CN103222034A - Polishing pad comprising transmissive region - Google Patents
Polishing pad comprising transmissive region Download PDFInfo
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- CN103222034A CN103222034A CN2011800557880A CN201180055788A CN103222034A CN 103222034 A CN103222034 A CN 103222034A CN 2011800557880 A CN2011800557880 A CN 2011800557880A CN 201180055788 A CN201180055788 A CN 201180055788A CN 103222034 A CN103222034 A CN 103222034A
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- polishing pad
- translucent insert
- main body
- pit
- translucent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Abstract
The invention provides a polishing pad comprising an optically transmissive region, wherein the polishing pad comprises a polishing pad body comprising an opaque first region and an optically transmissive second region, wherein the second region has at least one recess formed therein of at least one part of the polishing pad body, and at least one translucent window insert is integrated into the at least one recessed area. The polishing pad body and the at least one translucent window insert comprise different porous materials.
Description
Background technology
Chemical-mechanical polishing (" CMP ") technology is used to make microelectronic component to form flat surfaces on semiconductor wafer, Field Emission Display and many other microelectronic substrates.For example, the manufacturing of semiconductor device generally comprise form various process layers, to the part of these layers carry out selective removal or patterning, and above semiconductor substrate surface the extra process layer of deposition to form semiconductor wafer.For instance, these process layers can comprise insulating barrier, gate oxide level, conductive layer, reach the layer of metal or glass etc.Usually the uppermost surface of expectation process layer is (being smooth) on plane in some steps of wafer technique, to be used to deposit follow-up layer.CMP is used for the planarization of process layer, wherein, with material (as electric conducting material or the insulating material) polishing of deposition so that wafer planarization and be used for follow-up processing step.
In the polishing of substrate surface, it often is favourable that glossing is carried out in-situ monitoring.A kind of method of glossing being carried out in-situ monitoring relates to the polishing pad that use has hole or window.Described hole or window provide inlet, and by described inlet, light can pass to allow during described glossing by the described substrate surface of optical detection systems inspection.Polishing pad with hole or window is known and has been used for polishing substrate such as semiconductor device.For example, United States Patent (USP) 6,171,181 disclose the polishing pad that comprises the one-body molded moulding article with translucent area and zone of opacity.By the described translucent area that solidify to form of flowable polymer section bar material, described flowable polymer section bar material is translucent at first, makes a part of described polymer-based material keep its transparency after curing.The quick cooling in described flowable polymer section bar material zone causes the curing in described zone, thereby makes that the crystallization of the described material in described zone is minimized and amorphous translucent area is provided.United States Patent (USP) 6,840,843 disclose the polishing pad that comprises translucent area, and wherein by being prepared as follows described translucent area: suppress in the zone to porous polymer type polishing pad substrate, thereby described translucent area is provided.
Yet described hole or window often have the performance that is different from described polishing pad remainder, for example porosity, hardness, resistance to wear etc.These performance differences often cause the non-homogeneous polishing of substrate.In addition, hole or window typically are designed to allow light that the maximum of target base plate and detector is seen through.This fact does not consider that different substrates and different detectors may need to be used for the different qualities or the quantity of the light that optimum terminal detects.Therefore, this area still needs the polishing pad with optical transmission zone that improves.
Summary of the invention
The invention provides the polishing pad that comprises the optical transmission zone, wherein, described polishing pad comprises: the polishing pad main body (body that (a) comprises first area and second area, body), wherein said first area is opaque, wherein said second area is an optical transmission, wherein said second area has at least one pit that is formed at wherein, and (b) being incorporated at least one translucent insert in described at least one pit, wherein said polishing pad main body comprises first porous material and described at least one translucent insert comprises second porous material that is different from described first porous material.
The present invention also provides the preparation method of the polishing pad with optical transmission zone, may further comprise the steps: the polishing pad main body (a) is provided, wherein said polishing pad main body comprises first porous material, (b) in the polishing pad main body of at least a portion of described polishing pad main body, form at least one pit, (c) provide at least one translucent insert, wherein said translucent insert comprises second porous material that is different from described first porous material and (d) described at least one translucent insert is attached to described pit so that the polishing pad with at least one optical transmission zone to be provided.
Description of drawings
Fig. 1 is the cross-sectional view according to the polishing pad of embodiment of the present invention.
Fig. 2 is the cross-sectional view according to the polishing pad of embodiment of the present invention.
Fig. 3 A-3C has described according to the present invention the representative surperficial texture of the translucent window of some execution modes.
