CN1034481C - 免清洗的焊剂、其使用方法及应用 - Google Patents
免清洗的焊剂、其使用方法及应用 Download PDFInfo
- Publication number
- CN1034481C CN1034481C CN93119610A CN93119610A CN1034481C CN 1034481 C CN1034481 C CN 1034481C CN 93119610 A CN93119610 A CN 93119610A CN 93119610 A CN93119610 A CN 93119610A CN 1034481 C CN1034481 C CN 1034481C
- Authority
- CN
- China
- Prior art keywords
- solder flux
- acid
- water
- flux
- activator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000004907 flux Effects 0.000 title claims abstract description 150
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000003466 welding Methods 0.000 title abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims abstract description 135
- 239000012190 activator Substances 0.000 claims abstract description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000005476 soldering Methods 0.000 claims abstract description 31
- 239000004094 surface-active agent Substances 0.000 claims abstract description 20
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 11
- 239000011737 fluorine Substances 0.000 claims abstract description 11
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 19
- 229960005137 succinic acid Drugs 0.000 claims description 15
- 238000005219 brazing Methods 0.000 claims description 13
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 10
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 10
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 10
- 150000002894 organic compounds Chemical class 0.000 claims description 9
- 229910019142 PO4 Inorganic materials 0.000 claims description 6
- 239000010452 phosphate Substances 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- 150000001413 amino acids Chemical class 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 4
- 150000001735 carboxylic acids Chemical class 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 238000009736 wetting Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 238000011109 contamination Methods 0.000 abstract description 11
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 abstract description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 239000012855 volatile organic compound Substances 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 11
