CN103155203B - 具有封装的有机电子器件 - Google Patents
具有封装的有机电子器件 Download PDFInfo
- Publication number
- CN103155203B CN103155203B CN201180049430.7A CN201180049430A CN103155203B CN 103155203 B CN103155203 B CN 103155203B CN 201180049430 A CN201180049430 A CN 201180049430A CN 103155203 B CN103155203 B CN 103155203B
- Authority
- CN
- China
- Prior art keywords
- encapsulation layer
- organic
- layer
- functional unit
- inorganic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 63
- 239000010410 layer Substances 0.000 claims abstract description 108
- 238000000034 method Methods 0.000 claims abstract description 43
- 239000012044 organic layer Substances 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 230000015654 memory Effects 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 150000003384 small molecules Chemical class 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 6
- 230000008021 deposition Effects 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013086 organic photovoltaic Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10187219.0 | 2010-10-12 | ||
| EP10187219 | 2010-10-12 | ||
| PCT/IB2011/054407 WO2012049594A1 (en) | 2010-10-12 | 2011-10-06 | Organic electronic device with encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103155203A CN103155203A (zh) | 2013-06-12 |
| CN103155203B true CN103155203B (zh) | 2017-04-05 |
Family
ID=44860460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180049430.7A Active CN103155203B (zh) | 2010-10-12 | 2011-10-06 | 具有封装的有机电子器件 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9219246B2 (enExample) |
| EP (1) | EP2628201B1 (enExample) |
| JP (1) | JP6014593B2 (enExample) |
| KR (1) | KR101843028B1 (enExample) |
| CN (1) | CN103155203B (enExample) |
| BR (1) | BR112013008571B1 (enExample) |
| RU (1) | RU2575938C2 (enExample) |
| TW (1) | TW201222914A (enExample) |
| WO (1) | WO2012049594A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012222772B4 (de) * | 2012-12-11 | 2021-09-16 | Pictiva Displays International Limited | Organisches optoelektronisches Bauelement |
| CN103904249B (zh) * | 2012-12-25 | 2016-05-18 | 海洋王照明科技股份有限公司 | 有机电致发光器件及其制备方法 |
| KR102088203B1 (ko) * | 2013-10-01 | 2020-03-12 | 엘지디스플레이 주식회사 | 유기발광 표시장치 및 이의 제조방법 |
| DE102014101518A1 (de) * | 2014-02-07 | 2015-08-13 | Osram Oled Gmbh | Organisches optoelektronisches Bauelement und Verfahren zum Herstellen eines organischen optoelektronischen Bauelements |
| FR3021460B1 (fr) * | 2014-05-26 | 2017-03-10 | Astron Fiamm Safety | Dispositif comprenant au moins deux diodes electroluminescentes organiques |
| CN104241330B (zh) | 2014-09-05 | 2017-05-03 | 京东方科技集团股份有限公司 | 有机发光二极管显示装置及其制作方法 |
| CN105206764A (zh) * | 2015-08-20 | 2015-12-30 | 深圳市星火辉煌系统工程有限公司 | 一种oled显示器件的密封工艺 |
| US9812667B2 (en) | 2015-11-04 | 2017-11-07 | Microsoft Technology Licensing, Llc | Patterning of OLED display stacks |
| CN109155373B (zh) * | 2016-04-12 | 2021-02-02 | 株式会社Lg化学 | 封装膜 |
| CN110911382B (zh) * | 2018-09-14 | 2021-06-25 | 群创光电股份有限公司 | 天线装置 |
| CN109904341B (zh) * | 2019-01-31 | 2020-08-04 | 武汉华星光电半导体显示技术有限公司 | 一种oled显示面板及其制备方法 |
| CN110323358B (zh) * | 2019-07-11 | 2021-12-24 | 京东方科技集团股份有限公司 | 发光二极管及其制造方法和发光装置 |
| CN110429064B (zh) * | 2019-08-01 | 2020-11-10 | 武汉华星光电半导体显示技术有限公司 | 缓冲结构、显示面板及缓冲结构的制作方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395323A (zh) * | 2001-07-03 | 2003-02-05 | 株式会社半导体能源研究所 | 发光装置、制造发光装置的方法和电子设备 |
| CN101030628A (zh) * | 2005-09-07 | 2007-09-05 | 株式会社丰田自动织机 | 有机电致发光元件的制造方法 |
| CN101309531A (zh) * | 2007-04-23 | 2008-11-19 | 株式会社丰田自动织机 | 有机装置的制造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3537591B2 (ja) * | 1996-04-26 | 2004-06-14 | パイオニア株式会社 | 有機ｅｌディスプレイの製造方法 |
| US6274887B1 (en) * | 1998-11-02 | 2001-08-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method therefor |