Fig. 4 is the cross-sectional view according to the polishing pad of embodiment of the present invention.
Fig. 5 is the cross-sectional view according to the polishing pad of embodiment of the present invention.
Embodiment
The invention provides the polishing pad that comprises the optical transmission zone.Described polishing pad comprises: (a) polishing pad main body, described polishing pad main body comprises first area and second area, wherein said first area is opaque, wherein said second area is an optical transmission, wherein said second area has at least one pit that is formed at wherein, and (b) being incorporated at least one translucent insert in described at least one pit, wherein said polishing pad main body comprises first porous material and described at least one translucent insert comprises second porous material that is different from described first porous material.
Described polishing pad can have any suitable size.Typically, described polishing pad is round-shaped (it is used for the rotary finishing instrument) or manufacture ring-type shape belt (it is used for linear polishing tool).Preferably, polishing pad is circular.
Described polishing pad main body can comprise any suitable material.Desirably, described polishing pad main body comprises fluoropolymer resin.Described fluoropolymer resin can be any suitable fluoropolymer resin.Typically, described fluoropolymer resin is selected from thermoplastic elastomer (TPE), thermosetting polymer, polyurethane (for example thermoplastic polyurethane), polyolefin (for example TPO), Merlon, water-soluble polymer such as polyethylene glycol oxide, glycol, poly-(vinyl alcohol), biodegradable polymer is as poly-(lactic acid), poly-(butyric ester), can be by the polymer of UV or γ crosslinking with radiation, silicone, polysiloxanes, polyvinyl alcohol, nylon, elastomer rubber, the elastomer polyethylene, polytetrafluoroethylene, PETG, polyimides, Nomex, poly (arylene ether), polyacrylate, polystyrene, polymethyl methacrylate, their copolymer, and their mixture.Preferably, described fluoropolymer resin is a polyurethane, is more preferably thermoplastic polyurethane.
Described polishing pad main body can use any appropriate technology to produce, and wherein many are known in the art.For example, can be by forming described polishing pad main body such as the method for casting and extrude.Described fluoropolymer resin can be thermoplastic, is heated to it and temperature that flows takes place and schedule to last the shape of hoping by casting or extrude to be shaped then.Described fluoropolymer resin can provide loose structure by its natural structure.In other embodiments, can introduce loose structure by using different production technologies known in the art (as foaming, blowing etc.).Provide the exemplary process of the loose structure that comprises closed pore pore (pore) to comprise foaming such as supercritical fluid (SCF) method, phase inversion, spinodal or bimodal decomposition method or Compressed Gas injection method, all these are well known in the art.Provide the exemplary process of the loose structure that comprises the perforate pore to comprise that the particle to thermoplastic polymer such as polyurethane carries out sintering so that the perforate loose structure to be provided.
Described pad comprises the main body that contains first area and second area, and wherein said first area is that opaque and wherein said second area is an optical transmission.The first area of described polishing pad main body be porous and have first voidage.Described first voidage be non-zero and can be any suitable non-zero voidage.For example, described first voidage can be 5% or bigger (for example 10% bigger or 20% bigger or 30% bigger or 40% or bigger).Selectively, perhaps additionally, described first voidage can be 70% or littler (for example, 60% littler or 50% littler or 45% littler or 40% or littler).Described first voidage can define by any two of aforementioned interspace volume.Therefore, for instance, described first voidage can be 20%-70% or 20%-60% or 20%-50% or 25%-70% or 25%-60% or 25%-50%.
The first area of described polishing pad main body can have any suitable average pore size.For example, the first area of described polishing pad main body can have 500 μ m or littler average pore size (for example, 300 μ m or littler or 200 μ m or littler).In a preferred implementation, the first area of described polishing pad main body has 50 μ m or littler average pore size (for example, 40 μ m or littler or 30 μ m or littler).In another preferred embodiment, the first area of described polishing pad main body has the average pore size (for example, 1 μ m-15 μ m or 1 μ m-10 μ m) of 1 μ m-20 μ m.
Typically, the first area of described polishing pad main body mainly comprises closed pore (that is pore); Yet the first area of described polishing pad main body can also comprise perforate.Preferably, based on total void volume, the first area of described polishing pad main body comprises 5% or the closed pore of more (for example, 10% or more).More preferably, based on total void volume, the first area of described polishing pad main body comprises 20% or the closed pore of more (for example, 30% or more, 40% or more, or 50% or more).
The second area of described polishing pad main body can be porous, atresia basically, perhaps atresia fully.The second area of described polishing pad main body typically has the voidage less than the voidage of the first area of described polishing pad main body.
The first area of described polishing pad main body is opaque substantially or opaque fully.In one embodiment, a part opaque substantially or opaque described polishing pad main body fully is compressed the second area with the optical transmission that forms described polishing pad main body.Here employed term " optical transmission " is the light transmissive ability of at least a portion of instigating the described pad interface of contact, and it can be used to description translucent or material transparent slightly, partly, basically and fully.At least one second area of described polishing pad main body is preferred at least to light with 390-3500nm wavelength, more preferably visible light and be optical transmission from the visible light of LASER Light Source (especially for the LASER Light Source in the polissoir that uses with polishing pad) most preferably.
Do not wish to be subject to any concrete theory, think that the hole (pore) in described polishing pad main body causes passing the light generation scattering of described cell structure, thereby reduced the translucence of described polishing pad main body or made that described polishing pad main body is opaque.Think that the light scattering degree is the function of average pore size and average pore volume.Think that also the compression of described polishing pad main body has reduced the light scattering effect in described hole by reducing the porosity of described polishing pad main body in institute's constricted zone.The result, compare with unpressed described polishing pad main body (being the first area of described polishing pad main body), described constricted zone (being the second area of described polishing pad main body) has the light transmission (i.e. the light scattering degree of Jiang Diing and the translucence of increase) of increase.
The degree that the translucence that provides in this mode depends on described porous polymer structure at least in part and be compressed into (being the degree that the porosity of described porous polymer structure is reduced to) is provided.For example, the 10-50% of its thickness (being the non-compressed thickness of described polishing pad main body) (for example, 20-40%) before described polishing pad main body can be compressed to and compress.
Can any suitable mode known in the art carry out the compression of described polishing pad main body to form at least one pit.As one of ordinary skill in the art will appreciate, the most effective compress technique depends on employed concrete polymer in described polishing pad main body is made at least in part.For example, can by use the RF solder technology, by use felt wrapped roll or by use different briquetting machine known in the art as platen press, moulding press wait compress as described in the polishing pad main body.In addition, heating can be used separately or use with other compress technique, to obtain the pressure texture body.For example, described polishing pad main body can be heated to approaching, meet or surpass its temperature softening or melt temperature, be enough to heating time to allow cave under the weight of hole used polymer in described polishing pad main-body structure of second area of described polishing pad main body.Perhaps, can use another compress technique compress described polishing pad main body before, during or afterwards described polishing pad main body is applied heat.For example, the RF welding can use with the megahertz zone in radio-frequency (RF) energy apply the mould that combines, thereby cause the heating of the polishing pad main body that contacts with described mould, with the compression in the zone that causes described polishing pad main body.In another example, can use heated press or warm-up mill to compress described polishing pad main body, to compress the zone of described polishing pad main body.Make when being used for compressing described polishing pad main body when heating, preferably described polishing pad main body is heated to the temperature of approaching, as to meet or surpass described polishing pad main body softening or melt temperature with another compress technique.
In another embodiment, the described second area of described polishing pad main body has at least one pit, and wherein said at least one pit forms in a face (i.e. surface) of described polishing pad main body.Can remove cushion material from the face of described pad and form described pit or pit areas by using any suitable mode (for example by means of the instrument of uprooting (rooter tool)).In one embodiment, by being installed in the rotary cutting tool on computer numerical control (CNC) router table, from described pit areas, remove material.The degree of depth, the position of pit, the rotating speed of cutting tool and the flatness of pit by program code control cutting.In another embodiment, the second area of described polishing pad main body has first pit and second pit, wherein forms described first and second pits by remove cushion material on the relative face of described polishing pad main body.
Described polishing pad comprises at least one and is incorporated into translucent insert in described at least one pit areas.Described translucent window comprises the porous material that is different from employed material in described polishing pad main body preparation.Described translucent insert can comprise any suitable material.Desirably, described translucent insert comprises fluoropolymer resin.Described fluoropolymer resin can be those of described polishing pad main body preparation of being used for described herein.Preferably, the described fluoropolymer resin that is used to prepare described translucent insert is a thermoplastic polymer.
Fig. 1 has described the execution mode of polishing pad of the present invention.Insert 20 is incorporated in the pit in described polishing pad main body, to form regional transmission.Subpad 30 is fixed on the bottom surface of polishing pad main body 10.