- -1 Oxo carboxylic acid Chemical class 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000012459 cleaning agent Substances 0.000 description 7
- 150000004820 halides Chemical class 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000008014 freezing Effects 0.000 description 5
- 238000007710 freezing Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000012958 reprocessing Methods 0.000 description 5
- 235000001014 amino acid Nutrition 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000003912 environmental pollution Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PFNXDLYOYLRRNH-UHFFFAOYSA-N [C].FCl Chemical compound [C].FCl PFNXDLYOYLRRNH-UHFFFAOYSA-N 0.000 description 2
- LIPOUNRJVLNBCD-UHFFFAOYSA-N acetyl dihydrogen phosphate Chemical compound CC(=O)OP(O)(O)=O LIPOUNRJVLNBCD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000011469 building brick Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- JUINSXZKUKVTMD-UHFFFAOYSA-N hydrogen azide Chemical compound N=[N+]=[N-] JUINSXZKUKVTMD-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- JJJOZVFVARQUJV-UHFFFAOYSA-N 2-ethylhexylphosphonic acid Chemical compound CCCCC(CC)CP(O)(O)=O JJJOZVFVARQUJV-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- KBIWNQVZKHSHTI-UHFFFAOYSA-N 4-n,4-n-dimethylbenzene-1,4-diamine;oxalic acid Chemical compound OC(=O)C(O)=O.CN(C)C1=CC=C(N)C=C1 KBIWNQVZKHSHTI-UHFFFAOYSA-N 0.000 description 1
- JOOXCMJARBKPKM-UHFFFAOYSA-N 4-oxopentanoic acid Chemical compound CC(=O)CCC(O)=O JOOXCMJARBKPKM-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Natural products OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229940124277 aminobutyric acid Drugs 0.000 description 1
- 239000012491 analyte Substances 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RXQNHIDQIJXKTK-UHFFFAOYSA-N azane;pentanoic acid Chemical compound [NH4+].CCCCC([O-])=O RXQNHIDQIJXKTK-UHFFFAOYSA-N 0.000 description 1
- 239000003899 bactericide agent Substances 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
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- 150000002500 ions Chemical group 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000000306 recurrent effect Effects 0.000 description 1
