DE69323321T2 - Flussmittel ohne reinigungsmittel und dessen verwendung - Google Patents

Flussmittel ohne reinigungsmittel und dessen verwendung

Info

Publication number
DE69323321T2
DE69323321T2 DE69323321T DE69323321T DE69323321T2 DE 69323321 T2 DE69323321 T2 DE 69323321T2 DE 69323321 T DE69323321 T DE 69323321T DE 69323321 T DE69323321 T DE 69323321T DE 69323321 T2 DE69323321 T2 DE 69323321T2
Authority
DE
Germany
Prior art keywords
flux
soldering
exceeding
post
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69323321T
Other languages
English (en)
Other versions
DE69323321D1 (de
Inventor
Alvin F Schneider
David B Blumel
John V Tomczak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Assembly Solutions Inc
Original Assignee
Frys Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frys Metals Inc filed Critical Frys Metals Inc
Publication of DE69323321D1 publication Critical patent/DE69323321D1/de
Application granted granted Critical
Publication of DE69323321T2 publication Critical patent/DE69323321T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Detergent Compositions (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
DE69323321T 1992-11-19 1993-10-07 Flussmittel ohne reinigungsmittel und dessen verwendung Expired - Lifetime DE69323321T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/976,931 US5297721A (en) 1992-11-19 1992-11-19 No-clean soldering flux and method using the same
PCT/US1993/009567 WO1994011148A1 (en) 1992-11-19 1993-10-07 No-clean soldering flux and method using the same

Publications (2)

Publication Number Publication Date
DE69323321D1 DE69323321D1 (de) 1999-03-11
DE69323321T2 true DE69323321T2 (de) 1999-06-02

Family

ID=25524634

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323321T Expired - Lifetime DE69323321T2 (de) 1992-11-19 1993-10-07 Flussmittel ohne reinigungsmittel und dessen verwendung

Country Status (15)

Country Link
US (1) US5297721A (de)
EP (1) EP0668808B1 (de)
JP (1) JP2690197B2 (de)
KR (1) KR100186786B1 (de)
CN (1) CN1034481C (de)
AT (1) ATE176184T1 (de)
AU (1) AU5171093A (de)
BR (1) BR9307474A (de)
CA (1) CA2148598C (de)
DE (1) DE69323321T2 (de)
HK (1) HK1008311A1 (de)
MY (1) MY109119A (de)
SG (1) SG49734A1 (de)
TW (1) TW210300B (de)
WO (1) WO1994011148A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10117404A1 (de) * 2001-04-06 2002-10-17 Paff Stannol Loetmittel Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten

Families Citing this family (41)

* Cited by examiner, † Cited by third party
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TW282427B (de) * 1993-02-05 1996-08-01 Litton Systems Inc
US5507882A (en) * 1994-02-28 1996-04-16 Delco Electronics Corporation Low residue water-based soldering flux and process for soldering with same
US5571340A (en) * 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same
CN1049169C (zh) * 1995-03-16 2000-02-09 雒社教 免清洗焊剂
DE69636971T2 (de) * 1995-05-24 2007-12-13 Fry's Metals Inc. Weichlotflussmittel auf epoxybasis ohne flüchtige organische verbindungen
DE69635203T2 (de) * 1995-07-11 2006-06-29 Delphi Technologies, Inc., Troy Beschichtungen und Verfahren, insbesondere für Leiterplatten
US5932021A (en) * 1996-06-26 1999-08-03 Cala; Francis R. Aqueous cleaning composition for removing flux and method of use
US5958151A (en) * 1996-07-22 1999-09-28 Ford Global Technologies, Inc. Fluxing media for non-VOC, no-clean soldering
FR2756486B1 (fr) * 1996-12-04 1998-12-31 Oreal Dispositif aerosol a base de compositions alcooliques de materiaux fixants
US5958144A (en) * 1997-05-20 1999-09-28 Church & Dwight Flux-removing aqueous cleaning composition and method of use
US6059894A (en) * 1998-04-08 2000-05-09 Hewlett-Packard Company High temperature flip chip joining flux that obviates the cleaning process
GB9818760D0 (en) * 1998-08-28 1998-10-21 Triplex Safety Glass Co Production of heated windows
AU4807400A (en) * 1999-04-30 2000-11-17 University Of Florida Adeno-associated virus-delivered ribozyme compositions and methods of use
JP2001007158A (ja) * 1999-06-25 2001-01-12 Fujitsu Ltd 半田バンプの接合方法及び半田バンプ接合体
ATE302666T1 (de) 1999-12-03 2005-09-15 Frys Metals Inc Dba Alpha Metals Inc Weichlotflussmittel
US6524398B2 (en) 2000-04-13 2003-02-25 Fry's Metals, Inc. Low-residue, low-solder-ball flux
TW531868B (en) * 2001-08-21 2003-05-11 Au Optronics Corp Soldering type anisotropic conductive film
US20030221748A1 (en) * 2002-05-30 2003-12-04 Fry's Metals, Inc. Solder paste flux system
AU2003241670A1 (en) * 2002-06-17 2003-12-31 Harima Chemicals, Inc. Water-base aluminum-brazing composition and process of brazing
US6818988B2 (en) * 2002-07-25 2004-11-16 International Business Machines Corporation Method of making a circuitized substrate and the resultant circuitized substrate
WO2004027035A2 (en) * 2002-09-20 2004-04-01 Yale University Riboswitches, methods for their use, and compositions for use with riboswitches.
US7740713B2 (en) * 2004-04-28 2010-06-22 International Business Machines Corporation Flux composition and techniques for use thereof
US20050268991A1 (en) * 2004-06-03 2005-12-08 Enthone Inc. Corrosion resistance enhancement of tin surfaces
US8313901B2 (en) * 2005-12-21 2012-11-20 Yale University Methods and compositions related to the modulation of riboswitches
WO2008026588A1 (fr) * 2006-08-28 2008-03-06 Panasonic Electric Works Co., Ltd. Composition de résine thermodurcissable, son procédé de fabrication et carte de circuit
JP2010502752A (ja) * 2006-09-11 2010-01-28 イェール ユニバーシティー リシンリボスイッチ、リシンリボスイッチを用いた構造に基づく化合物設計、ならびにリシンリボスイッチを用いた使用のための方法および組成物
US20080121384A1 (en) * 2006-11-29 2008-05-29 Po-Yung Tseng Liquid cooled heat dissipator
DK2191001T3 (en) 2007-04-09 2016-09-19 Univ Florida RAAV VECTOR COMPOSITIONS WITH TYROSIN MODIFIED CAPSIDE PROTEINS AND PROCEDURES FOR USE THEREOF
WO2008150884A1 (en) * 2007-05-29 2008-12-11 Yale University Methods and compositions related to riboswitches that control alternative splicing and rna processing
EP2164996A4 (de) * 2007-05-29 2010-07-14 Univ Yale Riboswitches sowie verfahren und zusammensetzungen zur verwendung von und mit riboswitches
US10010981B2 (en) * 2007-09-28 2018-07-03 Indium Corporation Materials having increased mobility after heating
US9815149B2 (en) 2011-02-25 2017-11-14 International Business Machines Corporation Flux composition and techniques for use thereof
US9579738B2 (en) * 2011-02-25 2017-02-28 International Business Machines Corporation Flux composition and techniques for use thereof
US20180074115A1 (en) * 2016-09-09 2018-03-15 General Electric Company Residual ionic cleanliness evaluation component
JP6870354B2 (ja) * 2017-02-03 2021-05-12 岩崎電気株式会社 ランプ
EP3635421A1 (de) * 2017-06-05 2020-04-15 Cutsforth Inc. Überwachungssystem für erdungsvorrichtung
US10939600B2 (en) 2018-11-28 2021-03-02 International Business Machines Corporation Flux residue detection
KR20220045110A (ko) * 2019-07-25 2022-04-12 스테판 컴파니 비수성 솔더 플럭스 조성물
CN112171110A (zh) * 2020-09-17 2021-01-05 东莞市麦克莱恩新材料有限公司 一种新型水性不锈钢助焊剂的制备方法
JP6933825B1 (ja) * 2020-11-30 2021-09-08 千住金属工業株式会社 フラックスおよびソルダペースト
JP7007619B1 (ja) 2021-05-31 2022-02-10 千住金属工業株式会社 フラックス及びソルダペースト

Family Cites Families (27)

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US3746620A (en) * 1971-07-13 1973-07-17 Nl Industries Inc Water soluble flux composition
JPS4926825A (de) * 1972-07-07 1974-03-09
JPS4926826A (de) * 1972-07-10 1974-03-09
US3925112A (en) * 1974-02-19 1975-12-09 Hercules Chemical Co Inc Solder fluxes
US4000016A (en) * 1974-11-29 1976-12-28 International Business Machines Corporation Water soluble fluxes
GB1517116A (en) * 1976-05-27 1978-07-12 Frys Metals Ltd Soldering fluxes
US4077815A (en) * 1976-12-20 1978-03-07 International Business Machines Corporation Water soluble flux
US4113524A (en) * 1977-02-24 1978-09-12 Rca Corporation Method of assembling components on printed circuit boards
US4140554A (en) * 1977-09-30 1979-02-20 Chevron Research Company Water-rinsable soldering fluid containing a polyamide dispersant
US4151015A (en) * 1977-12-02 1979-04-24 Lake Chemical Company Flux for use in soldering
US4601763A (en) * 1984-10-11 1986-07-22 Lgz Landis & Gyr Zug Ag Method for the mechanical soft-soldering of heavy metals utilizing a fluxing agent
US4708751A (en) * 1984-12-14 1987-11-24 Alpha Grillo-Lotsysteme Gmbh Halogen-free foam fluxes
US4568395A (en) * 1985-05-10 1986-02-04 Nabhani Abdol R Precleaner system and soldering flux
JPH0773795B2 (ja) * 1985-07-02 1995-08-09 太陽インキ製造株式会社 はんだ付用水洗性フラツクス組成物
US4661173A (en) * 1986-07-25 1987-04-28 Mcdonnell Douglas Corporation Alloy-enriched solder cream
US4759490A (en) * 1986-10-23 1988-07-26 Fujitsu Limited Method for soldering electronic components onto a printed wiring board using a solder paste
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
US4895606A (en) * 1989-02-23 1990-01-23 Ashraf Jafri Formulations for soldering flux
US4940498A (en) * 1989-08-14 1990-07-10 Multicore Solders Limited Flux composition
US5004509A (en) * 1990-05-04 1991-04-02 Delco Electronics Corporation Low residue soldering flux
US4994119A (en) * 1990-05-09 1991-02-19 International Business Machines Corporation Water soluble soldering flux
US5085365B1 (en) * 1990-05-15 1995-08-08 Hughes Aircraft Co Water soluble soldering flux
US5141568A (en) * 1990-05-15 1992-08-25 Hughes Aircraft Company Water-soluble soldering paste
US5009724A (en) * 1990-07-02 1991-04-23 At&T Bell Laboratories Soldering flux and method of its use in fabricating and assembling circuit boards
JPH07121468B2 (ja) * 1990-10-03 1995-12-25 メック株式会社 はんだ付け用フラックス
US5145531A (en) * 1990-10-31 1992-09-08 Hughes Aircraft Company Fluxing apparatus and method
US5069730A (en) * 1991-01-28 1991-12-03 At&T Bell Laboratories Water-soluble soldering paste

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10117404A1 (de) * 2001-04-06 2002-10-17 Paff Stannol Loetmittel Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten

Also Published As

Publication number Publication date
ATE176184T1 (de) 1999-02-15
AU5171093A (en) 1994-06-08
DE69323321D1 (de) 1999-03-11
CA2148598C (en) 1998-09-22
SG49734A1 (en) 1998-06-15
JP2690197B2 (ja) 1997-12-10
WO1994011148A1 (en) 1994-05-26
KR100186786B1 (en) 1999-04-01
JPH08503168A (ja) 1996-04-09
EP0668808A4 (de) 1996-04-24
CA2148598A1 (en) 1994-05-26
HK1008311A1 (en) 1999-05-07
CN1034481C (zh) 1997-04-09
TW210300B (en) 1993-08-01
EP0668808B1 (de) 1999-01-27
CN1088865A (zh) 1994-07-06
MY109119A (en) 1996-12-31
EP0668808A1 (de) 1995-08-30
US5297721A (en) 1994-03-29
BR9307474A (pt) 1999-06-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition