CN103441091A - 一种半导体器件的制造设备和方法 - Google Patents
一种半导体器件的制造设备和方法 Download PDFInfo
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- CN103441091A CN103441091A CN201310389210XA CN201310389210A CN103441091A CN 103441091 A CN103441091 A CN 103441091A CN 201310389210X A CN201310389210X A CN 201310389210XA CN 201310389210 A CN201310389210 A CN 201310389210A CN 103441091 A CN103441091 A CN 103441091A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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CN201310389210.XA CN103441091B (zh) | 2013-08-30 | 2013-08-30 | 一种半导体器件的制造设备和方法 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104637830A (zh) * | 2014-12-31 | 2015-05-20 | 吴华 | 微电子芯片的软焊料装片机 |
CN105470171A (zh) * | 2015-12-01 | 2016-04-06 | 浙江罗丹照明电器有限公司 | 一种360度发光led节能灯的加工设备 |
CN105945481A (zh) * | 2016-06-08 | 2016-09-21 | 广东科杰机械自动化有限公司 | 一种半导体的自动生产方法 |
CN106298562A (zh) * | 2016-09-30 | 2017-01-04 | 淄博才聚电子科技有限公司 | 一种二极管引线框架合片装置及其合片工艺 |
CN106298561A (zh) * | 2016-09-30 | 2017-01-04 | 淄博才聚电子科技有限公司 | 一种桥引线框架合片装置及其合片工艺 |
CN106783650A (zh) * | 2016-12-14 | 2017-05-31 | 深圳清华大学研究院 | 用于半导体激光器自动打线的固定装置 |
CN106981448A (zh) * | 2017-05-09 | 2017-07-25 | 深圳市佳思特光电设备有限公司 | 一种led固晶机的二次上下料机构 |
CN108033248A (zh) * | 2017-04-14 | 2018-05-15 | 上海新阳半导体材料股份有限公司 | 针式元件处理用输送装置 |
CN109545726A (zh) * | 2018-11-07 | 2019-03-29 | Tcl王牌电器(惠州)有限公司 | 一种物料移取装置和物料封装生产线 |
CN111244748A (zh) * | 2019-12-31 | 2020-06-05 | 芯思杰技术(深圳)股份有限公司 | 管座加热方法、装置、芯片组装方法、芯片、加热结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006147860A (ja) * | 2004-11-19 | 2006-06-08 | Toshiba Corp | 半導体装置の製造装置および製造方法 |
US20120064657A1 (en) * | 2011-03-24 | 2012-03-15 | Primestar Solar, Inc. | Dynamic system for variable heating or cooling of linearly conveyed substrates |
CN202219366U (zh) * | 2011-07-25 | 2012-05-16 | 揭阳市宏乾电子有限公司 | 一种生产大功率管芯片的装置 |
CN102543801A (zh) * | 2012-02-20 | 2012-07-04 | 常熟艾科瑞思封装自动化设备有限公司 | 一种固晶机 |
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2013
- 2013-08-30 CN CN201310389210.XA patent/CN103441091B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006147860A (ja) * | 2004-11-19 | 2006-06-08 | Toshiba Corp | 半導体装置の製造装置および製造方法 |
US20120064657A1 (en) * | 2011-03-24 | 2012-03-15 | Primestar Solar, Inc. | Dynamic system for variable heating or cooling of linearly conveyed substrates |
CN202219366U (zh) * | 2011-07-25 | 2012-05-16 | 揭阳市宏乾电子有限公司 | 一种生产大功率管芯片的装置 |
CN102543801A (zh) * | 2012-02-20 | 2012-07-04 | 常熟艾科瑞思封装自动化设备有限公司 | 一种固晶机 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104637830B (zh) * | 2014-12-31 | 2018-03-27 | 南通金泰科技有限公司 | 微电子芯片的软焊料装片机 |
CN104637830A (zh) * | 2014-12-31 | 2015-05-20 | 吴华 | 微电子芯片的软焊料装片机 |
CN105470171B (zh) * | 2015-12-01 | 2018-03-20 | 浙江罗丹照明电器有限公司 | 一种360度发光led节能灯的加工设备 |
CN105470171A (zh) * | 2015-12-01 | 2016-04-06 | 浙江罗丹照明电器有限公司 | 一种360度发光led节能灯的加工设备 |
CN105945481A (zh) * | 2016-06-08 | 2016-09-21 | 广东科杰机械自动化有限公司 | 一种半导体的自动生产方法 |
CN106298561A (zh) * | 2016-09-30 | 2017-01-04 | 淄博才聚电子科技有限公司 | 一种桥引线框架合片装置及其合片工艺 |
CN106298562A (zh) * | 2016-09-30 | 2017-01-04 | 淄博才聚电子科技有限公司 | 一种二极管引线框架合片装置及其合片工艺 |
