KR20130102063A - 고해상도, 내용매성의 얇은 탄성중합체 인쇄 플레이트를 제조하는 방법 - Google Patents
고해상도, 내용매성의 얇은 탄성중합체 인쇄 플레이트를 제조하는 방법 Download PDFInfo
- Publication number
- KR20130102063A KR20130102063A KR1020137008050A KR20137008050A KR20130102063A KR 20130102063 A KR20130102063 A KR 20130102063A KR 1020137008050 A KR1020137008050 A KR 1020137008050A KR 20137008050 A KR20137008050 A KR 20137008050A KR 20130102063 A KR20130102063 A KR 20130102063A
- Authority
- KR
- South Korea
- Prior art keywords
- styrene
- polymer
- polymer layer
- layer
- elastomeric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 59
- 239000002904 solvent Substances 0.000 title description 4
- 229920000642 polymer Polymers 0.000 claims abstract description 179
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 42
- 125000003709 fluoroalkyl group Chemical group 0.000 claims abstract description 30
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 48
- 239000000178 monomer Substances 0.000 claims description 47
- 239000000203 mixture Substances 0.000 claims description 39
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 34
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 claims description 29
- 229920001400 block copolymer Polymers 0.000 claims description 29
- 239000003999 initiator Substances 0.000 claims description 26
- 238000004132 cross linking Methods 0.000 claims description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 25
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 19
- 229920006037 cross link polymer Polymers 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 18
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 11
- 238000003384 imaging method Methods 0.000 claims description 8
- 238000009736 wetting Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 176
- 239000000976 ink Substances 0.000 description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 20
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 17
- 239000000243 solution Substances 0.000 description 17
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 15
- 239000000126 substance Substances 0.000 description 15
- 229920001577 copolymer Polymers 0.000 description 14
- 239000010408 film Substances 0.000 description 14
- 239000000047 product Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- 239000000806 elastomer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 7
- HYQASEVIBPSPMK-UHFFFAOYSA-N 12-(2-methylprop-2-enoyloxy)dodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCOC(=O)C(C)=C HYQASEVIBPSPMK-UHFFFAOYSA-N 0.000 description 6
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 6
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 6
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 6
- 239000003504 photosensitizing agent Substances 0.000 description 6
- 238000009472 formulation Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 4
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 229920002633 Kraton (polymer) Polymers 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 238000007385 chemical modification Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 229940057404 di-(4-tert-butylcyclohexyl)peroxydicarbonate Drugs 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- -1 polydimethylsiloxane Polymers 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- LVJZCPNIJXVIAT-UHFFFAOYSA-N 1-ethenyl-2,3,4,5,6-pentafluorobenzene Chemical compound FC1=C(F)C(F)=C(C=C)C(F)=C1F LVJZCPNIJXVIAT-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- DCUFMVPCXCSVNP-UHFFFAOYSA-N methacrylic anhydride Chemical compound CC(=C)C(=O)OC(=O)C(C)=C DCUFMVPCXCSVNP-UHFFFAOYSA-N 0.000 description 2