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- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3616—Halogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
本发明属于一种焊剂及其使用方法。一种不含可挥发的有机化合物的免清洗的焊剂,其主要是由一种或多种无卤化物的水溶性活化剂及一水溶性用氟处理的表面活性剂和水组成,活化剂的用量为不大于焊剂重量的5%,表面活性剂的用量为不大于焊剂重量的1%。一种制造钎焊印刷线路组件的方法,该方法具有最低的离子污染残留物,该方法包括:用上述的免清洗的焊剂喷射在组件上;将待焊的组件进行预热,以将水从焊剂中挥发掉,及将组件进行波峰钎焊。该焊剂用于钎焊印刷线路组件。
Description
本发明涉及一种焊剂及其使用方法,尤其涉及一种水溶性焊剂及其使用方法,尤其在精密的高可靠性的电子元件组装方面,诸如:印刷线路组装方面,本发明具有明显的环境效益及显著的生产效益。
通常用已知的波峰钎焊方法完成印刷线路组件的组装,用该方法,印刷线路板(印刷电路板)的表面及准备在该印刷线路板上钎焊元件的引线或元件脚的表面,被置于焊料的波峰上,该焊料波峰沿线路板及线路板上安置的元件经过。焊料波峰接触待钎焊物的表面,并将它们钎焊起来,且将它们电连接在一起。事实上,现有技术的这些组件的钎焊,其焊剂通常被用于待连接物的表面,为了除去这些待连接物表面上的氧化物,要将接收焊料的表面用化学方法进行处理,以便较好地完成组件的电连接和机械连接。通常,该焊剂被应用于不要求严格控制焊剂量的场合(该焊剂被称作为泡沫焊剂),在该过程中,线路板和待组装的元件通过焊剂发泡床,该焊剂附着在待焊物的表面。在钎焊前,将焊剂与元件的结合处进行预热,已便使焊剂载体从表面扩散掉。
在印刷线路组装的波峰钎焊的电子工业中使用的焊剂,一般含有的成份通常取决于环境和/或必要的钎焊后处理时清洗剂的使用,而这些清洗剂的本身存在一些不希望有的环境危害。例如,典型的活性树脂焊剂使用的可挥发的有机化合物(VOC)载体,诸如:乙醇,该载体污染环境。这种焊剂基本上也使一些离子型钎焊后处理的污染物质的残留物(焊料和焊料的分解物残余成份及反应产物)遗留下来,这些残留物可腐蚀电子组件,并使电子组件的物理性能和电性能降低,最终导致电路的损坏。这样,尤其在精密的、高准确性的组装场合,除去这种残留物已成很必要的事情。最常用的清洗方法,是使用碳氯氟化物(CFC)清洗剂的蒸气去污方法来完成的。CFC的环境污染性,尤其近年来已认识到的它们对地球的大气臭氧层的影响,使CFC的污染性已成为重要的世界范围的问题。
由于电子技术生产过程的环境影响已变得越来越明了,为了满足日益增加的严格的行政法规的要求,本发明的目的在于提供一种可使用安全的对环境无危害的清洗剂(诸如:水)清除掉的焊剂,即开发一种可替代的清洗剂以及开发一种改进的焊剂组成以避免上述问题。
例如,已提出了各种各样的水溶性焊剂,这些焊剂可用水来清洗。作为一般使用目的,水清洗剂明显优于CFC清洗剂,现有的水溶性焊剂为了满足技术需要通常遗留有大量的残留物。例如:这些焊剂的组成中含有大量的可挥发的有机化合物溶剂(通常为乙醇)和/或含有囟化物的活化剂。正如早期文献所记载,可挥发的有机化合物溶剂可带来环境污染的问题。另一方面,含卤化物的活化剂的问题在于:它们残留有大量的离子残留物及钎焊后处理时必须被清除的大量残留物。更确切地说,在存在有湿度(水份)的情况下,这种残留物中含有的卤化物已被公知作为催化剂,而再产生腐蚀反应,即卤化物络合物与金属组装元件(例如:铝)的反应,然后重新发生卤代络合物与水的反应,而后变成自由基去再一次攻击金属离子。这样,只要湿度存在(当然,湿度实际上总是存在),腐蚀反应就可不断地进行,最终导致电路的损坏。
本发明的目的在于克服现有技术的不足,提供一种不含可挥发的有机化合物且免清洗的焊剂。本发明进一步提供使用该焊剂的方法和该焊剂的用途。
本发明的焊剂主要是由如下组分所组成的:一种或多种选自由羧酸、磺酸、磷酸、磷酸酯、氨基酸、链烷醇胺及它们的组合物所组成的无卤化物的水溶性活化剂,其用量为不大于焊剂重量的5%;一种能够有效地使焊剂完全润湿待焊物表面的水溶性用氟处理的表面活性剂,其用量为不大于焊剂重量的1%;和水。
所述的焊剂中所述的活化剂充分与水相溶,以保持焊剂在冷冻和解冻后完全呈溶液状。
上述的活化剂,在20℃下的水溶解性至少为,每100cc 5克,优选的活化剂为羧酸;或焊剂中仅含有一种活化剂,戊二酸;或仅含有琥珀酸;或仅含有两种活化剂,如戊二酸和琥珀酸。
所述的焊剂中活化剂的总量为焊剂重量的0.5%-3%;用氟处理的表面活性剂的量为不大于焊剂重量的0.1%。
本发明所提供的使用上述焊剂制造钎焊印刷线路组件的方法,该方法包括:用如上所述的焊剂喷射在组件上;将待焊的组件进行预热,以将水从焊剂中挥发掉,及将组件进行波峰钎焊;其中,以一适当的速度进行焊剂喷射,以致在水挥发掉以后,组件上所遗留的固体焊剂量为每平方英寸线路板200微克至1500微克,即每平方厘米线路板31微克至233微克。
其中,优先的喷射速度为每平方英寸线路板400-1200微克,即,每平方厘米线路板62~186微克。
本发明进一步提供了上述的免清洗焊剂在钎焊即刷线路组件方面的应用。
