201233482 、發明說明： 【發明所屬之技術領域】 本發明是關於一種抑制輸出變動，安定化照射的雷 射光輸出，可以適當地切斷薄膜的雷射光照射裝置以及 雷射光照射方法。 【先前技術】 偏光薄膜被廣泛地使用在液晶面板等各種製品。以 往，在偏光薄膜的切斷加工，雖然使用刃物，但從被切 斷物容易產生薄膜屑等異物，由於此異物附著在偏光薄 膜，所以做為被切斷物的製品之良率會低落。 因此，近年在偏光薄膜的切斷加工，使用雷射光來 取代刃物。藉由以雷射光進行切斷加工，比較以刃物的 切斷加工，因為從被切斷物難以產生薄膜屑等異物，所 以可抑制做為被切斷物的製品的良率低落。因此，以雷 射光的切斷方法是有用的，例如專利文獻1〜5所記 載，提出了各種方法。 【先前技術文獻】 【專利文獻】 【專利文獻1】日本公開專利公報「特開 2008-284572號公報（2008年11月27日公開）」 【專利文獻2】日本公開專利公報「特開 2008-302376號公報（2008年12月18日公開）」 【專利文獻3】曰本公開專利公報「特開2009-22978 201233482 號公報（2009年2月5日公開）」 【專利文獻4】曰本公胡蚩 細9-167321號公報（2_年 ^利公報「特開 丁 /月日公開） 【專利文獻5】曰本公開專利公報「 」 號公報（2010年3月11曰公開）」寺開編-5331〇 可疋，一般來說，雷射光振盪器，Α 並非固定，具有在過短的周期（例如厂雷射先=輸出 以夾著設定值的固定振幅來變動 故 光薄膜切斷加工所需的值，實偏 工偏光薄膜的狀況的問題點。以下 切斷加 點。 r具體说明關於該問題 雙光薄膜的輯加卫，是藉由以㈣速度搬 運偏光溥膜的長形物並照射雷射光來: 2雷射光的輸出值設定成偏光薄膜的切斷仃加工在:需 定===值:成比設定 =,，纏繞切斷加工後的偏光薄4臈 的鈿部（切斷部）變成被切細的狀 、 rnT生破損之不便。另-方面，為二= 便’即’為了可以在輸出值比設定值低—定以上 :::二將雷射光的輸出值設定在比偏光薄膜的‘ ，的5’則以輸出變動該輸出值變 * 了偏光簿膣的：：,一疋程度以上時，輸出值變得過 回，偏先_的端部（切斷部）被因雷射光照射產生過 201233482 剩的熱所熔解、熱膨脹並隆起彎曲。故，在切斷加工後 的偏光薄膜會產生品質惡化之其他不便。 但是，在上述專利文獻1〜5所記載的切斷方法， 關於雷射光振盪器的上述特性，即關於在過短的周期雷 射光的輸出變動的特性，並沒有進行特別的考慮或對 策。也就是說，在上述專利文獻1〜5所記載的切斷方 法，有不能將偏光薄膜適當地切斷加工的狀況之問題 點。故，需要一種能將偏光薄膜隨時適當地切斷加工的 雷射光照射裝置以及雷射光照射方法。 【發明内容】 本發明係有鑑於上述問題者，其主要目的為提供一 種雷射光照射裝置以及雷射光照射方法，抑制輸出變 動，安定化照射的雷射光輸出。 關於本發明的雷射光照射裝置，為了解決上述問 題，為了切斷薄膜將雷射光照射至該薄膜，具備：雷射 光振盪器（laser oscillator)’振盪雷射光；分光鏡（beam splitter)，將來自雷射光振盪器所振盪的雷射光分歧為 兩條，將分歧的雷射光中，一方的雷射光照射至薄膜； 測量裝置，測量分歧的雷射光中，的他方的雷射光的強 度；以及修正裝置，從被測量的強度算出上述雷射光振 盪器的輸出值，判斷上述輸出值相對於設定值是大還是 小，將上述雷射光振盪器的輸出值修正成靠近設定值。 根據上述結構，以測量裝置測量被分光鏡所分歧的 雷射光中，他方的雷射光之強度，以修正裝置從上述強 201233482 度算出雷射光振盪器的輸出值，判斷上述輸出值相對於 設定值是大還是小，可以將上述雷射光振盪器的輸出值 修正成靠近設定值。因此，即使將從上述雷射光照射裝 置振盪的雷射光的輸出值，設定成切斷薄膜所需（且更 低）的值，因為抑制輸出變動所使該輸出值不會變成低 於（小於）設定值一定程度以上，可以適當地切斷薄膜。 故，可以提供一種雷射光照射裝置，來抑制輸出變動（相 對於設定值的變動），安定化照射的雷射光的輸出並適 當地切斷薄膜。 上述測量裝置，更佳為測量分歧的雷射光中的透射 光的強度。又，上述測量裝置更佳為功率感應器（power sensor)。再者，上述雷射光振盪器，更佳為C02雷射光 振盈器。 關於本發明的雷射光照射方法，為了解決上述問 題，為了切斷薄膜將雷射光照射至該薄膜，該方法包 含：使來自雷射光振盪器所振盪的雷射光分歧為兩條， 將分歧的雷射光中，一方的雷射光照射至薄膜，並測量 他方的雷射光的強度；以及從測量的強度算出上述雷射 光振盪器的輸出值，判斷上述輸出值相對於設定值是大 還是小，將上述雷射光振盪器的輸出值全時（full-time ) 修正成靠近設定值。 根據上述結構，測量分歧的雷射光中的他方的雷射 光之強度，從上述強度算出雷射光振盪器的輸出值，判 斷上述輸出值相對於設定值是大還是小，將上述雷射光 振盪器的輸出值全時修正成靠近設定值。因此，即使將 201233482 從上述雷射光照射裝置振盪的雷射光的輸出值，設定成 切斷薄膜所需（且更低）的值，因為抑制輸出變動所使 該輸出值不會變成低於（小於）設定值一定程度以上， 可以適當地切斷薄膜。故，可以提供一種雷射光照射方 法，來抑制輸出變動（相對於設定值的變動），安定化 照射的雷射光的輸出並適當地切斷薄膜。 根據關於本發明的雷射光照射裝置以及雷射光照 射方法，即使將雷射光的輸出值設定成切斷薄膜所需 (且更低）的值，因為抑制輸出變動所使該輸出值不會 變成低於（小於）設定值一定程度以上，可以適當地切 斷薄膜。故，可以達成一效果，該效果是能提供一種雷 射光照射裝置以及雷射光照射方法，抑制輸出變動（相 對於設定值的變動），安定化照射的雷射光的輸出因而 能適當地切斷薄膜。 關於本發明的雷射光照射裝置以及雷射光照射方 法所切斷的薄膜，其端部（切斷部）不會變成被切細的狀 態，不會從端部向著偏光薄膜内側產生破損，而且雷射 光的輸出值不會被設定在比需要以上高，所以不會熔 解、熱膨脹並隆起、彎曲。故，在切斷加工後的偏光薄 膜不會產生品質惡化。 【實施方式】 關於本發明的實施的一形態，根據第一圖〜第五圖 如以下所述來說明。 又，在以下的說明，舉出被切斷的薄膜為偏光薄膜 201233482 的狀况為例。又，在本發明將薄膜「 a 分割為至少兩部分之外，還包含將斷」。將薄膜 _形成特定深度的溝(刻痕; 分」。更具體來說，「切斷畊至v—部 斷（剪除）、丰士她例缚膜的端部的切 ^ ^ Lf'}丰切斷、標記加工等。 [雷射光照射褒置] 本發明的雷射光照射裝置的-例如第一圖所 T二：第7圖所示’本實施型態之雷射光照射裝置10 =為了切斷偏光薄膜（薄膜），將雷射光 薄膜的裝置’具備：雷射繼器i、曲鏡2、= 3、功率感應器（測量裝置）4、處理板（修正九^ 聚f 圖未顯示)，並根據需要更具備擴束器（圖 未顯不）等光學部件。 雷射光振盪器1是振盪雷射光L的部件，可以採用 例如c〇2雷射光振盪器（二氧化碳雷射光振盪器）、uv 雷射光振盪器、半導體雷射光振盛器、YAG雷射光振 盪器、準分子雷射光振盪器等振盪器，具體結構並沒有x 特別限定。在上述例示的振盪器中，由於c〇2雷射光振 盪器是例如在偏光薄膜的切斷加工，可以適當的高輸出 振盪雷射光，所以更佳。 一般來說，雷射光振盪器，其雷射光的輸出並非固 定，具有在過短的周期（例如丨毫秒），輸出值以夾著 設定值的固定振幅來變動的特性，並在輸出低的狀況具 有雷射光的輸出值容易變得不安定（輸出越高輸出值的 變動幅度越容易變小）的特性。因此，為了使雷射光振 8 201233482 盪器1的輸出值進一步安定化，較佳為將雷射光振盪器 1的輸出做為相對較高輸出。但是，當輸出值過高，則 偏光薄膜被因雷射光照射產生過剩的熱所熔解、熱膨脹 並隆起彎曲，在切斷加工後的偏光薄膜會有產生品質惡 化之虞。故，雷射光振盪器1的輸出值，也可以對應偏 光薄膜的材質或厚度等條件，預先設定為適當的設定 值。也就是說，雷射光振盪器1的具體輸出值，較佳為 對應偏光薄膜的材質或厚度、偏光薄膜的搬運速度以及 分光鏡3所導致的透射光以及反射光的比率，設定為適 當的設定值。 照射的雷射光L的頻率，可以根據雷射光振盪器1 的輸出、偏光薄膜的材質或厚度、偏光薄膜的搬運速度 等條件來適當設定，但一般來說可以在5kHz以上， 100kHz 以下。 然後，雷射光振盪器1根據預先設定的設定值輸出 雷射光，並藉由做為修正裝置的處理板5，全時修正成 其輸出值靠近設定值。 雷射光照射裝置10，更佳為在從分光鏡3往偏光 薄膜的光路上，具備擴束器。擴束器是將雷射光L1擴 張成平行光束的部件，可以使用已知的擴束器。具體來 說，更佳為藉由擴束器，將雷射光L1的直徑擴張至2 倍〜10倍程度。藉由擴大雷射光的直徑，可以將照射 在偏光薄膜的雷射光的點徑更集中（變小）。 曲鏡（bent mirror) 2是將從雷射光振盪器1所振 盪的雷射光L，向著分光鏡3反射的部件。上述曲鏡2， 201233482 較佳為例如平面反射鏡，但也可以是可將雷射光L向著 分光鏡3反射的結構。又，其個數並沒有特別限定。 分光鏡（beam splitter) 3，是將從雷射光振盪器1 所振盪並藉由曲鏡2反射的雷射光L，以固定比率（比 例）分歧為兩部分的部件。也就是說，分光鏡3是以固 定比率將雷射光L分歧為反射光L1與透射光L2的部 件。然後，分光鏡3將分歧的雷射光中的反射光L1 (一 方的雷射光），經由聚光鏡等光學部件照射至偏光薄 膜，用於偏光薄膜的切斷加工，並將透射光L2 (他方 的雷射光）照射至功率感應器4,用於雷射光振盪器1 的輸出調節。該分光鏡3可以使用已知的分光鏡。 上述聚光鏡可以使用例如球面鏡片或非球面鏡片 等已知的鏡片，並沒有特別限定。又，因為以做為反射 光L1的雷射光的聚光徑來決定偏光薄膜的切斷寬度 (切割保留部），所以在偏光薄膜上的該雷射光的聚光 徑，較佳為5 // m以上、500 // m以下，更佳為10 // m 以上、400 /i m以下。 又，雖然在關於本實施形態的雷射光照射裝置10， 是將反射光L1使用於偏光薄膜的切斷加工，將透射光 L2使用於雷射光振盪器1的輸出調節的結構，但也可 以是藉由使用例如曲鏡（圖未顯示），將透射光L2使用 於偏光薄膜的切斷加工，將反射光L1使用於雷射光振 盪器1的輸出調節的結構。 做為測量裝置的功率感應器（power sensor) 4，是 將透射光L2變換為熱電動勢，測量做為透射光L2的雷 201233482 射光強度的元件。也就是說，功率感鹿 射雷射光所產生的電力，藉此來4測量藉由照 功率感應H 4的測4間隔為短者里射光的強度。 10毫秒，但沒有特別限定。又，住’若可以為例如 用已知的功率感應器。又，功率感應器4可以使 射光強度的結構。 /、里、置也可以是可測量雷 然後，功率感應器4將 值）的資料’經由A/D轉換 ：：射先強度（測量 板™D轉換器將泪= ί理 #料做;=數位資料發送至處理板5 做為L正表置的處理板5，内 processing unit)等演算處理裝置。該 應器4經由A/D轉換3|垃队AA、，曰 板5從功率感 分朵# 3八姑μ、#以接收的測1值的數位資料，與在 刀先鏡3刀歧的透射光u的比率 ： 射光振盪器1的輸出值，刹斷^异出上这苺 定的…定佶-[萝：值則述輸出值相對於預先設 又ΐ疋大還疋小（是超過還是不足），將上述雷 射光振m器1的輸出值全時修正成靠近設定值。也就 說’處理板5將演算結果以全時回饋 卜具體來說是例如每ίο毫秒回饋，將雷射光振 的實際輸出值調節（修正）成接近設定值。更具體來 在做為透射光L2的雷㈣強度變小，雷射光振盡器！ 的輸出值變得比設定值更小的狀況，s將雷射光振盪器 1的輸出調節成雷射光L的實際輸出值變大，另1 面’在做紐射M2的雷射光強度變大，雷射光振盡 器1的輸出值變得比蚊值更大的狀況，是將雷射光振 201233482 盪器1的輸出調節成雷射光L的實際輸出值變小。又， 處理板5也可以是可進行上述算出與判斷的結構，因此 其具體結構並沒有特別限定。 在關於本實施形態的雷射光照射裝置1〇，藉由上 述結構的功率感應器4以及處理板5，以例如1〇毫秒 的測量間隔測量透射光L2的強度，採用所謂FTS ( _ tmie stabilizer)系統來調節雷射光L的輸出值可以將 雷射光振盪器1的實際輸出值調節（修正）成接近設定 值，所以可以適當地切斷偏光薄膜。 關於本發明實施形態的雷射光照射裝置10,使用 做為-裝置，構成為例如持續進行偏光薄膜的切斷加工 的切割機(Sinter)(圖未顯示）。切割機係除了雷射照射 裝置10以外，還具備：捲出長的偏光薄膜（後述）的 捲出部、搬運該偏光薄膜的複數個搬運滾筒以及捲取被 切斷加工的偏光薄膜的捲取部等部件。以下說明關於切 割機。但是，由於在切割機的雷射照射裝置1〇以外的 結構是採用已知結構，所以簡略化其說明。 捲出巧是保持長的偏光薄膜，並藉由旋轉裝置的衣 轉將偏光薄膜朝向搬運滾筒捲出的部件，具體來說列寿 已知的捲出部。又’施加於偏光薄膜的張力以及偏光费 膜的搬運速度’是被旋轉裝置所調節。又，雖然捲出奇 可以設置為-個’但藉由設置為兩個，—方的捲出部备 偏光薄膜被全部捲出前，由於可以將該偏光薄膜與他2 的捲出。卩的偏㈣膜連接，所以可以減少交換偏光 的原材料的時間。 —[Technical Field] The present invention relates to a laser beam irradiation device and a laser beam irradiation method which can suppress the output fluctuation and stabilize the laser light output by irradiation. [Prior Art] A polarizing film is widely used in various products such as liquid crystal panels. In the cutting process of the polarizing film, a blade is used, and foreign matter such as film chips is likely to be generated from the object to be cut. Since the foreign matter adheres to the polarizing film, the yield of the product as the object to be cut is low. Therefore, in recent years, in the cutting process of a polarizing film, laser light has been used instead of the blade. In the cutting process by the laser light, the cutting process of the blade is compared, and foreign matter such as film dust is less likely to be generated from the object to be cut, so that the yield of the product as the object to be cut can be suppressed from being lowered. Therefore, it is useful to cut the laser light. For example, as disclosed in Patent Documents 1 to 5, various methods have been proposed. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2008-284572 (published on Nov. 27, 2008). [Patent Document 3] Japanese Laid-Open Patent Publication No. 2009-22978 201233482 (published on Feb. 5, 2009).蚩 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺 寺编-5331〇可疋, in general, the laser oscillator, Α is not fixed, with a short period of time (for example, factory laser first = output to change the fixed amplitude with a set value) The required value is a problem of the condition of the polarized film. The following is a cut-off point. r Specifically, the effect of the double-light film on the problem is to transport the elongated film of the polarizing film at (4) speed. Irradiation of laser light: 2 loss of laser light The cutting value of the polarizing film is set to be: === value: ratio setting =, the ridge portion (cutting portion) of the polarized thin film 4 after the winding cutting process is shredded, rnT is inconvenient to break. Another aspect is that the second = will be 'that' can be set lower than the set value - the above::: two will set the output value of the laser light to the '5' of the polarizing film Then, the output value changes to *the polarized book :::, when the level is more than one degree, the output value becomes too late, and the end portion (cutting portion) of the first _ is caused by the laser light, which is generated by 201233482. The heat is melted, thermally expanded, and swelled and bent. Therefore, the polarizing film after the cutting process has a problem of deterioration in quality. However, the cutting methods described in Patent Documents 1 to 5 described above regarding the laser oscillator. The characteristics, that is, the characteristics of the fluctuation of the output of the laser beam in the short period of time, are not particularly considered or countermeasures. In other words, in the cutting methods described in Patent Documents 1 to 5, the polarizing film cannot be appropriately selected. The situation of the ground cutting process Therefore, there is a need for a laser light irradiation apparatus and a laser light irradiation method capable of appropriately cutting a polarizing film at any time. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a main object thereof is to provide a laser light irradiation apparatus. In addition, the laser light irradiation method of the present invention suppresses the output fluctuation and stabilizes the laser light output of the irradiation. In order to solve the above problem, the laser light irradiation device of the present invention includes a laser light oscillator for irradiating the laser light to the film in order to cut the film. (laser oscillator) 'oscillation laser beam; beam splitter (beam splitter), the laser light from the laser oscillation of the laser is divided into two, one of the divergent laser light, one of the laser light is irradiated to the film; measuring device, Measuring the intensity of the other laser light in the divergent laser light; and correcting means for calculating the output value of the laser light oscillator from the measured intensity, and determining whether the output value is large or small with respect to the set value, The output value of the illuminating oscillator is corrected to be close to the set value. According to the above configuration, the measuring device measures the intensity of the other laser light that is diverged by the beam splitter, and the correction device calculates the output value of the laser light oscillator from the strong 201233482 degree, and determines the output value relative to the set value. Whether it is large or small, the output value of the above laser oscillator can be corrected to be close to the set value. Therefore, even if the output value of the laser light oscillated from the above-described laser light irradiation device is set to a value required to cut the film (and lower), since the output variation is suppressed, the output value does not become lower (less than). When the set value is more than a certain level, the film can be cut as appropriate. Therefore, it is possible to provide a laser light irradiation device which suppresses output fluctuation (change with respect to a set value), stabilizes the output of the irradiated laser light, and appropriately cuts the film. The above measuring device is more preferably for measuring the intensity of transmitted light in divergent laser light. Further, the above measuring device is more preferably a power sensor. Furthermore, the above laser light oscillator is more preferably a C02 