- 239000012074 organic phase Substances 0.000 description 2
- BSCHIACBONPEOB-UHFFFAOYSA-N oxolane;hydrate Chemical compound O.C1CCOC1 BSCHIACBONPEOB-UHFFFAOYSA-N 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- AQQBRCXWZZAFOK-UHFFFAOYSA-N 2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-pentadecafluorooctanoyl chloride Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(Cl)=O AQQBRCXWZZAFOK-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 229920001600 hydrophobic polymer Polymers 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 238000002174 soft lithography Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Printing Plates And Materials Therefor (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Laminated Bodies (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/873,584 US8541162B2 (en) | 2010-09-01 | 2010-09-01 | High resolution, solvent resistant, thin elastomeric printing plates |
| US12/873,584 | 2010-09-01 | ||
| PCT/US2011/050119 WO2012031058A2 (en) | 2010-09-01 | 2011-09-01 | High resolution, solvent resistant, thin elastomeric printing plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130102063A true KR20130102063A (ko) | 2013-09-16 |
Family
ID=44674878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137008050A Withdrawn KR20130102063A (ko) | 2010-09-01 | 2011-09-01 | 고해상도, 내용매성의 얇은 탄성중합체 인쇄 플레이트를 제조하는 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8541162B2 (https=) |
| EP (1) | EP2612202B1 (https=) |
| JP (1) | JP5902689B2 (https=) |
| KR (1) | KR20130102063A (https=) |
| CN (1) | CN103180783B (https=) |
| TW (1) | TW201216797A (https=) |
| WO (1) | WO2012031058A2 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8715906B2 (en) * | 2008-12-12 | 2014-05-06 | E I Du Pont De Nemours And Company | High resolution, solvent resistant, thin elastomeric printing plates |
| US8563220B2 (en) | 2010-09-01 | 2013-10-22 | E I Du Pont De Nemours And Company | High resolution, solvent resistant, thin elastomeric printing plates |
| US20130152808A1 (en) * | 2010-12-29 | 2013-06-20 | Robert D. Kross | Printing plate for monotype prints having viscoelastic gels and method for its use |
| WO2014133507A1 (en) * | 2013-02-27 | 2014-09-04 | Poly-Gel Llc | Printing plate for monotype prints having viscoelastic gels and method for its use |
| CN105899557B (zh) | 2013-12-06 | 2018-10-26 | 株式会社Lg化学 | 嵌段共聚物 |
| CN105934454B (zh) | 2013-12-06 | 2019-01-18 | 株式会社Lg化学 | 嵌段共聚物 |
| CN105873969B (zh) | 2013-12-06 | 2018-09-04 | 株式会社Lg化学 | 嵌段共聚物 |
| CN105980342B (zh) | 2013-12-06 | 2019-02-15 | 株式会社Lg化学 | 单体和嵌段共聚物 |
| CN105934455B (zh) | 2013-12-06 | 2019-01-18 | 株式会社Lg化学 | 嵌段共聚物 |
| US10239980B2 (en) | 2013-12-06 | 2019-03-26 | Lg Chem, Ltd. | Block copolymer |
| JP6483693B2 (ja) | 2013-12-06 | 2019-03-13 | エルジー・ケム・リミテッド | ブロック共重合体 |
| US10202480B2 (en) | 2013-12-06 | 2019-02-12 | Lg Chem, Ltd. | Block copolymer |
| EP3101043B1 (en) | 2013-12-06 | 2021-01-27 | LG Chem, Ltd. | Block copolymer |
| CN105916904B (zh) | 2013-12-06 | 2018-11-09 | 株式会社Lg化学 | 嵌段共聚物 |
| US10227436B2 (en) | 2013-12-06 | 2019-03-12 | Lg Chem, Ltd. | Block copolymer |
| WO2015084133A1 (ko) | 2013-12-06 | 2015-06-11 | 주식회사 엘지화학 | 블록 공중합체 |
| US10087276B2 (en) | 2013-12-06 | 2018-10-02 | Lg Chem, Ltd. | Block copolymer |
| JP6496318B2 (ja) | 2013-12-06 | 2019-04-03 | エルジー・ケム・リミテッド | ブロック共重合体 |
| EP3202798B1 (en) | 2014-09-30 | 2022-01-12 | LG Chem, Ltd. | Block copolymer |
| WO2016052994A1 (ko) | 2014-09-30 | 2016-04-07 | 주식회사 엘지화학 | 블록 공중합체 |
| JP6538159B2 (ja) | 2014-09-30 | 2019-07-03 | エルジー・ケム・リミテッド | ブロック共重合体 |
| WO2016053007A1 (ko) | 2014-09-30 | 2016-04-07 | 주식회사 엘지화학 | 패턴화 기판의 제조 방법 |
| EP3202802B1 (en) | 2014-09-30 | 2022-11-23 | LG Chem, Ltd. | Block copolymer |
| JP6524220B2 (ja) | 2014-09-30 | 2019-06-05 | エルジー・ケム・リミテッド | ブロック共重合体 |
| EP3203496B1 (en) | 2014-09-30 | 2021-12-29 | LG Chem, Ltd. | Method for producing patterned substrate |
| WO2016053000A1 (ko) | 2014-09-30 | 2016-04-07 | 주식회사 엘지화학 | 블록 공중합체 |
| WO2016053011A1 (ko) | 2014-09-30 | 2016-04-07 | 주식회사 엘지화학 | 블록 공중합체 |
| CN107075054B (zh) | 2014-09-30 | 2020-05-05 | 株式会社Lg化学 | 嵌段共聚物 |
| KR102412137B1 (ko) * | 2016-09-23 | 2022-06-23 | 에스케이이노베이션 주식회사 | 블록 공중합체를 이용한 미세 패턴의 형성 방법 |
| WO2022173000A1 (ja) * | 2021-02-10 | 2022-08-18 | 旭化成株式会社 | フレキソ印刷原版、フレキソ印刷版及びフレキソ印刷版の製造方法 |
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| US4264705A (en) | 1979-12-26 | 1981-04-28 | Uniroyal, Inc. | Multilayered elastomeric printing plate |
| JPH0232355A (ja) * | 1988-07-20 | 1990-02-02 | Konica Corp | 湿し水不要平版印刷版材料 |
| JP2643475B2 (ja) | 1989-09-27 | 1997-08-20 | 三菱マテリアル株式会社 | 撥水、撥油性を有する光硬化樹脂 |
| US5804353A (en) * | 1992-05-11 | 1998-09-08 | E. I. Dupont De Nemours And Company | Lasers engravable multilayer flexographic printing element |
| EP0665469A3 (en) | 1994-01-28 | 1996-02-21 | Minnesota Mining & Mfg | Flexographic plate with several layers. |
| GB9516723D0 (en) * | 1995-08-15 | 1995-10-18 | Horsell Plc | Water-less lithographic plates |
| WO1998013730A1 (en) | 1996-09-27 | 1998-04-02 | Minnesota Mining And Manufacturing Company | Multilayer flexographic printing plate |
| JPH1195431A (ja) * | 1997-09-18 | 1999-04-09 | Hitachi Chem Co Ltd | 感光性樹脂組成物、それを用いた樹脂膜の製造法及び物品 |
| KR100833743B1 (ko) * | 2004-06-11 | 2008-05-29 | 아사히 가세이 케미칼즈 가부시키가이샤 | 플렉소 인쇄판용 감광성 수지 |
| EP1782886A1 (en) | 2005-11-02 | 2007-05-09 | Sony Deutschland GmbH | A method of patterning molecules on a substrate using a micro-contact printing process |
| CN101099410B (zh) * | 2006-02-21 | 2011-12-21 | 株式会社村田制作所 | 压电发声体 |
| US20080000373A1 (en) | 2006-06-30 | 2008-01-03 | Maria Petrucci-Samija | Printing form precursor and process for preparing a stamp from the precursor |
| US8715906B2 (en) | 2008-12-12 | 2014-05-06 | E I Du Pont De Nemours And Company | High resolution, solvent resistant, thin elastomeric printing plates |
-
2010
- 2010-09-01 US US12/873,584 patent/US8541162B2/en not_active Expired - Fee Related
-
2011
- 2011-08-29 TW TW100130867A patent/TW201216797A/zh unknown
- 2011-09-01 WO PCT/US2011/050119 patent/WO2012031058A2/en not_active Ceased
- 2011-09-01 EP EP11760615.2A patent/EP2612202B1/en not_active Not-in-force
- 2011-09-01 KR KR1020137008050A patent/KR20130102063A/ko not_active Withdrawn
- 2011-09-01 CN CN201180050963.7A patent/CN103180783B/zh not_active Expired - Fee Related
- 2011-09-01 JP JP2013527301A patent/JP5902689B2/ja not_active Expired - Fee Related
-
2013
- 2013-09-04 US US14/017,976 patent/US8877428B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2612202B1 (en) | 2019-05-15 |
| CN103180783B (zh) | 2016-06-22 |
| US20140011137A1 (en) | 2014-01-09 |
| TW201216797A (en) | 2012-04-16 |
| US8541162B2 (en) | 2013-09-24 |
| JP5902689B2 (ja) | 2016-04-13 |
| EP2612202A2 (en) | 2013-07-10 |
| JP2013538147A (ja) | 2013-10-10 |
| US20120052446A1 (en) | 2012-03-01 |
| WO2012031058A2 (en) | 2012-03-08 |
| US8877428B2 (en) | 2014-11-04 |
| CN103180783A (zh) | 2013-06-26 |
| WO2012031058A3 (en) | 2012-06-28 |
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