MY166716A - Polishing pad comprising transmissive region - Google Patents
Polishing pad comprising transmissive regionInfo
- Publication number
- MY166716A MY166716A MYPI2013001771A MYPI2013001771A MY166716A MY 166716 A MY166716 A MY 166716A MY PI2013001771 A MYPI2013001771 A MY PI2013001771A MY PI2013001771 A MYPI2013001771 A MY PI2013001771A MY 166716 A MY166716 A MY 166716A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing pad
- region
- transmissive region
- pad body
- translucent window
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- 239000011148 porous material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
THE INVENTION PROVIDES A POLISHING PAD COMPRISING AN OPTICALLY TRANS MISSIVE REGION, WHEREIN THE POLISHING PAD COMPRISES A POLISHING PAD BODY COMPRISING AN OPAQUE FIRST REGION AND AN OPTICALLY TRANS MISSIVE SECOND REGION, WHEREIN THE SECOND REGION HAS AT LEAST ONE RECESS FORMED THEREIN OF AT LEAST ONE PART OF THE POLISHING PAD BODY, AND AT LEAST ONE TRANSLUCENT WINDOW INSERT IS INTEGRATED INTO THE AT LEAST ONE RECESSED AREA. THE POLISHING PAD BODY AND THE AT LEAST ONE TRANSLUCENT WINDOW INSERT COMPRISE DIFFERENT POROUS MATERIALS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41501510P | 2010-11-18 | 2010-11-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY166716A true MY166716A (en) | 2018-07-18 |
Family
ID=46084662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2013001771A MY166716A (en) | 2010-11-18 | 2011-11-18 | Polishing pad comprising transmissive region |
Country Status (8)
Country | Link |
---|---|
US (1) | US20130237136A1 (en) |
EP (1) | EP2641268A4 (en) |
JP (1) | JP5918254B2 (en) |
KR (1) | KR101602544B1 (en) |
CN (1) | CN103222034B (en) |
MY (1) | MY166716A (en) |
SG (1) | SG190249A1 (en) |
WO (1) | WO2012068428A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013123105A2 (en) * | 2012-02-14 | 2013-08-22 | Innopad, Inc. | Method of manufacturing a chemical mechanical planarization pad |
US20140370788A1 (en) * | 2013-06-13 | 2014-12-18 | Cabot Microelectronics Corporation | Low surface roughness polishing pad |
CN106853610B (en) * | 2015-12-08 | 2019-11-01 | 中芯国际集成电路制造(北京)有限公司 | Polishing pad and its monitoring method and monitoring system |
KR101829542B1 (en) * | 2016-07-27 | 2018-02-23 | 신우유니온(주) | Manufacturing method of buffer for nails |
US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
US11325221B2 (en) * | 2017-11-16 | 2022-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with multipurpose composite window |
US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
US11260495B2 (en) * | 2018-07-27 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and methods for chemical mechanical polishing |
JP7317440B2 (en) * | 2019-04-15 | 2023-07-31 | 株式会社ディスコ | dressing tool |
JP7220130B2 (en) * | 2019-07-11 | 2023-02-09 | 株式会社クラレ | Polishing pad and polishing pad manufacturing method |
KR102593117B1 (en) * | 2021-07-02 | 2023-10-24 | 에스케이엔펄스 주식회사 | Polishing pad and preparing method of semiconductor device using the same |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US5888120A (en) * | 1997-09-29 | 1999-03-30 | Lsi Logic Corporation | Method and apparatus for chemical mechanical polishing |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6248000B1 (en) * | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface |
US6280289B1 (en) * | 1998-11-02 | 2001-08-28 | Applied Materials, Inc. | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6716085B2 (en) * | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
US6247998B1 (en) * | 1999-01-25 | 2001-06-19 | Applied Materials, Inc. | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
US6071177A (en) * | 1999-03-30 | 2000-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for determining end point in a polishing process |
US6213845B1 (en) * | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
US6135859A (en) * | 1999-04-30 | 2000-10-24 | Applied Materials, Inc. | Chemical mechanical polishing with a polishing sheet and a support sheet |
US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
WO2001023141A1 (en) * | 1999-09-29 | 2001-04-05 | Rodel Holdings, Inc. | Polishing pad |
JP2001110762A (en) * | 1999-10-04 | 2001-04-20 | Asahi Kasei Corp | Polishing pad |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6840843B2 (en) * | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
JP4131632B2 (en) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | Polishing apparatus and polishing pad |
JP2003133270A (en) * | 2001-10-26 | 2003-05-09 | Jsr Corp | Window material for chemical mechanical polishing and polishing pad |
KR100541545B1 (en) * | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | Polishing table of a chemical mechanical polishing apparatus |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7435161B2 (en) * | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7264536B2 (en) * | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US7261625B2 (en) * | 2005-02-07 | 2007-08-28 | Inoac Corporation | Polishing pad |
US7764377B2 (en) * | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
KR101324644B1 (en) * | 2005-08-22 | 2013-11-01 | 어플라이드 머티어리얼스, 인코포레이티드 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
US7210980B2 (en) * | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
US20070197145A1 (en) * | 2006-02-15 | 2007-08-23 | Applied Materials, Inc. | Polishing article with window stripe |
JP5110677B2 (en) * | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | Polishing pad |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
JP2008226911A (en) * | 2007-03-08 | 2008-09-25 | Jsr Corp | Chemical and mechanical polishing pad, lamination pad for chemical mechanical polishing, and chemical and mechanical polishing method |
JP5363470B2 (en) * | 2007-06-08 | 2013-12-11 | アプライド マテリアルズ インコーポレイテッド | Thin polishing pad with window and molding process |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
WO2011008499A2 (en) * | 2009-06-30 | 2011-01-20 | Applied Materials, Inc. | Leak proof pad for cmp endpoint detection |
US8393940B2 (en) * | 2010-04-16 | 2013-03-12 | Applied Materials, Inc. | Molding windows in thin pads |
US8439994B2 (en) * | 2010-09-30 | 2013-05-14 | Nexplanar Corporation | Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection |
-
2011
- 2011-11-18 KR KR1020137015580A patent/KR101602544B1/en active IP Right Grant
- 2011-11-18 CN CN201180055788.0A patent/CN103222034B/en not_active Expired - Fee Related
- 2011-11-18 SG SG2013036363A patent/SG190249A1/en unknown
- 2011-11-18 JP JP2013540037A patent/JP5918254B2/en not_active Expired - Fee Related
- 2011-11-18 US US13/988,144 patent/US20130237136A1/en not_active Abandoned
- 2011-11-18 EP EP11841143.8A patent/EP2641268A4/en not_active Withdrawn
- 2011-11-18 MY MYPI2013001771A patent/MY166716A/en unknown
- 2011-11-18 WO PCT/US2011/061312 patent/WO2012068428A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2641268A2 (en) | 2013-09-25 |
KR101602544B1 (en) | 2016-03-10 |
SG190249A1 (en) | 2013-06-28 |
WO2012068428A2 (en) | 2012-05-24 |
CN103222034B (en) | 2016-03-09 |
EP2641268A4 (en) | 2017-01-25 |
US20130237136A1 (en) | 2013-09-12 |
WO2012068428A3 (en) | 2012-08-16 |
JP5918254B2 (en) | 2016-05-18 |
CN103222034A (en) | 2013-07-24 |
JP2013542863A (en) | 2013-11-28 |
KR20130116892A (en) | 2013-10-24 |
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