laser light vibrator. In the laser light irradiation method of the present invention, in order to solve the above problem, in order to cut the film and irradiate the laser light to the film, the method includes: diverging the laser light from the laser oscillation of the laser light into two, and diverging the thunder In the light, one of the laser light is irradiated onto the film, and the intensity of the other laser light is measured; and the output value of the laser light oscillator is calculated from the measured intensity, and it is determined whether the output value is large or small with respect to the set value. The output value of the laser oscillator is corrected to be close to the set value at full-time. According to the above configuration, the intensity of the other laser light in the divergent laser light is measured, the output value of the laser light oscillator is calculated from the intensity, and it is judged whether the output value is large or small with respect to the set value, and the laser light oscillator is used. The output value is corrected to be close to the set value at all times. Therefore, even if the output value of the laser light oscillated from the above-described laser light irradiation device of 201233482 is set to a value required to cut the film (and lower), since the output variation is suppressed, the output value does not become lower (less than If the set value is more than a certain level, the film can be cut as appropriate. Therefore, a laser light irradiation method can be provided to suppress the output fluctuation (change with respect to the set value), stabilize the output of the irradiated laser light, and appropriately cut the film. According to the laser light irradiation apparatus and the laser light irradiation method of the present invention, even if the output value of the laser light is set to a value required to cut the film (and lower), the output value does not become low because the output variation is suppressed. The film can be appropriately cut at a level of (less than) the set value. Therefore, it is possible to provide an effect of providing a laser beam irradiation device and a laser beam irradiation method, suppressing output fluctuation (change with respect to a set value), and stabilizing the output of the irradiated laser light, thereby appropriately cutting the film. . The film cut by the laser beam irradiation device and the laser beam irradiation method of the present invention does not become a shredded state at the end portion (cut portion), and does not cause damage to the inside of the polarizing film from the end portion, and The output value of the light is not set higher than necessary, so it does not melt, thermally expand, and bulges and bends. Therefore, the polarizing film after the cutting process does not deteriorate in quality. [Embodiment] An embodiment of the present invention will be described below with reference to the first to fifth aspects. In the following description, a case where the cut film is a polarizing film 201233482 is taken as an example. Further, in the present invention, the film "a is divided into at least two portions, and the film is also broken." The film _ is formed into a groove of a certain depth (scratch; minute). More specifically, "cutting the plough to the v-part (cut), and cutting the end of the scorpion's ligating film ^ ^ Lf'} Cutting, marking processing, etc. [Laser light irradiation device] The laser light irradiation device of the present invention - for example, the first figure T 2: Fig. 7 shows the laser light irradiation device 10 of the present embodiment = A polarizing film (film) is provided, and the device for laser light film is provided with: laser relay i, curved mirror 2, = 3, power sensor (measuring device) 4, processing plate (corrected nine ^ poly f diagram not shown) And, if necessary, an optical component such as a beam expander (not shown). The laser oscillator 1 is a component that oscillates the laser beam L, and can be, for example, a c〇2 laser oscillator (carbon dioxide laser oscillator). The oscillators such as the uv laser oscillator, the semiconductor laser oscillator, the YAG laser oscillator, and the excimer laser oscillator are not particularly limited. In the above-exemplified oscillator, c〇2 laser light is used. The oscillator is, for example, cut-off processing of a polarizing film, and can be adapted. The high output oscillating laser light is better. In general, the laser light oscillator has a fixed output of laser light, which has a fixed amplitude that is in a too short period (for example, 丨 milliseconds) and the output value is sandwiched between the set values. The characteristic that changes, and the output value of the laser light is likely to become unstable when the output is low (the higher the output, the smaller the fluctuation range of the output value is.) Therefore, in order to make the laser light 8 201233482 The output value of 1 is further stabilized, and it is preferable to use the output of the laser oscillator 1 as a relatively high output. However, when the output value is too high, the polarizing film is melted and thermally expanded by excessive heat generated by laser light irradiation. Further, the polarizing film after the cutting process is deteriorated in quality. Therefore, the output value of the laser oscillator 1 can be set to an appropriate setting value in accordance with conditions such as the material or thickness of the polarizing film. That is to say, the specific output value of the laser oscillator 1 is preferably the material or thickness of the polarizing