Can use any suitable method to prepare described translucent insert, any in the method that is used for preparing described polishing pad main body for example described herein.In a preferred embodiment, by casting or extruded thermoplastic fluoropolymer resin (for example, thermoplastic polyurethane), carry out the Compressed Gas injection method subsequently and prepare described translucent insert.For example, can extrude described thermoplastic polymer resin, then, make it in the balancing gate pit, stand high-pressure carbon dioxide, heat the carbon dioxide that is absorbed to cause subsequently and expand and make described fluoropolymer resin foaming so that window base plate of material to be provided.Then, this insert material die is become the net shape of the described pit on the face of described polishing pad main body, and adopt the RF welding to be incorporated in the described pit.
Described translucent insert has the voidage of non-zero.For example, the voidage of described translucent insert can be 1% or bigger (for example, 2% bigger or 3% bigger or 4% bigger or 5% or bigger).Selectively, perhaps additionally, the voidage of described translucent insert can be 25% or littler (for example, 20% littler or 15% or littler).The voidage of described translucent insert can define by any two of aforementioned interspace volume.Therefore, for instance, the voidage of described translucent insert can be 1%-25% or 1%-20% or 1%-15% or 1%-10% or 25%-60% or 25%-50%.
Described translucent insert can have any suitable average pore size.For example, described translucent insert can comprise the hole with 50 μ m or littler (for example, 40 μ m or littler or 30 μ m or littler) average pore size.In a preferred embodiment, described translucent insert comprises the hole of (for example, 1 μ m-15 μ m or the 1 μ m-10 μ m) average pore size that has 1 μ m-20 μ m.
Typically, described translucent insert mainly comprises closed pore (that is pore); Yet described translucent insert also can comprise perforate.Preferably, based on total void volume, described translucent insert comprises 5% or the closed pore of more (for example, 10% or more).More preferably, based on total void volume, described translucent insert comprise 20% or more (for example, 30% or more, 40% or more or 50% or more) closed pore.
Can use any appropriate technology that described translucent insert is incorporated in described at least one pit.The non-limiting example of appropriate technology comprises solder technology and uses adhesive.Preferably, by using solder technology, more preferably, described translucent insert is incorporated in described at least one pit by using RF welding or ultrasonic bonding.The RF welding relates to: the translucent insert that is welded in the pit on the described polishing pad main body is positioned, and use mould to instruct described welding procedure.Make other high frequency waves of megahertz level through described material, the result heats described each several part and described translucent insert and becomes and be incorporated in the described pit.Ultrasonic bonding relates to the translucent window using high frequency sound wave to make to comprise in the pit and the material generation fusion of polishing pad main body, thereby and cause described material to flow to together, make described translucent insert become and be incorporated in the described pit.Typically, ultrasound source is the metal sounding tuner (for example, " loudspeaker ") that high frequency electrical signal is changed into kilo hertz rank sound, although can use any suitable supersonic source.Described loudspeaker can be any suitable loudspeaker, for example stainless steel loudspeaker.Those loudspeaker can have any suitable shape or structure, and preferably by machine work to have shape similar shapes or even the identical shape with described translucent insert.
In some embodiments, original position forms in the pit of described translucent insert in described polishing pad main body.After described pit forms, the precursor of described translucent insert is placed in the described pit, and is converted into described translucent insert then.For example, the thermoplastic polyurethane particle can be positioned in the described pit, heat subsequently and/or compress and for example use RF welding, so that the sintered translucent that is incorporated in described pit insert to be provided.
In some embodiments, described polishing pad comprises at least two translucent inserts in the pit that is incorporated in the relative face that is formed on described polishing pad main body, and described translucent insert is desirably aligned with each other.In these execution modes, described at least two translucent inserts can be identical or different.Described at least two translucent inserts can comprise identical or different fluoropolymer resin.When described at least two translucent inserts not simultaneously, the translucent insert on described polishing pad front is a porous, and can be porous with the positive relative translucent insert of described polishing pad or can be basic or even atresia fully.
Fig. 2 has described the execution mode of the polishing pad of the present invention that comprises two translucent inserts.Translucent insert 20 is aimed at and is incorporated into 40 in the relative pit on the polishing pad main body 10.Subpad 30 is fixed on the bottom surface of polishing pad main body 10.