CN106298561B (zh) * | 2016-09-30 | 2018-08-21 | 山东才聚电子科技有限公司 | 一种桥引线框架合片装置及其合片工艺 |
CN106298562B (zh) * | 2016-09-30 | 2018-10-02 | 山东才聚电子科技有限公司 | 一种二极管引线框架合片装置及其合片工艺 |
CN106783650A (zh) * | 2016-12-14 | 2017-05-31 | 深圳清华大学研究院 | 用于半导体激光器自动打线的固定装置 |
CN106783650B (zh) * | 2016-12-14 | 2019-12-06 | 深圳清华大学研究院 | 用于半导体激光器自动打线的固定装置 |
CN108033248A (zh) * | 2017-04-14 | 2018-05-15 | 上海新阳半导体材料股份有限公司 | 针式元件处理用输送装置 |
CN108033248B (zh) * | 2017-04-14 | 2024-01-26 | 上海新阳半导体材料股份有限公司 | 针式元件处理用输送装置 |
CN106981448A (zh) * | 2017-05-09 | 2017-07-25 | 深圳市佳思特光电设备有限公司 | 一种led固晶机的二次上下料机构 |
CN106981448B (zh) * | 2017-05-09 | 2023-08-15 | 深圳市佳思特光电设备有限公司 | 一种led固晶机的二次上下料机构 |
CN109545726A (zh) * | 2018-11-07 | 2019-03-29 | Tcl王牌电器(惠州)有限公司 | 一种物料移取装置和物料封装生产线 |
CN109545726B (zh) * | 2018-11-07 | 2021-08-24 | Tcl王牌电器(惠州)有限公司 | 一种物料移取装置和物料封装生产线 |
CN111244748A (zh) * | 2019-12-31 | 2020-06-05 | 芯思杰技术(深圳)股份有限公司 | 管座加热方法、装置、芯片组装方法、芯片、加热结构 |
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CN103441091B (zh) | 2016-04-20 |
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Owner name: WUHAN LIANJUN TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WUHAN MUXTOR ELECTRONIC TECHNOLOGY CO., LTD. Effective date: 20150225 |
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Effective date of registration: 20150225 Address after: 430000 Hubei city of Wuhan province high four road East Lake New Technology Development Zone in the south of the two Buddha Ridge Road East of Gezhouba Dam Sun City 2 Building 6 layer 1 Applicant after: Wuhan Lian Jun Science and Technology Ltd. Address before: 430000 Hubei city of Wuhan province East Lake Development Zone, the new six way long Ju Juxian Technology Park building B-102 room Applicant before: Wuhan Muxtor Electronic Science & Technology Co., Ltd. |
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Effective date of registration: 20171213 Address after: 430000 East Lake Development Zone, Wuhan City, Hubei Province, hi-tech four Gezhouba Dam Sun City 2-601 Patentee after: Li Jun Address before: 430000 Hubei city of Wuhan province high four road East Lake New Technology Development Zone in the south of the two Buddha Ridge Road East of Gezhouba Dam Sun City 2 Building 6 layer 1 Patentee before: Wuhan Lian Jun Science and Technology Ltd. |
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Effective date of registration: 20180706 Address after: 454000 building 3, standardized industrial area, industrial zone, Xiu Wu County, Jiaozuo, Henan Patentee after: Henan Xin Yuguang Polytron Technologies Inc Address before: 430000 East Lake Development Zone, Wuhan, Hubei, four new road, Gezhouba Dam Sun City 2-601 Patentee before: Li Jun |
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Effective date of registration: 20200327 Address after: 430200 Gezhouba Sun City 2-601, No. 40, Gaoxin 4th Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: Li Jun Address before: 454000 building 3, standardized industrial area, industrial zone, Xiu Wu County, Jiaozuo, Henan Patentee before: SINY OPTIC-COM Co.,Ltd. |
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