film, the transport speed of the polarizing film, and the splitting. The ratio of the transmitted light and the reflected light caused by 3 is set to an appropriate set value. The frequency of the irradiated laser light L can be based on the output of the laser oscillator 1, the material or thickness of the polarizing film, and the transport speed of the polarizing film. The condition is appropriately set, but generally it can be 5 kHz or more and 100 kHz or less. Then, the laser light oscillator 1 outputs laser light according to a preset setting value, and is corrected to the processing board 5 as a correction device at all times. The output value is close to the set value. The laser beam irradiation device 10 preferably further includes a beam expander on the optical path from the beam splitter 3 to the polarizing film. The beam expander is a member that expands the laser beam L1 into a parallel beam and can be used. A known beam expander. Specifically, it is more preferable to expand the diameter of the laser light L1 by a factor of 2 to 10 times by a beam expander. By expanding the diameter of the laser light, the spot diameter of the laser light irradiated on the polarizing film can be more concentrated (smaller). The bent mirror 2 is a member that reflects the laser light L oscillated from the laser oscillator 1 toward the beam splitter 3. The curved mirror 2, 201233482 is preferably a planar mirror, for example, but may be configured to reflect the laser light L toward the beam splitter 3. Further, the number thereof is not particularly limited. A beam splitter 3 is a component which is divided into two parts at a fixed ratio (ratio) by the laser light L which is oscillated from the laser oscillator 1 and reflected by the curved mirror 2. That is, the dichroic mirror 3 is a component that divides the laser light L into the reflected light L1 and the transmitted light L2 at a fixed ratio. Then, the spectroscope 3 irradiates the reflected light L1 (one of the laser light) in the divergent laser light to the polarizing film via an optical member such as a condensing mirror, and cuts the polarizing film, and transmits the light L2 (the other light The light is incident on the power sensor 4 for output adjustment of the laser oscillator 1. The spectroscope 3 can use a known beam splitter. A known lens such as a spherical lens or an aspherical lens can be used as the condensing mirror, and is not particularly limited. Further, since the cutting width (cutting and retaining portion) of the polarizing film is determined by the collecting path of the laser light as the reflected light L1, the light collecting path of the laser light on the polarizing film is preferably 5 // m or more, 500 // m or less, more preferably 10 // m or more, and 400 / im or less. Further, in the laser beam irradiation apparatus 10 of the present embodiment, the reflected light L1 is used for the cutting process of the polarizing film, and the transmitted light L2 is used for the output adjustment of the laser oscillator 1. However, the configuration may be The transmitted light L2 is used for the cutting process of the polarizing film by using, for example, a curved mirror (not shown), and the reflected light L1 is used for the adjustment of the output of the laser oscillator 1. As a power sensor 4 of the measuring device, the transmitted light L2 is converted into a thermoelectromotive force, and the element of the lightning intensity of the light 20123482 is measured as the transmitted light L2. That is to say, the power senses the power generated by the laser beam, whereby the intensity of the light emitted by the light sensing H 4 is measured. 10 milliseconds, but is not particularly limited. Also, if it is used, for example, a known power sensor can be used. Further, the power sensor 4 can make the structure of the light intensity. /, Li, and can also be measurable Thunder, then, the power sensor 4 will be the value of the data 'via A / D conversion:: the first intensity (measurement board TMD converter will tear = ί理# material; = The digital data is sent to the processing board 5 as an arithmetic processing unit such as a processing board 5 and an internal processing unit. The device 4 is converted by A/D 3|disarm AA, and the seesaw 5 is extracted from the power sense #3八姑μ,# to receive the measured value of the digital data, and the knife in the first mirror 3 The ratio of the transmitted light u: The output value of the illuminating oscillator 1 is set to 莓 ^ 异 [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ Still insufficient, the output value of the laser photoresonator 1 is corrected to be close to the set value. That is to say, the processing board 5 returns the calculation result in full time. Specifically, for example, every ίο millisecond feedback, the actual output value of the laser light is adjusted (corrected) to be close to the set value. More specifically, the intensity of the lightning (four) as the transmitted light L2 becomes smaller, and the laser light is activated! The output value becomes smaller than the set value, s adjusts the output of the laser oscillator 1 so that the actual output value of the laser light L becomes larger, and the intensity of the laser light of the other side M2 becomes larger. The output value of the laser light illuminator 1 becomes larger than the mosquito value, and the output of the laser light oscillation 201233482 is adjusted so that the actual output value of the laser light L becomes small. Further, the processing plate 5 may have a configuration in which the above calculation and determination are possible, and