CN103199110A - 一种nldmos器件及其制造方法 - Google Patents
一种nldmos器件及其制造方法 Download PDFInfo
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- CN103199110A CN103199110A CN2012100051201A CN201210005120A CN103199110A CN 103199110 A CN103199110 A CN 103199110A CN 2012100051201 A CN2012100051201 A CN 2012100051201A CN 201210005120 A CN201210005120 A CN 201210005120A CN 103199110 A CN103199110 A CN 103199110A
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CN201210005120.1A CN103199110B (zh) | 2012-01-09 | 2012-01-09 | 一种nldmos器件及其制造方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110235238A (zh) * | 2017-02-02 | 2019-09-13 | 索泰克公司 | 用于射频应用的结构 |
CN113764502A (zh) * | 2020-06-02 | 2021-12-07 | 芯恩(青岛)集成电路有限公司 | 一种ldmos半导体器件及其制造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101877315A (zh) * | 2009-04-29 | 2010-11-03 | 上海华虹Nec电子有限公司 | 提高ldmos器件的崩溃电压的方法 |
CN102054864A (zh) * | 2009-11-05 | 2011-05-11 | 上海华虹Nec电子有限公司 | Ldmos及其制造方法 |
CN102097471A (zh) * | 2009-12-04 | 2011-06-15 | 美格纳半导体有限会社 | 半导体器件 |
KR20110078947A (ko) * | 2009-12-31 | 2011-07-07 | 주식회사 동부하이텍 | 반도체 소자 및 그의 제조방법 |
CN102122668A (zh) * | 2010-01-11 | 2011-07-13 | 世界先进积体电路股份有限公司 | 半导体结构及其制造方法 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101877315A (zh) * | 2009-04-29 | 2010-11-03 | 上海华虹Nec电子有限公司 | 提高ldmos器件的崩溃电压的方法 |
CN102054864A (zh) * | 2009-11-05 | 2011-05-11 | 上海华虹Nec电子有限公司 | Ldmos及其制造方法 |
CN102097471A (zh) * | 2009-12-04 | 2011-06-15 | 美格纳半导体有限会社 | 半导体器件 |
KR20110078947A (ko) * | 2009-12-31 | 2011-07-07 | 주식회사 동부하이텍 | 반도체 소자 및 그의 제조방법 |
CN102122668A (zh) * | 2010-01-11 | 2011-07-13 | 世界先进积体电路股份有限公司 | 半导体结构及其制造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110235238A (zh) * | 2017-02-02 | 2019-09-13 | 索泰克公司 | 用于射频应用的结构 |
CN110235238B (zh) * | 2017-02-02 | 2023-08-29 | 索泰克公司 | 用于射频应用的结构 |
CN113764502A (zh) * | 2020-06-02 | 2021-12-07 | 芯恩(青岛)集成电路有限公司 | 一种ldmos半导体器件及其制造方法 |
CN113764502B (zh) * | 2020-06-02 | 2024-05-31 | 芯恩(青岛)集成电路有限公司 | 一种ldmos半导体器件及其制造方法 |
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CN103199110B (zh) | 2015-10-14 |
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