In some embodiments, described translucent insert has superficial makings.Described superficial makings has promoted the lateral transfer of polishing composition, and perhaps abrasive particles passes the surface of described translucent window.Can use any proper technology that described superficial makings is provided, one of them example is to carry out embossing by the surface to described translucent window.Embossing can provide the various patterns as describing among Fig. 3 A-3C.For example, can use embossing to produce as dimple (dimple) pattern of describing among Fig. 3 A, hexagon pattern or anti-phase (reversed) hexagon pattern as describing among Fig. 3 C as describing among Fig. 3 B.Those of ordinary skills can easily expect the surface texture pattern that other is suitable.
Can be by using the RF soldering appliance, in the surface of described translucent window, described RF soldering appliance has in order to be transferred to the feature on described translucent window surface during described translucent window being incorporated into the described welding procedure in the described polishing pad main body with the superficial makings embossing.Perhaps, can be before being incorporated into described polishing pad main body, with the superficial makings embossing in the surface of described translucent insert.In addition, typically caused the formation corresponding to the higher and lower porosity region of the different degrees of compression in described translucent insert in the formation of lip-deep superficial makings of the translucent insert of foaming, it causes forming described textured pattern.
The superficial makings of described translucent insert can be designed to provide the transmittance of aequum.The existence of superficial makings can cause the bigger light scattering of the radiation beam of incident, therefore, can select the density of superficial makings and type so that required transmittance performance to be provided.In addition, the change of the described translucent window porosity by for example embossing also can influence the light scattering that is caused by the hole.
Described translucent insert randomly comprises the sol particle that is combined in the described translucent insert.When having described sol particle, it preferably disperses to spread all over described translucent insert.During chemico-mechanical polishing, such sol particle partially or completely is dissolved in the liquid-carrier of described polishing composition.Typically, described sol particle is a water-soluble granular.For example, described sol particle can be any suitable water-soluble granular, for example is selected from the particle of following material: dextrin, cyclodextrin, sweet mellow wine, lactose, hydroxypropyl cellulose, methylcellulose, starch, protein, amorphous non-crosslinked polyvinyl alcohol, amorphous non-crosslinked PVP, polyacrylic acid, polyethylene glycol oxide, water soluble light-sensitive resin, sulfonation polyisoprene and sulfonation polyisoprene copolymers.Described sol particle also can be the water-soluble inorganic particle, for example is selected from the particle of following material: potassium acetate, potassium nitrate, potash, saleratus, potassium chloride, KBr, potassium phosphate, magnesium nitrate, calcium carbonate and Sodium Benzoate.When described sol particle was dissolved, described translucent window can stay the perforate corresponding to the size of described sol particle.
In execution mode, described translucent insert comprises first thermoplastic polymer and second thermoplastic polymer, and wherein said first and second thermoplastic polymers are immiscible and form different phases in described translucent insert.The refractive index of described translucent insert depends on the refractive index of employed described thermoplastic polymer in it forms and their relative quantity, and can change based on above-mentioned parameter.
Described translucent insert can be any suitable shape, size or structure.For example, described translucent insert can have circle, ellipse, rectangle or foursquare shape.When described translucent insert was ellipse or rectangular shape, described insert typically had the maximum length of 3cm-8cm.When described translucent insert was circle or square shape, described translucent insert typically had diameter or the width of 1cm-4cm.Described translucent insert typically has the thickness of 0.1cm-5cm (for example, 0.1cm-3cm or 0.1cm-1cm).
Described polishing pad can comprise the translucent insert of any right quantity.Described translucent insert can be arranged on any correct position of described polishing pad main body.
In execution mode, described polishing pad further comprises the wear indicator that is arranged in described regional transmission.The endpoint signal that described wear indicator conforms with desirably being produced by polissoir transforms to provide preparation described polishing pad to be changed to the notice of new polishing pad.The window wear indicator typically is incorporated in the pit areas of described pad, between described pit areas and described translucent insert.The non-limiting example of suitable wear indicator comprises painted thermoplastic carbamate (polyurethane) layer, thermoplastic carbamate's layer of polarization, the thermoplastic carbamate's layer that comprises fluorescer, the polymeric layer with unique transmittance performance, oxide layer, comprise the polymer of thermochromic dye, be used for the moisture marker and the wavelength filter course of detection window leak.Fig. 4 has described the execution mode of polishing pad of the present invention, and described polishing pad comprises the relative translucent insert 20 and 40 that is incorporated in the polishing pad main body 10, and wherein wear indicator 50 is between translucent insert 20 and polishing pad 10.Subpad 30 is fixed on the bottom surface of polishing pad 10.