therefore the specific configuration thereof is not particularly limited. In the laser light irradiation apparatus 1 of the present embodiment, the power sensor 4 and the processing board 5 having the above configuration measure the intensity of the transmitted light L2 at a measurement interval of, for example, 1 〇 millisecond, using a so-called FTS ( _ tmie stabilizer). By adjusting the output value of the laser light L by the system, the actual output value of the laser light oscillator 1 can be adjusted (corrected) to be close to the set value, so that the polarizing film can be cut off appropriately. In the laser beam irradiation apparatus 10 according to the embodiment of the present invention, a cutter (not shown) for continuously cutting the polarizing film is used as the apparatus. The cutting machine includes, in addition to the laser irradiation device 10, a winding portion that winds up a long polarizing film (described later), a plurality of conveying rollers that transport the polarizing film, and a winding of a polarizing film that is wound and cut. Department and other components. The following describes the cutting machine. However, since the structure other than the laser irradiation device 1 of the cutting machine adopts a known structure, the description thereof will be simplified. The rolled-out is a member that keeps a long polarizing film and winds the polarizing film toward the carrying roller by the rotation of the rotating device, specifically, the winding portion known to the life. Further, the tension applied to the polarizing film and the conveying speed of the polarizing film are adjusted by the rotating device. Further, although the singularity of the singularity can be set to "one", the polarizing film can be wound up with the second polarizing film before being completely wound out by being provided in two. The partial (four) film connection of the crucible can reduce the time for exchanging polarized raw materials. -
S "u^33482 做為搬運偏光薄膜的搬運滾筒，係列舉已知的搬運 二通常搬運滾筒的寬度是15m〜2 5m程度。偏光 為隹搬運速度，若是例如lm/秒以上、l〇〇m/秒以下 偏朵2但亚沒有特別限定。又，在切割機也可以具備將 涛膜壓抵於搬運滾筒的接觸滾筒。 斷力η取。卩°又有兩個，是藉由旋轉裝置的旋轉捲取被切 部。^工的偏光薄膜的部件，具體來說列舉已知的捲取 Ϊ產腊又，施加於被切斷加工的偏光薄膜的張力以及偏光 、的搬運速度，是被旋轉裝置所調節。 成雷射照射裝置10被配設在被複數個搬運滾筒所形 ^偏光薄膜的搬運路徑的途中，持續切斷加工 3所搬運的偏光薄膜。又，偏光薄膜的切斷力 行以使雷射照射裝置10移動代替使偏光薄臈移動來進 工偏Ξΐ，藉由用上述結構的切割機，可以持續切斷加 两光溥膜。 [薄膜] 雷，照射裝置10切斷的薄膜（切斷對象）並沒有 d，但可以列舉已知的偏光薄膜。做為該偏光薄 l〇m、吊列舉長（例如在切斷方向的偏光薄膜長度為 向^上）㈣光薄膜，但也可以是短（例如在切斷方 士扁光薄膜長度為2m以上未滿10m)的或板狀（例 =斷方向的偏光薄膜長度為1〇cm以上未滿2m)的 做為偏光薄膜的結構，具體來說可以列舉為例如將 13 201233482 = ; 三乙酿纖維素)薄膜、⑽ 衣烯k聚合物）溥膜等薄膜貼合在 面，在相對於雷射昭射I w 1Λ 先子潯膑的兩 ΤΑΓ错时裝置的面的反面（背面）的 由黏著劑層積保護薄膜的結構。 = 的偏光子薄臈，可以列舉為以破等染色劑 :稀醇薄膜染色並延伸的薄膜，貼 =膜。又，代替上述心薄膜= , 化_ '纖維素系薄膜等親水性 膜、聚乙烯醇的脫水處理 酸處理物等的多烯定向薄膜。 邓的舌| ，為上述保護薄膜，也可以用聚酯薄膜 :酉夂乙二醋薄膜等薄膜。上述保護薄膜的厚度及寬产並 2特但從做為偏光薄膜的保護薄膜來使“ 觀』，較佳為例如5//m以上、6〇#m以下的， 2〇〇mm以上' i5〇〇mm以下的寬度。 又 —包含保護薄膜的偏光薄膜的厚度並沒有特別限 ^，但可以做為l〇〇#m以上、500/zm以下。又偏 光子薄膜的厚度，一般來說為10/zm以上、50#m以 I。再者，偏光薄膜在實用上沒有問題的範圍，在上述 •^層（偏光子薄膜、TAC薄膜以及C〇p薄膜、保護薄 膜）以外，也可以包含其他層。 [雷射光照射方法] 一關於本實施形態的雷射光照射方法，係為了切斷偏 光薄膜（薄膜）將雷射光照射至該偏光薄膜，使來自雷S "u^33482 As a transport roller for transporting polarizing film, the series is known to be handled. 2 The width of the normal transport roller is about 15m to 2m. The polarizing is the transport speed of the crucible, and is, for example, lm/sec or more and l〇〇m/sec or less. Further, the cutting machine may be provided with a contact roller that presses the membrane against the conveying roller. The breaking force η is taken. There are two more 卩°, which are taken up by the rotation of the rotating device. Specifically, the member of the polarizing film to be used is a known winding and waxing, and the tension applied to the polarizing film to be cut and the transport speed of the polarized light are adjusted by the rotating device. The laser irradiation apparatus 10 is disposed in the middle of the conveyance path of the polarizing film formed by the plurality of conveyance rollers, and continuously cuts the polarizing film conveyed by the processing 3. Further, the cutting force of the polarizing film is such that the laser irradiation device 10 is moved instead of moving the polarizing film to perform the biasing, and by using the cutter having the above configuration, the two aperture films can be continuously cut. [Film] Ray, the film (cut object) cut by the irradiation device 10 does not have d, but a known polarizing film can be cited. As the polarizing thin l〇m, the hanging length (for example, the length of the polarizing film in the cutting direction is the upper side) (4) the light film, but it may be short (for example, the length of the cut square light film is 2 m or more. The structure of the polarizing film is 10 m or more (for example, the length of the polarizing film in the direction of the broken direction is 1 〇cm or more and less than 2 m), and specifically, for example, 13 201233482 = ; The film, (10) ketene k polymer) film such as ruthenium film is bonded to the surface, and the adhesive layer is on the opposite side (back surface) of the surface of the device at the time of the two-dimensional error with respect to the laser emission I w 1 Λ The structure of the protective film. The polarizer of = is exemplified by a film which is dyed and stretched with a thinning dyeing agent: a thin film, and is attached to the film. Further, in place of the above-mentioned core film =, a polyene oriented film such as a hydrophilic film such as a cellulose film or a dehydrated acid treated product of polyvinyl alcohol. Deng's tongue |, for the above protective film, it is also possible to use a polyester film: a film such as a bismuth acetate film. The protective film has a thickness and a wide yield, and is preferably a "protective film" which is a polarizing film. For example, it is preferably 5//m or more and 6 〇#m or less, and 2 〇〇mm or more 'i5. Width of 〇〇mm or less. - The thickness of the polarizing film including the protective film is not particularly limited, but can be made as l〇〇#m or more and 500/zm or less. The thickness of the polarizing film is generally 10/zm or more and 50#m are I. Further, the polarizing film has no problem in practical use, and may be included in the above-mentioned layer (polarized film, TAC film, C〇p film, protective film). [Laser light irradiation method] The laser light irradiation method according to the present embodiment is a method of irradiating laser light to the polarizing film (film) to cut off the polarizing film (film)
