CN103222081B - 组件和包括该组件的电子器件 - Google Patents
组件和包括该组件的电子器件 Download PDFInfo
- Publication number
- CN103222081B CN103222081B CN201180055677.XA CN201180055677A CN103222081B CN 103222081 B CN103222081 B CN 103222081B CN 201180055677 A CN201180055677 A CN 201180055677A CN 103222081 B CN103222081 B CN 103222081B
- Authority
- CN
- China
- Prior art keywords
- dielectric layer
- semiconductor layer
- layer
- grid
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/478—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising a layer of composite material comprising interpenetrating or embedded materials, e.g. TiO2 particles in a polymer matrix
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
- H10K85/623—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene containing five rings, e.g. pentacene
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41597510P | 2010-11-22 | 2010-11-22 | |
| US61/415,975 | 2010-11-22 | ||
| PCT/US2011/061199 WO2012071243A2 (en) | 2010-11-22 | 2011-11-17 | Assembly and electronic devices including the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103222081A CN103222081A (zh) | 2013-07-24 |
| CN103222081B true CN103222081B (zh) | 2016-04-06 |
Family
ID=46052857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180055677.XA Expired - Fee Related CN103222081B (zh) | 2010-11-22 | 2011-11-17 | 组件和包括该组件的电子器件 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8835915B2 (enExample) |
| EP (1) | EP2643864A2 (enExample) |
| JP (1) | JP5931083B2 (enExample) |
| CN (1) | CN103222081B (enExample) |
| SG (1) | SG190340A1 (enExample) |
| WO (1) | WO2012071243A2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140061648A1 (en) * | 2012-08-31 | 2014-03-06 | David H. Levy | Thin film transistor including dielectric stack |
| KR102335364B1 (ko) | 2014-03-27 | 2021-12-06 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 오가노보란-함유 조성물, 및 그의 사용 방법 |
| CN107887269A (zh) * | 2017-11-03 | 2018-04-06 | 通威太阳能(安徽)有限公司 | 一种晶体硅太阳能电池刻蚀工艺 |
| KR102820132B1 (ko) | 2019-09-03 | 2025-06-12 | 고쿠리츠다이가쿠호우진 도쿄다이가쿠 | 유기 반도체 디바이스의 소스/드레인용 전극, 그것을 사용한 유기 반도체 디바이스, 및 그것들의 제조 방법 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6955939B1 (en) * | 2003-11-03 | 2005-10-18 | Advanced Micro Devices, Inc. | Memory element formation with photosensitive polymer dielectric |
| CN101359719A (zh) * | 2008-09-11 | 2009-02-04 | 电子科技大学 | 一种有机薄膜晶体管及其制备方法 |
| JP2009130368A (ja) * | 2007-11-26 | 2009-06-11 | Hitachi Ltd | 有機電界効果トランジスタ |
| CN101681929A (zh) * | 2007-05-30 | 2010-03-24 | 日产化学工业株式会社 | 薄膜晶体管用栅极绝缘膜形成剂 |
| CN101826563A (zh) * | 2009-03-03 | 2010-09-08 | E.I.内穆尔杜邦公司 | 封装材料和采用该封装材料形成的太阳能电池组件 |
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| US4262072A (en) | 1979-06-25 | 1981-04-14 | Minnesota Mining And Manufacturing Company | Poly(ethylenically unsaturated alkoxy) heterocyclic protective coatings |
| US5257478A (en) | 1990-03-22 | 1993-11-02 | Rodel, Inc. | Apparatus for interlayer planarization of semiconductor material |
| US5739254A (en) | 1996-08-29 | 1998-04-14 | Xerox Corporation | Process for haloalkylation of high performance polymers |
| US6126532A (en) | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
| US5921855A (en) | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| US6238592B1 (en) | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
| US6491843B1 (en) | 1999-12-08 | 2002-12-10 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
| US6702954B1 (en) | 2000-10-19 | 2004-03-09 | Ferro Corporation | Chemical-mechanical polishing slurry and method |
| US20030097010A1 (en) | 2001-09-27 | 2003-05-22 | Vogel Dennis E. | Process for preparing pentacene derivatives |
| AU2002327747A1 (en) | 2001-09-27 | 2003-04-07 | 3M Innovative Properties Company | Substituted pentacene semiconductors |
| US6998068B2 (en) | 2003-08-15 | 2006-02-14 | 3M Innovative Properties Company | Acene-thiophene semiconductors |
| US6913517B2 (en) | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| US6908366B2 (en) | 2003-01-10 | 2005-06-21 | 3M Innovative Properties Company | Method of using a soft subpad for chemical mechanical polishing |
| US7109519B2 (en) | 2003-07-15 | 2006-09-19 | 3M Innovative Properties Company | Bis(2-acenyl)acetylene semiconductors |
| JP4124787B2 (ja) | 2004-01-15 | 2008-07-23 | 松下電器産業株式会社 | 電界効果トランジスタ及びそれを用いた表示装置 |
