CN1034702C - 内含液体的微电子器件管壳及其制造方法 - Google Patents

内含液体的微电子器件管壳及其制造方法 Download PDF

Info

Publication number
CN1034702C
CN1034702C CN94115277A CN94115277A CN1034702C CN 1034702 C CN1034702 C CN 1034702C CN 94115277 A CN94115277 A CN 94115277A CN 94115277 A CN94115277 A CN 94115277A CN 1034702 C CN1034702 C CN 1034702C
Authority
CN
China
Prior art keywords
liquid
base
sealant
lid
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN94115277A
Other languages
English (en)
Chinese (zh)
Other versions
CN1109219A (zh
Inventor
布里安·A·韦伯
罗伯特·M·温特沃斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of CN1109219A publication Critical patent/CN1109219A/zh
Application granted granted Critical
Publication of CN1034702C publication Critical patent/CN1034702C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/22—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Micromachines (AREA)
CN94115277A 1993-09-13 1994-09-12 内含液体的微电子器件管壳及其制造方法 Expired - Fee Related CN1034702C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/119,555 US5413965A (en) 1993-09-13 1993-09-13 Method of making microelectronic device package containing a liquid
US119,555 1993-09-13

Publications (2)

Publication Number Publication Date
CN1109219A CN1109219A (zh) 1995-09-27
CN1034702C true CN1034702C (zh) 1997-04-23

Family

ID=22385036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94115277A Expired - Fee Related CN1034702C (zh) 1993-09-13 1994-09-12 内含液体的微电子器件管壳及其制造方法

Country Status (6)

Country Link
US (2) US5413965A (enExample)
EP (2) EP0952610A3 (enExample)
JP (1) JPH07106468A (enExample)
KR (1) KR950010028A (enExample)
CN (1) CN1034702C (enExample)
TW (1) TW263610B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2699365B1 (fr) * 1992-12-16 1995-02-10 Alcatel Telspace Système de dissipation de l'énergie calorifique dégagée par un composant électronique.
US5716763A (en) * 1994-12-06 1998-02-10 International Business Machines Corporation Liquid immersion heating process for substrate temperature uniformity
US5625227A (en) * 1995-01-18 1997-04-29 Dell Usa, L.P. Circuit board-mounted IC package cooling apparatus
WO1997007509A1 (en) * 1995-08-21 1997-02-27 Matsushita Electric Industrial Co., Ltd. Multimedia optical disk capable of preserving freshness of image content for long time and its reproduction apparatus and method
US6144157A (en) * 1998-05-18 2000-11-07 Motorola, Inc. Organic EL device with fluorocarbon liquid and UV epoxy layers and method
JP2000357766A (ja) * 1999-06-14 2000-12-26 Hitachi Ltd モジュール内への液体冷媒の封止方法
JP2001312213A (ja) 2000-04-26 2001-11-09 Internatl Business Mach Corp <Ibm> バックライトユニット、液晶表示装置、ならびに導光板の製造方法
US6525420B2 (en) 2001-01-30 2003-02-25 Thermal Corp. Semiconductor package with lid heat spreader
US7581585B2 (en) 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
US20080266801A1 (en) * 2007-04-30 2008-10-30 Rockwell Automation Technologies, Inc. Phase change cooled power electronic module
US8324719B2 (en) * 2009-08-31 2012-12-04 General Electric Company Electronic package system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63284837A (ja) * 1987-05-18 1988-11-22 Hitachi Ltd 半導体素子の冷却構造

