一种预成型焊片助焊剂的涂覆工艺 Download PDF

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CN103521953A
CN103521953A CN201310509937.7A CN201310509937A CN103521953A CN 103521953 A CN103521953 A CN 103521953A CN 201310509937 A CN201310509937 A CN 201310509937A CN 103521953 A CN103521953 A CN 103521953A
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scaling powder
powder
coating
preformed soldering
coating processes
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CN103521953B (zh
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赵锦业
叶富华
陆雁
韩华
陈明汉
黄耀林
杜昆
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Guangzhou Hanyuan Microelectronic Packaging Material Co ltd
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GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co Ltd
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Priority to JP2016549608A priority patent/JP6226350B2/ja
Priority to US15/031,284 priority patent/US20160288269A1/en
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Abstract

对于需要涂覆助焊剂的预成型焊片，助焊剂涂覆工艺通常是在预成型焊片上浸润一层液体助焊剂，经干燥成型而获得助焊剂涂层，但使用的液体助焊剂含挥发性有机溶剂，易造成操作人员的健康危害。本发明提供一种环保型的预成型焊片助焊剂涂覆工艺，工艺流程为：焊片预处理→粉末制备→涂覆→固化→后处理。本发明具有涂覆均匀稳定、涂覆厚度可控性高、结合力强、高效环保和成本低等优点，适用于各种预成型焊片表面的助焊剂涂覆。

Description

一种预成型焊片助焊剂的涂覆工艺
技术领域
本发明涉及助焊剂涂覆技术领域，特别涉及一种预成型焊片助焊剂的涂覆工艺，尤其适用于各种预成型焊片表面的助焊剂涂覆。
背景技术
预成型焊片是一种可按要求制成不同的形状、大小和表面形态的精密成型的焊料，适用于小公差的各种制造过程，广泛应用于印制线路板（PCB）组装、连接器和终端设备、芯片连接、电源模块基板附着、过滤连接器和电子组件装配等领域。预成型焊片通常用于对焊料的形状和质量有特殊要求的场合，可以做成任意尺寸和形状以满足客户的需要。预成型焊片具有形状多样性、可焊性好且能减少助焊剂飞溅、单独使用可以精确控制金属使用量等优点，已被确定为焊接中技术革新的一种重要手段。
为实现理想的精确焊接效果，预成型焊片通常需要涂覆一定的助焊剂。关于预成型焊片表面的助焊剂涂覆技术，目前只有少数发明专利涉及，例如CN 103056556A，CN 101905386A，CN 201711675U以及CN 202169445U。这些专利都是在通过浸润工艺在预成型焊片表面附着一层液体助焊剂，再经干燥成型而获得助焊剂涂层，这种涂覆方式存在以下不足：1）所用液体助焊剂大多含挥发性有机溶剂，易造成环境污染和操作人员的健康危害；2）涂覆厚度小，可控性不高；3）在助焊剂的配制和涂覆过程中均需要一定量的溶剂，但最终又得将其干燥除去，工艺复杂，涂覆效率低；4）成本高，造成物质、能量和人力资源的浪费。
发明内容
针对上述现有专利技术的不足，本发明提供一种环保型的预成型焊片助焊剂涂覆工艺，该工艺具有涂覆均匀稳定、涂覆厚度可控性高、高效环保和成本低等特点。
本发明为解决上述技术问题所采用的技术方案是：一种预成型焊片助焊剂的涂覆工艺，其工艺流程为：焊片预处理→粉末制备→涂覆→固化→后处理。
作为本发明的一种改进，本发明所述的焊片预处理包括将所述预成型焊片进行脱脂、清洗和干燥。
作为本发明的一种改进，本发明所述的粉末制备的方法包括：1）直接将助焊剂制成一定粒径的粉末颗粒；2）将助焊剂各组分制成粉末颗粒，然后混合均匀；3）先将助焊剂各组分采用机械混合，然后制成粉末颗粒；4）将助焊剂各组分熔融混合，冷却后制成粉末颗粒；5）将助焊剂各组分用适量分散剂混合均匀，脱除分散剂后制成粉末颗粒。
作为本发明的一种改进，本发明所述的粉末制备包括将助焊剂制成粒径≤350 μm的成分均匀的粉末。
作为本发明的一种改进，本发明所述的涂覆至少包括流化床浸涂、热喷涂、热熔敷、静电喷涂和静电振荡中的一种。
作为本发明的一种改进，本发明所述的静电喷涂的工艺参数包括：喷涂电压30-100 kV，喷涂距离10-25 cm。
作为本发明的一种改进，本发明所述的固化包括加热固化和辐射固化。
作为本发明的一种改进，本发明所述的加热包括电阻加热、红外线加热和微波加热，所述的辐射包括紫外光。
作为本发明的一种改进，本发明所述的加热固化的温度为55-200℃。
作为本发明的一种改进，本发明所述的后处理包括自然冷却、强制冷却、压制成型和裁切成型。
本发明首先对预成型焊片进行预处理，以获得洁净无油污的表面。因为预处理工艺质量好坏直接影响粉末涂膜质量，未进行前处理或前处理效果不佳，则易造成涂膜脱落、鼓泡等问题。本发明通过化学法脱脂、清洗和干燥以实现预成型焊片的预处理。对于表面洁净度已满足实际需要的预成型焊片，可以省去预处理而直接进行粉末制备和涂覆。
本发明优选的涂覆方法为静电喷涂，具体步骤如下：将可带静电的助焊剂制成一定粒度的粉末；然后用静电喷粉设备把助焊剂粉末喷涂到预成型焊片的表面，当粉末附着到一定厚度时，则会发生“同性相斥”的作用，不能再吸附到预成型焊片上，从而使焊片表面各部分的粉层厚度均匀；在烘烤设备中进行加热，使助焊剂粉层变软、流平和固化；最后冷却成型，即得到与预成型焊片结合紧密的均匀的助焊剂膜。在静电喷涂工艺中，影响喷涂质量的因素有：助焊剂粉末的导电率、粉末粒度、喷粉设备的形式、喷粉量、喷涂电压、喷涂时间、粉末和空气混合物的速度梯度等。本发明可根据不同助焊剂、不同涂覆厚度和不同使用要求选择合适的工艺参数，优选地，助焊剂粉末粒径为≤350 μm，喷涂电压为30-100 kV，喷涂距离为10-25 cm，固化温度为55-200℃。
传统的液体助焊剂浸润工艺的涂覆厚度一般为10-20 μm（见专利CN 202169445U），本发明的涂覆厚度可达100-300 μm，而且本发明可根据实际需要制备不同粒径的助焊剂粉末和/或选择合适的喷涂工艺参数，涂覆出不同厚度的助焊剂膜。因此，本发明的涂覆厚度可控性高。
与现有技术相比，本发明有益效果显著。本发明创新性地将静电喷涂技术与预成型焊片助焊剂的涂覆工艺相结合，助焊剂不含有机溶剂，节能环保，对操作人员无健康危害；涂覆均匀稳定，涂覆厚度可控性高；工艺简单，效率高，成本低，适用于各种预成型焊片表面的助焊剂涂覆。
具体实施方式
实施例1
一种预成型焊片助焊剂的涂覆工艺，工艺流程为：焊片预处理→粉末制备→涂覆→固化→后处理。具体步骤如下：
1）用适量乙醇对圆形预成型焊片进行脱脂和清洗，然后干燥；
2）直接将助焊剂制成粒径≤80 μm的粉末，放入流化床；
3）把预成型焊片适当预热后放入粉末流化床中浸涂，一段时间后取出；
4）将涂粉后的预成型焊片放入温度为80℃的电阻加热炉中进行固化；
5）自然冷却成型。
按以上工艺涂覆的助焊剂膜厚度约60 μm，均匀平整，与预成型焊片的结合力强，涂覆效果良好。
实施例2
一种预成型焊片助焊剂的涂覆工艺，工艺流程为：焊片预处理→粉末制备→涂覆→固化→后处理。具体步骤如下：
1）用适量乙醇对圆形预成型焊片进行脱脂和清洗，然后干燥；
2）直接将助焊剂制成粒径≤50 μm的粉末；
3）把适量助焊剂粉末放入静电喷涂设备，调节喷涂电压为30 kV，喷涂距离为10 cm，静电喷涂一段时间后停止；
4）将喷粉后的预成型焊片用红外线加热至55℃并完成固化；
5）自然冷却成型。
按以上工艺涂覆的助焊剂膜厚度约40 μm，均匀平整，与预成型焊片的结合力强，涂覆效果良好。
实施例3
一种预成型焊片助焊剂的涂覆工艺，工艺流程为：焊片预处理→粉末制备→涂覆→固化→后处理。具体步骤如下：
1）用适量乙醇对圆环形预成型焊片进行脱脂和清洗，然后干燥；
2）将助焊剂各组分熔融混合，冷却后制成粒径≤350 μm的粉末；
3）把适量助焊剂粉末放入静电喷涂设备，调节喷涂电压为100 kV，喷涂距离为25 cm，静电喷涂一段时间后停止；
4）将喷粉后的预成型焊片用微波加热至200℃并完成固化；
5）自然冷却，然后压制成型。
按以上工艺涂覆的助焊剂膜厚度约200 μm，均匀平整，与预成型焊片的结合力强，涂覆效果良好。
实施例4
一种预成型焊片助焊剂的涂覆工艺，工艺流程为：焊片预处理→粉末制备→涂覆→固化→后处理。具体步骤如下：
1）用适量乙醇对长方形预成型焊片进行脱脂和清洗，然后干燥；
2）将助焊剂各组分制成粒径≤100 μm的粉末，然后混合均匀；
3）把适量助焊剂粉末放入静电喷涂设备，调节喷涂电压为50 kV，喷涂距离为15 cm，静电喷涂一段时间后停止；
4）将喷粉后的预成型焊片用紫外光固化；
5）根据需要进行后处理，如打磨、修边和裁剪等。
按以上工艺涂覆的助焊剂膜厚度约80 μm，均匀平整，与预成型焊片的结合力强，涂覆效果良好。
需要说明的是以上实施例均是本发明的较佳实施例，并不是用来限定本发明的保护范围，对于本领域的技术人员来说，在上述实施例的基础上作出的简单的替换均属于本发明权利要求的保护范围。