| KR100560796B1 (ko) * | 2004-06-24 | 2006-03-13 | 삼성에스디아이 주식회사 | 유기 박막트랜지스터 및 그의 제조방법 |
| JP5109223B2 (ja) | 2004-08-04 | 2012-12-26 | ソニー株式会社 | 電界効果型トランジスタ |
| JP2008509271A (ja) | 2004-08-13 | 2008-03-27 | ヘ−ウク・イ | 機能性コーティング組成物、これを用いた機能性被膜及びそれらの製造方法 |
| US7523440B2 (en) | 2004-11-16 | 2009-04-21 | The Mathworks, Inc. | Dynamic generation of formatted user interfaces in software environments |
| WO2006057714A2 (en) | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
| US7264872B2 (en) | 2004-12-30 | 2007-09-04 | 3M Innovative Properties Company | Durable high index nanocomposites for AR coatings |
| US7241437B2 (en) | 2004-12-30 | 2007-07-10 | 3M Innovative Properties Company | Zirconia particles |
| US7410631B2 (en) | 2005-03-02 | 2008-08-12 | Aps Laboratory | Metal phosphate sols, metal nanoparticles, metal-chalcogenide nanoparticles, and nanocomposites made therefrom |
| JP4424341B2 (ja) | 2005-12-02 | 2010-03-03 | セイコーエプソン株式会社 | 薄膜トランジスタ、電子回路、表示装置および電子機器 |
| US7267610B1 (en) | 2006-08-30 | 2007-09-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having unevenly spaced grooves |
| KR101224723B1 (ko) | 2006-09-15 | 2013-01-21 | 삼성전자주식회사 | 유기 절연막 조성물, 이를 이용하여 제조된 유기 절연막 및유기 박막 트랜지스터 |
| KR101316291B1 (ko) | 2007-02-16 | 2013-10-08 | 삼성전자주식회사 | 공중합체, 유기절연층 조성물 및 그를 이용하여 제조된유기 절연층 및 유기 박막 트랜지스터 |
| US20090001356A1 (en) | 2007-06-29 | 2009-01-01 | 3M Innovative Properties Company | Electronic devices having a solution deposited gate dielectric |
| US7879688B2 (en) | 2007-06-29 | 2011-02-01 | 3M Innovative Properties Company | Methods for making electronic devices with a solution deposited gate dielectric |
| JP5385377B2 (ja) | 2008-05-15 | 2014-01-08 | スリーエム イノベイティブ プロパティズ カンパニー | 終点窓を持った研磨パッドおよびこれを用いたシステムおよび使用方法 |
| WO2009155106A1 (en) | 2008-05-30 | 2009-12-23 | 3M Innovative Properties Company | Silylethynyl pentacene compounds and compositions and methods of making and using the same |
| WO2009158201A1 (en) | 2008-06-27 | 2009-12-30 | 3M Innovative Properties Company | Methods op fabricating crystalline organic semiconductive layers |
| JP2010108986A (ja) * | 2008-10-28 | 2010-05-13 | Hitachi Chem Co Ltd | ゲート絶縁膜層成形材料、電界効果型トランジスタ及びこの電界効果型トランジスタの製造方法 |
| WO2010056568A1 (en) | 2008-11-14 | 2010-05-20 | 3M Innovative Properties Company | Off-center deposition of organic semiconductor in an organic semiconductor device |
| WO2010061886A1 (ja) * | 2008-11-28 | 2010-06-03 | 日産化学工業株式会社 | 薄膜トランジスタ用ゲート絶縁膜形成組成物 |
| US8418228B2 (en) * | 2008-12-03 | 2013-04-09 | Electronics And Telecommunications Research Institute | Converged access control method using network access device at penetration node of IP network of convergence ALL-IP network |
| JP5756605B2 (ja) * | 2010-06-15 | 2015-07-29 | 株式会社カネカ | 薄膜トランジスタ |
| KR20130089580A (ko) * | 2010-06-23 | 2013-08-12 | 아사히 가라스 가부시키가이샤 | 경화성 조성물 및 경화막의 제조 방법 |
-
2011
- 2011-11-17 SG SG2013038690A patent/SG190340A1/en unknown
- 2011-11-17 EP EP11840707.1A patent/EP2643864A2/en not_active Withdrawn
- 2011-11-17 US US13/880,914 patent/US8835915B2/en not_active Expired - Fee Related
- 2011-11-17 JP JP2013540016A patent/JP5931083B2/ja not_active Expired - Fee Related
- 2011-11-17 CN CN201180055677.XA patent/CN103222081B/zh not_active Expired - Fee Related
- 2011-11-17 WO PCT/US2011/061199 patent/WO2012071243A2/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6955939B1 (en) * | 2003-11-03 | 2005-10-18 | Advanced Micro Devices, Inc. | Memory element formation with photosensitive polymer dielectric |
| CN101681929A (zh) * | 2007-05-30 | 2010-03-24 | 日产化学工业株式会社 | 薄膜晶体管用栅极绝缘膜形成剂 |
| JP2009130368A (ja) * | 2007-11-26 | 2009-06-11 | Hitachi Ltd | 有機電界効果トランジスタ |
| CN101359719A (zh) * | 2008-09-11 | 2009-02-04 | 电子科技大学 | 一种有机薄膜晶体管及其制备方法 |
| CN101826563A (zh) * | 2009-03-03 | 2010-09-08 | E.I.内穆尔杜邦公司 | 封装材料和采用该封装材料形成的太阳能电池组件 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014502047A (ja) | 2014-01-23 |
| US8835915B2 (en) | 2014-09-16 |
| CN103222081A (zh) | 2013-07-24 |
| SG190340A1 (en) | 2013-06-28 |
| WO2012071243A3 (en) | 2012-08-02 |
| JP5931083B2 (ja) | 2016-06-08 |
| WO2012071243A2 (en) | 2012-05-31 |
| US20130256640A1 (en) | 2013-10-03 |
| EP2643864A2 (en) | 2013-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20181117 |
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| CF01 | Termination of patent right due to non-payment of annual fee |