When comprising, described polishing pad is disposed opposite to each other and when being incorporated into two translucent inserts in first and second pits on the relative face that is formed on described polishing pad main body, be incorporated in the described polishing pad back side described translucent insert can with the back side copline of described polishing pad, recessed from the back side of described polishing pad, perhaps, the extensible back side that exceeds described polishing pad.The translucent insert that extends beyond the back side of described polishing pad is depicted among Fig. 5.The first translucent insert 20 be incorporated in first pit on the polished surface of polishing pad main body 10 and with described polished surface copline, and the second translucent insert 40 is incorporated in the second relative pit on the bottom surface of described polishing pad main body 10 and extends beyond the bottom surface of polishing pad main body 10.In use, compressing described fixing subpad 30 by the pressing plate (not shown) allows described pressing plate that the described second translucent insert 40 is exerted pressure.The pressure that is applied to the described second translucent insert 40 is passed to the described first translucent insert 20, and can help to prevent to form air bag between the first translucent insert 20 and the substrate that polishing.
As shown in Fig. 1,2,4 and 5, can use or randomly can be used as one deck of multiple-level stack polishing pad separately according to polishing pad of the present invention.For example, polishing pad of the present invention can be used in combination with subpad.Described subpad can be any suitable subpad.Suitable subpad comprises polyurethane foam subpad, impregnated felt subpad, microvoid polyurethane subpad or sintering carbamate subpad.Described subpad is typically soft and therefore more compressible than described polishing pad than the present invention polishing pad.In some embodiments, described subpad is harder and not too compressible than described polishing pad.Described subpad comprises at least one window or the hole of the regional transmission that is used for exposing described polishing pad.Described subpad randomly comprises groove, passage, hollow bulb and grades.When polishing pad of the present invention and subpad are used in combination, typically exist and described polishing pad and described subpad is coextensive stretches and the middle back sheet between them, for example, the PETG film.
Polishing pad of the present invention has polished surface, and described polished surface randomly further comprises groove, passage and/or the perforation that promotes the lateral transfer of polishing composition on pad interface.Such groove, passage or perforation can have any suitable pattern, and can have any proper depth and width.Described polishing pad can have two or more different channel patterns.For example, can use the combination of big groove and minor groove.Described groove can be the form of inclined groove, concentric groove, spirality or circular groove, XY cross-hatched line pattern, and can be continuous or discrete on connectedness.Preferably, described polishing pad has the polished surface that comprises the minor groove that produces by the standard pad method for trimming at least.Typically, described translucent window does not dispose same trench, passage and/or the perforation that is used for described polishing pad.
The present invention further provides the method for polishing substrate, described method comprises: polished substrate (i) is provided, the at least a portion that described substrate is contacted with the polishing system that comprises polishing pad of the present invention as herein described and polishing composition and (iii) use the worn described substrate of described polishing system is to polish described substrate.
Described polishing composition can be any suitable polishing composition.Described polishing composition typically comprises aqueous carrier, pH conditioning agent and optional grinding agent.Depend on the workpiece type of polishing, described polishing composition randomly can further comprise oxidant, organic acid, complexing agent, pH buffer, surfactant, corrosion inhibitor, defoamer etc.
Following examples further illustrate the present invention, limit its scope by any way but should not be construed as certainly.
Embodiment 1
This embodiment has proved that the textured pattern of translucent insert is to the influence of laser by the transmission percentage of polishing pad regional transmission of the present invention.
By (Aurora IL) cuts and uses router to form pit on the polished surface side and prepares sample for D-200, Cabot Microelectronics with cellular polyurethane foams polishing pad.Described pit is that 30 mils are dark and form rectangle (oblong).Described polishing pad sheet material is the 53-56 mil thick.
Prepared the translucent insert of thermoplastic polyurethane, on the surface of this translucent insert, be formed with different textured patterns with Shore D hardness of 55.Use the aluminum instrument of patterning to form described texture by the RF welding.By described aluminum tool surfaces is carried out laser engraving or is formed described pattern by chemical etching.(Carol Stream IL) makes described instrument pattern by Mold-Tech Inc..Then, by the RF welding, described translucent insert is incorporated into the regional transmission to be formed for testing in the pit that is formed in the described polishing pad sheet material.