S 14 201233482 射光=器！所振盪的雷射光L分歧為兩條，將分 雷射光中’例如反射光L1 (一方的雷射光）經弁 鏡等光學部件照射至偏光薄膜，使用於該偏光薄膜的切 並測量做為透射光L2 (他方的雷射光）的雷 二光強度’從測1的強度（例如測量值的數位資料）鱼 在以分光鏡3分歧的透射光L2的比率（比例） ，、 =光振盈器i的輸出值，判斷上述輸出值相對於預 先5又疋的設定值是大還是小（是超過還是不足）， =射光缝器1的輸出值全時修正成靠近設定值的 、做為上述雷射光L，由於C〇2雷射光可以獲得例如 適合偏光薄膜的切斷加工的高輸出，所以更佳。又，照 射的雷射光L的頻率，雖然可以藉由雷射光振盪器i的' 輸出、偏光薄膜的材質或厚度、偏光薄膜的搬運速度等 條件來適當設定，但一般來說可以做為5kHz以上、 lOOkHZ 以下。 為了使雷射光L分歧為兩部分，可以用如上述的分 光鏡3。但是，分歧方法並不限於使用分光鏡的方法， 也可以是將雷射光L分歧為兩部分的方法。但是，反射 光L1與透射光L2的比率，也可以對應雷射光振盪器i 的輸出、偏光薄膜的材質或厚度、偏光薄膜的搬運速度 專條件來適當設定，並沒有特別限定。 又，在關於本實施形態的雷射光照射方法，雖然是 將反射光L1使用於薄膜的切斷加工，將透射光L2使用 於珀射光振盪器1的輸出調節的結構，但也可以做為將 201233482 透射光L2使用於薄膜的切斷加工，將反射光u使用於 雷射光振盪器1的輸出調節的結構。 為了測i做為透射光L2的雷射光強度，可以使用 如上述的功率感應器4。但是測量方法並不限定於使用 功率感應器的方法’也可以是可測量雷射光強度的方 法又測里間卩同短者為更佳，也可以為例如1 〇毫秒， 並沒有特別限定。 >七將上述雷射光振盪器丨的輸出值全時修正成靠近 设疋值’也可以用如上述的處理板5。但是，修正方法 並不限疋於用處理板的方法，也可以是可將用測量的雷 射光強度（例如測量值的數位f料）、透射光L 2的比率 (比例）以及預先設定的設定值的演算結果，以例如每 10ff _至雷射絲盪器1，將雷射絲盪器！的實 際輸出值’ _ (修正）成接近設定㈣方法。更具體 t說以疋f做為透射光L2的雷射光的強度變 …雷射光振盪器1的 況，是將雷射光振盪器！的輪出坰值f ?狀 鈐屮㈣4· s + 輸出5周卽成雷射光L的實際 „大，另一方面，在做為透射光L2的雷射光強 Π大:雷射光議1的輪出值變得比設』 狀况’疋將雷射光振盪器！的輸 際輸出值變小的方法。 丨力乂田耵尤L的貫 一在關於本實施形態的雷射光照射方法， 宅秒的測量間隔來測量透射井S 14 201233482 射光=器! The oscillating laser light L is divided into two, and the reflected light L1 (one of the laser light) is irradiated to the polarizing film via an optical member such as a krypton mirror, and is used for the transmission and measurement of the polarizing film as a transmission. Light L2 (the other laser light) the intensity of the lightning light 'from the intensity of the measurement 1 (for example, the digital data of the measured value) the ratio of the fish in the transmitted light L2 diverging with the beam splitter 3 (proportion), = light vibrator The output value of i is judged whether the output value is larger or smaller than the preset value of 5 ( (is it exceeds or is insufficient), and the output value of the ejector 1 is corrected to be close to the set value as the above-mentioned ray The light emission L is more preferable because the C〇2 laser light can obtain, for example, a high output suitable for the cutting process of the polarizing film. Further, the frequency of the laser light L to be irradiated can be appropriately set by the condition of the output of the laser oscillator i, the material or thickness of the polarizing film, and the transport speed of the polarizing film, but generally it can be 5 kHz or more. , lOOkHZ below. In order to make the laser light L divergent into two parts, the beam splitter 3 as described above can be used. However, the method of divergence is not limited to the method using a spectroscope, and may be a method of diverging the laser light L into two parts. However, the ratio of the reflected light L1 to the transmitted light L2 may be appropriately set in accordance with the output of the laser oscillator i, the material or thickness of the polarizing film, and the transport speed of the polarizing film, and is not particularly limited. Further, in the laser light irradiation method according to the present embodiment, the reflected light L1 is used for the cutting process of the film, and the transmitted light L2 is used for the output adjustment of the channel optical oscillator 1. However, the configuration may be adopted. 201233482 The transmitted light L2 is used for the cutting process of the film, and the reflected light u is used for the adjustment of the output of the laser oscillator 1. In order to measure the intensity of the laser light as the transmitted light L2, the power sensor 4 as described above can be used. However, the measuring method is not limited to the method of using the power sensor, and the method of measuring the intensity of the laser light may be preferably the same as the short distance, or may be, for example, 1 〇 millisecond, and is not particularly limited. > Seven, the output value of the above-described laser light oscillator 丨 is corrected to be close to the set value ′. The processing board 5 as described above can also be used. However, the correction method is not limited to the method using the processing board, and may be a measurement of the intensity of the laser light (for example, the digital value of the measured value), the ratio (proportion) of the transmitted light L 2 , and a preset setting. The result of the calculation of the value, for example, every 10 ff _ to the laser filament 1 , the laser filament! The actual output value ' _ (corrected) is close to the set (four) method. More specifically, the intensity of the laser light with 疋f as the transmitted light L2 is changed... The condition of the laser oscillator 1 is the laser oscillator! The round 坰 f ? ? 钤屮 四 四 四 四 四 四 四 四 四 四 四 四 四 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 , , , , , , , , , , In the case of the laser light irradiation method of the present embodiment, the measurement interval of the home and the second is the method of reducing the output value of the output of the laser light oscillator. To measure the transmission well