按照本发明的基本特征之一,本发明提供一种焊剂,该焊剂为水溶性的(确实以水溶液的形式存在),实际上为不含有可挥发的有机化合物的卤化物,更确切地说,该焊剂没有腐蚀作用。尤其是本发明配制的焊剂,在印刷线路组装的波峰钎焊时提供了高效的充分的助熔。更重要的是,该焊剂达到最小的离子污染物残留量和更高的表面绝缘度,以便在钎焊的后处理时不需要清洗。本发明独特的无需清洗的焊剂可避免使用可挥发的有机化合物所带来的环境污染问题,以及在钎焊后处理清洗过程中(甚至包括水清洗过程中)带来的成本增加的问题,本发明更优选的方式,即本发明的免清洗焊剂,尤其在运输和贮存时也具有优点,即可重复进行焊剂的冷冻和解冻,而对焊剂组成的基本性能没有不利的影响。
简而言之,本发明提供一种免清洗的焊剂,该焊剂实质上不含有可挥发的有机化合物,基本上是含有一种或更多种无卤化物的水溶性的活化剂,其总量不大于焊剂重量的5%;一种用量不超过焊剂重量的1%的用氟处理的表面活性剂;和水。优选地,焊剂中的每种活化剂可在水中充分溶解以保持在焊剂的冷冻和解冻后为完全溶液状态。
根据本发明的第二个主要特征,本发明提供一种制造钎焊印刷线路组件的方法,在该方法中,离子污染物的残留量降至最低。该方法包括用上述描述的焊剂喷射在待焊组件上,并预热该钎焊的组件以将水从焊剂中挥发掉,并波峰钎焊这些组件。
利用如前所述的方法,尤其利用使用本发明具有极佳性能的免清洗焊剂,该方法不需要进行钎焊的后清洗处理,本发明的离子污染物残留量可达到甚至低于已经过钎焊后清洗处理的符合军用标准的严格要求的印刷电路组件的残留量。
本发明的波峰钎焊可在例如:大气环境或在实质上为惰性气体环境、诸如:控制氧含量的氮气环境下进行。
根据本发明的焊剂,其含有三种基本成份,它们为:无卤化物的水溶性活化剂(一种或更多种)、水溶性用氟处理的表面活性剂、并且水优选为去离子水。本发明由于是在室温下加入适当比例的活化剂和表面活性剂到水中,并混合成一水溶液,使本发明的焊剂易于制备。当然,该焊剂应与通常在印刷线路组件的波峰钎焊中使用的焊料相适合及与在该钎焊过程通常使用的金属相适应。焊料通常为二价锡/铅体系,该体系中含有大约60%的锡和40%的铅(以重量计),以63%的锡和37%的铅较典型。也可存在另外的组成,诸如:银和锑体系,62%的锡/36%的铅/2%的银为这种组成的典型例子。无铅的焊料体系,诸如:锡/铋体系,例如已知的为42%的锡/58%的铋焊料。待钎焊的金属通常为包括铜、锡包覆的铜及铜合金(例如:青铜和黄铜)。其它的金属也可使用,它们包括:镍、铁—镍合金和科代合金(Kovar) (铁—镍-钴合金),也可用金、银、钯或锡-铅合金涂覆。
为适于印刷线路组件的焊剂用途,本发明的焊剂优选使用喷射焊剂(spraying flux)。与传统的波峰钎焊过程使用的发泡焊剂技术比较起来,根据本发明的喷射焊剂,其使所使用的焊剂的量更易于精确控制,以便使焊剂用于待焊物表面的量足以产生较好的钎焊点,同时也使在钎焊后,焊剂残留在组件上的量减至最低。过多的焊剂残留量是不理想的,主要是由于它们可导致表面绝缘度降低和组件电性能的损坏(特别是在高温和高湿度的情况下)。
优选的喷射速度为:在干燥后(即水被完全挥发掉以后),焊剂“固体”(更准确地说,非挥发物)保留在印刷线路组件上的量每平方英寸线路板为约200微克至约1500微克的范围(每平方厘米为31微克-约233微克),更优选为每平方英寸的线路板约400微克至约1200微克(每平方厘米62微克至186微克)。这可确保足以用波峰钎焊表面的焊剂覆盖,并具有较好钎焊点以及确保离子污染物的残留量降至最低,并使钎焊组件具有较高的表面绝缘度,而不需要焊接的后清洗过程。
1、活化剂
本发明的焊剂将含有一种或更多种无囟化物的水溶性活化剂。尽管在本发明的较宽的范围内并不要求,但已发现使用这种活化剂的显著优点。因此,优选的活化剂,其在水中具有足够的溶解性,以保证焊剂在一次或更多次的冷冻/解冻循环后仍为完全的溶液状态。更确切地说,假如焊剂在运输或贮存期间冷冻,这种活化剂的使用能确保在焊剂解冻后成为溶液状,因而仍然能有效地使用。总的说来,在20℃(68°F)下,水的溶解度至少为约每100CC5克,就足以适合该用途。低溶解性的活化剂不具有如前所述的优点,主要是由于在焊剂经受冷冻/解冻循环时,这些活化剂析出或不能保留在溶液中,因而,没有下一步骤(诸如,将焊剂加热到高于室内温度以重新恢复成溶液),这种焊剂就不能被使用。
焊剂中活化剂的用量应为焊剂重量的约0.2%~5.0%。较低含量的活化剂不能提供足够的钎焊活性,而较高的活化剂含量导致过量的残留物存在,这些残留物对最终的钎焊组件产生不利的影响,并且也没有打算清除这些残留物。当然,在较强的和较弱的活化剂中,较强的活化剂的用量更趋向于所给出用量范围的较低值。优选的活化剂量为焊剂重量的0.5%~3.0%。
适合于本发明使用的无卤化物的活化剂的例子包括有机活化剂,诸如:羧酸、磺酸、磷酸、磷酸酯、氨基酸、链烷醇胺和它们的结合物。这些活化剂与通常在电子工业过程中使用的含卤化物的活化剂,诸如:氢卤化胺(例如:氢氯化胺和氢溴化胺)相比仅存在较少的离子污染物。另外,不存在卤化物,就不能导致早些时候描述的再发生的腐蚀反应(这些反应在卤化物存在时发生)。
