CN103260816A - 激光照射装置及激光照射方法 - Google Patents
激光照射装置及激光照射方法 Download PDFInfo
- Publication number
- CN103260816A CN103260816A CN2011800616215A CN201180061621A CN103260816A CN 103260816 A CN103260816 A CN 103260816A CN 2011800616215 A CN2011800616215 A CN 2011800616215A CN 201180061621 A CN201180061621 A CN 201180061621A CN 103260816 A CN103260816 A CN 103260816A
- Authority
- CN
- China
- Prior art keywords
- laser
- output value
- laser irradiation
- output
- irradiation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
- B29D11/00788—Producing optical films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Laser Beam Processing (AREA)
- Polarising Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-288671 | 2010-12-24 | ||
| JP2010288671A JP2012135782A (ja) | 2010-12-24 | 2010-12-24 | レーザー光照射装置およびレーザー光照射方法 |
| PCT/JP2011/079832 WO2012086764A1 (ja) | 2010-12-24 | 2011-12-22 | レーザー光照射装置およびレーザー光照射方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103260816A true CN103260816A (zh) | 2013-08-21 |
Family
ID=46314031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011800616215A Pending CN103260816A (zh) | 2010-12-24 | 2011-12-22 | 激光照射装置及激光照射方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2012135782A (enExample) |
| KR (1) | KR20140019313A (enExample) |
| CN (1) | CN103260816A (enExample) |
| TW (1) | TW201233482A (enExample) |
| WO (1) | WO2012086764A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378260A (zh) * | 2016-05-17 | 2017-11-24 | 发那科株式会社 | 激光加工装置和激光加工方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013128966A (ja) * | 2011-12-22 | 2013-07-04 | Sumitomo Chemical Co Ltd | レーザー光照射装置、フィルム切断装置、レーザー光照射方法及びフィルム切断方法 |
| JP7475220B2 (ja) * | 2020-07-03 | 2024-04-26 | 住友重機械工業株式会社 | レーザパワー計測装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478694A (en) * | 1987-09-19 | 1989-03-24 | Hitachi Maxell | Method and device for cutting raw film consisting of plastic film as base material |
| JPH09122946A (ja) * | 1995-10-31 | 1997-05-13 | Hitachi Cable Ltd | 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置 |
| JP2000357835A (ja) * | 1999-06-15 | 2000-12-26 | Amada Eng Center Co Ltd | レーザ発振器 |
| CN101266926A (zh) * | 2007-01-24 | 2008-09-17 | 索尼株式会社 | 激光绘图方法和设备 |
-
2010
- 2010-12-24 JP JP2010288671A patent/JP2012135782A/ja not_active Withdrawn
-
2011
- 2011-12-20 TW TW100147292A patent/TW201233482A/zh unknown
- 2011-12-22 KR KR1020137018981A patent/KR20140019313A/ko not_active Withdrawn
- 2011-12-22 CN CN2011800616215A patent/CN103260816A/zh active Pending
- 2011-12-22 WO PCT/JP2011/079832 patent/WO2012086764A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478694A (en) * | 1987-09-19 | 1989-03-24 | Hitachi Maxell | Method and device for cutting raw film consisting of plastic film as base material |
| JPH09122946A (ja) * | 1995-10-31 | 1997-05-13 | Hitachi Cable Ltd | 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置 |
| JP2000357835A (ja) * | 1999-06-15 | 2000-12-26 | Amada Eng Center Co Ltd | レーザ発振器 |
| CN101266926A (zh) * | 2007-01-24 | 2008-09-17 | 索尼株式会社 | 激光绘图方法和设备 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378260A (zh) * | 2016-05-17 | 2017-11-24 | 发那科株式会社 | 激光加工装置和激光加工方法 |
| CN107378260B (zh) * | 2016-05-17 | 2019-07-05 | 发那科株式会社 | 激光加工装置和激光加工方法 |
| US10537964B2 (en) | 2016-05-17 | 2020-01-21 | Fanuc Corporation | Laser machining apparatus and laser machining method for performing laser machining while controlling reflected light |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140019313A (ko) | 2014-02-14 |
| TW201233482A (en) | 2012-08-16 |
| JP2012135782A (ja) | 2012-07-19 |
| WO2012086764A1 (ja) | 2012-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130821 |