CN103210041B - 热固化型有机硅树脂组合物、以及使用该组合物而得的含有有机硅树脂的结构体和光半导体元件密封体 - Google Patents

热固化型有机硅树脂组合物、以及使用该组合物而得的含有有机硅树脂的结构体和光半导体元件密封体 Download PDF

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CN103210041B
CN103210041B CN201180054196.7A CN201180054196A CN103210041B CN 103210041 B CN103210041 B CN 103210041B CN 201180054196 A CN201180054196 A CN 201180054196A CN 103210041 B CN103210041 B CN 103210041B
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acid
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formula
enumerate
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CN103210041A (zh
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武井吉仁
石川和宪
斋木丈章
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Yokohama Rubber Co Ltd
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    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
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    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/4809—Loop shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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CN201180054196.7A 2010-11-10 2011-11-08 热固化型有机硅树脂组合物、以及使用该组合物而得的含有有机硅树脂的结构体和光半导体元件密封体 Expired - Fee Related CN103210041B (zh)

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JP2010251966 2010-11-10
JP2010-251966 2010-11-10
PCT/JP2011/075727 WO2012063822A1 (ja) 2010-11-10 2011-11-08 熱硬化型シリコーン樹脂組成物、ならびに、これを用いて得られるシリコーン樹脂含有構造体および光半導体素子封止体

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WO2014119907A1 (en) * 2013-01-31 2014-08-07 Kolon Industries, Inc. Silicone resin and method of preparing the same
MY170153A (en) * 2013-08-01 2019-07-09 Daicel Corp Curable resin composition and semiconductor device using same
JP5736525B1 (ja) * 2013-08-02 2015-06-17 株式会社ダイセル 硬化性樹脂組成物及びそれを用いた半導体装置
KR101631048B1 (ko) * 2013-08-06 2016-06-15 주식회사 다이셀 경화성 수지 조성물 및 그것을 사용한 반도체 장치
JP6803539B2 (ja) * 2016-08-23 2020-12-23 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
CN111072712A (zh) * 2019-12-23 2020-04-28 东莞市贝特利新材料有限公司 一种有机硅增粘剂及其制备方法和高透明自粘性加成型有机硅橡胶组合物
CN113337245B (zh) * 2021-07-26 2022-03-25 深圳市希顺有机硅科技有限公司 一种脱醇型光伏组件密封胶及其制备方法
CN115627120B (zh) * 2022-10-26 2023-06-16 深圳市华思电子科技有限公司 一种单组份无溶剂加成型有机硅三防涂料

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CA2499782A1 (en) * 2005-03-07 2006-09-07 Queen's University At Kingston Sol gel functionalized silicate catalyst and scavenger
US8076411B2 (en) * 2005-04-06 2011-12-13 Dow Corning Corporation Organosiloxane compositions
JP5444631B2 (ja) * 2007-04-06 2014-03-19 横浜ゴム株式会社 光半導体素子封止用組成物、その硬化物および光半導体素子封止体
JP4877381B2 (ja) * 2008-12-16 2012-02-15 横浜ゴム株式会社 シラノール縮合触媒、加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体

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JP5045861B2 (ja) 2012-10-10
TW201237105A (en) 2012-09-16
TWI540183B (zh) 2016-07-01
CN103210041A (zh) 2013-07-17
KR20130034666A (ko) 2013-04-05
WO2012063822A1 (ja) 2012-05-18

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