CN103222034B - 包含透射区域的抛光垫 - Google Patents

包含透射区域的抛光垫 Download PDF

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Publication number
CN103222034B
CN103222034B CN201180055788.0A CN201180055788A CN103222034B CN 103222034 B CN103222034 B CN 103222034B CN 201180055788 A CN201180055788 A CN 201180055788A CN 103222034 B CN103222034 B CN 103222034B
Authority
CN
China
Prior art keywords
polishing pad
translucent insert
translucent
pad body
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180055788.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN103222034A (zh
Inventor
K.内维尔
A.普拉萨德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of CN103222034A publication Critical patent/CN103222034A/zh
Application granted granted Critical
Publication of CN103222034B publication Critical patent/CN103222034B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN201180055788.0A 2010-11-18 2011-11-18 包含透射区域的抛光垫 Expired - Fee Related CN103222034B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41501510P 2010-11-18 2010-11-18
US61/415,015 2010-11-18
PCT/US2011/061312 WO2012068428A2 (en) 2010-11-18 2011-11-18 Polishing pad comprising transmissive region

Publications (2)

Publication Number Publication Date
CN103222034A CN103222034A (zh) 2013-07-24
CN103222034B true CN103222034B (zh) 2016-03-09

Family

ID=46084662

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180055788.0A Expired - Fee Related CN103222034B (zh) 2010-11-18 2011-11-18 包含透射区域的抛光垫

Country Status (8)

Country Link
US (1) US20130237136A1 (enExample)
EP (1) EP2641268A4 (enExample)
JP (1) JP5918254B2 (enExample)
KR (1) KR101602544B1 (enExample)
CN (1) CN103222034B (enExample)
MY (1) MY166716A (enExample)
SG (1) SG190249A1 (enExample)
WO (1) WO2012068428A2 (enExample)

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US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
CN106853610B (zh) * 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 抛光垫及其监测方法和监测系统
KR101829542B1 (ko) * 2016-07-27 2018-02-23 신우유니온(주) 손톱용 버퍼의 제조방법
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
US11260495B2 (en) * 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
JP7317440B2 (ja) * 2019-04-15 2023-07-31 株式会社ディスコ ドレッシング工具
JP7220130B2 (ja) * 2019-07-11 2023-02-09 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
CN117098632A (zh) * 2021-01-25 2023-11-21 Cmc材料有限责任公司 具有受控的纹理表面的终点窗
KR102593117B1 (ko) * 2021-07-02 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

Citations (5)

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EP0824995A1 (en) * 1996-08-16 1998-02-25 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
EP1306163A1 (en) * 2001-10-26 2003-05-02 JSR Corporation Window member for chemical mechanical polishing and polishing pad
CN101184582A (zh) * 2005-04-25 2008-05-21 卡伯特微电子公司 用于化学机械抛光的多层抛光垫材料
CN101242931A (zh) * 2005-08-22 2008-08-13 应用材料股份有限公司 基于光谱的监测化学机械研磨的装置及方法
CN101443157A (zh) * 2006-05-17 2009-05-27 东洋橡胶工业株式会社 抛光垫

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US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6716085B2 (en) * 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6247998B1 (en) * 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
US6071177A (en) * 1999-03-30 2000-06-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for determining end point in a polishing process
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6358130B1 (en) * 1999-09-29 2002-03-19 Rodel Holdings, Inc. Polishing pad
JP2001110762A (ja) * 1999-10-04 2001-04-20 Asahi Kasei Corp 研磨パッド
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6840843B2 (en) * 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
KR100541545B1 (ko) * 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) * 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
WO2007024807A2 (en) * 2005-08-22 2007-03-01 Applied Materials, Inc. Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US7210980B2 (en) * 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
US20070197145A1 (en) * 2006-02-15 2007-08-23 Applied Materials, Inc. Polishing article with window stripe
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
JP2008226911A (ja) * 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法
WO2008154185A2 (en) * 2007-06-08 2008-12-18 Applied Materials, Inc. Thin polishing pad with window and molding process
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US8662957B2 (en) * 2009-06-30 2014-03-04 Applied Materials, Inc. Leak proof pad for CMP endpoint detection
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US8439994B2 (en) * 2010-09-30 2013-05-14 Nexplanar Corporation Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0824995A1 (en) * 1996-08-16 1998-02-25 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
EP1306163A1 (en) * 2001-10-26 2003-05-02 JSR Corporation Window member for chemical mechanical polishing and polishing pad
CN101184582A (zh) * 2005-04-25 2008-05-21 卡伯特微电子公司 用于化学机械抛光的多层抛光垫材料
CN101242931A (zh) * 2005-08-22 2008-08-13 应用材料股份有限公司 基于光谱的监测化学机械研磨的装置及方法
CN101443157A (zh) * 2006-05-17 2009-05-27 东洋橡胶工业株式会社 抛光垫

Also Published As

Publication number Publication date
KR101602544B1 (ko) 2016-03-10
JP5918254B2 (ja) 2016-05-18
KR20130116892A (ko) 2013-10-24
CN103222034A (zh) 2013-07-24
SG190249A1 (en) 2013-06-28
WO2012068428A3 (en) 2012-08-16
MY166716A (en) 2018-07-18
JP2013542863A (ja) 2013-11-28
US20130237136A1 (en) 2013-09-12
EP2641268A2 (en) 2013-09-25
WO2012068428A2 (en) 2012-05-24
EP2641268A4 (en) 2017-01-25

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Granted publication date: 20160309

Termination date: 20171118