JP2012135782A - レーザー光照射装置およびレーザー光照射方法 - Google Patents
レーザー光照射装置およびレーザー光照射方法 Download PDFInfo
- Publication number
- JP2012135782A JP2012135782A JP2010288671A JP2010288671A JP2012135782A JP 2012135782 A JP2012135782 A JP 2012135782A JP 2010288671 A JP2010288671 A JP 2010288671A JP 2010288671 A JP2010288671 A JP 2010288671A JP 2012135782 A JP2012135782 A JP 2012135782A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- film
- oscillator
- output value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
- B29D11/00788—Producing optical films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Laser Beam Processing (AREA)
- Polarising Elements (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010288671A JP2012135782A (ja) | 2010-12-24 | 2010-12-24 | レーザー光照射装置およびレーザー光照射方法 |
| TW100147292A TW201233482A (en) | 2010-12-24 | 2011-12-20 | Laser beam irradiation device and laser beam irradiation method |
| CN2011800616215A CN103260816A (zh) | 2010-12-24 | 2011-12-22 | 激光照射装置及激光照射方法 |
| KR1020137018981A KR20140019313A (ko) | 2010-12-24 | 2011-12-22 | 레이저광 조사 장치 및 레이저광 조사 방법 |
| PCT/JP2011/079832 WO2012086764A1 (ja) | 2010-12-24 | 2011-12-22 | レーザー光照射装置およびレーザー光照射方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010288671A JP2012135782A (ja) | 2010-12-24 | 2010-12-24 | レーザー光照射装置およびレーザー光照射方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014055553A Division JP2014121736A (ja) | 2014-03-18 | 2014-03-18 | レーザー光照射装置およびレーザー光照射方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012135782A true JP2012135782A (ja) | 2012-07-19 |
| JP2012135782A5 JP2012135782A5 (enExample) | 2012-08-30 |
Family
ID=46314031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010288671A Withdrawn JP2012135782A (ja) | 2010-12-24 | 2010-12-24 | レーザー光照射装置およびレーザー光照射方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2012135782A (enExample) |
| KR (1) | KR20140019313A (enExample) |
| CN (1) | CN103260816A (enExample) |
| TW (1) | TW201233482A (enExample) |
| WO (1) | WO2012086764A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013094758A1 (ja) * | 2011-12-22 | 2013-06-27 | 住友化学株式会社 | レーザー光照射システム、レーザー光照射方法及び記録媒体 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6342949B2 (ja) | 2016-05-17 | 2018-06-13 | ファナック株式会社 | 反射光を抑制しながらレーザ加工を行うレーザ加工装置及びレーザ加工方法 |
| JP7475220B2 (ja) * | 2020-07-03 | 2024-04-26 | 住友重機械工業株式会社 | レーザパワー計測装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478694A (en) * | 1987-09-19 | 1989-03-24 | Hitachi Maxell | Method and device for cutting raw film consisting of plastic film as base material |
| JPH09122946A (ja) * | 1995-10-31 | 1997-05-13 | Hitachi Cable Ltd | 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000357835A (ja) * | 1999-06-15 | 2000-12-26 | Amada Eng Center Co Ltd | レーザ発振器 |
| JP4274251B2 (ja) * | 2007-01-24 | 2009-06-03 | ソニー株式会社 | レーザ描画方法及びレーザ描画装置 |
-
2010
- 2010-12-24 JP JP2010288671A patent/JP2012135782A/ja not_active Withdrawn
-
2011
- 2011-12-20 TW TW100147292A patent/TW201233482A/zh unknown
- 2011-12-22 KR KR1020137018981A patent/KR20140019313A/ko not_active Withdrawn
- 2011-12-22 CN CN2011800616215A patent/CN103260816A/zh active Pending
- 2011-12-22 WO PCT/JP2011/079832 patent/WO2012086764A1/ja not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478694A (en) * | 1987-09-19 | 1989-03-24 | Hitachi Maxell | Method and device for cutting raw film consisting of plastic film as base material |
| JPH09122946A (ja) * | 1995-10-31 | 1997-05-13 | Hitachi Cable Ltd | 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013094758A1 (ja) * | 2011-12-22 | 2013-06-27 | 住友化学株式会社 | レーザー光照射システム、レーザー光照射方法及び記録媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201233482A (en) | 2012-08-16 |
| WO2012086764A1 (ja) | 2012-06-28 |
| CN103260816A (zh) | 2013-08-21 |
| KR20140019313A (ko) | 2014-02-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101706416B1 (ko) | 편광판 절단 방법 및 상기 방법에 의해 절단된 편광판 | |
| JP6381539B2 (ja) | 異なる幅のガラスリボンを製造するための方法及び装置 | |
| JP5293498B2 (ja) | ウエブ搬送装置及びその方法と電池の製造方法 | |
| US20170355635A1 (en) | Feedback-controlled laser cutting of flexible glass substrates | |
| KR20150096691A (ko) | 광학 표시 디바이스의 생산 방법 및 광학 표시 디바이스의 생산 시스템 | |
| CN109073805B (zh) | 用于在光学膜处进行标记的系统和方法 | |
| US10710351B2 (en) | System and method for continuously manufacturing optical display device | |
| JP2012135782A (ja) | レーザー光照射装置およびレーザー光照射方法 | |
| CN103153526B (zh) | 激光切割装置及具有该装置的切条机 | |
| CN110014227A (zh) | 一种用于切割偏光片的激光切割方法以及激光切割系统 | |
| JP2014121736A (ja) | レーザー光照射装置およびレーザー光照射方法 | |
| WO2013094758A1 (ja) | レーザー光照射システム、レーザー光照射方法及び記録媒体 | |
| US7955466B2 (en) | Method of and apparatus for manufacturing polarization plate | |
| JP2012518212A (ja) | 偏光板の製造方法 | |
| TW201417919A (zh) | 雷射加工系統 | |
| JP6020884B2 (ja) | レーザー加工方法 | |
| JP4614175B2 (ja) | フィルム貼り合わせ装置 | |
| KR20120043941A (ko) | 필름 절단을 위한 레이저 절단 장치 및 이를 이용한 필름 절단 방법 | |
| KR20170080545A (ko) | 레이저 절단 장치 | |
| JPH05192705A (ja) | ストリップ圧延の平担度制御装置 | |
| WO2024157622A1 (ja) | 粘着剤層を有する積層フィルムの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120706 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120706 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20120706 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20120806 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120828 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121115 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130212 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130610 |
|
| A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20130618 |
|
| A912 | Removal of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20130906 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20140319 |