,,n 、处对九L2的強度，採用所謂FTS (full time stabihzer)系統來調節 可以將雪!+本桩嚷。。t ^ ~ n即笛射先L的輸出值， 將雷射1的實際輸出值調節（修正）成接 201233482 近設定值，所以可以適當地切斷偏光薄膜。 關於本實施形態的雷射光照射方法，可以適當地採 用於例如持續進行偏光薄膜的切斷加工的切割機。 又，關於本發明的雷射光照射裝置以及雷射光照射 方法，由於是可以適當地切斷薄膜的裝置以及方法，所 以也可以理解是雷射光切斷裝置以及雷射光切斷方法。 [實施例] 檢討關於本實施形態的雷射光照射裝置ίο的性 能。又，為了對比關於本實施形態的雷射光照射裝置 10的性能，檢討以往的雷射光照射裝置的性能。具體 來說是，測量從關於本實施形態的雷射光照射裝置10 以及以往的雷射光照射裝置的雷射光振盪器1所振盪 的雷射光L的輸出變動。 以第三圖表示檢討性能的雷射光照射裝置的結 構。如第三圖所示，以往的雷射光照射裝置20，具備： 雷射光振盪器1、曲鏡2、曲鏡8以及聚光鏡（圖未顯 示）。也就是說，以往的雷射光照射裝置20並不具備分 光鏡、功率感應器、A/D轉換器以及處理板，是以曲鏡 2以及曲鏡8反射從雷射光振盪器1所振盪的所有雷射 光L，使用於薄膜的切斷加工的結構。又，雷射光照射 裝置20，關於用來將上述雷射光振盪器1的輸出值修 正成接近設定值的結構以外的結構(例如擴束器等光學 部件），係與雷射光照射裝置10相同具備。又，雷射光 振盪器1在雷射光照射裝置10與雷射光照射裝置20是 用相同的振盪器。 17 201233482 然後，用關於本實施形態的雷射光照射裝置10與 以往的雷射光照射裝置20，來測量從雷射光振盪器j 所振盪的雷射光L的輸出變動。 即，將從雷射光振盪器1所振盪的雷射光L的輸出 值設定為14.0W，以6m/分的速度切斷加工薄膜。在關 於本實施形態的雷射光照射裝置10，如第二（a)圖所 示，貫際輸出的雷射光L·的輸出值，一般來說是納入 13.4〜14.1W的範圍内（平均13 8w，振幅〇 7w)。對 此’在以往的雷射光照射裝置2〇，如第四（a)圖所示， 貫際輸出的雷射光L的輸出值，一般來說是分佈在12 3 〜15.0W的範圍内（平均13 8w，振幅2 7W)。因此， 從如第五（a )圖所示的結果可知，在將雷射光L的輸 出值設定在14.0W的狀況，從雷射光照射裝置1〇的雷 射光振盪器1所振盪的雷射光L的輸出變動會變小，關 於本實施形態的雷射光照射裝置1〇的性能，與以往的 雷射光照射裝置20的性能相比較，判斷有顯著優越的 效果。 又’將從雷射光振盪器i所振盪的雷射光^的輸出 值a又疋在49.5W’以30m/分的速度切斷加工薄膜。在關 於本實施形態的雷射光照射裝置1〇，如第二（b)圖所 示，實際輸出的雷射光L的輸出值，一般來說是納入 48.9〜50.4W的範圍内（平均49 5W，振幅16W)。對 士，在以往的雷射光照射裝置2〇，如第四（b)圖所示， 貫際輸出的雷射光L的輸出值，一般來說是分佈在46 4 〜51.1W的範圍内（平均49 2w，振幅4 7W)。因此， 201233482 從如第五（b)圖所示的結果可知，在將雷射光L的輸 出值設定在49.5W的狀況，從雷射光照射裝置10的雷 射光振盪器1所振盪的雷射光L的輸出變動會變小，關 於本實施形態的雷射光照射裝置10的性能，與以往的 雷射光照射裝置20的性能相比較，判斷有顯著優越的 效果。 又，將從雷射光振盪器1所振盪的雷射光L的輸出 值設定在100.0W，以60m/分的速度切斷加工薄膜。在 關於本實施形態的雷射光照射裝置10，如第二（c)圖 所示，實際輸出的雷射光L的輸出值，一般來說是納入 99.3〜100.6W的範圍内（平均99.9W，振幅1.3W)。對 此，在以往的雷射光照射裝置20，如第四（c )圖所示， 實際輸出的雷射光L的輸出值，一般來說是分佈在95.2 〜102.8W的範圍内（平均99.1W，振幅7.6W)。因此， 從如第五（c)圖所示的結果可知，在將雷射光L的輸 出值設定在100.0W的狀況，從雷射光照射裝置10的雷 射光振盪器1所振盪的雷射光L的輸出變動會變小，關 於本實施形態的雷射光照射裝置10的性能，與以往的 雷射光照射裝置20的性能相比較，判斷有顯著優越的 效果。 也就是說，從第五（a)〜（c)圖所示結果，關於 本實施形態的雷射光照射裝置10的性能，與以往雷射 光照射裝置20的性能比較，因為從雷射光振盪器1振 盪的雷射光L的輸出變動小，所以可知是顯著優越者。 又，本發明並不限定於上述實施形態，也可以在記 19 201233482 載的範圍内實施施加各種變形的狀態，因此，可以在申 請專利範圍進行各種變更。 [產業上的利用可能性] 根據關於本發明的雷射光照射裝置以及雷射光照 射方法’即使將雷射光的輸出值設定成切斷薄膜所需 (且更低）的值，因為抑制輸出變動所使該輸出值不會 麦成低於（小於）設定值一定以上，可以適當地切斷薄 膜。故，可以達成一效果，該效果是能提供一種雷射光 裝置以及雷射光照射方法，抑制輸出變動（相對於 δ又疋值的變動），安定化照射的雷射光的輸出因而能 當地切斷薄膜。 過 故，關於本發明的雷射光照射裝置以及雷射光昭射 方法，例如因為可以於偏光薄膜的切斷加工，在使 =偏光薄膜的例如液晶面板等各種製品的製造過程 中就是在使用偏光薄膜的各種產業可以廣泛利用。 l園式簡單說明】 財㈣的料絲縣置的一邮 =照^=是:示;射光的輸出值被上 所照射的雷射光的輸㈣2，。絲被雷射光照射裝 圖表示以往的雷射光照射裝置的-例的概略結 圖U)、（b)、（c)是表示被以往的雷射光照射,, n, the strength of the nine L2, using the so-called FTS (full time stabihzer) system to adjust the snow! + this pile. . t ^ ~ n is the output value of the flute first L, and the actual output value of the laser 1 is adjusted (corrected) to be close to the set value of 201233482, so the polarizing film can be cut off appropriately. The laser light irradiation method of the present embodiment can be suitably applied to, for example, a cutter that continuously cuts the polarizing film. Further, the laser light irradiation device and the laser light irradiation method of the present invention are also known as a laser light cutting device and a laser light cutting method because they are devices and methods that can appropriately cut the film. [Embodiment] The performance of the laser beam irradiation device ίο of the present embodiment was reviewed. Further, in order to compare the performance of the laser beam irradiation apparatus 10 of the present embodiment, the performance of the conventional laser beam irradiation apparatus is reviewed. Specifically, the output fluctuation of the laser light L oscillated from the laser beam irradiation device 10 of the present embodiment and the laser beam irradiation device 1 of the conventional laser beam irradiation device is measured. The structure of the laser light irradiation apparatus for reviewing performance is shown in the third figure. As shown in the third figure, the conventional laser beam irradiation device 20 includes a laser beam oscillator 1, a curved mirror 2, a curved mirror 8, and a condensing mirror (not shown). That is, the conventional laser light irradiation device 20 does not include a spectroscope, a power sensor, an A/D converter, and a processing plate, and reflects all of the oscillations oscillated from the laser oscillator 1 by the curved mirror 2 and the curved mirror 8. The laser light L is used for the structure of the film cutting process. Further, the laser light irradiation device 20 has a configuration other than the configuration for correcting the output value of the laser light oscillator 1 to a value close to the set value (for example, an optical member such as a beam expander), and is similar to the laser light irradiation device 10. . Further, the laser oscillator 1 uses the same oscillator as the laser beam irradiation device 10 and the laser beam irradiation device 20. 17 201233482 Then, with the laser light irradiation device 10 of the present embodiment and the conventional laser light irradiation device 20, the output fluctuation of the laser light L oscillated from the laser light oscillator j is measured. In other words, the output value of the laser light L oscillated from the laser oscillator 1 was set to 14.0 W, and the processed film was cut at a speed of 6 m/min. In the laser beam irradiation apparatus 10 of the present embodiment, as shown in the second (a) diagram, the output value of the laser light L· outputted continuously is generally included in the range of 13.4 to 14.1 W (average 13 8 w). , amplitude 〇 7w). In the conventional laser light irradiation device 2, as shown in the fourth (a) diagram, the output value of the laser light L outputted continuously is generally distributed in the range of 12 3 to 15.0 W (average 13 8w, amplitude 2 7W). Therefore, as is clear from the results shown in the fifth (a), the laser light L oscillated from the laser oscillator 1 of the laser beam irradiation device 1 is set in a state where the output value of the laser light L is set to 14.0 W. The output fluctuation of the laser light irradiation device 1 of the present embodiment is judged to be significantly superior to the performance of the conventional laser light irradiation device 20 as compared with the performance of the conventional laser light irradiation device 20. Further, the output value a of the laser light oscillated from the laser oscillator i was cut at a speed of 30 m/min at 49.5 W'. In the laser light irradiation apparatus 1 of the present embodiment, as shown in the second (b) diagram, the output value of the laser light L actually outputted is generally included in the range of 48.9 to 50.4 W (average 49 5 W, Amplitude 16W). In the conventional laser light irradiation device 2, as shown in the fourth (b) diagram, the output value of the laser light L outputted continuously is generally distributed in the range of 46 4 to 51.1 W (average 49 2w, amplitude 4 7W). Therefore, 201233482, as can be seen from the results shown in the fifth (b), the laser light oscillated from the laser oscillator 1 of the laser beam irradiation device 10 when the output value of the laser light L is set to 49.5 W. The output variation of the laser light irradiation device 10 of the present embodiment is judged to be significantly superior to the performance of the conventional laser light irradiation device 20 as compared with the performance of the conventional laser light irradiation device 20. Further, the output value of the laser light L oscillated from the laser oscillator 1 was set to 100.0 W, and the processed film was cut at a speed of 60 m/min. In the laser beam irradiation apparatus 10 of the present embodiment, as shown in the second (c) diagram, the output value of the laser light L actually outputted is generally in the range of 99.3 to 100.6 W (average 99.9 W, amplitude). 1.3W). On the other hand, in the conventional laser light irradiation device 20, as shown in the fourth (c) diagram, the output value of the actually output laser light L is generally distributed in the range of 95.2 to 102.8 W (average 99.1 W, Amplitude 7.6W). Therefore, as is clear from the results shown in the fifth (c), the laser light oscillated from the laser oscillator 1 of the laser beam irradiation device 10 is set in a state where the output value of the laser light L is set to 100.0 W. The output variation is small, and the performance of the laser beam irradiation apparatus 10 of the present embodiment is judged to have a significantly superior effect as compared with the performance of the conventional laser beam irradiation apparatus 20. That is, from the results shown in the fifth (a) to (c), the performance of the laser beam irradiation apparatus 10 of the present embodiment is compared with the performance of the conventional laser beam irradiation apparatus 20 because the laser light oscillator 1 is used. Since the fluctuation of the output of the oscillated laser light L is small, it is known that it is significantly superior. Further, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention as set forth in the scope of the patent application. [Industrial Applicability] According to the laser light irradiation device and the laser light irradiation method of the present invention, even if the output value of the laser light is set to a value required to cut the film (and lower), since the output fluctuation is suppressed When the output value is not lower than (less than) the set value, the film can be appropriately cut. Therefore, an effect can be attained by providing a laser light device and a laser light irradiation method, suppressing output fluctuation (change with respect to δ and 疋 value), and stabilizing the output of the irradiated laser light so that the film can be locally cut. . In the laser light irradiation device and the laser light emission method of the present invention, for example, a polarizing film can be used in the production process of various products such as a liquid crystal panel such as a polarizing film because the polarizing film can be cut. Various industries can be widely used. l Simple description of the garden type] The post of the silk county set by Cai (4) = photo ^ = yes: the output value of the light is transmitted by the laser light (4) 2. The wire is irradiated with laser light. The figure shows a schematic diagram of a conventional laser light irradiation device. U), (b), and (c) show that the laser beam is irradiated by the conventional laser beam.
20 201233482 置所照射的雷射光的輸出變動圖。 第五圖：（a )、（ b )、（ c )是對比被關於本發明的雷射光 照射裝置所照射的雷射光的輸出變動，與被 光照射裝置所照射的雷射光的輪出變動的 主的®射 【主要元件符號說明】 1 雷射光振盪器 2、8 3 4 5 10、2〇 L L1 L2 曲鏡 分光鏡 功率感應器（測量裝置） 處理板（修正裝置） 雷射光照射裝置 雷射光 雷射光 透射光 2120 201233482 Output change diagram of the laser light to be irradiated. Fifth drawing: (a), (b), and (c) are comparisons between the output fluctuation of the laser light irradiated by the laser light irradiation device of the present invention and the fluctuation of the laser light irradiated by the light irradiation device. Main ® shot [Main component symbol description] 1 Laser optical oscillator 2, 8 3 4 5 10, 2〇L L1 L2 Curved mirror spectroscope power sensor (measuring device) Processing board (correcting device) Laser light irradiation device Radiated light transmitted light 21