为了适于本发明的用途,已发现羧酸活化剂提供极佳的钎焊结合性能及较好的表面绝缘度,并使离子污染物残留量降至最低。在羧酸类中,已发现戊二酸和琥珀酸尤其适合于作为本发明的活化剂,它们可单独使用或结合使用。
下列的羧酸和其它活化剂的例子适于本发明,它们在水中的溶解度在20℃(68°F)时为每100CC至少为5克:
一元羧酸
甲酸
乙酸
丙酸
丁酸
二元羧酸
乙二酸
丙二酸
琥珀酸
戊二酸
马来酸
亚甲基丁二酸
三元羧酸
丙烯三甲酸
羟基羧酸
羟基乙酸
2-羟基丙酸
苯乙醇酸
羟基丁二酸
酒石酸
柠檬酸
二元醇酸
氧代羧酸
乙酰丙酸
磺酸
苯碘酸
甲苯磺酸
磷酸
乙酰基磷酸
1-羟基亚乙基-1,1-二膦酸
苯膦酸
磷酸酯
一元磷酸酯和二元磷酸酯
脂肪族的脂族醇
乙氧化醇,芳香基醇或
芳香基乙氧化醇
氨基酸
氨基乙酸
氨基丁酸
氨基戊酸
链烷醇胺
三异丙醇胺
三乙醇胺
2、表面活性剂
用氟处理的表面活性剂是本发明的焊剂的重要组成之一。作为一类的用氟处理的表面活性剂是有效的表面活性剂,在非常低的浓度下也有效。在本发明的实施过程中,表面活性剂的浓度为焊剂重量的约1.0%以下,优选为浓度不大于0.1%。该用量使焊剂能够普遍润湿待焊物的表面,另一方面,焊剂残留量还没达到焊后需要被清除的程度。
Zonyl FSN氟化表面活性剂(描述为过氟烷基乙氧酯) (可从E.I.Dupont de Nemours & Co.,Inc.得到)已被发现尤其适合于本发明。来自其它制造商的用氟处理的表面活性剂也可使用,诸如:Fluorad FC-430(描述为氟代脂肪族聚合酯)可从Industrial Chemical Products Division of 3M得到;及ATSURF氟代表面活性剂,可从Imperial ChemicalIndustries得到。
3、其它成份
本发明的焊剂可含有各种各样的少量添加剂成份,这些成份对焊剂主要性能的影响可忽略不计。这些成份包括:例如:防腐剂,诸如:三偶氮甲苯,取代的三偶氮甲苯(例如:三偶氮羟基甲苯)、偶氮亚胺及取代的偶氮亚胺;稳定剂和杀菌剂。这些成份所加入的总量优选为不超过焊剂重量的约0.1%。这些成份的使用可通过现有技术很好地了解。
另外,某些有机溶剂载体,诸如:异丙醇,可由制造商提供。例如,Dupont 过氟烷基乙氧酯氟代表面活性剂用于下文出现的数个特殊实例中的用量为每30%水和30%异丙基乙醇活化剂(表面活性剂)的浓度为40%。本发明的焊剂中实际上使用的该成份的浓度很小,无论如何,异丙基乙醇存在于焊剂中的量可被忽略。作为一个实例,过氟烷基乙氧酯为焊剂重量的0.09%时,可使异丙基乙醇含量仅为焊剂重量的0.027%。勿需说的是,这种微不足道存在的乙醇的量实质上不能改变焊剂中的无可挥发的有机化合物的数据。
利用本发明的免清洗焊剂,并利用本发明的焊剂进行钎焊,不需要进行钎焊的后清洗处理,本发明的离子污染物残留量可达到甚至低于已经过钎焊后清洗处理的符合军用标准的严格要求的印刷电路组件的残留量。
特殊的实例
下列为根据本发明的组成的组合物的特殊实例。在每一实例中,焊剂的制备可通过将活化剂和表面活性剂溶解于去离子水中以产生均匀的水溶液。所有在实施例中列举的成份可立即从市面上得到,无需改进就可使用。实施例1-8的酸性活化剂和实施例5的三异丙醇胺可从市面上得到纯的物质(基本上为100%的纯度)。实施例5中Maphes L-10是一种脂肪族磷酸脂(可从Mazer Chemical Inc.得到)。
实施例1 %(重量计)
DI水 98.91
戊二酸 0.50
琥珀酸 0.50
过氟烷基乙氧酯 0.09
100.00%
实施例2 %(重量)
DI水 97.91
戊二酸 1.0
琥珀酸 1.0
过氟烷基乙氧酯 0.09
100.00%
实施例3 %(重量)
DI水 97.91
琥珀酸 2.0
过氟烷基乙氧酯 0.09
100.00%
实施例4 %%(重量)
DI水 97.85
亚甲基丁二酸 2.0
Fluorad FC-430 0.05
苯并三唑 0.10
100.00%
实施例5 %(重量)
DI水 97.91
琥珀酸 1.0
Maphos L-10 0.8
三异丙醇胺 0.2
过氟烷基乙氧酯 0.09
100.00%
实施例6 %(重量)
DI水 97.95
琥珀酸 1.8
对-苯磺酸 0.2
Fluorad FC-430 0.05
100.00%
实施例7 %(重量)
DI水 97.91
琥珀酸 1.0
氨基二酸 1.0
过氟烷基乙氧酯 0.09
100.00%
实施例8 %(重量)
DI水 97.91
琥珀酸 1.9
乙酰基磷酸 0.1
过氟烷基乙氧酯 0.09
100.00%
在上述实施例中,实施例1-4中的焊剂更为优选,这些焊剂中仅含有羧酸活化剂。这四个组合物经受的冷冻/解冻试验如下:将每一种焊剂的样品放入玻璃瓶中,盖上顶盖,并将其放在-15℃(5°F)的冰箱中冷冻24小时。然后将瓶子从冰箱中移出,将冷冻的焊剂解冻并加热至室温。在室温下(20~25℃;68-77°F)的整个试验过程中,这些焊剂中没有一种出现分离和沉淀现象。这意味着:如果这些焊剂在低温下被运输和贮存,当其被放置在室内,并将其热加至环境温度时,这些焊剂完全变成均匀的溶液以适合于使用。
将上述试验在5℃(41°F)的冰箱中进行重复试验。这些样品中无任何一种出现沉淀现象。