| US6268695B1 (en) * | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| BE1012802A3 (fr) * | 1999-07-28 | 2001-03-06 | Cockerill Rech & Dev | Dispositif electroluminescent et son procede de fabrication. |
| JP3761843B2 (ja) * | 2001-07-03 | 2006-03-29 | 株式会社半導体エネルギー研究所 | 発光装置及び電子機器 |
| JP3775499B2 (ja) * | 2002-01-08 | 2006-05-17 | 株式会社リコー | 半導体装置及びその製造方法、並びにｄｃ−ｄｃコンバータ |
| JP2004014447A (ja) * | 2002-06-11 | 2004-01-15 | Sony Corp | 表示装置およびその製造方法 |
| JP2006502537A (ja) * | 2002-10-07 | 2006-01-19 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光ディスプレイの製造方法 |
| WO2004032573A1 (en) * | 2002-10-07 | 2004-04-15 | Koninklijke Philips Electronics N.V. | Method for manufacturing a light emitting display |
| JP2005266616A (ja) * | 2004-03-19 | 2005-09-29 | Hideki Matsumura | 光学的表示装置及びその製造方法 |
| JP4708360B2 (ja) * | 2004-10-29 | 2011-06-22 | パイオニア株式会社 | 有機エレクトロルミネセンス表示装置及びその製造方法 |
| JP2007080569A (ja) * | 2005-09-12 | 2007-03-29 | Toyota Industries Corp | 有機エレクトロルミネッセンス素子の製造方法 |
| JP4795779B2 (ja) * | 2005-11-09 | 2011-10-19 | 株式会社アルバック | 有機エレクトロルミネッセンス表示パネル |
| US8003999B2 (en) * | 2005-12-30 | 2011-08-23 | Samsung Mobile Display Co., Ltd. | Organic light emitting device |
| JP2008071561A (ja) * | 2006-09-13 | 2008-03-27 | Fuji Electric Holdings Co Ltd | 有機ｅｌ素子、および、有機ｅｌ素子の製造方法 |
| EP2144290A1 (en) * | 2008-07-08 | 2010-01-13 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Electronic device and method of manufacturing the same |
| FR2936651B1 (fr) * | 2008-09-30 | 2011-04-08 | Commissariat Energie Atomique | Dispositif optoelectronique organique et son procede d'encapsulation. |
-
2011
- 2011-10-06 WO PCT/IB2011/054407 patent/WO2012049594A1/en not_active Ceased
- 2011-10-06 KR KR1020137012212A patent/KR101843028B1/ko active Active
- 2011-10-06 RU RU2013121673/28A patent/RU2575938C2/ru active
- 2011-10-06 EP EP11773566.2A patent/EP2628201B1/en active Active
- 2011-10-06 BR BR112013008571-1A patent/BR112013008571B1/pt active IP Right Grant
- 2011-10-06 US US13/877,689 patent/US9219246B2/en active Active
- 2011-10-06 JP JP2013533301A patent/JP6014593B2/ja active Active
- 2011-10-06 CN CN201180049430.7A patent/CN103155203B/zh active Active
- 2011-10-11 TW TW100136809A patent/TW201222914A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395323A (zh) * | 2001-07-03 | 2003-02-05 | 株式会社半导体能源研究所 | 发光装置、制造发光装置的方法和电子设备 |
| CN101030628A (zh) * | 2005-09-07 | 2007-09-05 | 株式会社丰田自动织机 | 有机电致发光元件的制造方法 |
| CN101309531A (zh) * | 2007-04-23 | 2008-11-19 | 株式会社丰田自动织机 | 有机装置的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6014593B2 (ja) | 2016-10-25 |
| BR112013008571A2 (pt) | 2019-11-19 |
| BR112013008571B1 (pt) | 2021-02-23 |
| KR101843028B1 (ko) | 2018-05-14 |
| CN103155203A (zh) | 2013-06-12 |
| EP2628201B1 (en) | 2020-01-08 |
| JP2013542569A (ja) | 2013-11-21 |
| RU2575938C2 (ru) | 2016-02-27 |
| RU2013121673A (ru) | 2014-11-20 |
| EP2628201A1 (en) | 2013-08-21 |
| KR20130108388A (ko) | 2013-10-02 |
| US9219246B2 (en) | 2015-12-22 |
| TW201222914A (en) | 2012-06-01 |
| WO2012049594A1 (en) | 2012-04-19 |
| US20130217168A1 (en) | 2013-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: The city of Eindhoven in Holland Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Holland Ian Deho Finn Patentee before: Koninklijke Philips Electronics N.V. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180621 Address after: Beijing City, Haidian District Qinghe Street No. 68 Huarun colorful city shopping center two 9 floor room 01 Patentee after: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Address before: The city of Eindhoven in Holland Patentee before: KONINKLIJKE PHILIPS N.V. |
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| TR01 | Transfer of patent right |