Will be from the laser aiming of 655nm lasing light emitter by each regional transmission of testing.Use Newport light power meter (Newport Corporation, Irvine, CA) laser of detection transmission of model 1931-C.The results are shown in the table 1 of described test.When describing textured pattern, the pattern that has provided described Mold-Tech instrument is numbered as a reference.From described data as can be seen, depend on the pattern of selecting to be used for described translucent insert, can produce the transmission percentage values of wide region.Therefore therefore, can select the insert of different patternings, and in polishing pad, form different regional transmissions, to provide with so that be used to polish the transmission percentage of the optimized optimum of end point determination of application.
Table 1
| Pattern is described | The M-T numbering | Transmission percentage |
| No texture | N.A. | 44.5 |
| Sub-box | MT-11640 | 14.5 |
| The dimple pattern | MT-11605 | 8.9 |
| Anti-phase hexagon | MT-11610 | 3.0 |
| The hexagon pattern | MT-11600 | 2.5 |
| Big grid | MT-11475 | 1.4 |
| Random pattern | MT-11430 | 1.3 |
| Random pattern | MT-11570 | 2.8 |
| Random pattern | MT-11050 | 3.2 |
All lists of references (comprising publication, patent application and patent) of quoting herein are hereby incorporated by, its with reference to degree as each list of references by separately and specify to be incorporated herein by reference and each list of references is all set forth in this article.
In describing scope of the present invention (the particularly scope of claims), use term " " and " a kind of " and " being somebody's turn to do " and similar indicant to be understood to include odd number and plural number, unless explanation or the obvious contradiction of context are arranged in addition herein.Term " comprises ", " having ", " comprising " and " containing " be interpreted as open-ended term (that is, meaning " including, but are not limited to "), except as otherwise noted.Herein number range only enumerate the method for writing a Chinese character in simplified form that drops on each independent values in this scope as mentioning separately, unless explanation is arranged in addition, and in specification, introduce each independent values herein, just here enumerated separately as it.All methods described herein can any suitable order be carried out, unless this paper have in addition the explanation or with the obvious contradiction of context.Any and all examples that provide herein or exemplary language (as, " for example ") use only be used for illustrating better the present invention, rather than scope of the present invention is limited, except as otherwise noted.Do not have language to be understood that in the specification to be any non-claimed key element is indicated as be of the present invention put into practice necessary.
Preferred implementation of the present invention has been described herein, comprise the inventor known carry out optimal mode of the present invention.By reading above-mentioned specification, it is distinct that the variation of those preferred implementations will become for the person of ordinary skill of the art.The inventor wishes that the technical staff suitably adopts this variation, and the inventor wishes that the present invention puts into practice with being different from the specifically described mode of this paper.Therefore, the present invention includes applicable law and allowed, all modifications and the equivalent of cited theme in the appended claims.In addition, its combination in any of the above-mentioned key element in might changing comprise in the present invention, unless this paper have in addition explanation or with the obvious contradiction of context.
Claims (20)
1. the polishing pad that comprises the optical transmission zone, wherein, described polishing pad comprises: the polishing pad main body that (a) comprises first area and second area, wherein said first area is opaque, wherein said second area is an optical transmission, wherein said second area has at least one pit that is formed at wherein, and (b) being incorporated at least one translucent insert in described at least one pit, wherein said polishing pad main body comprises first porous material and described at least one translucent insert comprises second porous material that is different from described first porous material.
2. the polishing pad of claim 1, wherein said polishing pad main body comprises first thermoplastic polymer and described at least one translucent insert comprises second thermoplastic polymer that is different from described first thermoplastic polymer.
3. the polishing pad of claim 1, wherein said translucent insert comprises first thermoplastic polymer and second thermoplastic polymer, is immiscible with wherein said first and second thermoplastic polymers and forms different phases in described translucent window.
4. the polishing pad of claim 1, wherein said translucent insert further comprises the particle of the material that is different from described second porous material.
5. the polishing pad of claim 4, wherein said particle comprise can be water-soluble material.
6. the polishing pad of claim 1, wherein said translucent insert has the voidage of 0.1%-10%.
7. the polishing pad of claim 1, wherein said translucent insert has the polished surface that has texture.
8. the polishing pad of claim 1, wherein said second area has first pit and second pit that is formed at wherein, have the first translucent insert and described second pit that are incorporated into wherein with wherein said first pit and have the second translucent insert that is incorporated into wherein.
9. the surface that the polishing pad of claim 8, the surface that wherein comprises the described polishing pad main body of described second pit define plane and the wherein said second translucent insert basically with described plane copline.
10. the polishing pad of claim 8, the surface that the surface that wherein comprises the described polishing pad main body of described second pit defines plane and the wherein said second translucent insert extends beyond described plane.
