CN103180783B - 制备高分辨率、耐溶剂、弹性体薄印刷板的方法 - Google Patents

制备高分辨率、耐溶剂、弹性体薄印刷板的方法 Download PDF

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Publication number
CN103180783B
CN103180783B CN201180050963.7A CN201180050963A CN103180783B CN 103180783 B CN103180783 B CN 103180783B CN 201180050963 A CN201180050963 A CN 201180050963A CN 103180783 B CN103180783 B CN 103180783B
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CN
China
Prior art keywords
layer
polymer
styrene
polymer layer
polymeric
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Expired - Fee Related
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CN201180050963.7A
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English (en)
Chinese (zh)
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CN103180783A (zh
Inventor
G·D·杰科克斯
G·B·布朗谢特
N·G·塔西
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EIDP Inc
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EI Du Pont de Nemours and Co
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Publication of CN103180783A publication Critical patent/CN103180783A/zh
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Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0015—Production of aperture devices, microporous systems or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
CN201180050963.7A 2010-09-01 2011-09-01 制备高分辨率、耐溶剂、弹性体薄印刷板的方法 Expired - Fee Related CN103180783B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/873,584 US8541162B2 (en) 2010-09-01 2010-09-01 High resolution, solvent resistant, thin elastomeric printing plates
US12/873,584 2010-09-01
PCT/US2011/050119 WO2012031058A2 (en) 2010-09-01 2011-09-01 High resolution, solvent resistant, thin elastomeric printing plates

Publications (2)

Publication Number Publication Date
CN103180783A CN103180783A (zh) 2013-06-26
CN103180783B true CN103180783B (zh) 2016-06-22

Family

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CN201180050963.7A Expired - Fee Related CN103180783B (zh) 2010-09-01 2011-09-01 制备高分辨率、耐溶剂、弹性体薄印刷板的方法

Country Status (7)

Country Link
US (2) US8541162B2 (https=)
EP (1) EP2612202B1 (https=)
JP (1) JP5902689B2 (https=)
KR (1) KR20130102063A (https=)
CN (1) CN103180783B (https=)
TW (1) TW201216797A (https=)
WO (1) WO2012031058A2 (https=)

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US8715906B2 (en) * 2008-12-12 2014-05-06 E I Du Pont De Nemours And Company High resolution, solvent resistant, thin elastomeric printing plates
US8563220B2 (en) 2010-09-01 2013-10-22 E I Du Pont De Nemours And Company High resolution, solvent resistant, thin elastomeric printing plates
US20130152808A1 (en) * 2010-12-29 2013-06-20 Robert D. Kross Printing plate for monotype prints having viscoelastic gels and method for its use
WO2014133507A1 (en) * 2013-02-27 2014-09-04 Poly-Gel Llc Printing plate for monotype prints having viscoelastic gels and method for its use
CN105899557B (zh) 2013-12-06 2018-10-26 株式会社Lg化学 嵌段共聚物
CN105934454B (zh) 2013-12-06 2019-01-18 株式会社Lg化学 嵌段共聚物
CN105873969B (zh) 2013-12-06 2018-09-04 株式会社Lg化学 嵌段共聚物
CN105980342B (zh) 2013-12-06 2019-02-15 株式会社Lg化学 单体和嵌段共聚物
CN105934455B (zh) 2013-12-06 2019-01-18 株式会社Lg化学 嵌段共聚物
US10239980B2 (en) 2013-12-06 2019-03-26 Lg Chem, Ltd. Block copolymer
JP6483693B2 (ja) 2013-12-06 2019-03-13 エルジー・ケム・リミテッド ブロック共重合体
US10202480B2 (en) 2013-12-06 2019-02-12 Lg Chem, Ltd. Block copolymer
EP3101043B1 (en) 2013-12-06 2021-01-27 LG Chem, Ltd. Block copolymer
CN105916904B (zh) 2013-12-06 2018-11-09 株式会社Lg化学 嵌段共聚物
US10227436B2 (en) 2013-12-06 2019-03-12 Lg Chem, Ltd. Block copolymer
WO2015084133A1 (ko) 2013-12-06 2015-06-11 주식회사 엘지화학 블록 공중합체
US10087276B2 (en) 2013-12-06 2018-10-02 Lg Chem, Ltd. Block copolymer
JP6496318B2 (ja) 2013-12-06 2019-04-03 エルジー・ケム・リミテッド ブロック共重合体
EP3202798B1 (en) 2014-09-30 2022-01-12 LG Chem, Ltd. Block copolymer
WO2016052994A1 (ko) 2014-09-30 2016-04-07 주식회사 엘지화학 블록 공중합체
JP6538159B2 (ja) 2014-09-30 2019-07-03 エルジー・ケム・リミテッド ブロック共重合体
WO2016053007A1 (ko) 2014-09-30 2016-04-07 주식회사 엘지화학 패턴화 기판의 제조 방법
EP3202802B1 (en) 2014-09-30 2022-11-23 LG Chem, Ltd. Block copolymer
JP6524220B2 (ja) 2014-09-30 2019-06-05 エルジー・ケム・リミテッド ブロック共重合体
EP3203496B1 (en) 2014-09-30 2021-12-29 LG Chem, Ltd. Method for producing patterned substrate
WO2016053000A1 (ko) 2014-09-30 2016-04-07 주식회사 엘지화학 블록 공중합체
WO2016053011A1 (ko) 2014-09-30 2016-04-07 주식회사 엘지화학 블록 공중합체
CN107075054B (zh) 2014-09-30 2020-05-05 株式会社Lg化学 嵌段共聚物
KR102412137B1 (ko) * 2016-09-23 2022-06-23 에스케이이노베이션 주식회사 블록 공중합체를 이용한 미세 패턴의 형성 방법
WO2022173000A1 (ja) * 2021-02-10 2022-08-18 旭化成株式会社 フレキソ印刷原版、フレキソ印刷版及びフレキソ印刷版の製造方法

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JPH0232355A (ja) * 1988-07-20 1990-02-02 Konica Corp 湿し水不要平版印刷版材料
JP2643475B2 (ja) 1989-09-27 1997-08-20 三菱マテリアル株式会社 撥水、撥油性を有する光硬化樹脂
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Also Published As

Publication number Publication date
EP2612202B1 (en) 2019-05-15
US20140011137A1 (en) 2014-01-09
TW201216797A (en) 2012-04-16
US8541162B2 (en) 2013-09-24
KR20130102063A (ko) 2013-09-16
JP5902689B2 (ja) 2016-04-13
EP2612202A2 (en) 2013-07-10
JP2013538147A (ja) 2013-10-10
US20120052446A1 (en) 2012-03-01
WO2012031058A2 (en) 2012-03-08
US8877428B2 (en) 2014-11-04
CN103180783A (zh) 2013-06-26
WO2012031058A3 (en) 2012-06-28

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Granted publication date: 20160622

Termination date: 20200901