CN103260816A - 激光照射装置及激光照射方法 - Google Patents

激光照射装置及激光照射方法 Download PDF

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Publication number
CN103260816A
CN103260816A CN2011800616215A CN201180061621A CN103260816A CN 103260816 A CN103260816 A CN 103260816A CN 2011800616215 A CN2011800616215 A CN 2011800616215A CN 201180061621 A CN201180061621 A CN 201180061621A CN 103260816 A CN103260816 A CN 103260816A
Authority
CN
China
Prior art keywords
laser
output value
laser irradiation
output
irradiation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800616215A
Other languages
English (en)
Chinese (zh)
Inventor
及川伸
松本力也
闵晟旭
赵在亨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hardram Co ltd
Sumitomo Chemical Co Ltd
Original Assignee
Hardram Co ltd
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hardram Co ltd, Sumitomo Chemical Co Ltd filed Critical Hardram Co ltd
Publication of CN103260816A publication Critical patent/CN103260816A/zh
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/0074Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00788Producing optical films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Laser Beam Processing (AREA)
  • Polarising Elements (AREA)
CN2011800616215A 2010-12-24 2011-12-22 激光照射装置及激光照射方法 Pending CN103260816A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-288671 2010-12-24
JP2010288671A JP2012135782A (ja) 2010-12-24 2010-12-24 レーザー光照射装置およびレーザー光照射方法
PCT/JP2011/079832 WO2012086764A1 (ja) 2010-12-24 2011-12-22 レーザー光照射装置およびレーザー光照射方法

Publications (1)

Publication Number Publication Date
CN103260816A true CN103260816A (zh) 2013-08-21

Family

ID=46314031

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800616215A Pending CN103260816A (zh) 2010-12-24 2011-12-22 激光照射装置及激光照射方法

Country Status (5)

Country Link
JP (1) JP2012135782A (enExample)
KR (1) KR20140019313A (enExample)
CN (1) CN103260816A (enExample)
TW (1) TW201233482A (enExample)
WO (1) WO2012086764A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107378260A (zh) * 2016-05-17 2017-11-24 发那科株式会社 激光加工装置和激光加工方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013128966A (ja) * 2011-12-22 2013-07-04 Sumitomo Chemical Co Ltd レーザー光照射装置、フィルム切断装置、レーザー光照射方法及びフィルム切断方法
JP7475220B2 (ja) * 2020-07-03 2024-04-26 住友重機械工業株式会社 レーザパワー計測装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6478694A (en) * 1987-09-19 1989-03-24 Hitachi Maxell Method and device for cutting raw film consisting of plastic film as base material
JPH09122946A (ja) * 1995-10-31 1997-05-13 Hitachi Cable Ltd 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置
JP2000357835A (ja) * 1999-06-15 2000-12-26 Amada Eng Center Co Ltd レーザ発振器
CN101266926A (zh) * 2007-01-24 2008-09-17 索尼株式会社 激光绘图方法和设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6478694A (en) * 1987-09-19 1989-03-24 Hitachi Maxell Method and device for cutting raw film consisting of plastic film as base material
JPH09122946A (ja) * 1995-10-31 1997-05-13 Hitachi Cable Ltd 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置
JP2000357835A (ja) * 1999-06-15 2000-12-26 Amada Eng Center Co Ltd レーザ発振器
CN101266926A (zh) * 2007-01-24 2008-09-17 索尼株式会社 激光绘图方法和设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107378260A (zh) * 2016-05-17 2017-11-24 发那科株式会社 激光加工装置和激光加工方法
CN107378260B (zh) * 2016-05-17 2019-07-05 发那科株式会社 激光加工装置和激光加工方法
US10537964B2 (en) 2016-05-17 2020-01-21 Fanuc Corporation Laser machining apparatus and laser machining method for performing laser machining while controlling reflected light

Also Published As

Publication number Publication date
KR20140019313A (ko) 2014-02-14
TW201233482A (en) 2012-08-16
JP2012135782A (ja) 2012-07-19
WO2012086764A1 (ja) 2012-06-28

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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130821