11. have the preparation method of the polishing pad in optical transmission zone, may further comprise the steps:
(a) provide the polishing pad main body, wherein said polishing pad main body comprises first porous material,
(b) in described polishing pad main body, form at least one pit,
(c) provide at least one translucent insert, wherein said translucent insert comprise second porous material that is different from described first porous material and
(d) described at least one translucent insert is attached to described pit so that the polishing pad with at least one optical transmission zone to be provided.
12. the method for claim 11, wherein said polishing pad main body comprise first thermoplastic polymer and described at least one translucent insert comprises second thermoplastic polymer that is different from described first thermoplastic polymer.
13. the method for claim 11, wherein said translucent insert comprises first thermoplastic polymer and second thermoplastic polymer, is immiscible with wherein said first and second thermoplastic polymers and forms different phases in described translucent insert.
14. the method for claim 11, wherein said translucent insert further comprises the particle of the material that is different from described second porous material.
15. the method for claim 11 wherein, before described translucent insert is attached to described pit, forms described translucent insert.
16. the method for claim 11 is wherein by the described translucent insert of following formation: the precursor of described translucent insert is positioned in the described pit, then, described precursor conversion is become described translucent insert.
17. comprising, the method for claim 11, the step that wherein forms pit in described polishing pad main body use the energy input that is selected from pressurization, heating, radio-frequency radiation, ultrasonic bonding and their combination.
18. the method for claim 11, the step that wherein forms pit in described polishing pad main body comprises the use router.
19. the method for claim 11, wherein the step that described at least one translucent insert is attached to described pit comprises that use is selected from the energy input of solvent bonding, pressurization, heating, radio-frequency radiation, ultrasonic bonding and their combination.
20. the method for claim 11, wherein said translucent insert has the polished surface that has texture.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41501510P | 2010-11-18 | 2010-11-18 | |
| US61/415,015 | 2010-11-18 | ||
| PCT/US2011/061312 WO2012068428A2 (en) | 2010-11-18 | 2011-11-18 | Polishing pad comprising transmissive region |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103222034A true CN103222034A (en) | 2013-07-24 |
| CN103222034B CN103222034B (en) | 2016-03-09 |
Family
ID=46084662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180055788.0A Expired - Fee Related CN103222034B (en) | 2010-11-18 | 2011-11-18 | Comprise the polishing pad of regional transmission |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20130237136A1 (en) |
| EP (1) | EP2641268A4 (en) |
| JP (1) | JP5918254B2 (en) |
| KR (1) | KR101602544B1 (en) |
| CN (1) | CN103222034B (en) |
| MY (1) | MY166716A (en) |
| SG (1) | SG190249A1 (en) |
| WO (1) | WO2012068428A2 (en) |
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| CN111823140A (en) * | 2019-04-15 | 2020-10-27 | 株式会社迪思科 | Dressing tool |
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| KR101829542B1 (en) * | 2016-07-27 | 2018-02-23 | 신우유니온(주) | Manufacturing method of buffer for nails |
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| JP7220130B2 (en) * | 2019-07-11 | 2023-02-09 | 株式会社クラレ | Polishing pad and polishing pad manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20190056335A (en) * | 2017-11-16 | 2019-05-24 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Polishing pad with multipurpose composite window |
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| CN109794849B (en) * | 2017-11-16 | 2021-12-21 | 罗门哈斯电子材料Cmp控股股份有限公司 | Polishing pad with pad wear indicator |
| KR102600819B1 (en) | 2017-11-16 | 2023-11-10 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Polishing pad with multipurpose composite window |
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| CN111823140A (en) * | 2019-04-15 | 2020-10-27 | 株式会社迪思科 | Dressing tool |
| CN111823140B (en) * | 2019-04-15 | 2024-02-20 | 株式会社迪思科 | Dressing tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013542863A (en) | 2013-11-28 |
| KR20130116892A (en) | 2013-10-24 |
| EP2641268A4 (en) | 2017-01-25 |
| SG190249A1 (en) | 2013-06-28 |
| KR101602544B1 (en) | 2016-03-10 |
| WO2012068428A3 (en) | 2012-08-16 |
| MY166716A (en) | 2018-07-18 |
| JP5918254B2 (en) | 2016-05-18 |
| WO2012068428A2 (en) | 2012-05-24 |
| CN103222034B (en) | 2016-03-09 |
| EP2641268A2 (en) | 2013-09-25 |
| US20130237136A1 (en) | 2013-09-12 |
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