KR20140019313A - 레이저광 조사 장치 및 레이저광 조사 방법 - Google Patents

레이저광 조사 장치 및 레이저광 조사 방법 Download PDF

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Publication number
KR20140019313A
KR20140019313A KR1020137018981A KR20137018981A KR20140019313A KR 20140019313 A KR20140019313 A KR 20140019313A KR 1020137018981 A KR1020137018981 A KR 1020137018981A KR 20137018981 A KR20137018981 A KR 20137018981A KR 20140019313 A KR20140019313 A KR 20140019313A
Authority
KR
South Korea
Prior art keywords
laser beam
film
laser
oscillator
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137018981A
Other languages
English (en)
Korean (ko)
Inventor
신 오이카와
리키야 마츠모토
민성욱
조재형
Original Assignee
수미토모 케미칼 컴퍼니 리미티드
(주)하드램
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 수미토모 케미칼 컴퍼니 리미티드, (주)하드램 filed Critical 수미토모 케미칼 컴퍼니 리미티드
Publication of KR20140019313A publication Critical patent/KR20140019313A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00788—Producing optical films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Laser Beam Processing (AREA)
  • Polarising Elements (AREA)
KR1020137018981A 2010-12-24 2011-12-22 레이저광 조사 장치 및 레이저광 조사 방법 Withdrawn KR20140019313A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010288671A JP2012135782A (ja) 2010-12-24 2010-12-24 レーザー光照射装置およびレーザー光照射方法
JPJP-P-2010-288671 2010-12-24
PCT/JP2011/079832 WO2012086764A1 (ja) 2010-12-24 2011-12-22 レーザー光照射装置およびレーザー光照射方法

Publications (1)

Publication Number Publication Date
KR20140019313A true KR20140019313A (ko) 2014-02-14

Family

ID=46314031

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137018981A Withdrawn KR20140019313A (ko) 2010-12-24 2011-12-22 레이저광 조사 장치 및 레이저광 조사 방법

Country Status (5)

Country Link
JP (1) JP2012135782A (enExample)
KR (1) KR20140019313A (enExample)
CN (1) CN103260816A (enExample)
TW (1) TW201233482A (enExample)
WO (1) WO2012086764A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013128966A (ja) * 2011-12-22 2013-07-04 Sumitomo Chemical Co Ltd レーザー光照射装置、フィルム切断装置、レーザー光照射方法及びフィルム切断方法
JP6342949B2 (ja) 2016-05-17 2018-06-13 ファナック株式会社 反射光を抑制しながらレーザ加工を行うレーザ加工装置及びレーザ加工方法
JP7475220B2 (ja) * 2020-07-03 2024-04-26 住友重機械工業株式会社 レーザパワー計測装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6478694A (en) * 1987-09-19 1989-03-24 Hitachi Maxell Method and device for cutting raw film consisting of plastic film as base material
JP3102322B2 (ja) * 1995-10-31 2000-10-23 日立電線株式会社 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置
JP2000357835A (ja) * 1999-06-15 2000-12-26 Amada Eng Center Co Ltd レーザ発振器
JP4274251B2 (ja) * 2007-01-24 2009-06-03 ソニー株式会社 レーザ描画方法及びレーザ描画装置

Also Published As

Publication number Publication date
TW201233482A (en) 2012-08-16
JP2012135782A (ja) 2012-07-19
WO2012086764A1 (ja) 2012-06-28
CN103260816A (zh) 2013-08-21

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20130718

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid