TW201233482A - Laser beam irradiation device and laser beam irradiation method - Google Patents
Laser beam irradiation device and laser beam irradiation method Download PDFInfo
- Publication number
- TW201233482A TW201233482A TW100147292A TW100147292A TW201233482A TW 201233482 A TW201233482 A TW 201233482A TW 100147292 A TW100147292 A TW 100147292A TW 100147292 A TW100147292 A TW 100147292A TW 201233482 A TW201233482 A TW 201233482A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser light
- laser
- film
- oscillator
- output value
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 abstract description 37
- 238000012545 processing Methods 0.000 abstract description 17
- 239000010408 film Substances 0.000 description 134
- 238000010586 diagram Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 230000010355 oscillation Effects 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QYIGOGBGVKONDY-UHFFFAOYSA-N 1-(2-bromo-5-chlorophenyl)-3-methylpyrazole Chemical compound N1=C(C)C=CN1C1=CC(Cl)=CC=C1Br QYIGOGBGVKONDY-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- 101100481695 Mus musculus Tmie gene Proteins 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 241000239226 Scorpiones Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- CCGKOQOJPYTBIH-UHFFFAOYSA-N ethenone Chemical compound C=C=O CCGKOQOJPYTBIH-UHFFFAOYSA-N 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000004018 waxing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
- B29D11/00788—Producing optical films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Laser Beam Processing (AREA)
- Polarising Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010288671A JP2012135782A (ja) | 2010-12-24 | 2010-12-24 | レーザー光照射装置およびレーザー光照射方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201233482A true TW201233482A (en) | 2012-08-16 |
Family
ID=46314031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100147292A TW201233482A (en) | 2010-12-24 | 2011-12-20 | Laser beam irradiation device and laser beam irradiation method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2012135782A (enExample) |
| KR (1) | KR20140019313A (enExample) |
| CN (1) | CN103260816A (enExample) |
| TW (1) | TW201233482A (enExample) |
| WO (1) | WO2012086764A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI777625B (zh) * | 2020-07-03 | 2022-09-11 | 日商住友重機械工業股份有限公司 | 雷射功率測量裝置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013128966A (ja) * | 2011-12-22 | 2013-07-04 | Sumitomo Chemical Co Ltd | レーザー光照射装置、フィルム切断装置、レーザー光照射方法及びフィルム切断方法 |
| JP6342949B2 (ja) | 2016-05-17 | 2018-06-13 | ファナック株式会社 | 反射光を抑制しながらレーザ加工を行うレーザ加工装置及びレーザ加工方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478694A (en) * | 1987-09-19 | 1989-03-24 | Hitachi Maxell | Method and device for cutting raw film consisting of plastic film as base material |
| JP3102322B2 (ja) * | 1995-10-31 | 2000-10-23 | 日立電線株式会社 | 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置 |
| JP2000357835A (ja) * | 1999-06-15 | 2000-12-26 | Amada Eng Center Co Ltd | レーザ発振器 |
| JP4274251B2 (ja) * | 2007-01-24 | 2009-06-03 | ソニー株式会社 | レーザ描画方法及びレーザ描画装置 |
-
2010
- 2010-12-24 JP JP2010288671A patent/JP2012135782A/ja not_active Withdrawn
-
2011
- 2011-12-20 TW TW100147292A patent/TW201233482A/zh unknown
- 2011-12-22 KR KR1020137018981A patent/KR20140019313A/ko not_active Withdrawn
- 2011-12-22 CN CN2011800616215A patent/CN103260816A/zh active Pending
- 2011-12-22 WO PCT/JP2011/079832 patent/WO2012086764A1/ja not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI777625B (zh) * | 2020-07-03 | 2022-09-11 | 日商住友重機械工業股份有限公司 | 雷射功率測量裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012135782A (ja) | 2012-07-19 |
| WO2012086764A1 (ja) | 2012-06-28 |
| CN103260816A (zh) | 2013-08-21 |
| KR20140019313A (ko) | 2014-02-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101706416B1 (ko) | 편광판 절단 방법 및 상기 방법에 의해 절단된 편광판 | |
| JP4651731B2 (ja) | レーザースクライブ加工方法 | |
| US20090218475A1 (en) | Laser Annealing Apparatus and Method | |
| TW201628751A (zh) | 彈性玻璃基板之回饋控制的雷射切割 | |
| TW201233482A (en) | Laser beam irradiation device and laser beam irradiation method | |
| KR101618392B1 (ko) | 레이저 장치, 광치료 장치, 노광 장치, 디바이스 제조 방법, 및 물체 검사 장치 | |
| KR20150133697A (ko) | 레이저 어닐링 장치 | |
| CN109073805B (zh) | 用于在光学膜处进行标记的系统和方法 | |
| CN103153526B (zh) | 激光切割装置及具有该装置的切条机 | |
| JP2010158715A (ja) | レーザ加工装置 | |
| US11322903B2 (en) | Solid state laser apparatus | |
| TWI403376B (zh) | 等能量脈波同步運動之雷射裝置 | |
| JP2012076143A5 (ja) | レーザー切断装置、これを備えるスリッター機、およびレーザー切断方法 | |
| JP2014121736A (ja) | レーザー光照射装置およびレーザー光照射方法 | |
| WO2013094758A1 (ja) | レーザー光照射システム、レーザー光照射方法及び記録媒体 | |
| KR20130077415A (ko) | 레이저 어닐링 장치 및 레이저 어닐링 방법 | |
| CN102593702B (zh) | 等能量脉波同步运动的雷射装置 | |
| JP6020884B2 (ja) | レーザー加工方法 | |
| JP5362169B2 (ja) | レーザ装置、光学装置の制御方法、およびレーザ装置の制御方法 | |
| CN209805088U (zh) | 一种适用于极片料带切割的Q-Switch激光器 | |
| JP5645220B2 (ja) | 半導体膜のレーザアニール装置 | |
| JP2019149400A (ja) | レーザ光源装置及びレーザ光調整方法 | |
| JP2017224679A (ja) | レーザ発振器、及び、エラー検知方法 | |
| JP2016021540A (ja) | レーザ発振装置 | |
| JP2011244018A (ja) | レーザ装置、光学装置の制御方法、およびレーザ装置の制御方法 |