将实施例1-2的焊剂进行波峰钎焊试验。试验用板为双面板,焊料覆盖着裸铜板,均匀施用热空气,并通过孔道放置。用Electrovert Econopak II型焊机在线路板上喷射焊剂和进行波峰焊接(63%锡/37%铅焊料)。其表面被预热至537℃(999°F),其传送速度为1.07m/min(3.5英尺/分(ft/min))。这些配置使得线路板在进行波峰钎焊之前,就将全部的水从焊剂中挥发出去。钎焊点的温度为260℃(500°F)。
钎焊后,将板面进行焊剂浸湿的质量检验,发现这些线路板性能优良。难以观察到焊料不润湿(non-wetting)、去湿、桥接或毛刺现象。利用孔式灌注形成的焊缝光滑并有光泽。难以观察到焊剂残留物的痕迹,焊剂均匀地分布在线路板表面。
实施例1、2中用焊剂钎焊的一些线路板可用由Alpha Metals.Inc.of Jersey City,New Jersey生产的Omegameter 600SMD型离子污染物测量装置对离子污染程度进行测量。测量结果为均属于军用标准Mil-P-28809允许的每平方英寸最大为14微克范围内。这证明:这些焊剂的离子污染物残留量非常低。
用实施例1-2的焊剂钎焊的线路板可用IPC-SF-818标准3级组装试验条件下进行表面绝缘度的试验,对每种焊剂在85℃/85%R.H.条件下进行超过7天实验,最低要求为10×108欧姆的实验结果进一步证实,在目前的水平下,焊剂的残留物(例如:焊剂和焊剂反应物的残留物及分解产物)基本上是不腐蚀的。试验的结果表明:线路板经过实验未发现明显的腐蚀现象。
上文所描述的本发明是选择优选的实施例,基于本发明的原理和精神,在本领域技术范围内对本发明作出的各种变化和改进,均不超出本发明的范围。
Claims (18)
1、一种焊剂,其特征在于:该焊剂不含可挥发的有机化合物且免清洗的焊剂,其主要是由如下组分所组成的:
一种或多种选自由羧酸、磺酸、磷酸、磷酸酯、氨基酸、链烷醇胺及它们的组合物所组成的组的无卤化物的水溶性活化剂, 其用量为不大于焊剂重量的5%;
一种能够有效地使焊剂完全润湿待焊物表面的水溶性用氟处理的表面活性剂,其用量为不大于焊剂重量的1%;
和水。
2、如权利要求1的焊剂,其特征在于:所述的活化剂在20℃下的水溶解性至少为每100cc 5克。
3、如权利要求2的焊剂,其特征在于:所述的活化剂为羧酸。
4、如权利要求2的焊剂,其特征在于:仅含有一种活化剂,即戊二酸。
5、如权利要求2的焊剂,其特征在于:仅含有一种活化剂,即琥珀酸。
6、如权利要求2的焊剂,其特征在于:仅含有两种活化剂,即戊二酸和琥珀酸。
7、如权利要求1的焊剂,其特征在于:所述的活化剂的总量为焊剂重量的0.5%-3%。
8、如权利要求7的焊剂,其特征在于:用氟处理的表面活性剂的量为不大于焊剂重量的0.1%。
9、一种使用如权利要求1的焊剂制造钎焊印刷线路组件的方法,该方法包括:
用所述的焊剂喷射在组件上;
将待焊的组件进行预热,以将水从焊剂中挥发掉,及将组件进行波峰钎焊;其特征在于:
以一适当的速度进行焊剂喷射,以致在水被挥发掉以后,组件上所遗留的固体焊剂量为每平方英寸线路板200微克至1500微克,即每平方厘米线路板31微克至233微克。
10、如权利要求9的方法,其特征在于:所述的活化剂在20℃下的水溶解性至少为每100cc 5克。
11、如权利要求10的方法,其特征在于:所述的活化剂为羧酸。
12、如权利要求10的方法,其特征在于:仅含有一种活化剂,即戊二酸。
13、如权利要求10的方法,其特征在于:仅含有一种活化剂,即琥珀酸。
14、如权利要求10的方法,其特征在于:仅含有两种活化剂,即戊二酸和琥珀酸。
15、如权利要求9的方法,其特征在于:所述的喷射速度为每平方英寸线路板400微克至1200微克,即每平方厘米线路板62微克至286微克。
16、如权利要求9的焊剂,其特征在于:所述的活化剂的总量为焊剂重量的0.5%-3.0%。
17、如权利要求16的焊剂,其特征在于:用氟处理的表面活性剂的量为不大于焊剂重量的0.1%。
18、权利要求1至8之一的免清洗焊剂在钎焊印刷线路组件方面的应用。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US07/976,931 | 1992-11-19 | ||
US07/976,931 US5297721A (en) | 1992-11-19 | 1992-11-19 | No-clean soldering flux and method using the same |
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CN1088865A CN1088865A (zh) | 1994-07-06 |
CN1034481C true CN1034481C (zh) | 1997-04-09 |
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US (1) | US5297721A (zh) |
EP (1) | EP0668808B1 (zh) |
JP (1) | JP2690197B2 (zh) |
KR (1) | KR100186786B1 (zh) |
CN (1) | CN1034481C (zh) |
AT (1) | ATE176184T1 (zh) |
AU (1) | AU5171093A (zh) |
BR (1) | BR9307474A (zh) |
CA (1) | CA2148598C (zh) |
DE (1) | DE69323321T2 (zh) |
HK (1) | HK1008311A1 (zh) |
MY (1) | MY109119A (zh) |
SG (1) | SG49734A1 (zh) |
TW (1) | TW210300B (zh) |
WO (1) | WO1994011148A1 (zh) |
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-
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- 1992-11-19 US US07/976,931 patent/US5297721A/en not_active Expired - Lifetime
- 1992-12-07 TW TW081109768A patent/TW210300B/zh active
-
1993
- 1993-10-07 SG SG1996004488A patent/SG49734A1/en unknown
- 1993-10-07 DE DE69323321T patent/DE69323321T2/de not_active Expired - Lifetime
- 1993-10-07 AU AU51710/93A patent/AU5171093A/en not_active Abandoned
- 1993-10-07 AT AT93922843T patent/ATE176184T1/de active
- 1993-10-07 JP JP6512075A patent/JP2690197B2/ja not_active Expired - Fee Related
- 1993-10-07 BR BR9307474A patent/BR9307474A/pt not_active IP Right Cessation
- 1993-10-07 CA CA002148598A patent/CA2148598C/en not_active Expired - Fee Related
- 1993-10-07 EP EP93922843A patent/EP0668808B1/en not_active Expired - Lifetime
- 1993-10-07 WO PCT/US1993/009567 patent/WO1994011148A1/en active IP Right Grant
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- 1993-11-01 CN CN93119610A patent/CN1034481C/zh not_active Expired - Fee Related
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1995
- 1995-05-17 KR KR1019950701988A patent/KR100186786B1/ko not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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DE69323321T2 (de) | 1999-06-02 |
JPH08503168A (ja) | 1996-04-09 |
EP0668808A1 (en) | 1995-08-30 |
US5297721A (en) | 1994-03-29 |
TW210300B (en) | 1993-08-01 |
CN1088865A (zh) | 1994-07-06 |
AU5171093A (en) | 1994-06-08 |
MY109119A (en) | 1996-12-31 |
DE69323321D1 (de) | 1999-03-11 |
HK1008311A1 (en) | 1999-05-07 |
CA2148598C (en) | 1998-09-22 |
EP0668808A4 (en) | 1996-04-24 |
JP2690197B2 (ja) | 1997-12-10 |
KR100186786B1 (en) | 1999-04-01 |
WO1994011148A1 (en) | 1994-05-26 |
CA2148598A1 (en) | 1994-05-26 |
EP0668808B1 (en) | 1999-01-27 |
ATE176184T1 (de) | 1999-02-15 |
SG49734A1 (en) | 1998-06-15 |
BR9307474A (pt) | 1999-06-01 |
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