Claims (10)

1.一种预成型焊片助焊剂的涂覆工艺，其特征在于，所述涂覆工艺的流程为：焊片预处理→粉末制备→涂覆→固化→后处理。
2.根据权利要求1所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的焊片预处理包括将所述预成型焊片进行脱脂、清洗和干燥。
3.根据权利要求1所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的粉末制备的方法包括：1）直接将助焊剂制成一定粒径的粉末颗粒；2）将助焊剂各组分制成粉末颗粒，然后混合均匀；3）先将助焊剂各组分采用机械混合，然后制成粉末颗粒；4）将助焊剂各组分熔融混合，冷却后制成粉末颗粒；5）将助焊剂各组分用适量分散剂混合均匀，脱除分散剂后制成粉末颗粒。
4.根据权利要求1所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的粉末制备包括将助焊剂制成粒径≤350 μm的粉末。
5.根据权利要求1所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的涂覆至少包括流化床浸涂、热喷涂、热熔敷、静电喷涂和静电振荡中的一种。
6.根据权利要求5所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的静电喷涂的工艺参数包括：喷涂电压30-100 kV，喷涂距离10-25 cm。
7.根据权利要求1所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的固化包括加热固化和辐射固化。
8.根据权利要求7所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的加热包括电阻加热、红外线加热和微波加热，所述的辐射包括紫外光。
9.根据权利要求7所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的加热固化的温度为55-200℃。
10.根据权利要求1所述的预成型焊片助焊剂的涂覆工艺，其特征在于：所述的后处理包括自然冷却、强制冷却、压制成型和裁切成型。
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CN106783768B (zh) * 2016-12-29 2019-04-02 广州汉源新材料股份有限公司 一种预成型纳米银膜
CN112122825A (zh) * 2020-08-17 2020-12-25 深圳市兴鸿泰锡业有限公司 一种5g通讯锡基带涂层无卤素预成型焊片的制备方法
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CN114669913A (zh) * 2022-04-11 2022-06-28 云南锡业集团（控股）有限责任公司研发中心 一种预涂覆脆性合金异形焊片的生产方法

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