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
JPS56164543A (en) * 1980-05-23 1981-12-17 Hitachi Ltd Manufacture of semiconductor device
JPS607739A (ja) * 1983-06-27 1985-01-16 Nec Corp 半導体装置の製造方法
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
JPS6037756A (ja) * 1983-08-10 1985-02-27 Mitsubishi Electric Corp 半導体装置
JPS60183743A (ja) * 1984-03-01 1985-09-19 Hitachi Chem Co Ltd 半導体類のパツケ−ジ成形方法
JPS61125057A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 半導体装置
US5126919A (en) * 1985-10-04 1992-06-30 Fujitsu Limited Cooling system for an electronic circuit device
JPS6396945A (ja) * 1986-10-14 1988-04-27 Nippon Denso Co Ltd 大電力用半導体装置
US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid
JPS63116461A (ja) * 1986-11-05 1988-05-20 Tomoegawa Paper Co Ltd 固体撮像装置の気密封止方法
US4961106A (en) * 1987-03-27 1990-10-02 Olin Corporation Metal packages having improved thermal dissipation
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
JPH01291452A (ja) * 1988-05-19 1989-11-24 Sanyo Electric Co Ltd 半導体装置の製造方法
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
JPH03296237A (ja) * 1990-04-16 1991-12-26 Hitachi Ltd 熱伝導用半導体チップの背面接合方法およびそれを用いた半導体装置
US5097387A (en) * 1990-06-27 1992-03-17 Digital Equipment Corporation Circuit chip package employing low melting point solder for heat transfer
JP2515923B2 (ja) * 1990-11-15 1996-07-10 九州日本電気株式会社 半導体装置の封止方法
JP2867753B2 (ja) * 1991-02-25 1999-03-10 富士電機株式会社 半導体装置
JPH04312962A (ja) * 1991-03-18 1992-11-04 Mitsubishi Electric Corp 液体封止半導体装置及びその組立方法
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
JPH05251578A (ja) * 1992-03-05 1993-09-28 Hitachi Ltd 接合方法および接合装置
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63284837A (ja) * 1987-05-18 1988-11-22 Hitachi Ltd 半導体素子の冷却構造

Also Published As

Publication number Publication date
JPH07106468A (ja) 1995-04-21
US5413965A (en) 1995-05-09
EP0952610A2 (en) 1999-10-27
EP0952610A3 (en) 2000-05-17
EP0644592A1 (en) 1995-03-22
US5477084A (en) 1995-12-19
KR950010028A (ko) 1995-04-26
CN1109219A (zh) 1995-09-27
TW263610B (enExample) 1995-11-21

Similar Documents

Publication Publication Date Title
EP1524690B1 (en) Semiconductor package with heat spreader
US5891753A (en) Method and apparatus for packaging flip chip bare die on printed circuit boards
US4849857A (en) Heat dissipating interconnect tape for use in tape automated bonding
KR100446290B1 (ko) 댐을 포함하는 반도체 패키지 및 그 제조방법
US5455456A (en) Integrated circuit package lid
CN1034702C (zh) 内含液体的微电子器件管壳及其制造方法
US5851337A (en) Method of connecting TEHS on PBGA and modified connecting structure
US20080230924A1 (en) Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
TW200834768A (en) Low profile ball grid array (BGA) package with exposed die and method of making same
US5612853A (en) Package for a power semiconductor device
US5796038A (en) Technique to produce cavity-up HBGA packages
US20040061206A1 (en) Discrete package having insulated ceramic heat sink
JPH09502833A (ja) 多リード数パッケージにおける被覆ボンディングワイヤ
CN208127188U (zh) 功率器件的封装模块及引线框架
US7309838B2 (en) Multi-layered circuit board assembly with improved thermal dissipation
US7129587B2 (en) Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
CN112018056B (zh) 电子封装件及其制法
CN118315349A (zh) 芯片集成封装散热系统及其制备方法
JPH0342512B2 (enExample)
Ito et al. A novel flip chip technology using nonconductive resin sheet
US7378723B2 (en) Method and apparatus for decoupling conductive portions of a microelectronic device package
CN222261024U (zh) 具有镂空基板的封装结构
JPS587064B2 (ja) シユウセキカイロヨウパツケ−ジ
KR0167388B1 (ko) 반도체장치
Carden et al. Epoxy encapsulation on ceramic quad flat packs

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee