CN103443889B - 电子元器件 - Google Patents
电子元器件 Download PDFInfo
- Publication number
- CN103443889B CN103443889B CN201280011568.2A CN201280011568A CN103443889B CN 103443889 B CN103443889 B CN 103443889B CN 201280011568 A CN201280011568 A CN 201280011568A CN 103443889 B CN103443889 B CN 103443889B
- Authority
- CN
- China
- Prior art keywords
- outer electrode
- insulating barrier
- back side
- main body
- electronic devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000004888 barrier function Effects 0.000 claims abstract description 78
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 230000006378 damage Effects 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 238000009751 slip forming Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 208000031481 Pathologic Constriction Diseases 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 235000011837 pasties Nutrition 0.000 description 2
- 230000036262 stenosis Effects 0.000 description 2
- 208000037804 stenosis Diseases 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-072164 | 2011-03-29 | ||
JP2011072164 | 2011-03-29 | ||
PCT/JP2012/055050 WO2012132726A1 (ja) | 2011-03-29 | 2012-02-29 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103443889A CN103443889A (zh) | 2013-12-11 |
CN103443889B true CN103443889B (zh) | 2016-06-15 |
Family
ID=46930473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280011568.2A Active CN103443889B (zh) | 2011-03-29 | 2012-02-29 | 电子元器件 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5459567B2 (ja) |
CN (1) | CN103443889B (ja) |
TW (1) | TWI532065B (ja) |
WO (1) | WO2012132726A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101525662B1 (ko) * | 2013-04-26 | 2015-06-03 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 적층 세라믹 전자부품 실장 기판 |
KR101504002B1 (ko) * | 2013-05-21 | 2015-03-18 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 적층 세라믹 커패시터 실장 기판 |
JP6769058B2 (ja) * | 2016-03-14 | 2020-10-14 | Tdk株式会社 | 積層コンデンサ |
JP6769059B2 (ja) * | 2016-03-14 | 2020-10-14 | Tdk株式会社 | 積層コンデンサ |
JP6794791B2 (ja) * | 2016-11-09 | 2020-12-02 | Tdk株式会社 | 電子部品 |
KR102230044B1 (ko) | 2019-12-12 | 2021-03-19 | 삼성전기주식회사 | 코일 부품 |
WO2023002894A1 (ja) * | 2021-07-19 | 2023-01-26 | 株式会社村田製作所 | セラミック電子部品 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101320619A (zh) * | 2007-03-29 | 2008-12-10 | Tdk株式会社 | 电子元件及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63153511U (ja) * | 1987-03-27 | 1988-10-07 | ||
JPH08162357A (ja) * | 1994-11-30 | 1996-06-21 | Murata Mfg Co Ltd | セラミック電子部品 |
JP3347292B2 (ja) * | 1998-06-01 | 2002-11-20 | 太陽誘電株式会社 | 面実装型コイル部品 |
JP3531543B2 (ja) * | 1999-07-30 | 2004-05-31 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法及び積層セラミック電子部品 |
JP2004039937A (ja) * | 2002-07-04 | 2004-02-05 | Tdk Corp | セラミック電子部品 |
JP4093188B2 (ja) * | 2003-05-27 | 2008-06-04 | 株式会社村田製作所 | 積層セラミック電子部品とその実装構造および実装方法 |
JP2006100451A (ja) * | 2004-09-28 | 2006-04-13 | Taiyo Yuden Co Ltd | 3端子積層コンデンサ及び実装構造 |
JP4650007B2 (ja) * | 2005-02-01 | 2011-03-16 | 株式会社村田製作所 | 積層コンデンサ |
JP2010199171A (ja) * | 2009-02-24 | 2010-09-09 | Shinko Electric Ind Co Ltd | チップ部品実装配線基板 |
-
2012
- 2012-02-29 CN CN201280011568.2A patent/CN103443889B/zh active Active
- 2012-02-29 WO PCT/JP2012/055050 patent/WO2012132726A1/ja active Application Filing
- 2012-02-29 JP JP2013507290A patent/JP5459567B2/ja active Active
- 2012-03-02 TW TW101106845A patent/TWI532065B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101320619A (zh) * | 2007-03-29 | 2008-12-10 | Tdk株式会社 | 电子元件及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103443889A (zh) | 2013-12-11 |
JPWO2012132726A1 (ja) | 2014-07-24 |
JP5459567B2 (ja) | 2014-04-02 |
WO2012132726A1 (ja) | 2012-10-04 |
TW201239927A (en) | 2012-10-01 |
TWI532065B (zh) | 2016-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |